TWI735699B - 脆性材料基板之分斷方法及分斷裝置 - Google Patents

脆性材料基板之分斷方法及分斷裝置 Download PDF

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Publication number
TWI735699B
TWI735699B TW106138639A TW106138639A TWI735699B TW I735699 B TWI735699 B TW I735699B TW 106138639 A TW106138639 A TW 106138639A TW 106138639 A TW106138639 A TW 106138639A TW I735699 B TWI735699 B TW I735699B
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TW
Taiwan
Prior art keywords
brittle material
material substrate
breaking
support plate
elastic support
Prior art date
Application number
TW106138639A
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English (en)
Chinese (zh)
Other versions
TW201820440A (zh
Inventor
村上健二
Original Assignee
日商三星鑽石工業股份有限公司
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Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201820440A publication Critical patent/TW201820440A/zh
Application granted granted Critical
Publication of TWI735699B publication Critical patent/TWI735699B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
TW106138639A 2016-11-29 2017-11-08 脆性材料基板之分斷方法及分斷裝置 TWI735699B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016231163A JP7020660B2 (ja) 2016-11-29 2016-11-29 脆性材料基板の分断方法及び分断装置
JPJP2016-231163 2016-11-29

Publications (2)

Publication Number Publication Date
TW201820440A TW201820440A (zh) 2018-06-01
TWI735699B true TWI735699B (zh) 2021-08-11

Family

ID=62228620

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106138639A TWI735699B (zh) 2016-11-29 2017-11-08 脆性材料基板之分斷方法及分斷裝置

Country Status (5)

Country Link
JP (1) JP7020660B2 (ja)
KR (1) KR102451845B1 (ja)
CN (1) CN108115853B (ja)
SG (1) SG10201709740TA (ja)
TW (1) TWI735699B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112331589B (zh) * 2020-10-26 2023-08-22 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种辊压单元、划槽晶圆分离装置及划槽晶圆分离方法
JP2022180079A (ja) * 2021-05-24 2022-12-06 株式会社ディスコ 基板の分離方法
CN114226996B (zh) * 2021-12-09 2024-05-24 深圳泰德激光技术股份有限公司 宝石的切割方法及装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9310427B2 (en) * 2013-07-24 2016-04-12 Advantest Corporation High speed tester communication interface between test slice and trays

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JPH05217969A (ja) * 1992-01-31 1993-08-27 Oki Electric Ind Co Ltd 半導体発光素子のウエハ劈開方法
JP2000124537A (ja) * 1998-10-21 2000-04-28 Sharp Corp 半導体レーザチップの製造方法とその方法に用いられる製造装置
JP2001257180A (ja) 2000-03-10 2001-09-21 Sony Corp 材料基板のへき開方法及びへき開装置
KR20040022926A (ko) * 2002-09-10 2004-03-18 삼성전자주식회사 박형 웨이퍼용 테이프 부착 장치
JP4705418B2 (ja) 2005-06-29 2011-06-22 株式会社ディスコ ウェーハの加工方法
JP2008066684A (ja) * 2006-09-08 2008-03-21 Takatori Corp ダイシングフレームへの基板のマウント装置
JP2009054624A (ja) 2007-08-23 2009-03-12 Nec Electronics Corp ウェーハ補助シート、半導体ウェーハのブレーキング装置及びブレーキング方法
JP2010029930A (ja) * 2008-07-31 2010-02-12 Disco Abrasive Syst Ltd レーザ加工装置及びレーザ加工方法
JP5431053B2 (ja) 2009-07-27 2014-03-05 日東電工株式会社 粘着テープ貼付け方法および粘着テープ貼付け装置
JP2012209635A (ja) * 2011-03-29 2012-10-25 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP5824231B2 (ja) * 2011-04-11 2015-11-25 シャープ株式会社 ブレーキング装置
JP5912283B2 (ja) * 2011-04-20 2016-04-27 株式会社ディスコ 粘着テープ及びウエーハの加工方法
JP2013197149A (ja) * 2012-03-16 2013-09-30 Kansai Seiki Kogyo Kk テープ貼付装置およびテープ貼付方法
JP2014031293A (ja) * 2012-08-03 2014-02-20 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のスクライブ方法
JP6039363B2 (ja) * 2012-10-26 2016-12-07 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置
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JP6650663B2 (ja) * 2014-03-28 2020-02-19 三星ダイヤモンド工業株式会社 樹脂シートの分断方法及び分断装置
JP6481465B2 (ja) * 2014-08-21 2019-03-13 三星ダイヤモンド工業株式会社 複合基板のブレイク方法
JP6428113B2 (ja) * 2014-09-30 2018-11-28 三星ダイヤモンド工業株式会社 パターニング基板のブレイク方法並びにブレイク装置
KR101623026B1 (ko) * 2014-10-06 2016-05-20 한국미쯔보시다이아몬드공업(주) 접합 기판의 커팅 방법

Patent Citations (1)

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US9310427B2 (en) * 2013-07-24 2016-04-12 Advantest Corporation High speed tester communication interface between test slice and trays

Also Published As

Publication number Publication date
TW201820440A (zh) 2018-06-01
KR20180061024A (ko) 2018-06-07
KR102451845B1 (ko) 2022-10-07
JP2018086784A (ja) 2018-06-07
JP7020660B2 (ja) 2022-02-16
SG10201709740TA (en) 2018-06-28
CN108115853A (zh) 2018-06-05
CN108115853B (zh) 2021-05-04

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