TWI702670B - 處理腔室中排列的基板處理設備及其作業方法 - Google Patents

處理腔室中排列的基板處理設備及其作業方法 Download PDF

Info

Publication number
TWI702670B
TWI702670B TW105114563A TW105114563A TWI702670B TW I702670 B TWI702670 B TW I702670B TW 105114563 A TW105114563 A TW 105114563A TW 105114563 A TW105114563 A TW 105114563A TW I702670 B TWI702670 B TW I702670B
Authority
TW
Taiwan
Prior art keywords
base
disk
metal ring
magnet
center
Prior art date
Application number
TW105114563A
Other languages
English (en)
Chinese (zh)
Other versions
TW201701390A (zh
Inventor
金起範
史勝曄
禹覽
李明振
崔承大
崔鐘聖
許浩範
Original Assignee
南韓商周星工程股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商周星工程股份有限公司 filed Critical 南韓商周星工程股份有限公司
Publication of TW201701390A publication Critical patent/TW201701390A/zh
Application granted granted Critical
Publication of TWI702670B publication Critical patent/TWI702670B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
TW105114563A 2015-05-11 2016-05-11 處理腔室中排列的基板處理設備及其作業方法 TWI702670B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20150065094 2015-05-11
KR10-2015-0065094 2015-05-11
KR1020150097515A KR102508025B1 (ko) 2015-05-11 2015-07-09 공정챔버 내부에 배치되는 기판 처리장치 및 그 작동방법
KR10-2015-0097515 2015-07-09

Publications (2)

Publication Number Publication Date
TW201701390A TW201701390A (zh) 2017-01-01
TWI702670B true TWI702670B (zh) 2020-08-21

Family

ID=57537945

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105114563A TWI702670B (zh) 2015-05-11 2016-05-11 處理腔室中排列的基板處理設備及其作業方法

Country Status (5)

Country Link
US (2) US10229849B2 (enExample)
JP (1) JP6959696B2 (enExample)
KR (1) KR102508025B1 (enExample)
CN (2) CN107667421B (enExample)
TW (1) TWI702670B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102508025B1 (ko) * 2015-05-11 2023-03-10 주성엔지니어링(주) 공정챔버 내부에 배치되는 기판 처리장치 및 그 작동방법
KR20190140373A (ko) * 2018-06-11 2019-12-19 캐논 톡키 가부시키가이샤 기판 회전 장치 및 기판 회전 방법
CN110643949B (zh) * 2019-10-29 2022-08-05 苏州华楷微电子有限公司 一种公转式半导体蒸发台的蒸发方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206288A (ja) * 2008-02-27 2009-09-10 Mtc:Kk 薄型基板回転処理装置
KR20090116236A (ko) * 2008-05-06 2009-11-11 삼성전기주식회사 화학 기상 증착 장치
KR20130061802A (ko) * 2011-12-02 2013-06-12 주식회사 케이씨텍 회전하는 서셉터 포켓을 구비한 증착장치

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01184277A (ja) * 1988-01-18 1989-07-21 Matsushita Electric Ind Co Ltd 基板回転装置
US5795448A (en) * 1995-12-08 1998-08-18 Sony Corporation Magnetic device for rotating a substrate
DE19811873A1 (de) * 1997-03-19 1998-09-24 Materials Research Corp Verfahren und Vorrichtung zum Variieren der Substratgeschwindigkeit während eines Sputterprozesses
JP2001526953A (ja) * 1997-12-22 2001-12-25 ユナキス・トレーディング・アクチェンゲゼルシャフト 真空処理装置
JP4470680B2 (ja) * 2004-10-12 2010-06-02 日立電線株式会社 気相成長装置
KR101200372B1 (ko) * 2005-06-15 2012-11-12 주성엔지니어링(주) 박막 제조 장치 및 이를 이용한 박막 증착 방법
FR2922358B1 (fr) * 2007-10-16 2013-02-01 Hydromecanique & Frottement Procede de traitement de surface d'au moins une piece au moyen de sources elementaires de plasma par resonance cyclotronique electronique
KR100957525B1 (ko) 2008-01-18 2010-05-11 이석태 반도체 및 평기판 회전장비용 전원장치
JP5276388B2 (ja) * 2008-09-04 2013-08-28 東京エレクトロン株式会社 成膜装置及び基板処理装置
KR20100046962A (ko) * 2008-10-28 2010-05-07 세메스 주식회사 기판 이송 장치
KR20110116901A (ko) 2010-04-20 2011-10-26 엘아이지에이디피 주식회사 서셉터 회전장치 및 이를 이용한 화학기상 증착장치
US20120305036A1 (en) * 2011-06-01 2012-12-06 Lam Research Ag Device for treating surfaces of wafer-shaped articles
JP6017817B2 (ja) * 2011-12-15 2016-11-02 住友化学株式会社 表面処理装置、表面処理方法、基板支持機構およびプログラム
JP5344204B2 (ja) * 2012-03-05 2013-11-20 三菱マテリアル株式会社 表面被覆切削工具
JP6050944B2 (ja) * 2012-04-05 2016-12-21 東京エレクトロン株式会社 プラズマエッチング方法及びプラズマ処理装置
CN103322996B (zh) * 2013-06-20 2016-04-13 上海交通大学 电磁驱动静电检测体声波谐振三轴微陀螺及其制备方法
JP6330630B2 (ja) * 2014-11-13 2018-05-30 東京エレクトロン株式会社 成膜装置
KR102508025B1 (ko) * 2015-05-11 2023-03-10 주성엔지니어링(주) 공정챔버 내부에 배치되는 기판 처리장치 및 그 작동방법
JP6507953B2 (ja) * 2015-09-08 2019-05-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009206288A (ja) * 2008-02-27 2009-09-10 Mtc:Kk 薄型基板回転処理装置
KR20090116236A (ko) * 2008-05-06 2009-11-11 삼성전기주식회사 화학 기상 증착 장치
KR20130061802A (ko) * 2011-12-02 2013-06-12 주식회사 케이씨텍 회전하는 서셉터 포켓을 구비한 증착장치

Also Published As

Publication number Publication date
CN114005783A (zh) 2022-02-01
JP2018515930A (ja) 2018-06-14
US20190164801A1 (en) 2019-05-30
US20180144968A1 (en) 2018-05-24
KR102508025B1 (ko) 2023-03-10
US10229849B2 (en) 2019-03-12
KR20160132743A (ko) 2016-11-21
US10818534B2 (en) 2020-10-27
TW201701390A (zh) 2017-01-01
JP6959696B2 (ja) 2021-11-05
CN107667421B (zh) 2021-10-01
CN107667421A (zh) 2018-02-06

Similar Documents

Publication Publication Date Title
TWI702670B (zh) 處理腔室中排列的基板處理設備及其作業方法
CN101501833B (zh) 支撑基片的装置
JP4300523B2 (ja) エピタキシャル成長装置
TW201207138A (en) Deposition apparatus
JP7248465B2 (ja) 基板処理装置のスピンチャック
KR20170092105A (ko) 기판 처리 장치
JP7055806B2 (ja) 基板処理装置
KR20160073281A (ko) 공정챔버 내부에 배치되는 기판 가공장치
JP4862002B2 (ja) 薄型基板回転処理装置
CN111719140A (zh) 用于气相沉积设备的晶圆承载装置
KR101523944B1 (ko) 웨이퍼 코팅장치
JP2018515930A5 (enExample)
TWM597509U (zh) 旋轉裝置及其晶舟裝置
KR102408889B1 (ko) 기판 처리 장치
KR101136536B1 (ko) 자석을 이용한 코팅 장치
TW202018108A (zh) 3d蒸鍍之公自轉鍍鍋結構
TWI694538B (zh) 處理腔室中排列的基板處理設備及其作業方法
KR102510956B1 (ko) 기판 처리장치
KR101389188B1 (ko) 웨이퍼 양면 연마 장치
KR101321582B1 (ko) 밸런싱 기능을 갖는 서셉터 및 이를 이용하는 증착 공정장비
WO2004077538A1 (ja) 研磨装置、研磨方法及び半導体デバイスの製造方法
JP3490394B2 (ja) マスク位置決め装置
JPS6253774A (ja) スピンナ装置
KR101420091B1 (ko) 코팅 면을 가진 진공 척
JPH01134945A (ja) ウエハ保持装置