TWI713274B - 電氣特性之檢查方法、及半導體裝置之製造方法 - Google Patents

電氣特性之檢查方法、及半導體裝置之製造方法 Download PDF

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Publication number
TWI713274B
TWI713274B TW106110315A TW106110315A TWI713274B TW I713274 B TWI713274 B TW I713274B TW 106110315 A TW106110315 A TW 106110315A TW 106110315 A TW106110315 A TW 106110315A TW I713274 B TWI713274 B TW I713274B
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TW
Taiwan
Prior art keywords
semiconductor device
electrode
adhesive film
conductive adhesive
anisotropic conductive
Prior art date
Application number
TW106110315A
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English (en)
Chinese (zh)
Other versions
TW201803236A (zh
Inventor
本庄慶司
大和田保
樋口靖幸
金子純一
Original Assignee
日商迪睿合股份有限公司
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Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW201803236A publication Critical patent/TW201803236A/zh
Application granted granted Critical
Publication of TWI713274B publication Critical patent/TWI713274B/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2868—Complete testing stations; systems; procedures; software aspects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
TW106110315A 2016-04-12 2017-03-28 電氣特性之檢查方法、及半導體裝置之製造方法 TWI713274B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2016-079852 2016-04-12
JP2016079852A JP2017191688A (ja) 2016-04-12 2016-04-12 電気特性の検査方法

Publications (2)

Publication Number Publication Date
TW201803236A TW201803236A (zh) 2018-01-16
TWI713274B true TWI713274B (zh) 2020-12-11

Family

ID=60041742

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106110315A TWI713274B (zh) 2016-04-12 2017-03-28 電氣特性之檢查方法、及半導體裝置之製造方法

Country Status (4)

Country Link
JP (1) JP2017191688A (ja)
KR (2) KR102124550B1 (ja)
TW (1) TWI713274B (ja)
WO (1) WO2017179390A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI694530B (zh) * 2019-03-08 2020-05-21 致茂電子股份有限公司 電子元件測試方法以及測試探針
CN113109610B (zh) * 2021-04-06 2021-10-26 北京中微普业科技有限公司 一种rf裸芯片扁平探针测试工装

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11305185A (ja) * 1998-04-17 1999-11-05 Ricoh Co Ltd 検査装置および方法
TWI276252B (en) * 2002-08-27 2007-03-11 Jsr Corp Anisotropic conductive plate and manufacturing method and applications thereof
JP2007064936A (ja) * 2005-09-02 2007-03-15 Jsr Corp 回路基板の検査装置および回路基板の検査方法
CN1967261A (zh) * 2005-11-16 2007-05-23 松下电器产业株式会社 检查装置及检查方法
JP2012114319A (ja) * 2010-11-26 2012-06-14 Seiko Epson Corp マザー基板、電子部品の検査方法、電子部品、及び電子部品の製造方法、並びに電子機器
JP2014178212A (ja) * 2013-03-14 2014-09-25 Ricoh Co Ltd 半導体試験装置および半導体の試験方法
JP2014192210A (ja) * 2013-03-26 2014-10-06 Renesas Electronics Corp 半導体装置、半導体装置の製造方法、および半導体装置の検査方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06784Y2 (ja) * 1986-10-17 1994-01-05 理化電子株式会社 電子部品の検査用治具
JPH0855648A (ja) 1994-08-12 1996-02-27 Shinano Polymer Kk エラストマーコネクター
JPH08148213A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JP3616031B2 (ja) * 2001-05-10 2005-02-02 富士通株式会社 異方導電性シート、その製造方法、電子装置及び動作試験用検査装置
JP2004288911A (ja) * 2003-03-24 2004-10-14 Casio Comput Co Ltd 半導体ウエハ試験装置およびその試験方法
JP5049694B2 (ja) 2007-08-07 2012-10-17 ルネサスエレクトロニクス株式会社 プローブカード、半導体検査装置および半導体装置の製造方法
KR101551898B1 (ko) * 2007-10-05 2015-09-09 신꼬오덴기 고교 가부시키가이샤 배선 기판, 반도체 장치 및 이들의 제조 방법
CN109166649B (zh) * 2012-08-24 2021-04-13 迪睿合电子材料有限公司 各向异性导电膜及其制造方法
JP2014066527A (ja) * 2012-09-24 2014-04-17 National Institute Of Advanced Industrial & Technology 積層ｌｓｉの接続状態の検査方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11305185A (ja) * 1998-04-17 1999-11-05 Ricoh Co Ltd 検査装置および方法
TWI276252B (en) * 2002-08-27 2007-03-11 Jsr Corp Anisotropic conductive plate and manufacturing method and applications thereof
JP2007064936A (ja) * 2005-09-02 2007-03-15 Jsr Corp 回路基板の検査装置および回路基板の検査方法
CN1967261A (zh) * 2005-11-16 2007-05-23 松下电器产业株式会社 检查装置及检查方法
JP2012114319A (ja) * 2010-11-26 2012-06-14 Seiko Epson Corp マザー基板、電子部品の検査方法、電子部品、及び電子部品の製造方法、並びに電子機器
JP2014178212A (ja) * 2013-03-14 2014-09-25 Ricoh Co Ltd 半導体試験装置および半導体の試験方法
JP2014192210A (ja) * 2013-03-26 2014-10-06 Renesas Electronics Corp 半導体装置、半導体装置の製造方法、および半導体装置の検査方法

Also Published As

Publication number Publication date
KR20200074244A (ko) 2020-06-24
TW201803236A (zh) 2018-01-16
KR102320098B1 (ko) 2021-11-02
JP2017191688A (ja) 2017-10-19
KR20180104733A (ko) 2018-09-21
KR102124550B1 (ko) 2020-06-18
WO2017179390A1 (ja) 2017-10-19

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