TWI704581B - 導電材料及連接構造體 - Google Patents

導電材料及連接構造體 Download PDF

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Publication number
TWI704581B
TWI704581B TW105127115A TW105127115A TWI704581B TW I704581 B TWI704581 B TW I704581B TW 105127115 A TW105127115 A TW 105127115A TW 105127115 A TW105127115 A TW 105127115A TW I704581 B TWI704581 B TW I704581B
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TW
Taiwan
Prior art keywords
solder
electrode
conductive
temperature
particles
Prior art date
Application number
TW105127115A
Other languages
English (en)
Chinese (zh)
Other versions
TW201721663A (zh
Inventor
永田麻衣
定永周治郎
伊藤将大
久保田敬士
石澤英亮
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW201721663A publication Critical patent/TW201721663A/zh
Application granted granted Critical
Publication of TWI704581B publication Critical patent/TWI704581B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Powder Metallurgy (AREA)
TW105127115A 2015-08-24 2016-08-24 導電材料及連接構造體 TWI704581B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-165213 2015-08-24
JP2015165213 2015-08-24

Publications (2)

Publication Number Publication Date
TW201721663A TW201721663A (zh) 2017-06-16
TWI704581B true TWI704581B (zh) 2020-09-11

Family

ID=58100331

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105127115A TWI704581B (zh) 2015-08-24 2016-08-24 導電材料及連接構造體

Country Status (5)

Country Link
JP (2) JP6294973B2 (ja)
KR (1) KR102605910B1 (ja)
CN (1) CN107636773B (ja)
TW (1) TWI704581B (ja)
WO (1) WO2017033934A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200631240A (en) * 2005-02-24 2006-09-01 Sony Chemicals Corp Insulation-coated electroconductive particles
CN100546757C (zh) * 2005-04-01 2009-10-07 旭化成电子材料株式会社 导电性填料和焊料
JP2012097226A (ja) * 2010-11-04 2012-05-24 Asahi Kasei E-Materials Corp 異方導電性接着フィルム及び接続構造体
TW201340121A (zh) * 2012-02-21 2013-10-01 Sekisui Chemical Co Ltd 導電性粒子、導電性粒子之製造方法、導電材料及連接構造體
TW201344711A (zh) * 2012-03-26 2013-11-01 Sekisui Chemical Co Ltd 導電材料及連接構造體

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
JP3769688B2 (ja) 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 端子間の接続方法及び半導体装置の実装方法
CN101501154B (zh) 2006-08-25 2013-05-15 住友电木株式会社 粘合带、接合体和半导体封装件
JP5491856B2 (ja) * 2007-03-19 2014-05-14 ナミックス株式会社 異方性導電ペースト
JP5851071B1 (ja) * 2014-03-07 2016-02-03 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200631240A (en) * 2005-02-24 2006-09-01 Sony Chemicals Corp Insulation-coated electroconductive particles
CN100546757C (zh) * 2005-04-01 2009-10-07 旭化成电子材料株式会社 导电性填料和焊料
JP2012097226A (ja) * 2010-11-04 2012-05-24 Asahi Kasei E-Materials Corp 異方導電性接着フィルム及び接続構造体
TW201340121A (zh) * 2012-02-21 2013-10-01 Sekisui Chemical Co Ltd 導電性粒子、導電性粒子之製造方法、導電材料及連接構造體
TW201344711A (zh) * 2012-03-26 2013-11-01 Sekisui Chemical Co Ltd 導電材料及連接構造體

Also Published As

Publication number Publication date
KR20180042148A (ko) 2018-04-25
JP6294973B2 (ja) 2018-03-14
TW201721663A (zh) 2017-06-16
JP2018133336A (ja) 2018-08-23
CN107636773B (zh) 2019-09-27
CN107636773A (zh) 2018-01-26
JPWO2017033934A1 (ja) 2017-10-12
WO2017033934A1 (ja) 2017-03-02
KR102605910B1 (ko) 2023-11-24

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