TW201900862A - 無鉛銲料助焊劑用洗淨劑組成物、無鉛銲料助焊劑之洗淨方法 - Google Patents
無鉛銲料助焊劑用洗淨劑組成物、無鉛銲料助焊劑之洗淨方法 Download PDFInfo
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- TW201900862A TW201900862A TW107117401A TW107117401A TW201900862A TW 201900862 A TW201900862 A TW 201900862A TW 107117401 A TW107117401 A TW 107117401A TW 107117401 A TW107117401 A TW 107117401A TW 201900862 A TW201900862 A TW 201900862A
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- Prior art keywords
- lead
- free solder
- flux
- component
- ether
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- 150000002576 ketones Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- IPMWIVQWGGRTLD-UHFFFAOYSA-N n'-[2-(propylamino)ethyl]ethane-1,2-diamine Chemical compound CCCNCCNCCN IPMWIVQWGGRTLD-UHFFFAOYSA-N 0.000 description 1
- SRTOAFZPEOCBGW-UHFFFAOYSA-N n,n,n',n'-tetraethylhexane-1,6-diamine Chemical compound CCN(CC)CCCCCCN(CC)CC SRTOAFZPEOCBGW-UHFFFAOYSA-N 0.000 description 1
- OQIRZNNBUNOXTQ-UHFFFAOYSA-N n,n,n',n'-tetraethylpentane-1,5-diamine Chemical compound CCN(CC)CCCCCN(CC)CC OQIRZNNBUNOXTQ-UHFFFAOYSA-N 0.000 description 1
- TXXWBTOATXBWDR-UHFFFAOYSA-N n,n,n',n'-tetramethylhexane-1,6-diamine Chemical compound CN(C)CCCCCCN(C)C TXXWBTOATXBWDR-UHFFFAOYSA-N 0.000 description 1
- DNOJGXHXKATOKI-UHFFFAOYSA-N n,n,n',n'-tetramethylpentane-1,5-diamine Chemical compound CN(C)CCCCCN(C)C DNOJGXHXKATOKI-UHFFFAOYSA-N 0.000 description 1
- OAFOHGONKIXDDE-UHFFFAOYSA-N n,n,n',n'-tetrapropylhexane-1,6-diamine Chemical compound CCCN(CCC)CCCCCCN(CCC)CCC OAFOHGONKIXDDE-UHFFFAOYSA-N 0.000 description 1
- UICCSKORMGVRCB-UHFFFAOYSA-N n-[2-(diethylamino)ethyl]-n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCNCCN(CC)CC UICCSKORMGVRCB-UHFFFAOYSA-N 0.000 description 1
- JPJMSWSYYHNPLD-UHFFFAOYSA-N n-[2-(dimethylamino)ethyl]-n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCNCCN(C)C JPJMSWSYYHNPLD-UHFFFAOYSA-N 0.000 description 1
- FIDAJBOTMYEWMR-UHFFFAOYSA-N n-[2-(dipropylamino)ethyl]-n',n'-dipropylethane-1,2-diamine Chemical compound CCCN(CCC)CCNCCN(CCC)CCC FIDAJBOTMYEWMR-UHFFFAOYSA-N 0.000 description 1
- DVVORTHDQVBZOO-UHFFFAOYSA-N n-[2-[di(propan-2-yl)amino]ethyl]-n',n'-di(propan-2-yl)ethane-1,2-diamine Chemical compound CC(C)N(C(C)C)CCNCCN(C(C)C)C(C)C DVVORTHDQVBZOO-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002265 redox agent Substances 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- 239000002455 scale inhibitor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
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- Chemical & Material Sciences (AREA)
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- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
本發明之主要目的係提供一種無鉛銲料助焊劑用洗淨劑組成物, 其可在短時間內洗淨以松香助焊劑或水溶性助焊劑進行焊接時所產生之助焊劑殘渣,且進一步地,即使被洗淨物係複雜並具有細微構造之實裝基板等,其仍具備優異的間隙洗淨性。
本發明係提供一種無鉛銲料助焊劑用洗淨劑組成物,其特徵 係包含:(A)含有選自二乙二醇乙基甲基醚、二乙二醇二乙基醚及二丙二醇二甲基醚所成群中至少1種之有機溶劑;(B)下述式(1)所表示之醇胺;及(C)羥基羧酸;
(n係1~3之整數,R係表示碳數1~4之烷基或羥烷基)。
Description
本發明,係關於一種無鉛銲料助焊劑用洗淨劑組成物、無鉛銲料助焊劑之洗淨方法。
將電子零件表面安裝於印刷電路板時,一般會進行焊接。通常,焊接時,會去除焊料及母材表面之氧化膜,抑或使用助焊劑以達到防止焊料及母材表面之再氧化、獲得充分焊接性之目的。然而,助焊劑具腐蝕性,助焊劑殘渣會降低印刷電路基板之品質。因此,有需洗淨去除助焊劑殘渣之情形。
傳統上,表面安裝零件之焊料接合,係廣泛使用松香基底之助焊劑(松香助焊劑),此松香助焊劑之殘渣,則係以氟氯烷等之鹵代烴洗淨。然而,因鹵代烴對於環境極為有害,導致其使用已受限制,故松香助焊劑殘渣之洗淨劑,目前已檢討鹵代烴等之各種取代物。例如,著火的危險、對環境之影響等較小,且松香助焊劑殘渣之溶解力優異者,已提案含有聚氧化烯烷基醚系之非鹵素系有機溶劑等之洗淨劑(專利文獻1~3)。
此外,作為環境問題之一對策,以水取代鹵代烴進行洗淨 亦被檢討。可進行水洗淨之助焊劑,非如松香助焊劑之疏水性者,有聚醚系樹脂等添加活性劑、溶劑等之水溶性助焊劑。由於水溶性助焊劑之殘渣具有吸濕性,故必須進行洗淨。此與非必須洗淨之松香助焊劑殘渣係相異之特徴。因此,水溶性助焊劑之殘渣,通常係以水洗淨,但有洗淨不充分之情形。
在此,會考慮將上述專利文獻1~3等之洗淨劑作為水溶性助焊劑殘渣之洗淨劑使用。然而,由於此等之洗淨劑並非以去除水溶性助焊劑殘渣為目的來檢討,此外,水溶性助焊劑殘渣,具有與松香助焊劑殘渣相異之特徴,故即使使用上述之松香助焊劑用洗淨劑仍難以充分洗淨水溶性助焊劑殘渣。此外,專利文獻3之洗淨劑組成物,係含有具烷基之醇胺,但如此之胺有將銅板等之金屬基板腐蝕之問題。
【專利文獻1】日本特開平4-57899號公報
【專利文獻2】日本特開平8-73893號公報
【專利文獻3】國際公開第2009/020199號說明書
本發明,主要目的係提供一種無鉛銲料助焊劑用洗淨劑組 成物,其可在短時間內洗淨以松香助焊劑或水溶性助焊劑進行焊接時所產生之助焊劑殘渣,且進一步地,即使被洗淨物係複雜並具有細微構造之實裝基板等,其仍具備優異之間隙洗淨性。
本發明者,經深入研究之結果,發現在洗淨劑組成物含有:含特定之二元醇醚之有機溶劑及胺、經基羧酸時,可解決前述課題,從而完成本發明。亦即,本發明係關於以下之無鉛銲料助焊劑用洗淨劑組成物、及無鉛銲料助焊劑之洗淨方法。
1.一種無鉛銲料助焊劑用洗淨劑組成物,其特徵係包含:(A)含有選自二乙二醇乙基甲基醚、二乙二醇二乙基醚及二丙二醇二甲基醚所成群中至少1種之有機溶劑;(B)下述式(1)所表示之醇胺;及(C)羥基羧酸;
(n係1~3之整數,R係表示碳數1~4之烷基或羥烷基)。
2.如前項1之無鉛銲料助焊劑用洗淨劑組成物,其中,(B)成分,係N,N-雙(2-羥乙基)-N-環己胺。
3.如前項1或2之無鉛銲料助焊劑用洗淨劑組成物,其中,(C)成分,係選自檸檬酸、異檸檬酸、酒石酸及蘋果酸所成群中至少1 種。
4.如前項1~3中任一項之無鉛銲料助焊劑用洗淨劑組成物,其中,係含有2.8~70重量%之(A)成分、0.04~5重量%之(B)成分、0.01~2重量%之(C)成分、及5~97重量%之水。
5.如前項1~4中任一項之無鉛銲料助焊劑用洗淨劑組成物,其中,在溫度25℃下之表面張力係10~60dyne/cm。
6.一種無鉛銲料助焊劑之洗淨方法,其特徵係將前項1~5中任一項之無鉛銲料助焊劑用洗淨劑組成物,與附著無鉛銲料助焊劑之被洗淨物接觸而洗淨。
藉由本發明之無鉛銲料助焊劑用洗淨劑組成物(以下,簡稱為洗淨劑組成物),其可在短時間內洗淨以松香助焊劑或水溶性助焊劑進行焊接時所產生之助焊劑殘渣,此外,即使被洗淨物係複雜並具有細微構造之實裝基板等,其仍具備優異之間隙洗淨性。進一步,前述洗淨劑組成物具有不會使金屬基板腐蝕之效果。
【圖1】間隙洗淨性中「無助焊劑殘渣」時,即「◎」之圖
【圖2】間隙洗淨性中「有助焊劑殘渣」時,即「×」之圖
本發明之洗淨劑組成物之洗淨對象之「無鉛銲料助焊劑」,具體而言,係意指源自無鉛焊料之含有錫之助焊劑殘渣,可列舉例如:(甲)粉狀之無鉛焊料與助焊劑組成物所成膏狀之焊接後所生助焊劑殘渣、抑或(乙)無鉛焊料所形成之電極,介由助焊劑組成物焊接後所生助焊劑殘渣。
又,「無鉛焊料」,可列舉例如:Sn-Ag系焊料、Sn-Cu系焊料、Sn-Ag-Cu系焊料、Sn-Zn系焊料、Sn-Sb系焊料等。
此外,「助焊劑組成物」,具體而言,可列舉例如:將樹脂酸類(天然松香、重合松香、α、β不飽和羧酸變性松香等)或合成樹脂類(丙烯酸樹脂、聚醯胺樹脂等)等之基底樹脂;活性劑(己二酸等之有機酸、二乙基胺溴氫酸鹽等之鹵素系化合物等);觸變劑(硬化蓖麻油、羥基硬脂酸乙烯雙醯胺等);溶劑(二乙二醇單己基醚,二乙二醇單丁基醚等)作為主成分之組成物。
本發明之洗淨劑組成物,係含有:(A)含有選自二乙二醇乙基甲基醚、二乙二醇二乙基醚及二丙二醇二甲基醚所成群中至少1種之有機溶劑(以下,簡稱為(A)成分);(B)下述式(1)所表示之醇胺(以下,簡稱為(B)成分);及(C)羥基羧酸(以下,簡稱為(C)成分)。
【化3】
(n係1~3之整數,R係表示碳數1~4之烷基或羥烷基)
(A)成分,係含有選自二乙二醇乙基甲基醚、二乙二醇二乙基醚及二丙二醇二甲基醚所成群中至少1種。由於此等之二烷基二亞烷基二元醇,表面張力及黏度低,有易於進入基板之間隙的傾向。
此外,(A)成分,只要不損害間隙洗淨性,亦可與其他二元醇醚併用。其他二元醇醚,並無特別限定,可列舉例如:二乙二醇單甲基醚、二乙二醇二甲基醚、二乙二醇單乙基醚、二乙二醇單n-丙基醚、二乙二醇二n-丙基醚、二乙二醇甲基丙基醚、二乙二醇乙基丙基醚、二乙二醇單n-丁基醚、二乙二醇二n-丁基醚、二乙二醇甲基丁基醚、二乙二醇乙基丁基醚、二乙二醇丙基丁基醚、二乙二醇單n-戊基醚、二乙二醇二n-戊基醚、二乙二醇甲基戊基醚、二乙二醇乙基戊基醚、二乙二醇丙基戊基醚、二乙二醇丁基戊基醚、二乙二醇單n-己基醚等之二乙二醇醚類;二丙二醇單甲基醚,對應此等之三或四乙二醇醚類等,此等可單獨1種,抑或將2種以上組合使用,其含有量亦並無特別限定,本發明之洗淨劑組成物為100重量%時,係40重量%以下為佳。
(A)成分之含有量,並無特別限定,惟根據間隙洗淨性之觀點,本發明之洗淨劑組成物為100重量%時,通常係2.8~70重量%,較佳係5~70重量%,更佳係20~70重量%。
(B)成分,係下述式(1)所表示之醇胺,其係不使金屬 基板腐蝕,且為了發揮助焊劑之洗淨性之必要成分。
(n係1~3之整數,R係表示碳數1~4之烷基或羥烷基)
前述式(1)所表示之醇胺,可列舉例如:N-羥乙基-N-甲基-N-環己胺、N-乙基-N-(2-羥乙基)-N-環己胺、N,N-雙(2-羥甲基)-N-環己胺、N,N-雙(2-羥乙基)-N-環己胺等。此等可單獨使用或2種以上組合使用。此等之中,根據間隙洗淨性之觀點,係N,N-雙(2-羥乙基)-N-環己胺為佳。
(B)成分之含有量,並無特別限定,惟根據間隙洗淨性之觀點,本發明之洗淨劑組成物為100重量%時,通常係0.04~5重量%,較佳係0.04~3重量%,更佳係0.1~2重量%。
本發明之洗淨劑組成物,亦可將(B)成分以外之醇胺(B-1)(以下,簡稱為(B-1)成分)、或脂肪族胺(B2)(以下,簡稱為(B-2)成分)等併用。(B-1)成分,並無特別限定,可列舉例如:二乙醇胺、N-甲基二乙醇胺、N-乙基二乙醇胺、N-n-丁基二乙醇胺、N-t-丁基二乙醇胺、三乙醇胺、N-(β-胺乙基)乙醇胺、N-(β-胺乙基)異丙醇胺等。此外,(B-2)成分,並無特別限定,可列舉例如:辛基胺、癸基胺、十二烷基胺、四癸基胺、十六烷基胺、2-乙基己基胺等之第1級脂肪族胺; N,N,N’,N’-四甲基戊亞甲基二胺、N,N,N’,N’-四乙基戊亞甲基二胺、N,N,N’,N’-四異丙基戊亞甲基二胺、N,N,N’,N’-四-n-丙基戊亞甲基二胺、N,N,N’,N’-四甲基六亞甲基二胺、N,N,N’,N’-四乙基六亞甲基二胺、N,N,N’,N’-四異丙基六亞甲基二胺、N,N,N’,N’-四-n-丙基六亞甲基二胺等之第3級二胺;雙(2-二甲基胺乙基)醚、雙(2-二乙基胺乙基)醚、雙(2-二異丙基胺乙基)醚、雙(2-二-n-丙基胺乙基)醚等之二胺烷基醚;1,1,7,7-四甲基二乙烯三胺、1,1,7,7-四乙基二乙烯三胺、1,1,7,7-四異丙基二乙烯三胺、1,1,7,7-四-n-丙基二乙烯三胺、N,N,N’,N”,N”-戊甲基二乙烯三胺、4-甲基-1,1,7,7-四乙基二乙烯三胺、4-甲基-1,1,7,7-四異丙基二乙烯三胺、4-甲基-1,1,7,7-四-n-丙基二乙烯三胺等之三胺等。此等可單獨使用或2種以上組合使用。(B-1)成分及(B-2)成分之含有量,並無特別限定,根據不腐蝕金屬基板之觀點,本發明之洗淨劑組成物為100重量%時,係2重量%以下為佳。
(C)成分,並無特別限定,可使用各種習知者,可列舉例如:檸檬酸、異檸檬酸、蘋果酸、酒石酸等。此外,亦可使用前述酸之鹽類,鹽類可列舉如,鈉鹽、鉀鹽、銨鹽、烷醇胺鹽。此等可單獨使用或2種以上組合使用。此等之中,根據助焊劑殘渣洗淨性之觀點,選自檸檬酸、異檸檬酸及蘋果酸所成群中至少1種為佳,檸檬酸更佳。
(C)成分之含有量,並無特別限定,但根據助焊劑殘渣溶解性之觀點,本發明之洗淨劑組成物為100重量%時,通常係0.01~2重量%,較佳係0.1~2重量%,更佳係0.1~1重量%。
本發明之洗淨劑組成物,係進一步含有水。水,可列舉例如:純水、離子交換水、精製水等。此外,水的混合可為1次亦可分為複數次。水之含有量亦無特別限定,根據洗淨劑之非危險物化之觀點,本發明之洗淨劑組成物為100重量%時,通常係5~97重量%,較佳係20~90重量%,更佳係20~50重量%。
此外,本發明之洗淨劑組成物,亦可因應必要含有非鹵素系有機溶劑,可列舉例如:含有1,3-二甲基-2-咪唑啉酮、1,3-二乙基-2-咪唑啉酮、1,3-二丙基-2-咪唑啉酮、N-甲基-2-吡咯烷酮等之氮原子之溶劑;己烷、庚烷、辛烷等之烴類;甲醇、乙醇、苯甲醇等之醇類;丙酮、甲基乙基酮等之酮;二乙基醚、四氫呋喃、二元醇醚類等之醚類;醋酸乙基、醋酸甲基等之酯類等,此等可單獨使用或2種以上組合使用。
又,本發明之洗淨劑組成物,只要在不損害本發明所預期之效果的範圍內,亦可添加各種習知的添加劑,例如非離子性界面活性劑(相當(A)成分者除外)、陰離子性界面活性劑,陽離子性界面活性劑等之各種界面活性劑等。
非離子性界面活性劑,可列舉例如:一般式(2):R2-O-(CH2-CH2-O)e-H(式中,R2係碳數8~20之烷基,e係表示0~20之整數。)所表示之化合物、或脂肪酸醯胺之環氧乙烷加成物、去水山梨醇脂肪酸酯、蔗糖脂肪酸酯、脂肪酸烷醇醯胺,對應此等之聚氧丙烷系界面活性劑等,此等可單獨使用或2種以上組合使用。
陰離子性界面活性劑,可列舉例如:硫酸酯系陰離子性界面活性劑(高級醇之硫酸酯鹽、烷基硫酸酯鹽、聚氧乙烯烷基硫酸酯鹽 等);磺酸鹽系陰離子性界面活性劑(烷基磺酸鹽、烷基苯磺酸鹽等)等,此等可單獨使用或2種以上組合使用。
陽離子性界面活性劑,可列舉例如:烷基化銨鹽、4級銨等,此等可單獨使用或2種以上組合使用。
兩性界面活性劑,可列舉如,胺基酸型、內鹽型兩性界面活性劑等,此等可單獨使用或2種以上組合使用。
本發明之洗淨劑組成物,亦可混合各種習知的添加劑。添加劑並無特別限定,可列舉例如:螯合劑,抗氧化劑,氧化還原劑,防垢劑,防銹劑,pH調整劑,消泡劑等。
本發明之洗淨劑組成物之物性,並無特別限定,例如,表面張力在溫度25℃下,通常係約10~60dyne/cm,較佳係約10~50dyne/cm,更佳係約10~40dyne/cm。藉由使表面張力在該範圍內,可使間隙洗淨性易為良好。
此外,本發明之洗淨劑組成物不具著火點,係非危險物。
此外,本發明之洗淨劑組成物,可因應必要含有除了該(A)成分以外之非鹵素系有機溶劑。可列舉例如:含氮化合物系溶劑(1,3-二甲基-2-咪唑啉酮、1,3-二乙基-2-咪唑啉酮、1,3-二丙基-2-咪唑啉酮、N-甲基-2-吡咯烷酮等);碳氫化合物系溶劑(己烷、庚烷、辛烷等);醇系溶劑(甲醇、乙醇、苯甲醇等);酮系溶劑(丙酮、甲基乙基酮等);醚系溶劑(二乙基醚、四氫呋喃、二元醇醚類等);酯系溶劑(醋酸乙基、醋酸甲基等)等,此等可單獨使用或2種以上組合使用。
<無鉛銲料助焊劑之去除方法>
本發明之無鉛銲料助焊劑之去除方法,係可藉由將本發明之洗淨劑組成物與附著有無鉛焊料助焊劑之被洗淨物接觸,從而去除前述助焊劑者。
本發明之洗淨劑組成物之利用態樣並無特別限定,可採用各種習知的方法。可列舉例如:使用噴霧裝置將洗淨劑組成物以噴霧方式噴灑在附著有無鉛焊料助焊劑之被洗淨物上之方法(參照日本特開2007-096127號公報),在洗淨劑組成物中浸漬被洗淨物並以超音波洗淨之方法,使用直通式洗淨裝置(登錄商標「」,荒川化學工業股份有限公司製,日本專利第2621800號等)之方法等。
使用本發明之洗淨劑組成物去除無鉛焊料助焊劑後,以水洗濯所得之洗淨物較佳。特別係,本發明之去除方法,較佳係將本發明之洗淨劑組成物以噴霧方式噴灑在無鉛焊料助焊劑而得到洗淨物後,對於該洗淨物以噴霧方式噴灑水的方法。
此外,洗濯處理,可複數次重複進行。例如,對於前述洗淨物,藉由預洗濯處理後,進行完成洗濯處理,從而可有效地去除洗淨物表面所附著之洗淨劑組成物。
預洗濯處理,只要使用純水等根據傳統之預漂洗處理之方法進行即可。
完成漂洗處理,只要根據傳統之方法進行即可。可列舉例如:對於預漂洗處理物使用純水等處理之方法。
預漂洗處理後及/或完成漂洗處理後,亦可因應必要進行乾燥處理。
又,洗濯步驟,將水以噴霧方式噴灑在該被洗淨物之態様 下進行時,根據低發泡性之觀點,本發明之洗淨劑組成物,亦不含前述之各種界面活性劑為佳。
以下,藉由實施例及比較例詳細說明本發明,惟並非因此而由其等限制本發明之範圍。
(無鉛銲料助焊劑用洗淨劑組成物之調製)
將表1所示之各成分混合(重量%基準),調製實施例1~10及比較例1~6之無鉛銲料助焊劑用洗淨劑組成物。
[金屬基板之腐蝕(確認變色之有無)]
在200ml之燒杯中。採取實施例1之無鉛銲料助焊劑用洗淨劑組成物150g,並放入鋁板(鋁板A1050P(JIS H3100所規定),尺寸:70mm×150mm×0.8mm),在60℃下浸漬10分鐘。冷卻後,取出鋁板,重複仔細水洗後,藉由氮吹去除液滴。以肉眼觀察確認鋁板之變色有無。此外,實施例2~10、及比較例1~6之無鉛銲料助焊劑用洗淨劑組成物亦以同樣方法進行評估。結果如表1所示(以下相同)。
(評估基準)
○:無鋁板之變色×:有鋁板之變色
〔水溶性助焊劑殘渣之製作〕
將市售之水溶性助焊劑(製品名「WF-6317」,千住金屬工業股份有限公司製)30重量份、及無鉛焊料粉末(96.5Sn3.0Ag0.5Cu,20-38μm,三井金屬鑛業股份有限公司製)70重量份混合調製成焊膏。將前述焊膏放入軟 膏罐,在溫度270℃之熱板上加熱熔融後,冷卻,採取從焊膏中分離之水溶性助焊劑殘渣。前述助焊劑殘渣作為以無鉛水溶性焊料焊接後所生殘渣之模型使用。
採取前述助焊劑殘渣之一部分,使用波長分散型螢光X線分析裝置(製品名「ZSX100e」,日本(股)理學)測定錫濃度。結果,檢測出5重量%之錫。
〔洗淨用模型基板之製作〕
藉由在基底之環氧玻璃基板(縱40cm×橫40cm×厚1mm)上,形成多個高度30μm之抗蝕劑凸塊,並從上方接著1枚作為間格物之玻璃小板(縱16cm×橫16cm×厚0.5mm),從而形成間隙洗淨用之基板。之後,以甲醇將前述水溶性助焊劑殘渣稀釋為濃度15%之液體10μl,供給至該玻璃小板間之凹部,從而製作洗淨用模型基板。
〔間隙洗淨性〕
以實施例1之無鉛銲料助焊劑用洗淨劑組成物(液溫50℃)對於前述模型基板進行噴霧洗淨(壓力0.2MPa,溫度50℃,1分)。使用水進行噴霧洗淨(壓力為0.2MPa,1分)洗濯基板,藉由氮吹去除液滴後,以80℃之循風乾燥機乾燥10分鐘。使用光學顯微鏡(基恩士股份有限公司製VHX6000)觀察乾燥後之基板上所殘留之助焊劑殘渣。評估基準如以下所示。此外,實施例2~10、及比較例1~6之無鉛銲料助焊劑用洗淨劑組成物亦相同地進行評估。
(評估基準)
◎:無助焊劑殘渣(參照圖1)
○:有微量助焊劑殘渣,但係在不影響基板之電信賴性之範圍內
△:有微量助焊劑殘渣,係在會若干影響基板之電信賴性之範圍內
×:有助焊劑殘渣(參照圖2)
※各成分之含有量,係以重量比率(重量%)表示。
表1中之簡稱,係表示以下化合物。
.DEDG:二乙二醇二乙基醚
.MEDG:二乙二醇乙基甲基醚
.DPDM:二丙二醇二甲基醚
.BDG:二乙二醇單n-丁基醚
.CHE-20:N,N-雙(2-羥乙基)-N-環己胺(商品名:『胺基醇CHE-20』,日本乳化劑(股)製)
.MBD:N-n-丁基二乙醇胺
〔對於供給有松香助焊劑殘渣之模型基板的間隙洗淨性〕
使用含有市售松香系助焊劑之焊膏(solder paste)(製品名「松樹焊料VAPY-LF219」,荒川化學工業股份有限公司製),藉由與段落【0055】~【0057】所記載之相同方法製作模型基板(由於此次之製品係焊膏,故省略焊膏之調整過程)。以實施例4之無鉛銲料助焊劑用洗淨劑組成物洗淨前述模型基板時,明確顯示出其具有相同優異之間隙洗淨性。
Claims (6)
- 一種無鉛銲料助焊劑用洗淨劑組成物,其特徵係包含:(A)含有選自二乙二醇乙基甲基醚、二乙二醇二乙基醚及二丙二醇二甲基醚所成群中至少1種之有機溶劑;(B)由下述式(1)所表示之醇胺;及(C)羥基羧酸;
- 如申請專利範圍第1項之無鉛銲料助焊劑用洗淨劑組成物,其中,(B)成分,係N,N-雙(2-羥乙基)-N-環己胺。
- 如申請專利範圍第1或2項之無鉛銲料助焊劑用洗淨劑組成物,其中,(C)成分,係選自檸檬酸、異檸檬酸、酒石酸及蘋果酸所成群中至少1種。
- 如申請專利範圍第1~3項中任一項之無鉛銲料助焊劑用洗淨劑組成物,其中,係含有2.8~70重量%之(A)成分、0.04~5重量%之(B)成分、0.01~2重量%之(C)成分、及5~97重量%之水。
- 如申請專利範圍第1~4項中任一項之無鉛銲料助焊劑用洗淨劑組成物,其中,在溫度25℃下之表面張力係10~60dyne/cm。
- 一種無鉛銲料助焊劑之洗淨方法,其特徵係將申請專利範圍第1~5項中任一項之無鉛銲料助焊劑用洗淨劑組成物,與附著無鉛銲料助焊劑之被洗淨物接觸而洗淨。
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US8372792B2 (en) * | 2007-08-08 | 2013-02-12 | Arakawa Chemical Industries, Ltd. | Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux |
KR20090020199A (ko) | 2007-08-23 | 2009-02-26 | 주식회사 코오롱 | 연마패드 및 그의 제조방법 |
JP5556658B2 (ja) * | 2008-08-27 | 2014-07-23 | 荒川化学工業株式会社 | 鉛フリーはんだフラックス除去用洗浄剤組成物および鉛フリーはんだフラックス除去システム |
WO2011019189A2 (ko) * | 2009-08-11 | 2011-02-17 | 동우 화인켐 주식회사 | 레지스트 박리액 조성물 및 이를 이용한 레지스트의 박리방법 |
JP5857740B2 (ja) * | 2009-09-03 | 2016-02-10 | 荒川化学工業株式会社 | 鉛フリーハンダ水溶性フラックス除去用洗浄剤、除去方法及び洗浄方法 |
KR101128865B1 (ko) * | 2010-10-01 | 2012-03-26 | 에이케이켐텍 주식회사 | 리플로우 공정에 따른 플럭스 잔사 세정제 조성물 및 이를 이용한 세정방법 |
JP2018127573A (ja) * | 2017-02-10 | 2018-08-16 | 荒川化学工業株式会社 | 電子材料用リンス剤 |
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- 2018-05-21 JP JP2018096880A patent/JP6822440B2/ja active Active
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JP6822440B2 (ja) | 2021-01-27 |
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