TWI698989B - 影像傳感晶片的封裝方法以及封裝結構 - Google Patents

影像傳感晶片的封裝方法以及封裝結構 Download PDF

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TWI698989B
TWI698989B TW105131852A TW105131852A TWI698989B TW I698989 B TWI698989 B TW I698989B TW 105131852 A TW105131852 A TW 105131852A TW 105131852 A TW105131852 A TW 105131852A TW I698989 B TWI698989 B TW I698989B
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photosensitive ink
wafer
opening
image sensor
sensor chip
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TW105131852A
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TW201714291A (zh
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王之奇
王卓偉
謝國梁
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大陸商蘇州晶方半導體科技股份有限公司
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Priority claimed from CN201510649774.1A external-priority patent/CN105226036B/zh
Priority claimed from CN201520780060.XU external-priority patent/CN205050839U/zh
Application filed by 大陸商蘇州晶方半導體科技股份有限公司 filed Critical 大陸商蘇州晶方半導體科技股份有限公司
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Abstract

本發明提供影像傳感晶片封裝方法以及封裝結構，該封裝方法包括：提供晶圓，所述晶圓具有第一表面以及與所述第一表面相背的第二表面，所述晶圓具有多顆網格排列的影像傳感晶片，影像傳感晶片具有影像傳感區以及焊墊，所述影像傳感區以及焊墊位於所述第一表面側；於所述晶圓的第二表面形成切割槽以及與所述焊墊對應的開孔，所述開孔暴露出所述焊墊；在所述切割槽中填充第一感光油墨；在所述晶圓的第二表面塗佈第二感光油墨，使第二感光油墨覆蓋所述開孔並在所述開孔中形成空腔，該方法形成的影像傳感晶片封裝結構能有效避免第二感光油墨與開孔的底部接觸，提升了影像傳感晶片的封裝良率，提高了影像傳感晶片封裝結構的信賴性。

Description

影像傳感晶片的封裝方法以及封裝結構
本發明涉及半導體技術領域，尤其涉及晶圓級半導體晶片的封裝方法以及封裝結構。。
現今主流的半導體晶片封裝技術是晶圓級晶片尺寸封裝技術(Wafer Level Chip Size Packaging，WLCSP)，是對整片晶圓進行封裝並測試後再切割得到單個成品晶片的技術。利用此種封裝技術封裝後的單個成品晶片尺寸與單個晶粒尺寸差不多，順應了市場對微電子產品日益輕、小、短、薄化和低價化要求。晶圓級晶片尺寸封裝技術是當前封裝領域的熱點和未來發展的趨勢。
本發明提供一種影像傳感晶片的封裝方法，其能夠提高影像傳感晶片封裝結構的信賴性。該影像傳感晶片的封裝方法包括：提供晶圓，所述晶圓具有第一表面以及與所述第一表面相背的第二表面，所述晶圓具有多顆網格排列的影像傳感晶片，影像傳感晶片具有影像傳感區以及焊墊，所述影像傳感區以及焊墊位於所述第一表面側；於所述晶圓的第二表面形成切割槽以及與所述焊墊對應的開孔，所述開孔暴露出所述焊墊；在所述切割槽中填充第一感光油墨；在所述晶圓的第二表面塗佈第二感光油墨，使第二感光油墨覆蓋所述開孔並在所述開孔中形成空腔。
可選地，在所述切割槽中填充第一感光油墨的步驟包括：在所述晶圓的第二表面塗佈第一感光油墨使所述切割槽填充第一感光油墨；透過曝光顯影的方式將切割槽區域以外的第一感光油墨去除。
可選地，採用旋塗的方式在所述切割槽中填充第一感光油墨，採用旋塗的方式在所述晶圓的第二表面塗佈第二感光油墨，旋塗第一感光 油墨的旋塗速率小於旋塗第二感光油墨的旋塗速率。
可選地，所述第一感光油墨的黏度小於第二感光油墨的黏度。
可選地，所述第一感光油墨的黏度小於8Kcps，所述第二感光油墨的黏度大於12Kcps。
可選地，在所述晶圓第二表面形成切割槽以及開孔之前還包括：提供保護基板，所述保護基板上設置有網格排列的支撐單元，每一支撐單元對應一個影像傳感晶片；將所述晶圓的第一表面與所述保護基板對位壓合，所述支撐單元位於所述晶圓與所述保護基板之間；對所述晶圓的第二表面進行研磨減薄。
可選地，於所述晶圓的第二表面形成切割槽以及開孔的步驟包括：採用蝕刻工藝同時於所述晶圓的第二表面形成預切割槽以及開孔；利用切刀沿所述預切割槽切割，所述切刀切透所述晶圓的第一表面形成切割槽。
可選地，在塗佈第二感光油墨之前還包括：於所述開孔的側壁形成絕緣層；於所述絕緣層上以及所述開孔的底部形成再佈線層，使所述再佈線層與所述焊墊電連接；採用絲網印刷的方式在所述晶圓的第二表面塗佈第二感光油墨使所述第二感光油墨上形成多個通孔，所述通孔暴露出所述再佈線層；在所述通孔中形成焊球，所述焊球與所述再佈線層電連接。
可選地，在塗佈第二感光油墨之前還包括：於所述開孔的側壁形成絕緣層；於所述絕緣層上以及所述開孔的底部形成再佈線層，使所述再佈線層與所述焊墊電連接；採用旋塗的方式在所述晶圓的第二表面整面塗佈第二感光油墨；透過曝光顯影的方式在所述第二感光油墨上形成多個通孔使所述通孔暴露出所述再佈線層；在所述通孔中形成焊球，所述焊球與所述再佈線層電連接。
本發明還提供一種影像傳感晶片封裝結構，包括：基底，具有第一面以及與所述第一面相背的第二面；位於所述基底第一面的影像傳感區以及焊墊；位於所述第二面並向所述第一表面延伸的開孔，所述開孔與所述焊墊對應並暴露出所述焊墊；包覆所述基底側面的第一感光油墨；所述封裝結構還包括第二感光油墨，所述第二感光油墨覆蓋所述開孔並在所述開孔中形成空腔。
可選地，所述封裝結構還包括：與所述基底第一面對位壓合的保護基板；位於所述保護基板與所述基底之間的支撐單元，所述支撐單元包圍所述影像傳感區；所述第一感光油墨包覆部分所述支撐單元的側面。
可選地，所述第一感光油墨的黏度小於第二感光油墨的黏度。
可選地，所述第一感光油墨的黏度小於8Kcps，所述第二感光油墨的黏度大於12Kcps。
可選地，所述封裝結構還包括：位於所述開孔側壁的絕緣層；位於所述絕緣層上以及開孔底部的再佈線層，所述再佈線層與所述焊墊電連接；所述第二感光油墨覆蓋所述再佈線層，且在所述第二感光油墨上設置有通孔，所述通孔暴露出所述再佈線層；通孔中設置有焊球，所述焊球與所述再佈線層電連接。
根據本發明的封裝結構，在開孔中形成空腔，能有效避免再佈線層與焊墊脫離的情況，提升影像傳感晶片的封裝良率，提高影像傳感晶片封裝結構的信賴性。
1:晶圓
2:保護基板
3:支撐單元
10:影像傳感晶片
11:影像傳感區
12:焊墊
21:切割槽
22:開孔
23:絕緣層
24:再佈線層
25:焊球
26:防焊油墨
100:晶圓
101:第一表面
102:第二表面
103:切割槽
103’:預切割槽
110:影像傳感晶片
111:影像傳感區
112:焊墊
113:開孔
114、114’:絕緣層
115:再佈線層
116:焊球
117:第一感光油墨
118:第二感光油墨
119:空腔
200:保護基板
210:支撐單元
301:第一面
302:第二面
310:基底
1140:緩衝層
d:減薄後晶圓的厚度
D:減薄前晶圓的厚度
圖1為一種晶圓級影像傳感晶片的封裝結構示意圖；圖2為晶圓級影像傳感晶片的結構示意圖；圖3為根據本發明實施例的晶圓級影像傳感晶片封裝結構的剖面示意圖；圖4至圖12為根據本發明實施例的晶圓級影像傳感晶片封裝方法的示意圖；圖13為根據本發明實施例的單顆影像傳感晶片封裝結構示意圖。
以下將結合附圖對本發明的具體實施方式進行詳細描述。但這些實施方式並不限制本發明，本領域的普通技術入員根據這些實施方式所做出的結構、方法、或功能上的變換均包含在本發明的保護範圍內。
請參考圖1，公開一種晶圓級影像傳感晶片的封裝結構。晶圓1與保護基板2對位元壓合，支撐單元3位於晶圓1與保護基板2之間使兩者之 間形成間隙，避免保護基板2與晶圓1直接接觸。晶圓1包括多顆網格狀排列的影像傳感晶片10。影像傳感晶片10包括影像傳感區11以及焊墊12。多個支撐單元3網格狀排列於保護基板2上且與影像傳感晶片10對應。當保護基板2與晶圓1對位壓合後，支撐單元3包圍影像傳感區11。晶圓1具有第一表面以及與所述第一表面相背的第二表面。影像傳感區11以及焊墊12位於晶圓的第一表面側。
為了實現焊墊12與其他電路電連接，在晶圓1的第二表面側設置有朝向第一表面延伸的開孔22，開孔22與焊墊12對應且開孔22的底部暴露出焊墊12。在開孔22的側壁設置有絕緣層23，絕緣層23上以及開孔22的底部設置有再佈線層24。再佈線層24與焊墊12電連接。焊球25與再佈線層24電連接。透過焊球25電連接其他電路實現焊墊12與其他電路之間形成電連接。
為了便於將封裝完成的影像傳感晶片切割下來，於晶圓1的第二表面設置有朝向第一表面延伸的切割槽21。
在向晶圓1的第二表面排列焊球25之前，需要塗佈防焊油墨26。通常在切割槽21以及開孔22中也填充了防焊油墨26以達到保護、絕緣的效果。
然而，當防焊油墨26填滿開孔22時，防焊油墨與再佈線層完全接觸，在後續的回流焊以及信賴性測試中，防焊油墨26的熱脹冷縮形成作用於再佈線層24的力，在這種力的拉扯下，再佈線層24容易與焊墊12脫離，導致不良。
因此，在本發明一個實施例中，透過在開孔中形成空腔，使防焊油墨不與開孔底部的佈線層接觸，能夠有效防止再佈線層與焊墊脫離。
請參考圖2，為晶圓級影像傳感晶片的結構示意圖。晶圓100具有多顆網格排列的影像傳感晶片110，在影像傳感晶片110之間預留有空隙，後續完成封裝工藝以及測試之後，沿空隙分離影像傳感晶片。
每一影像傳感晶片110具有影像傳感區111以及多個焊墊112，焊墊112位於影像傳感區111的側邊且與影像傳感區111位於晶元100的同一表面側。
請參考圖3，為本發明一實施例晶圓級影像傳感晶片封裝結構的 剖面示意圖。保護基板200的其中一面設置有網格排列的多個支撐單元210，當晶圓100與保護基板200對位壓合後，支撐單元210位於晶圓100與保護基板200之間使兩者之間形成間隙，且支撐單元210與影像傳感晶片110一一對應，支撐單元210包圍影像傳感區111。
晶圓100具有第一表面101以及與第一表面101相背的第二表面102。影像傳感區111以及焊墊112位於第一表面101側。在晶圓的第二表面102具有朝向第一表面101延伸的切割槽103以及開孔113。每一開孔113與每一焊墊112的位置對應，且開孔113的底部暴露出焊墊112。
利用再佈線層115以及焊球116方便焊墊112與其他線路連接。具體地，開孔113的側壁以及晶圓100的第二表面102具有絕緣層114。在絕緣層114上以及開孔113的底部形成再佈線層115。再佈線層115與焊墊112電連接，且在晶圓100的第二表面102上設置有焊球116。焊球116與再佈線層115電連接。透過焊球116電連接其他電路實現焊墊112與其他電路之間形成電連接。
切割槽103內填充有第一感光油墨117，第二感光油墨118覆蓋開孔113且在開孔113中形成空腔119。第二感光油墨118上具有通孔，通孔暴露出再佈線層115，焊球116位於通孔內並與再佈線層115電連接。
於本實施例中，參閱圖3，第一感光油墨117部分溢出切割槽103。當然，本發明實施例不限定第一感光油墨117必須充滿或者溢出切割槽103，第一感光油墨117填充切割槽103的下半部分，第二感光油墨118填充切割槽103的上半部分並覆蓋切割槽103。本發明實施例中的第一感光油墨填充切割槽應理解為第一感光油墨至少填充切割槽的下半部分，而不限定必須充滿或者溢出切割槽。
為了在開孔113中形成空腔119，具體的封裝工藝如下。
提供晶圓100，晶圓100的結構示意圖請參考圖1。
提供保護基板200，在保護基板200的其中一面有網格排列的多個支撐單元210。於本實施例中，支撐單元210的材質為感光油墨，透過曝光顯影的方式形成於保護基板200的其中一面。
請參考圖4，將晶圓100與保護基板200對位壓合，利用黏合膠將晶圓100與保護基板200黏合。支撐單元210位於晶圓100與保護基板200之 間，三者包圍形成多個網格排列的密封空間。每一密封空間對應一個影像傳感晶片110。支撐單元210包圍影像傳感晶片110的影像傳感區111。
請參考圖5，對晶圓100的第二表面102進行研磨減薄。減薄前晶圓100的厚度為D，減薄後晶圓100的厚度為d。
請參考圖6，利用蝕刻工藝在晶圓100的第二表面102蝕刻出朝向晶圓100第一表面101的預切割槽103’以及開孔113。開孔113底部暴露出焊墊112。於本實施例中，預切割槽103’與開孔113的深度相同。當然，於此步驟中也可以僅僅蝕刻出開孔113而不蝕刻出預切割槽103’。
請參考圖7，從晶圓100的第二表面102朝向第一表面101的方向，利用切刀沿預切割槽103’切割，直至切透晶圓100的第一表面101形成切割槽103，即切刀切入支撐單元210一部分。由於晶圓100的材質較脆，韌性、延展性較差，切刀採用硬度較大的刀，如金屬刀。
請參考圖8(a)，在晶圓100的第二表面102、開孔113的側壁和底部以及切割槽103的內壁形成絕緣層114。於本實施例中，絕緣層114為有機絕緣材料，具有絕緣以及一定的柔性。採用噴塗或者旋塗工藝形成絕緣層114，然後透過雷射或者曝光顯影的方式暴露出焊墊112。
請參考圖8(b)，也可以在晶圓100的第二表面102、開孔113的側壁和底部以及切割槽103的內壁沉積絕緣層114’。絕緣層114’的材質為無機材料，通常為二氧化矽。由於二氧化矽抗衝擊能力不如有機絕緣材料114，還需要透過曝光顯影工藝在晶圓101的第二表面形成緩衝層1140以方便後續上焊球，然後採用蝕刻工藝蝕刻掉開孔113底部的絕緣層露出焊墊112。
請參考圖9，在絕緣層114(或者絕緣層114’)上形成再佈線層115，再佈線層115與焊墊112電連接。
本發明實施例關鍵要在切割槽103充滿感光油墨，而在開孔113中形成空腔119使感光油墨不接觸開孔113底部，避免感光油墨充滿開孔113。
具體地，請參考圖10，在切割槽103中填充第一感光油墨117。於本實施例中，透過旋塗工藝從晶圓100的第二表面102整面旋塗第一感光油墨117，再採用曝光顯影工藝將切割槽103區域以外的第一感光油墨117去除。
為了保證第一感光油墨117至少充滿切割槽103的下半部分，可以採用黏度較低的感光油墨或者降低旋塗工藝中的旋塗速率，使第一感光油墨充分填充至切割槽103的底部。透過添加稀釋劑可以降低感光油墨的黏度。在一種實現方式中，第一感光油墨117的黏度小於8Kcps。
請參考圖11，在晶圓100的第二表面102塗佈第二感光油墨118，使第二感光油墨118覆蓋開孔113並在開孔113中形成空腔119。第二感光油墨118形成阻焊層，方便後續上焊球工藝，具有阻焊、保護晶片的作用。
為了保證在開孔113中形成空腔119，可以採用黏度較高的感光油墨或者提高旋塗第二感光油墨118的旋塗速率，使第二感光油墨118無法填充開孔113的底部而只是覆蓋在開孔113的上半部分。在一種實現方式中，第二感光油墨118的黏度大於12Kcps。
在一種實現方式中，旋塗第一感光油墨117的旋塗速率小於旋塗第二感光油墨118的旋塗速率。
在一種實現方式中，第一感光油墨117的黏度小於第二感光油墨118的黏度。
為了方便後續上焊球，需要在第二感光油墨118對應再佈線層115的位置形成通孔。具體的，透過從晶圓100第二表面102整面塗佈第二感光油墨118，再固化、曝光顯影工藝形成通孔，通孔暴露出再佈線層115。當然，也可以透過絲網印刷的方式將第二感光油墨118塗佈至晶圓100的第二表面102且形成暴露再佈線層115的通孔。
請參考圖12，採用上焊球工藝，在通孔中形成焊球116使焊球116與再佈線層電連接。
最後，沿切割槽103從晶圓100的第二表面102朝向晶圓100的第一表面101切割晶圓100以及保護基板200，得到單顆的影像傳感晶片封裝結構。
請參考圖13，單顆影像傳感晶片封裝結構300包括從晶圓100上切割得到的基底310，其具有第一面301以及與第一面301相背的第二面302，影像傳感區111以及焊墊112位於第一面301，開孔113以及焊球116位於第二面302，基底310的側壁被感光油墨包覆。
於本實施例中，基底310的側壁被第一感光油墨117完全包覆， 當然，基底310的側壁靠近第二面302的部分側壁也可以由第二感光油墨118覆蓋包覆，即第一感光油墨117包覆部分支撐單元210的側壁以及基底靠近基底第一面301的部分基底側壁，基底靠近第二面302的部分側壁由第二感光油墨118覆蓋包覆。
當絕緣層114為有機絕緣材料時，再佈線層115與絕緣層114之間對應焊球116的位置可以不設置緩衝層1140。
當絕緣層114’為無機材料時，再佈線層115與絕緣層114之間對應焊球116的位置設置有緩衝層1140，緩衝層1140為光阻材料，可以採用曝光顯影工藝形成。
應當理解，雖然本說明書按照實施方式加以描述，但並非每個實施方式僅包含一個獨立的技術方案，說明書的這種敘述方式僅僅是為清楚起見，本領域技術人員應當將說明書作為一個整體，各實施方式中的技術方案也可以經適當組合，形成本領域技術人員可以理解的其他實施方式。
上文所列出的一系列的詳細說明僅僅是針對本發明的可行性實施方式的具體說明，它們並非用以限制本發明的保護範圍，凡未脫離本發明技藝精神所作的均等實施方式或變更均應包含在本發明的保護範圍之內。
本申請要求於2015年10月10日提交中國專利局、申請號為201510649774.1、發明名稱為“影像傳感晶片的封裝方法以及封裝結構”，以及於2015年10月10日提交中國專利局、申請號為201520780060.X、實用新型名稱為“影像傳感晶片封裝結構”的中國專利申請的優先權，其全部內容透過引用結合在本申請中。
100:晶圓
101:第一表面
102:第二表面
103:切割槽
110:影像傳感晶片
111:影像傳感區
112:焊墊
113:開孔
114:絕緣層
115:再佈線層
116:焊球
117:第一感光油墨
118:第二感光油墨
119:空腔
200:保護基板
210:支撐單元

Claims (14)

  1. 一種影像傳感晶片的封裝方法，包括：提供晶圓，所述晶圓具有第一表面以及與所述第一表面相背的第二表面，所述晶圓具有多顆網格排列的影像傳感晶片，所述影像傳感晶片具有影像傳感區以及焊墊，所述影像傳感區以及所述焊墊位於所述第一表面側；於所述晶圓的第二表面形成切割槽以及與所述焊墊對應的開孔，所述開孔暴露出所述焊墊；其中所述封裝方法還包括：在所述切割槽中填充第一感光油墨；在所述晶圓的第二表面塗佈第二感光油墨，使第二感光油墨覆蓋所述開孔並在所述開孔中形成空腔。
  2. 根據請求項1所述的影像傳感晶片封裝方法，其中在所述切割槽中填充第一感光油墨的步驟包括：在所述晶圓的第二表面塗佈第一感光油墨，使所述切割槽填充第一感光油墨；透過曝光顯影的方式將切割槽區域以外的第一感光油墨去除。
  3. 根據請求項1所述的影像傳感晶片封裝方法，其中採用旋塗的方式在所述切割槽中填充第一感光油墨，採用旋塗的方式在所述晶圓的第二表面塗佈第二感光油墨，旋塗第一感光油墨的旋塗速率小於旋塗第二感光油墨的旋塗速率。
  4. 根據請求項1所述的影像傳感晶片封裝方法，其中所述第一感光油墨的黏度小於第二感光油墨的黏度。
  5. 根據請求項4所述的影像傳感晶片封裝方法，其中所述第一感光油墨的黏度小於8Kcps，所述第二感光油墨的黏度大於12Kcps。
  6. 根據請求項1所述的影像傳感晶片封裝方法，其中在所述晶圓第二表面形成切割槽以及開孔之前還包括：提供保護基板，所述保護基板上設置有網格排列的支撐單元，每一支撐單元對應一個影像傳感晶片；將所述晶圓的第一表面與所述保護基板對位壓合，所述支撐單元位於所述晶圓與所述保護基板之間； 對所述晶圓的第二表面進行研磨減薄。
  7. 根據請求項1或6所述的影像傳感晶片封裝方法，其中於所述晶圓的第二表面形成切割槽以及開孔的步驟包括：採用蝕刻工藝同時於所述晶圓的第二表面形成預切割槽以及開孔；利用切刀沿所述預切割槽切割，所述切刀切透所述晶圓的第一表面形成切割槽。
  8. 根據請求項1所述的影像傳感晶片封裝方法，其中在塗佈第二感光油墨之前還包括：於所述開孔的側壁形成絕緣層；於所述絕緣層上以及所述開孔的底部形成再佈線層，使所述再佈線層與所述焊墊電連接；採用絲網印刷的方式在所述晶圓的第二表面塗佈第二感光油墨使所述第二感光油墨上形成多個通孔，所述通孔暴露出所述再佈線層；在所述通孔中形成焊球，所述焊球與所述再佈線層電連接。
  9. 根據請求項1所述的影像傳感晶片封裝方法，其中在塗佈第二感光油墨之前還包括：於所述開孔的側壁形成絕緣層；於所述絕緣層上以及所述開孔的底部形成再佈線層，使所述再佈線層與所述焊墊電連接；採用旋塗的方式在所述晶圓的第二表面整面塗佈第二感光油墨；透過曝光顯影的方式在所述第二感光油墨上形成多個通孔使所述通孔暴露出所述再佈線層；在所述通孔中形成焊球，所述焊球與所述再佈線層電連接。
  10. 一種影像傳感晶片封裝結構，包括：基底，具有第一面以及與所述第一面相背的第二面；位於所述基底第一面的影像傳感區以及焊墊；位於所述第二面並向所述第一表面延伸的開孔，所述開孔與所述焊墊對應並暴露出所述焊墊；包覆所述基底側面的第一感光油墨；其中： 所述封裝結構還包括第二感光油墨，所述第二感光油墨覆蓋所述開孔並在所述開孔中形成空腔。
  11. 根據請求項10所述的影像傳感晶片封裝結構，其中所述封裝結構還包括：與所述基底第一面對位壓合的保護基板；位於所述保護基板與所述基底之間的支撐單元，所述支撐單元包圍所述影像傳感區；所述第一感光油墨包覆部分所述支撐單元的側面。
  12. 根據請求項10所述的影像傳感晶片封裝結構，其中所述第一感光油墨的黏度小於第二感光油墨的黏度。
  13. 根據請求項12所述的影像傳感晶片封裝結構，其特徵在於，所述第一感光油墨的黏度小於8Kcps，所述第二感光油墨的黏度大於12Kcps。
  14. 根據請求項10所述的影像傳感晶片封裝結構，其中所述封裝結構還包括：位於所述開孔側壁的絕緣層；位於所述絕緣層上以及開孔底部的再佈線層，所述再佈線層與所述焊墊電連接；所述第二感光油墨覆蓋所述再佈線層，且在所述第二感光油墨上設置有通孔，所述通孔暴露出所述再佈線層；通孔中設置有焊球，所述焊球與所述再佈線層電連接。
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