TWI716524B - 覆銅積層體及印刷線路板 - Google Patents

覆銅積層體及印刷線路板 Download PDF

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Publication number
TWI716524B
TWI716524B TW106100257A TW106100257A TWI716524B TW I716524 B TWI716524 B TW I716524B TW 106100257 A TW106100257 A TW 106100257A TW 106100257 A TW106100257 A TW 106100257A TW I716524 B TWI716524 B TW I716524B
Authority
TW
Taiwan
Prior art keywords
clad laminate
copper
bis
adhesive layer
component
Prior art date
Application number
TW106100257A
Other languages
English (en)
Chinese (zh)
Other versions
TW201736118A (zh
Inventor
田崎崇司
塩谷淳
山口貴史
杦本啓輔
中村太陽
Original Assignee
日商荒川化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荒川化學工業股份有限公司 filed Critical 日商荒川化學工業股份有限公司
Publication of TW201736118A publication Critical patent/TW201736118A/zh
Application granted granted Critical
Publication of TWI716524B publication Critical patent/TWI716524B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW106100257A 2016-01-05 2017-01-05 覆銅積層體及印刷線路板 TWI716524B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-000423 2016-01-05
JP2016000423 2016-01-05

Publications (2)

Publication Number Publication Date
TW201736118A TW201736118A (zh) 2017-10-16
TWI716524B true TWI716524B (zh) 2021-01-21

Family

ID=59306122

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106100257A TWI716524B (zh) 2016-01-05 2017-01-05 覆銅積層體及印刷線路板

Country Status (4)

Country Link
JP (1) JP6825368B2 (ja)
KR (1) KR20170082130A (ja)
CN (1) CN107009697A (ja)
TW (1) TWI716524B (ja)

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* Cited by examiner, † Cited by third party
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WO2018062405A1 (ja) * 2016-09-29 2018-04-05 積水化学工業株式会社 硬化体及び多層基板
JP7479781B2 (ja) 2017-02-28 2024-05-09 日鉄ケミカル＆マテリアル株式会社 金属張積層板、接着シート、接着性ポリイミド樹脂組成物及び回路基板
TWI637405B (zh) * 2017-03-15 2018-10-01 臻鼎科技股份有限公司 低介電樹脂組合物及應用其的膠片及電路板
JP7271146B2 (ja) * 2017-12-28 2023-05-11 日鉄ケミカル＆マテリアル株式会社 ダイマージアミン組成物、その製造方法及び樹脂フィルム
US11950376B2 (en) 2018-03-30 2024-04-02 Mitsui Mining & Smelting Co., Ltd. Copper-clad laminate
CN110871606B (zh) * 2018-09-03 2023-05-16 日铁化学材料株式会社 覆金属层叠板、粘接片、粘接性聚酰亚胺树脂组合物及电路基板
JP7203409B2 (ja) * 2018-10-25 2023-01-13 ユニチカ株式会社 ビスマレイミド
JP6539404B1 (ja) * 2018-12-13 2019-07-03 日本メクトロン株式会社 金属層付基板
CN112048240B (zh) * 2019-06-06 2022-03-01 达迈科技股份有限公司 底漆组成物、金属积层板及其制法
WO2020255871A1 (ja) * 2019-06-17 2020-12-24 株式会社クラレ 金属張積層体の製造方法
CN111040156B (zh) * 2019-11-28 2022-05-31 李南文 一种耐溶剂且高尺寸稳定性的交联型聚酰亚胺薄膜
JP7302461B2 (ja) * 2019-12-10 2023-07-04 トヨタ紡織株式会社 ポリアミド化合物、及びその製造方法
JP2021106248A (ja) * 2019-12-27 2021-07-26 日鉄ケミカル＆マテリアル株式会社 金属張積層板及び回路基板
CN111303424B (zh) * 2020-04-15 2022-10-21 江阴骏驰新材料科技有限公司 一种透明的高分子材料组合物及其应用
US20240043637A1 (en) * 2021-03-25 2024-02-08 Nippon Kayaku Kabushiki Kaisha Thermally curable resin composition, cured object, resin sheet, prepreg, metal-clad laminate, multilayered printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device
CN116829619A (zh) * 2021-03-25 2023-09-29 日本化药株式会社 树脂组合物、硬化物、树脂片材、预浸体、覆金属箔层叠板、多层印刷配线板、密封用材料、纤维加强复合材料、接着剂及半导体装置
CN113677089B (zh) * 2021-08-11 2023-03-10 华为技术有限公司 一种印刷电路板、天线系统和电子设备
JP2023147328A (ja) * 2022-03-30 2023-10-13 藤森工業株式会社 接着剤付金属基材及び積層体
JP2023147329A (ja) * 2022-03-30 2023-10-13 藤森工業株式会社 接着剤付金属基材及び積層体

Citations (2)

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TW201511941A (zh) * 2013-09-30 2015-04-01 Nippon Steel & Sumikin Chem Co 覆銅積層板、印刷配線板及其使用方法
TWI493007B (zh) * 2012-02-24 2015-07-21 Arakawa Chem Ind A polyimide-based adhesive composition, a hardened product, an adhesive sheet, a laminate, and a flexible printed substrate

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JP2003105199A (ja) * 2001-09-28 2003-04-09 Sumitomo Bakelite Co Ltd ポリイミド樹脂組成物溶液およびフィルム状接着剤
TWI461119B (zh) * 2009-01-20 2014-11-11 Toyoboseki Kabushikikaisha 多層氟樹脂膜及印刷配線板
JP2010238926A (ja) * 2009-03-31 2010-10-21 Nippon Mining & Metals Co Ltd プリント配線板用銅箔及びその製造方法
JP2011108848A (ja) * 2009-11-17 2011-06-02 Ube Nitto Kasei Co Ltd 絶縁性機能膜付き金属箔、フレキシブル金属張り積層板、電子部品実装モジュールおよびその製造方法
JP5534378B2 (ja) * 2012-02-24 2014-06-25 荒川化学工業株式会社 ポリイミド系接着剤組成物、硬化物、接着シート、積層体、フレキシブルプリント基板
JP2014138020A (ja) * 2013-01-15 2014-07-28 Nippon Kayaku Co Ltd 高周波回路用プリント配線基板
WO2014208644A1 (ja) * 2013-06-28 2014-12-31 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム及び金属張積層体
JP6234802B2 (ja) * 2013-12-18 2017-11-22 株式会社有沢製作所 積層体
JP6261037B2 (ja) * 2014-02-06 2018-01-17 古河電気工業株式会社 高周波回路用銅箔、銅張積層板及びプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493007B (zh) * 2012-02-24 2015-07-21 Arakawa Chem Ind A polyimide-based adhesive composition, a hardened product, an adhesive sheet, a laminate, and a flexible printed substrate
TW201511941A (zh) * 2013-09-30 2015-04-01 Nippon Steel & Sumikin Chem Co 覆銅積層板、印刷配線板及其使用方法

Also Published As

Publication number Publication date
TW201736118A (zh) 2017-10-16
JP6825368B2 (ja) 2021-02-03
KR20170082130A (ko) 2017-07-13
JP2017121807A (ja) 2017-07-13
CN107009697A (zh) 2017-08-04

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