TWI744088B - 樹脂成形品的製造方法以及樹脂成形裝置 - Google Patents

樹脂成形品的製造方法以及樹脂成形裝置 Download PDF

Info

Publication number
TWI744088B
TWI744088B TW109139362A TW109139362A TWI744088B TW I744088 B TWI744088 B TW I744088B TW 109139362 A TW109139362 A TW 109139362A TW 109139362 A TW109139362 A TW 109139362A TW I744088 B TWI744088 B TW I744088B
Authority
TW
Taiwan
Prior art keywords
lead frame
positioning
resin
carrying
support member
Prior art date
Application number
TW109139362A
Other languages
English (en)
Chinese (zh)
Other versions
TW202129778A (zh
Inventor
太田哲生
諸橋信行
Original Assignee
日商Ｔｏｗａ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW202129778A publication Critical patent/TW202129778A/zh
Application granted granted Critical
Publication of TWI744088B publication Critical patent/TWI744088B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C2045/0094—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection moulding of small-sized articles, e.g. microarticles, ultra thin articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW109139362A 2020-01-20 2020-11-11 樹脂成形品的製造方法以及樹脂成形裝置 TWI744088B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-006547 2020-01-20
JP2020006547A JP7240339B2 (ja) 2020-01-20 2020-01-20 樹脂成形品の製造方法及び樹脂成形装置

Publications (2)

Publication Number Publication Date
TW202129778A TW202129778A (zh) 2021-08-01
TWI744088B true TWI744088B (zh) 2021-10-21

Family

ID=76809870

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109139362A TWI744088B (zh) 2020-01-20 2020-11-11 樹脂成形品的製造方法以及樹脂成形裝置

Country Status (4)

Country Link
JP (1) JP7240339B2 (ja)
KR (1) KR102397598B1 (ja)
CN (1) CN113134923B (ja)
TW (1) TWI744088B (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW530355B (en) * 1999-12-27 2003-05-01 Nitto Denko Corp Resin sealing method for semiconductors and release film used therefor
TWI256113B (en) * 2003-03-14 2006-06-01 Siliconware Precision Industries Co Ltd Semiconductor package positionable in encapsulating process and method for fabricating the same
TWI292738B (en) * 2005-07-13 2008-01-21 Seoul Semiconductor Co Ltd Mold for forming a molding member and method of fabricating a molding member using the same
TW201430966A (zh) * 2012-09-13 2014-08-01 Nitto Denko Corp 密封體的製造方法、密封體製造用框狀間隔件、密封體及電器
TWI559467B (zh) * 2014-03-27 2016-11-21 Towa Corp Resin forming apparatus and resin forming method
TWI623068B (zh) * 2015-11-09 2018-05-01 Towa Corp Resin packaging device and resin packaging method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59154031A (ja) * 1983-02-22 1984-09-03 Takeshi Amakawa 半導体リ−ドフレ−ムの自動供給・取出方法
KR930006593B1 (ko) * 1990-10-20 1993-07-21 현대 전자 산업 주식회사 반도체 리드 프레임 로우더용 헤드 유니트
JPH0521440A (ja) 1991-07-10 1993-01-29 Hitachi Ltd 半導体装置
JP2957759B2 (ja) * 1991-07-12 1999-10-06 芝浦メカトロニクス株式会社 リードフレーム搬送装置
JPH0521440U (ja) * 1991-07-29 1993-03-19 山形日本電気株式会社 樹脂封止金型
JP2007242958A (ja) 2006-03-09 2007-09-20 Matsushita Electric Ind Co Ltd リードフレーム搬送システム
JP2008028189A (ja) 2006-07-21 2008-02-07 Renesas Technology Corp 半導体装置の製造方法
JP2008307823A (ja) * 2007-06-15 2008-12-25 Sumitomo Electric Fine Polymer Inc 熱収縮性チューブの製造方法およびその製造装置
JP2010125634A (ja) * 2008-11-26 2010-06-10 Suzuka Fuji Xerox Co Ltd 熱収縮性フッ素樹脂チューブの製造方法
CN103474373B (zh) * 2012-06-08 2016-03-09 矽品科技（苏州）有限公司 电镀机收料装置
JP5953601B2 (ja) * 2012-07-09 2016-07-20 アピックヤマダ株式会社 樹脂モールド装置及び樹脂モールド方法
JP6580519B2 (ja) * 2016-05-24 2019-09-25 Ｔｏｗａ株式会社 圧縮成形装置、樹脂封止品製造装置、圧縮成形方法、及び樹脂封止品の製造方法
JP6094781B1 (ja) * 2016-08-02 2017-03-15 第一精工株式会社 リードフレーム搬送装置及びリードフレームの搬送方法
JP6164380B1 (ja) 2017-01-30 2017-07-19 第一精工株式会社 基材の搬送装置及び基材の搬送方法
JP6804410B2 (ja) * 2017-08-09 2020-12-23 Ｔｏｗａ株式会社 搬送機構、樹脂成形装置、成形対象物の成形型への受け渡し方法、及び樹脂成形品の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW530355B (en) * 1999-12-27 2003-05-01 Nitto Denko Corp Resin sealing method for semiconductors and release film used therefor
TWI256113B (en) * 2003-03-14 2006-06-01 Siliconware Precision Industries Co Ltd Semiconductor package positionable in encapsulating process and method for fabricating the same
TWI292738B (en) * 2005-07-13 2008-01-21 Seoul Semiconductor Co Ltd Mold for forming a molding member and method of fabricating a molding member using the same
TW201430966A (zh) * 2012-09-13 2014-08-01 Nitto Denko Corp 密封體的製造方法、密封體製造用框狀間隔件、密封體及電器
TWI559467B (zh) * 2014-03-27 2016-11-21 Towa Corp Resin forming apparatus and resin forming method
TWI623068B (zh) * 2015-11-09 2018-05-01 Towa Corp Resin packaging device and resin packaging method

Also Published As

Publication number Publication date
JP7240339B2 (ja) 2023-03-15
TW202129778A (zh) 2021-08-01
CN113134923B (zh) 2023-01-03
KR102397598B1 (ko) 2022-05-16
CN113134923A (zh) 2021-07-20
JP2021114539A (ja) 2021-08-05
KR20210093738A (ko) 2021-07-28

Similar Documents

Publication Publication Date Title
US20240217144A1 (en) Compression molding device and compression molding method
TWI647085B (zh) 樹脂成形裝置及樹脂成形方法
JP4791851B2 (ja) 電子部品の樹脂封止成形装置
TWI728725B (zh) 樹脂成形裝置以及樹脂成形品的製造方法
US20080020510A1 (en) Fabrication method of semiconductor device
JP2014231185A (ja) 樹脂モールド装置および樹脂モールド方法
TW201910088A (zh) 樹脂成型品的搬運機構、樹脂成型裝置以及樹脂成型品的製造方法
TWI730336B (zh) 樹脂成形裝置及樹脂成形品的製造方法
TWI746198B (zh) 樹脂成形品之製造方法及樹脂成形裝置
TWI744088B (zh) 樹脂成形品的製造方法以及樹脂成形裝置
JP5285737B2 (ja) 電子部品の樹脂封止成形方法及び樹脂封止成形装置
KR102202436B1 (ko) 수지 성형 장치, 수지 성형 방법, 및 수지 성형품의 제조 방법
KR102198457B1 (ko) 반송 장치, 수지 성형 장치 및 수지 성형품 제조 방법
JP2006156796A (ja) 半導体チップの樹脂封止成形方法、及び、装置
TW202039199A (zh) 樹脂成形裝置以及樹脂成形品的製造方法
TW202019659A (zh) 柱塞的更換方法、柱塞單元及樹脂成形裝置
TW202233382A (zh) 搬送機構、樹脂成形裝置及樹脂成形品的製造方法
KR102498113B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
KR102553765B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
KR20130006380U (ko) 반도체 소자 몰딩 장치
JP2022170507A (ja) 樹脂成形装置、及び樹脂成形品の製造方法
TW202330230A (zh) 樹脂密封裝置、密封模具以及樹脂密封方法
KR20010038218A (ko) 반도체 패키지 제조용 몰딩 설비