JP4705418B2 - ウェーハの加工方法 - Google Patents
ウェーハの加工方法 Download PDFInfo
- Publication number
- JP4705418B2 JP4705418B2 JP2005189540A JP2005189540A JP4705418B2 JP 4705418 B2 JP4705418 B2 JP 4705418B2 JP 2005189540 A JP2005189540 A JP 2005189540A JP 2005189540 A JP2005189540 A JP 2005189540A JP 4705418 B2 JP4705418 B2 JP 4705418B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- street
- adhesive tape
- back surface
- streets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003672 processing method Methods 0.000 title claims 3
- 239000002390 adhesive tape Substances 0.000 claims description 37
- 230000001681 protective effect Effects 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 18
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Description
W1:表面
S1:縦方向ストリート S2:横方向ストリート D:デバイス
W2:裏面
T1:保護テープ T2、T3:粘着テープ
F:フレーム
1:レーザ光 2:脆性領域 3:押圧ローラー 4:切削ブレード 5:研削砥石
Claims (1)
- 縦方向及び横方向のストリートによって区画されて表面に複数のデバイスが形成されたウェーハの表面に保護テープを貼着し、
該ストリートを分離させるために、該ウェーハに対してその裏面側からレーザ光を照射して該ストリートの内部に脆性領域を形成する予備加工を施す予備加工工程と、
該予備加工されたウェーハの裏面が上を向いた状態で、該ウェーハをリング状のフレームの開口部に載置すると共に、該フレームの上面及び該ウェーハの裏面に粘着テープを貼着する粘着テープ貼着工程と、
該粘着テープが貼着された状態のウェーハに所定の加工を施す加工工程と
を少なくとも含むウェーハの加工方法であって、
該粘着テープ貼着工程において、該ストリートに対して45度の方向に押圧ローラーを移動させて該粘着テープを該ウェーハの裏面に押圧して貼着した後、該ウェーハの表面から該保護テープを該ストリートに対して45度の方向に剥離し、
該加工工程において、該ストリートに外力を加えて該ウェーハを個々のデバイスに分割するウェーハの加工方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005189540A JP4705418B2 (ja) | 2005-06-29 | 2005-06-29 | ウェーハの加工方法 |
US11/447,130 US20070004177A1 (en) | 2005-06-29 | 2006-06-06 | Wafer processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005189540A JP4705418B2 (ja) | 2005-06-29 | 2005-06-29 | ウェーハの加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007012751A JP2007012751A (ja) | 2007-01-18 |
JP4705418B2 true JP4705418B2 (ja) | 2011-06-22 |
Family
ID=37590148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005189540A Active JP4705418B2 (ja) | 2005-06-29 | 2005-06-29 | ウェーハの加工方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070004177A1 (ja) |
JP (1) | JP4705418B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006272862A (ja) * | 2005-03-30 | 2006-10-12 | Tdk Corp | セラミックグリーンシートの切断装置及び切断方法 |
JP5645593B2 (ja) * | 2010-10-21 | 2014-12-24 | 株式会社ディスコ | ウエーハの分割方法 |
JP5803049B2 (ja) * | 2011-06-13 | 2015-11-04 | 株式会社東京精密 | 半導体基板の切断方法 |
JP5825511B2 (ja) * | 2011-06-13 | 2015-12-02 | 株式会社東京精密 | 半導体基板の切断方法 |
JP2014150109A (ja) * | 2013-01-31 | 2014-08-21 | Disco Abrasive Syst Ltd | 減圧処理装置 |
JP6481050B2 (ja) * | 2015-05-08 | 2019-03-13 | 富士フイルム株式会社 | デバイス基板及び半導体デバイスの製造方法 |
JP5900811B2 (ja) * | 2015-08-28 | 2016-04-06 | 株式会社東京精密 | 半導体基板の割断方法 |
JP7020660B2 (ja) * | 2016-11-29 | 2022-02-16 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法及び分断装置 |
JP6951124B2 (ja) * | 2017-05-23 | 2021-10-20 | 株式会社ディスコ | 加工方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002211506A (ja) * | 2001-01-15 | 2002-07-31 | Matsushita Electric Ind Co Ltd | 部品形成用基板の搬送方法 |
JP2003077944A (ja) * | 2001-06-22 | 2003-03-14 | Nitto Denko Corp | 接着フィルム付き半導体ウェハの製造方法 |
JP2003124146A (ja) * | 2001-10-11 | 2003-04-25 | Lintec Corp | 保護シート剥離方法及び装置 |
JP2004001076A (ja) * | 2002-03-12 | 2004-01-08 | Hamamatsu Photonics Kk | レーザ加工方法 |
JP2004165570A (ja) * | 2002-11-15 | 2004-06-10 | Nitto Denko Corp | 半導体ウエハからの保護テープ除去方法およびその装置 |
JP2004349623A (ja) * | 2003-05-26 | 2004-12-09 | Disco Abrasive Syst Ltd | 非金属基板の分割方法 |
US20050126694A1 (en) * | 2003-12-15 | 2005-06-16 | Nitto Denko Corporation | Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same |
JP2006013000A (ja) * | 2004-06-23 | 2006-01-12 | Sekisui Chem Co Ltd | Icチップの製造方法 |
JP2006024743A (ja) * | 2004-07-08 | 2006-01-26 | Lintec Corp | シート貼付装置 |
JP2006100413A (ja) * | 2004-09-28 | 2006-04-13 | Tokyo Seimitsu Co Ltd | フィルム貼付方法およびフィルム貼付装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3562720A (en) * | 1969-03-24 | 1971-02-09 | Intercontinental Systems Inc | Input/output system |
CA1245285A (en) * | 1986-06-27 | 1988-11-22 | Chester Schrade | Ac voltage regulator |
US6262600B1 (en) * | 2000-02-14 | 2001-07-17 | Analog Devices, Inc. | Isolator for transmitting logic signals across an isolation barrier |
JP2004311576A (ja) * | 2003-04-03 | 2004-11-04 | Toshiba Corp | 半導体装置の製造方法 |
EP1634436A1 (en) * | 2003-05-29 | 2006-03-15 | TDK Semiconductor Corporation | A method and apparatus for full duplex signaling across a pulse transformer |
JP2005028423A (ja) * | 2003-07-09 | 2005-02-03 | Disco Abrasive Syst Ltd | レーザー加工方法およびレーザー加工装置 |
US7167081B2 (en) * | 2003-10-14 | 2007-01-23 | Strumpf David M | Communication module and process for networking within and between powered communication devices over a multi-phase power distribution system or subsystem |
-
2005
- 2005-06-29 JP JP2005189540A patent/JP4705418B2/ja active Active
-
2006
- 2006-06-06 US US11/447,130 patent/US20070004177A1/en not_active Abandoned
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002211506A (ja) * | 2001-01-15 | 2002-07-31 | Matsushita Electric Ind Co Ltd | 部品形成用基板の搬送方法 |
JP2003077944A (ja) * | 2001-06-22 | 2003-03-14 | Nitto Denko Corp | 接着フィルム付き半導体ウェハの製造方法 |
JP2003124146A (ja) * | 2001-10-11 | 2003-04-25 | Lintec Corp | 保護シート剥離方法及び装置 |
JP2004001076A (ja) * | 2002-03-12 | 2004-01-08 | Hamamatsu Photonics Kk | レーザ加工方法 |
JP2004165570A (ja) * | 2002-11-15 | 2004-06-10 | Nitto Denko Corp | 半導体ウエハからの保護テープ除去方法およびその装置 |
JP2004349623A (ja) * | 2003-05-26 | 2004-12-09 | Disco Abrasive Syst Ltd | 非金属基板の分割方法 |
US20050126694A1 (en) * | 2003-12-15 | 2005-06-16 | Nitto Denko Corporation | Protective tape joining method and apparatus using the same as well as protective tape separating method and apparatus using the same |
JP2006013000A (ja) * | 2004-06-23 | 2006-01-12 | Sekisui Chem Co Ltd | Icチップの製造方法 |
JP2006024743A (ja) * | 2004-07-08 | 2006-01-26 | Lintec Corp | シート貼付装置 |
JP2006100413A (ja) * | 2004-09-28 | 2006-04-13 | Tokyo Seimitsu Co Ltd | フィルム貼付方法およびフィルム貼付装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2007012751A (ja) | 2007-01-18 |
US20070004177A1 (en) | 2007-01-04 |
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