TWI722109B - 絕緣被覆導電粒子、異向導電性接著劑及連接結構體 - Google Patents

絕緣被覆導電粒子、異向導電性接著劑及連接結構體 Download PDF

Info

Publication number
TWI722109B
TWI722109B TW106104320A TW106104320A TWI722109B TW I722109 B TWI722109 B TW I722109B TW 106104320 A TW106104320 A TW 106104320A TW 106104320 A TW106104320 A TW 106104320A TW I722109 B TWI722109 B TW I722109B
Authority
TW
Taiwan
Prior art keywords
particles
insulating
layer
conductive particles
conductive
Prior art date
Application number
TW106104320A
Other languages
English (en)
Chinese (zh)
Other versions
TW201803960A (zh
Inventor
中川昌之
赤井邦彦
江尻芳則
山崎将平
渡辺靖
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW201803960A publication Critical patent/TW201803960A/zh
Application granted granted Critical
Publication of TWI722109B publication Critical patent/TWI722109B/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/12—Treatment with organosilicon compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW106104320A 2016-02-10 2017-02-10 絕緣被覆導電粒子、異向導電性接著劑及連接結構體 TWI722109B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-023927 2016-02-10
JP2016023927 2016-02-10

Publications (2)

Publication Number Publication Date
TW201803960A TW201803960A (zh) 2018-02-01
TWI722109B true TWI722109B (zh) 2021-03-21

Family

ID=59563916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106104320A TWI722109B (zh) 2016-02-10 2017-02-10 絕緣被覆導電粒子、異向導電性接著劑及連接結構體

Country Status (5)

Country Link
JP (1) JP6798509B2 (ja)
KR (1) KR102649185B1 (ja)
CN (2) CN113345624B (ja)
TW (1) TWI722109B (ja)
WO (1) WO2017138483A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102180143B1 (ko) * 2017-12-29 2020-11-17 국도화학 주식회사 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및／또는 이를 포함하는 반도체 장치
CN112740338B (zh) * 2018-11-07 2022-09-06 日本化学工业株式会社 包覆颗粒和包含其的导电性材料、和包覆颗粒的制造方法
DE102019107633A1 (de) * 2019-03-25 2020-10-29 Sphera Technology Gmbh Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems
CN115428097A (zh) * 2020-10-06 2022-12-02 德山金属株式会社 导电粒子、导电材料以及连接结构体
KR102598343B1 (ko) * 2020-10-06 2023-11-06 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050086A (ja) * 2008-07-23 2010-03-04 Hitachi Chem Co Ltd 絶縁被覆導電粒子及びその製造方法
JP2014017213A (ja) * 2012-07-11 2014-01-30 Hitachi Chemical Co Ltd 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤
JP2015187983A (ja) * 2014-03-10 2015-10-29 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE759730R (fr) 1969-12-03 1971-05-17 Ekco Instr Ltd Appareil indicateur ou detecteur pour un rayonnement nucleaire,tel que des rayons
JP4563110B2 (ja) * 2004-08-20 2010-10-13 積水化学工業株式会社 導電性微粒子の製造方法
US20080070146A1 (en) * 2006-09-15 2008-03-20 Cabot Corporation Hydrophobic-treated metal oxide
US8202502B2 (en) * 2006-09-15 2012-06-19 Cabot Corporation Method of preparing hydrophobic silica
JP5899063B2 (ja) * 2011-06-22 2016-04-06 積水化学工業株式会社 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
US9150736B2 (en) * 2012-11-27 2015-10-06 Ppg Industries Ohio, Inc. Methods of coating an electrically conductive substrate and related electrodepositable compositions
JP5926942B2 (ja) * 2011-12-09 2016-05-25 サカタインクス株式会社 非磁性静電荷像現像用トナーの製造方法
JP6151990B2 (ja) * 2012-07-03 2017-06-21 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6480661B2 (ja) * 2012-07-03 2019-03-13 積水化学工業株式会社 絶縁性粒子付き導電性粒子の製造方法、導電材料の製造方法及び接続構造体の製造方法
KR20140017213A (ko) 2012-07-31 2014-02-11 건국대학교 산학협력단 카르도 구조를 갖는 황산화 고분자 전해질막 및 이를 포함하는 연료전지
JP6318025B2 (ja) * 2013-06-27 2018-04-25 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6577723B2 (ja) * 2014-03-10 2019-09-18 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP6379761B2 (ja) * 2014-07-09 2018-08-29 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050086A (ja) * 2008-07-23 2010-03-04 Hitachi Chem Co Ltd 絶縁被覆導電粒子及びその製造方法
JP2014017213A (ja) * 2012-07-11 2014-01-30 Hitachi Chemical Co Ltd 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤
JP2015187983A (ja) * 2014-03-10 2015-10-29 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
TW201803960A (zh) 2018-02-01
JP6798509B2 (ja) 2020-12-09
WO2017138483A1 (ja) 2017-08-17
JPWO2017138483A1 (ja) 2018-12-20
CN113345624A (zh) 2021-09-03
CN113345624B (zh) 2023-05-12
CN108604481A (zh) 2018-09-28
KR102649185B1 (ko) 2024-03-18
KR20180110019A (ko) 2018-10-08

Similar Documents

Publication Publication Date Title
TWI722109B (zh) 絕緣被覆導電粒子、異向導電性接著劑及連接結構體
TWI603345B (zh) 導電粒子、異向性導電接著劑膜及連接構造體
JP4563110B2 (ja) 導電性微粒子の製造方法
TWI774656B (zh) 導電粒子、絕緣被覆導電粒子、異向導電性接著劑、連接結構體及導電粒子的製造方法
KR20130026991A (ko) 절연 피복용 입자, 절연 피복 도전 입자, 이방 도전 재료 및 접속 구조체
TWI721096B (zh) 導電粒子、絕緣被覆導電粒子、異向導電性接著劑、連接結構體及導電粒子的製造方法
JP2011150975A (ja) 異方導電性フィルム
JP5667557B2 (ja) 導電性微粒子および異方性導電材料
KR20220100631A (ko) 도전성 입자, 그 제조 방법 및 그것을 포함하는 도전성 재료
JP6825324B2 (ja) 絶縁被覆導電粒子と、それを用いた異方導電性接着剤及び接続構造体
JP5434626B2 (ja) 回路接続用接着剤及び異方導電性フィルム
KR20220100632A (ko) 도전성 입자, 그 제조 방법 및 그것을 포함하는 도전성 재료
WO2023171631A1 (ja) 導電粒子、回路接続用接着フィルム及びその製造方法、並びに、接続構造体及びその製造方法
WO2023171630A1 (ja) 導電粒子、回路接続用接着フィルム及びその製造方法、並びに、接続構造体及びその製造方法
JP5883283B2 (ja) 導電性粒子及び異方性導電材料
CN118830030A (zh) 导电粒子、电路连接用黏合膜及其制造方法、以及连接结构体及其制造方法
CN118872005A (zh) 导电粒子、电路连接用黏合膜及其制造方法、以及连接结构体及其制造方法
JP5667541B2 (ja) 導電性微粒子及びそれを含む異方性導電材料