KR102605910B1 - 도전 재료 및 접속 구조체 - Google Patents

도전 재료 및 접속 구조체 Download PDF

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Publication number
KR102605910B1
KR102605910B1 KR1020177023799A KR20177023799A KR102605910B1 KR 102605910 B1 KR102605910 B1 KR 102605910B1 KR 1020177023799 A KR1020177023799 A KR 1020177023799A KR 20177023799 A KR20177023799 A KR 20177023799A KR 102605910 B1 KR102605910 B1 KR 102605910B1
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KR
South Korea
Prior art keywords
solder
electrode
temperature
conductive particles
conductive
Prior art date
Application number
KR1020177023799A
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English (en)
Korean (ko)
Other versions
KR20180042148A (ko
Inventor
마이 나가따
슈우지로우 사다나가
마사히로 이또우
다까시 구보따
히데아끼 이시자와
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20180042148A publication Critical patent/KR20180042148A/ko
Application granted granted Critical
Publication of KR102605910B1 publication Critical patent/KR102605910B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Wire Bonding (AREA)
KR1020177023799A 2015-08-24 2016-08-23 도전 재료 및 접속 구조체 KR102605910B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-165213 2015-08-24
JP2015165213 2015-08-24
PCT/JP2016/074531 WO2017033934A1 (ja) 2015-08-24 2016-08-23 導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
KR20180042148A KR20180042148A (ko) 2018-04-25
KR102605910B1 true KR102605910B1 (ko) 2023-11-24

Family

ID=58100331

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177023799A KR102605910B1 (ko) 2015-08-24 2016-08-23 도전 재료 및 접속 구조체

Country Status (5)

Country Link
JP (2) JP6294973B2 (ja)
KR (1) KR102605910B1 (ja)
CN (1) CN107636773B (ja)
TW (1) TWI704581B (ja)
WO (1) WO2017033934A1 (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
JP3769688B2 (ja) 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 端子間の接続方法及び半導体装置の実装方法
JP5099284B2 (ja) * 2005-02-24 2012-12-19 ソニーケミカル＆インフォメーションデバイス株式会社 異方性接続シート材料
KR100995779B1 (ko) * 2005-04-01 2010-11-22 아사히 가세이 일렉트로닉스 가부시끼가이샤 도전성 필러 및 땜납 재료
JPWO2008023452A1 (ja) 2006-08-25 2010-01-07 住友ベークライト株式会社 接着テープ、接合体および半導体パッケージ
TWI476266B (zh) * 2007-03-19 2015-03-11 Namics Corp 異方性導電膏
JP2012097226A (ja) * 2010-11-04 2012-05-24 Asahi Kasei E-Materials Corp 異方導電性接着フィルム及び接続構造体
CN103443869B (zh) * 2012-02-21 2015-10-21 积水化学工业株式会社 导电性粒子、导电性粒子的制造方法、导电材料及连接结构体
WO2013146604A1 (ja) * 2012-03-26 2013-10-03 積水化学工業株式会社 導電材料及び接続構造体
CN105684096B (zh) * 2014-03-07 2018-04-17 积水化学工业株式会社 导电糊剂、连接结构体及连接结构体的制造方法

Also Published As

Publication number Publication date
KR20180042148A (ko) 2018-04-25
JP6294973B2 (ja) 2018-03-14
WO2017033934A1 (ja) 2017-03-02
TWI704581B (zh) 2020-09-11
JP2018133336A (ja) 2018-08-23
JPWO2017033934A1 (ja) 2017-10-12
TW201721663A (zh) 2017-06-16
CN107636773A (zh) 2018-01-26
CN107636773B (zh) 2019-09-27

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