CN114005783A - 布置在处理室中的基板处理设备及其操作方法 - Google Patents

布置在处理室中的基板处理设备及其操作方法 Download PDF

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Publication number
CN114005783A
CN114005783A CN202111132309.2A CN202111132309A CN114005783A CN 114005783 A CN114005783 A CN 114005783A CN 202111132309 A CN202111132309 A CN 202111132309A CN 114005783 A CN114005783 A CN 114005783A
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CN
China
Prior art keywords
disk
metal ring
magnet
susceptor
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111132309.2A
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English (en)
Chinese (zh)
Inventor
金起范
史胜晔
禹览
李明振
崔承大
崔鐘圣
许浩范
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jusung Engineering Co Ltd
Original Assignee
Jusung Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jusung Engineering Co Ltd filed Critical Jusung Engineering Co Ltd
Publication of CN114005783A publication Critical patent/CN114005783A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
CN202111132309.2A 2015-05-11 2016-05-10 布置在处理室中的基板处理设备及其操作方法 Pending CN114005783A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR10-2015-0065094 2015-05-11
KR20150065094 2015-05-11
KR10-2015-0097515 2015-07-09
KR1020150097515A KR102508025B1 (ko) 2015-05-11 2015-07-09 공정챔버 내부에 배치되는 기판 처리장치 및 그 작동방법
CN201680027285.5A CN107667421B (zh) 2015-05-11 2016-05-10 布置在处理室中的基板处理设备及其操作方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201680027285.5A Division CN107667421B (zh) 2015-05-11 2016-05-10 布置在处理室中的基板处理设备及其操作方法

Publications (1)

Publication Number Publication Date
CN114005783A true CN114005783A (zh) 2022-02-01

Family

ID=57537945

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202111132309.2A Pending CN114005783A (zh) 2015-05-11 2016-05-10 布置在处理室中的基板处理设备及其操作方法
CN201680027285.5A Active CN107667421B (zh) 2015-05-11 2016-05-10 布置在处理室中的基板处理设备及其操作方法

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Country Status (5)

Country Link
US (2) US10229849B2 (enExample)
JP (1) JP6959696B2 (enExample)
KR (1) KR102508025B1 (enExample)
CN (2) CN114005783A (enExample)
TW (1) TWI702670B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102508025B1 (ko) * 2015-05-11 2023-03-10 주성엔지니어링(주) 공정챔버 내부에 배치되는 기판 처리장치 및 그 작동방법
KR20190140373A (ko) * 2018-06-11 2019-12-19 캐논 톡키 가부시키가이샤 기판 회전 장치 및 기판 회전 방법
CN110643949B (zh) * 2019-10-29 2022-08-05 苏州华楷微电子有限公司 一种公转式半导体蒸发台的蒸发方法

Citations (7)

* Cited by examiner, † Cited by third party
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JPH01184277A (ja) * 1988-01-18 1989-07-21 Matsushita Electric Ind Co Ltd 基板回転装置
JPH1121668A (ja) * 1997-03-19 1999-01-26 Materials Res Corp 基板回転装置及び基板回転方法
US6454908B1 (en) * 1997-12-22 2002-09-24 Unaxis Trading Ag Vacuum treatment system
CN101828246A (zh) * 2007-10-16 2010-09-08 H.E.F.公司 通过电子回旋共振产生的等离子体基本源来处理至少一个零件的表面的方法
KR20130061802A (ko) * 2011-12-02 2013-06-12 주식회사 케이씨텍 회전하는 서셉터 포켓을 구비한 증착장치
CN104169030A (zh) * 2012-03-05 2014-11-26 三菱综合材料株式会社 表面包覆切削工具
US20160138159A1 (en) * 2014-11-13 2016-05-19 Tokyo Electron Limited Film forming apparatus

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US5795448A (en) * 1995-12-08 1998-08-18 Sony Corporation Magnetic device for rotating a substrate
JP4470680B2 (ja) * 2004-10-12 2010-06-02 日立電線株式会社 気相成長装置
KR101200372B1 (ko) * 2005-06-15 2012-11-12 주성엔지니어링(주) 박막 제조 장치 및 이를 이용한 박막 증착 방법
KR100957525B1 (ko) 2008-01-18 2010-05-11 이석태 반도체 및 평기판 회전장비용 전원장치
JP4862002B2 (ja) 2008-02-27 2012-01-25 株式会社エムテーシー 薄型基板回転処理装置
KR101053047B1 (ko) * 2008-05-06 2011-08-01 삼성엘이디 주식회사 화학 기상 증착 장치
JP5276388B2 (ja) * 2008-09-04 2013-08-28 東京エレクトロン株式会社 成膜装置及び基板処理装置
KR20100046962A (ko) * 2008-10-28 2010-05-07 세메스 주식회사 기판 이송 장치
KR20110116901A (ko) 2010-04-20 2011-10-26 엘아이지에이디피 주식회사 서셉터 회전장치 및 이를 이용한 화학기상 증착장치
US20120305036A1 (en) * 2011-06-01 2012-12-06 Lam Research Ag Device for treating surfaces of wafer-shaped articles
JP6017817B2 (ja) * 2011-12-15 2016-11-02 住友化学株式会社 表面処理装置、表面処理方法、基板支持機構およびプログラム
JP6050944B2 (ja) * 2012-04-05 2016-12-21 東京エレクトロン株式会社 プラズマエッチング方法及びプラズマ処理装置
CN103322996B (zh) * 2013-06-20 2016-04-13 上海交通大学 电磁驱动静电检测体声波谐振三轴微陀螺及其制备方法
KR102508025B1 (ko) * 2015-05-11 2023-03-10 주성엔지니어링(주) 공정챔버 내부에 배치되는 기판 처리장치 및 그 작동방법
JP6507953B2 (ja) * 2015-09-08 2019-05-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01184277A (ja) * 1988-01-18 1989-07-21 Matsushita Electric Ind Co Ltd 基板回転装置
JPH1121668A (ja) * 1997-03-19 1999-01-26 Materials Res Corp 基板回転装置及び基板回転方法
US6454908B1 (en) * 1997-12-22 2002-09-24 Unaxis Trading Ag Vacuum treatment system
CN101828246A (zh) * 2007-10-16 2010-09-08 H.E.F.公司 通过电子回旋共振产生的等离子体基本源来处理至少一个零件的表面的方法
KR20130061802A (ko) * 2011-12-02 2013-06-12 주식회사 케이씨텍 회전하는 서셉터 포켓을 구비한 증착장치
CN104169030A (zh) * 2012-03-05 2014-11-26 三菱综合材料株式会社 表面包覆切削工具
US20160138159A1 (en) * 2014-11-13 2016-05-19 Tokyo Electron Limited Film forming apparatus

Also Published As

Publication number Publication date
US20180144968A1 (en) 2018-05-24
KR102508025B1 (ko) 2023-03-10
CN107667421B (zh) 2021-10-01
US20190164801A1 (en) 2019-05-30
JP2018515930A (ja) 2018-06-14
TW201701390A (zh) 2017-01-01
JP6959696B2 (ja) 2021-11-05
CN107667421A (zh) 2018-02-06
KR20160132743A (ko) 2016-11-21
US10818534B2 (en) 2020-10-27
US10229849B2 (en) 2019-03-12
TWI702670B (zh) 2020-08-21

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