TWI697378B - 具有維修區域的裝置 - Google Patents

具有維修區域的裝置 Download PDF

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Publication number
TWI697378B
TWI697378B TW106101027A TW106101027A TWI697378B TW I697378 B TWI697378 B TW I697378B TW 106101027 A TW106101027 A TW 106101027A TW 106101027 A TW106101027 A TW 106101027A TW I697378 B TWI697378 B TW I697378B
Authority
TW
Taiwan
Prior art keywords
main power
frame
panel
power switch
maintenance area
Prior art date
Application number
TW106101027A
Other languages
English (en)
Chinese (zh)
Other versions
TW201741067A (zh
Inventor
斎藤淳
吉田幹
風呂中武
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201741067A publication Critical patent/TW201741067A/zh
Application granted granted Critical
Publication of TWI697378B publication Critical patent/TWI697378B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
TW106101027A 2016-02-23 2017-01-12 具有維修區域的裝置 TWI697378B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016031901A JP6695625B2 (ja) 2016-02-23 2016-02-23 メンテナンス領域を有する装置
JP2016-031901 2016-02-23

Publications (2)

Publication Number Publication Date
TW201741067A TW201741067A (zh) 2017-12-01
TWI697378B true TWI697378B (zh) 2020-07-01

Family

ID=59675880

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106101027A TWI697378B (zh) 2016-02-23 2017-01-12 具有維修區域的裝置

Country Status (4)

Country Link
JP (1) JP6695625B2 (ja)
KR (1) KR102493113B1 (ja)
CN (1) CN107104066B (ja)
TW (1) TWI697378B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7446668B2 (ja) 2019-08-23 2024-03-11 株式会社ディスコ 加工廃液処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000325292A (ja) * 1999-05-24 2000-11-28 Olympus Optical Co Ltd 内視鏡用医療装置
JP2012109524A (ja) * 2010-10-25 2012-06-07 Origin Electric Co Ltd 電源装置
CN103367059A (zh) * 2013-08-02 2013-10-23 胡俊兵 一种高压智能断路器
CN203480647U (zh) * 2013-09-18 2014-03-12 刘雪东 一种电力检修安全保护器

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269299A (ja) * 1999-03-18 2000-09-29 Kokusai Electric Co Ltd 半導体製造装置
US6424097B1 (en) * 2000-05-12 2002-07-23 Infocus Corporation Projection lamp safety interlock apparatus and method
JP4119762B2 (ja) * 2003-01-31 2008-07-16 富士フイルム株式会社 記録メデイア保護機構
JP4961168B2 (ja) 2006-06-14 2012-06-27 株式会社ディスコ 加工装置
TWM327903U (en) * 2007-09-19 2008-03-01 Taian Etacom Technology Co Ltd Protective door lock of an insertion-type power distribution box
JP5086123B2 (ja) * 2008-02-15 2012-11-28 株式会社ディスコ 加工廃液処理装置
TWM366229U (en) * 2009-05-22 2009-10-01 Taian Etacom Technology Co Ltd Safety interlocking mechanism of jack-in type distribution box
CN102312624B (zh) * 2011-07-01 2013-11-13 广东北江开关厂有限公司 一种用于开关柜的前门与电缆室门的闭锁结构

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000325292A (ja) * 1999-05-24 2000-11-28 Olympus Optical Co Ltd 内視鏡用医療装置
JP2012109524A (ja) * 2010-10-25 2012-06-07 Origin Electric Co Ltd 電源装置
CN103367059A (zh) * 2013-08-02 2013-10-23 胡俊兵 一种高压智能断路器
CN203480647U (zh) * 2013-09-18 2014-03-12 刘雪东 一种电力检修安全保护器

Also Published As

Publication number Publication date
CN107104066B (zh) 2022-05-03
JP2017148888A (ja) 2017-08-31
KR20170099366A (ko) 2017-08-31
CN107104066A (zh) 2017-08-29
TW201741067A (zh) 2017-12-01
JP6695625B2 (ja) 2020-05-20
KR102493113B1 (ko) 2023-01-27

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