TWI746041B - 狹縫噴嘴以及基板處理裝置 - Google Patents

狹縫噴嘴以及基板處理裝置 Download PDF

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Publication number
TWI746041B
TWI746041B TW109122794A TW109122794A TWI746041B TW I746041 B TWI746041 B TW I746041B TW 109122794 A TW109122794 A TW 109122794A TW 109122794 A TW109122794 A TW 109122794A TW I746041 B TWI746041 B TW I746041B
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TW
Taiwan
Prior art keywords
slit nozzle
lip
substrate
adjustment
longitudinal direction
Prior art date
Application number
TW109122794A
Other languages
English (en)
Chinese (zh)
Other versions
TW202112453A (zh
Inventor
安陪裕滋
塩田明仁
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202112453A publication Critical patent/TW202112453A/zh
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Publication of TWI746041B publication Critical patent/TWI746041B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B05C5/0258—Coating heads with slot-shaped outlet flow controlled, e.g. by a valve
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
TW109122794A 2019-09-19 2020-07-06 狹縫噴嘴以及基板處理裝置 TWI746041B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019170109A JP6869305B2 (ja) 2019-09-19 2019-09-19 スリットノズルおよび基板処理装置
JP2019-170109 2019-09-19

Publications (2)

Publication Number Publication Date
TW202112453A TW202112453A (zh) 2021-04-01
TWI746041B true TWI746041B (zh) 2021-11-11

Family

ID=74877211

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109122794A TWI746041B (zh) 2019-09-19 2020-07-06 狹縫噴嘴以及基板處理裝置

Country Status (4)

Country Link
JP (1) JP6869305B2 (ja)
KR (1) KR102321818B1 (ja)
CN (1) CN214440464U (ja)
TW (1) TWI746041B (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013166262A (ja) * 2012-02-14 2013-08-29 Japan Steel Works Ltd:The 押出成形用ｔダイおよび押出成形機
JP2017060910A (ja) * 2015-09-24 2017-03-30 日本電気株式会社 塗布装置、塗布方法及び計測方法
TWI693105B (zh) * 2014-09-02 2020-05-11 日商斯克林集團公司 顯影液噴出噴嘴及顯影處理裝置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR9107320A (pt) * 1991-09-27 1994-08-02 Du Pont Revestimento compósito de espessura variável com gradiente de coloração na direção transversa-tela
JPH06142588A (ja) * 1992-11-12 1994-05-24 Mitsubishi Kasei Corp 塗布ダイ
JP3629334B2 (ja) * 1996-04-09 2005-03-16 大日本スクリーン製造株式会社 塗布装置
JP4592450B2 (ja) * 2005-03-07 2010-12-01 大日本印刷株式会社 ダイヘッド及びスリットギャップ調整方法
KR101125649B1 (ko) * 2010-05-24 2012-03-27 삼성에스디아이 주식회사 활물질 코팅 장치 및 이를 이용한 코팅 방법
JP6794473B2 (ja) * 2017-02-03 2020-12-02 ビークルエナジージャパン株式会社 塗工ダイ、塗工装置、塗工方法及び二次電池の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013166262A (ja) * 2012-02-14 2013-08-29 Japan Steel Works Ltd:The 押出成形用ｔダイおよび押出成形機
TWI693105B (zh) * 2014-09-02 2020-05-11 日商斯克林集團公司 顯影液噴出噴嘴及顯影處理裝置
JP2017060910A (ja) * 2015-09-24 2017-03-30 日本電気株式会社 塗布装置、塗布方法及び計測方法

Also Published As

Publication number Publication date
JP2021045720A (ja) 2021-03-25
KR102321818B1 (ko) 2021-11-03
CN214440464U (zh) 2021-10-22
KR20210033884A (ko) 2021-03-29
TW202112453A (zh) 2021-04-01
JP6869305B2 (ja) 2021-05-12

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