TWI711090B - 在氧化物接合晶圓堆疊中的晶粒封裝 - Google Patents

在氧化物接合晶圓堆疊中的晶粒封裝 Download PDF

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TWI711090B
TWI711090B TW106143303A TW106143303A TWI711090B TW I711090 B TWI711090 B TW I711090B TW 106143303 A TW106143303 A TW 106143303A TW 106143303 A TW106143303 A TW 106143303A TW I711090 B TWI711090 B TW I711090B
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wafer
cavity
semiconductor
assembly
die
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TW106143303A
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TW201907493A (zh
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約翰 德瑞普
傑森 米爾恩
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美商雷神公司
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  • Wire Bonding (AREA)
  • Micromachines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW106143303A 2017-05-16 2017-12-11 在氧化物接合晶圓堆疊中的晶粒封裝 TWI711090B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/596,663 2017-05-16
US15/596,663 US10242967B2 (en) 2017-05-16 2017-05-16 Die encapsulation in oxide bonded wafer stack

Publications (2)

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TW201907493A TW201907493A (zh) 2019-02-16
TWI711090B true TWI711090B (zh) 2020-11-21

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US (2) US10242967B2 (https=)
EP (1) EP3625825A1 (https=)
JP (1) JP6826214B2 (https=)
KR (2) KR102196673B1 (https=)
CN (1) CN110494975A (https=)
CA (1) CA3062895C (https=)
IL (1) IL268996B (https=)
SG (1) SG11201907133XA (https=)
TW (1) TWI711090B (https=)
WO (1) WO2018212785A1 (https=)

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TWI721183B (zh) * 2016-06-20 2021-03-11 美商蝴蝶網路公司 用於微製造超音波傳感器的電接點配置
US9859245B1 (en) * 2016-09-19 2018-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. Chip package structure with bump and method for forming the same
US11625523B2 (en) 2016-12-14 2023-04-11 iCometrue Company Ltd. Logic drive based on standard commodity FPGA IC chips
TWI892242B (zh) 2016-12-14 2025-08-01 成真股份有限公司 標準大宗商品化現場可編程邏輯閘陣列(fpga)積體電路晶片組成之邏輯驅動器
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