TWI750369B - 樹脂模製模具及樹脂模製裝置 - Google Patents

樹脂模製模具及樹脂模製裝置 Download PDF

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Publication number
TWI750369B
TWI750369B TW107115086A TW107115086A TWI750369B TW I750369 B TWI750369 B TW I750369B TW 107115086 A TW107115086 A TW 107115086A TW 107115086 A TW107115086 A TW 107115086A TW I750369 B TWI750369 B TW I750369B
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TW
Taiwan
Prior art keywords
mold
workpiece
block
resin
members
Prior art date
Application number
TW107115086A
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English (en)
Chinese (zh)
Other versions
TW201902658A (zh
Inventor
齊藤高志
野村祐大
Original Assignee
日商山田尖端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商山田尖端科技股份有限公司 filed Critical 日商山田尖端科技股份有限公司
Publication of TW201902658A publication Critical patent/TW201902658A/zh
Application granted granted Critical
Publication of TWI750369B publication Critical patent/TWI750369B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW107115086A 2017-06-02 2018-05-03 樹脂模製模具及樹脂模製裝置 TWI750369B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-110471 2017-06-02
JP2017110471A JP6891048B2 (ja) 2017-06-02 2017-06-02 樹脂モールド金型及び樹脂モールド装置

Publications (2)

Publication Number Publication Date
TW201902658A TW201902658A (zh) 2019-01-16
TWI750369B true TWI750369B (zh) 2021-12-21

Family

ID=64456267

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107115086A TWI750369B (zh) 2017-06-02 2018-05-03 樹脂模製模具及樹脂模製裝置

Country Status (3)

Country Link
JP (1) JP6891048B2 (enExample)
TW (1) TWI750369B (enExample)
WO (1) WO2018221090A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7121763B2 (ja) * 2020-02-14 2022-08-18 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
JP7360368B2 (ja) * 2020-08-18 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
DE202021101012U1 (de) * 2021-03-01 2022-03-01 Wickert Maschinenbau GmbH Vorrichtung zum Einlegen von vorgefertigten Teilen in ein Formwerkzeug einer Presse sowie Presse mit einer solchen Vorrichtung
JP7576333B2 (ja) * 2021-12-06 2024-10-31 アピックヤマダ株式会社 樹脂封止装置及び封止金型
JP2025010701A (ja) * 2023-07-10 2025-01-23 アピックヤマダ株式会社 実装装置及び実装方法
JP7538972B1 (ja) 2024-02-07 2024-08-22 日機装株式会社 加圧装置
JP7581554B1 (ja) 2024-04-18 2024-11-12 日機装株式会社 加圧装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119803A (ja) * 2002-09-27 2004-04-15 Towa Corp 電子部品の樹脂注入方法及び装置
CN103561926A (zh) * 2011-06-02 2014-02-05 矢崎总业株式会社 用于嵌入模制的模具及用于嵌入模制套圈的方法
WO2014199733A1 (ja) * 2013-06-14 2014-12-18 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
CN105313279A (zh) * 2014-07-29 2016-02-10 第一精工株式会社 树脂密封装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11126787A (ja) * 1997-10-24 1999-05-11 Towa Corp 電子部品の樹脂封止成形方法及び金型
JP4658353B2 (ja) * 2001-03-01 2011-03-23 ルネサスエレクトロニクス株式会社 樹脂モールド金型及び樹脂モールドパッケージの製造方法
JP4834407B2 (ja) * 2006-01-17 2011-12-14 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
JP4875927B2 (ja) * 2006-06-02 2012-02-15 アピックヤマダ株式会社 樹脂モールド装置
JP5576614B2 (ja) * 2009-03-06 2014-08-20 日立マクセル株式会社 薄膜状インサート成形品の製造方法、および薄膜状インサート成形品
JP5807898B2 (ja) * 2011-03-24 2015-11-10 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
KR20140106691A (ko) * 2011-12-22 2014-09-03 다이킨 고교 가부시키가이샤 이형 필름
WO2015159743A1 (ja) * 2014-04-18 2015-10-22 アピックヤマダ株式会社 樹脂モールド金型および樹脂モールド方法
JP6475512B2 (ja) * 2015-02-25 2019-02-27 新日本無線株式会社 モールド成型装置及びモールド成型方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004119803A (ja) * 2002-09-27 2004-04-15 Towa Corp 電子部品の樹脂注入方法及び装置
CN103561926A (zh) * 2011-06-02 2014-02-05 矢崎总业株式会社 用于嵌入模制的模具及用于嵌入模制套圈的方法
WO2014199733A1 (ja) * 2013-06-14 2014-12-18 アピックヤマダ株式会社 樹脂モールド金型及び樹脂モールド装置
CN105313279A (zh) * 2014-07-29 2016-02-10 第一精工株式会社 树脂密封装置

Also Published As

Publication number Publication date
JP2018202740A (ja) 2018-12-27
WO2018221090A1 (ja) 2018-12-06
TW201902658A (zh) 2019-01-16
JP6891048B2 (ja) 2021-06-18

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