TWI754753B - 無鉛銲料助焊劑用洗淨劑組成物、無鉛銲料助焊劑之洗淨方法 - Google Patents

無鉛銲料助焊劑用洗淨劑組成物、無鉛銲料助焊劑之洗淨方法 Download PDF

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Publication number
TWI754753B
TWI754753B TW107117401A TW107117401A TWI754753B TW I754753 B TWI754753 B TW I754753B TW 107117401 A TW107117401 A TW 107117401A TW 107117401 A TW107117401 A TW 107117401A TW I754753 B TWI754753 B TW I754753B
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TW
Taiwan
Prior art keywords
lead
free solder
solder flux
flux
cleaning
Prior art date
Application number
TW107117401A
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English (en)
Chinese (zh)
Other versions
TW201900862A (zh
Inventor
久保夏希
Original Assignee
日商荒川化學工業股份有限公司
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Application filed by 日商荒川化學工業股份有限公司 filed Critical 日商荒川化學工業股份有限公司
Publication of TW201900862A publication Critical patent/TW201900862A/zh
Application granted granted Critical
Publication of TWI754753B publication Critical patent/TWI754753B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Detergent Compositions (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW107117401A 2017-05-26 2018-05-22 無鉛銲料助焊劑用洗淨劑組成物、無鉛銲料助焊劑之洗淨方法 TWI754753B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017104384 2017-05-26
JP2017-104384 2017-05-26

Publications (2)

Publication Number Publication Date
TW201900862A TW201900862A (zh) 2019-01-01
TWI754753B true TWI754753B (zh) 2022-02-11

Family

ID=64449263

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107117401A TWI754753B (zh) 2017-05-26 2018-05-22 無鉛銲料助焊劑用洗淨劑組成物、無鉛銲料助焊劑之洗淨方法

Country Status (4)

Country Link
JP (1) JP6822440B2 (ja)
KR (1) KR102419315B1 (ja)
CN (1) CN108929808B (ja)
TW (1) TWI754753B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7215978B2 (ja) * 2019-08-21 2023-01-31 荒川化学工業株式会社 洗浄剤組成物及び洗浄方法
US11781092B2 (en) * 2019-08-27 2023-10-10 Resonac Corporation Composition, and method for cleaning adhesive polymer
JP2023167583A (ja) * 2022-05-12 2023-11-24 三菱重工業株式会社 洗浄装置及び洗浄方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996007503A1 (en) * 1994-09-09 1996-03-14 Fry's Metals, Inc. Rosin-free, low voc, no-clean soldering flux and method using the same
TW200745327A (en) * 2006-03-17 2007-12-16 Arakawa Chem Ind Cleaner composition for removal of lead-free soldering flux, rinsing agent for removal of lead-free soldering flux, and method for removal of lead-free soldering flux
TW200914606A (en) * 2007-08-08 2009-04-01 Arakawa Chem Ind Cleanser composition for removal of lead-free soldering flux, and method for removal of lead-free soldering flux

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0457899A (ja) 1990-06-27 1992-02-25 Arakawa Chem Ind Co Ltd ロジン系ハンダフラックスの洗浄剤および該洗浄剤を用いてなるロジン系ハンダフラックスの洗浄方法
JP2813862B2 (ja) 1994-07-05 1998-10-22 荒川化学工業株式会社 洗浄剤組成物
JPH0959698A (ja) * 1995-08-23 1997-03-04 Asahi Chem Ind Co Ltd メタルマスク用洗浄剤組成物
US5733378A (en) * 1996-02-26 1998-03-31 Austin American Technology Method for cleaning printed circuit boards
CN101037646B (zh) * 2003-08-27 2010-12-08 化研科技株式会社 除去助焊剂用洗涤剂及助焊剂的洗涤方法
JP2005112887A (ja) * 2003-10-03 2005-04-28 Kaken Tec Kk フラックス用洗浄剤組成物およびそれを用いた洗浄方法
KR20090020199A (ko) 2007-08-23 2009-02-26 주식회사 코오롱 연마패드 및 그의 제조방법
JP5556658B2 (ja) * 2008-08-27 2014-07-23 荒川化学工業株式会社 鉛フリーはんだフラックス除去用洗浄剤組成物および鉛フリーはんだフラックス除去システム
WO2011019189A2 (ko) * 2009-08-11 2011-02-17 동우 화인켐 주식회사 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법
JP5857740B2 (ja) * 2009-09-03 2016-02-10 荒川化学工業株式会社 鉛フリーハンダ水溶性フラックス除去用洗浄剤、除去方法及び洗浄方法
KR101128865B1 (ko) * 2010-10-01 2012-03-26 에이케이켐텍 주식회사 리플로우 공정에 따른 플럭스 잔사 세정제 조성물 및 이를 이용한 세정방법
JP2018127573A (ja) * 2017-02-10 2018-08-16 荒川化学工業株式会社 電子材料用リンス剤

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996007503A1 (en) * 1994-09-09 1996-03-14 Fry's Metals, Inc. Rosin-free, low voc, no-clean soldering flux and method using the same
TW200745327A (en) * 2006-03-17 2007-12-16 Arakawa Chem Ind Cleaner composition for removal of lead-free soldering flux, rinsing agent for removal of lead-free soldering flux, and method for removal of lead-free soldering flux
TW200914606A (en) * 2007-08-08 2009-04-01 Arakawa Chem Ind Cleanser composition for removal of lead-free soldering flux, and method for removal of lead-free soldering flux

Also Published As

Publication number Publication date
TW201900862A (zh) 2019-01-01
KR20180129663A (ko) 2018-12-05
JP6822440B2 (ja) 2021-01-27
JP2018199808A (ja) 2018-12-20
KR102419315B1 (ko) 2022-07-08
CN108929808A (zh) 2018-12-04
CN108929808B (zh) 2020-11-27

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