JPWO2025004919A1 - - Google Patents
Info
- Publication number
- JPWO2025004919A1 JPWO2025004919A1 JP2025529674A JP2025529674A JPWO2025004919A1 JP WO2025004919 A1 JPWO2025004919 A1 JP WO2025004919A1 JP 2025529674 A JP2025529674 A JP 2025529674A JP 2025529674 A JP2025529674 A JP 2025529674A JP WO2025004919 A1 JPWO2025004919 A1 JP WO2025004919A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/698—Semiconductor materials that are electrically insulating, e.g. undoped silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023103878 | 2023-06-26 | ||
| PCT/JP2024/022172 WO2025004919A1 (ja) | 2023-06-26 | 2024-06-19 | 複合部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025004919A1 true JPWO2025004919A1 (https=) | 2025-01-02 |
| JPWO2025004919A5 JPWO2025004919A5 (https=) | 2026-02-13 |
Family
ID=93939018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025529674A Pending JPWO2025004919A1 (https=) | 2023-06-26 | 2024-06-19 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20260011631A1 (https=) |
| JP (1) | JPWO2025004919A1 (https=) |
| CN (1) | CN120826780A (https=) |
| WO (1) | WO2025004919A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5536980B2 (ja) * | 2007-11-27 | 2014-07-02 | パナソニック株式会社 | 実装方法 |
| US9741649B2 (en) * | 2014-06-04 | 2017-08-22 | Invensas Corporation | Integrated interposer solutions for 2D and 3D IC packaging |
| US11302592B2 (en) * | 2017-03-08 | 2022-04-12 | Mediatek Inc. | Semiconductor package having a stiffener ring |
| US10242967B2 (en) * | 2017-05-16 | 2019-03-26 | Raytheon Company | Die encapsulation in oxide bonded wafer stack |
| JP7242342B2 (ja) * | 2019-02-22 | 2023-03-20 | 三菱重工業株式会社 | マルチチップモジュール、電子機器およびマルチチップモジュールの製造方法 |
-
2024
- 2024-06-19 WO PCT/JP2024/022172 patent/WO2025004919A1/ja not_active Ceased
- 2024-06-19 JP JP2025529674A patent/JPWO2025004919A1/ja active Pending
- 2024-06-19 CN CN202480017141.6A patent/CN120826780A/zh active Pending
-
2025
- 2025-09-09 US US19/323,548 patent/US20260011631A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN120826780A (zh) | 2025-10-21 |
| US20260011631A1 (en) | 2026-01-08 |
| WO2025004919A1 (ja) | 2025-01-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251113 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251113 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20260427 |