JP6695625B2 - メンテナンス領域を有する装置 - Google Patents
メンテナンス領域を有する装置 Download PDFInfo
- Publication number
- JP6695625B2 JP6695625B2 JP2016031901A JP2016031901A JP6695625B2 JP 6695625 B2 JP6695625 B2 JP 6695625B2 JP 2016031901 A JP2016031901 A JP 2016031901A JP 2016031901 A JP2016031901 A JP 2016031901A JP 6695625 B2 JP6695625 B2 JP 6695625B2
- Authority
- JP
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- Prior art keywords
- main power
- housing
- power switch
- rod
- panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000012423 maintenance Methods 0.000 title claims description 35
- 239000007788 liquid Substances 0.000 claims description 33
- 239000002699 waste material Substances 0.000 claims description 32
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 230000035515 penetration Effects 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 239000000706 filtrate Substances 0.000 description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000001914 filtration Methods 0.000 description 9
- 230000004308 accommodation Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003456 ion exchange resin Substances 0.000 description 2
- 229920003303 ion-exchange polymer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Machine Tool Units (AREA)
- Inverter Devices (AREA)
- Switch Cases, Indication, And Locking (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
4 筐体
4a 第1開口部
4b 第2開口部
6 カバー
8 配管
10 廃液タンク
12 廃液ポンプ
14 配管
16 電磁弁
18 濾過ユニット
20 フィルタ
22 濾液受けパン
24 配管
26 濾液タンク
28 圧力センサ
30 濾液ポンプ
32 配管
34 純水生成ユニット
36 紫外線光源
38 配管
40 第1イオン交換器
42 第2イオン交換器
44 電磁弁
46 電磁弁
48 配管
50 精密フィルタ
52 圧力センサ
54 比抵抗計
56 配管
58 温度調整ユニット
60 配管
62 蓋
64 開閉扉
66 入力パッド
68 モニタ
70 主電源スイッチ
70a 回転部
72 パネル
72a 受け部
74 ロッド
74a 第1フランジ部
74b 第2フランジ部
76 第1保持部
78 第2保持部
80 コイルばね
82 貫装部
82a 貫通穴
84 螺子
Claims (2)
- 筐体と、
主電源のオンとオフとを切り替えるための主電源スイッチと、
該筐体内に形成され、メンテナンスの時に作業者がアクセスするメンテナンス領域と、
該メンテナンス領域を覆うための開閉扉と、
該主電源がオンになるオン位置に該主電源スイッチを合わせた状態で該筐体に固定され、該主電源がオフになるオフ位置に該主電源スイッチを合わせた状態で該筐体から取り外すことのできるパネルと、
一端が該パネルで押止されるロッドと、
該開閉扉に形成され、該ロッドの他端側が挿入される貫通穴を有する貫装部と、を備え、
該開閉扉を閉じた状態で該パネルを該筐体に固定し該ロッドの一端の位置を規制することで、該ロッドは、他端側が該貫通穴に挿入される貫装位置に位置付けられ、
該主電源スイッチを該オフ位置に合わせて該パネルを該筐体から取り外すことで、該ロッドは、他端側が該貫通穴から抜去される抜去位置に位置付けられることを特徴とする廃液処理装置、切削装置、レーザー加工装置、研削装置、研磨装置、及び洗浄装置のいずれかであるメンテナンス領域を有する装置。 - 該パネルは、該主電源がオンになるオン位置に該主電源スイッチを合わせた状態で該主電源スイッチを囲むように該筐体に固定され、
該主電源スイッチを該オフ位置に合わせて該パネルを該筐体から取り外すことで、該ロッドは、一端側が該パネルに接触した状態で他端側が該貫通穴から抜去される抜去位置に位置付けられることを特徴とする請求項1に記載のメンテナンス領域を有する装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016031901A JP6695625B2 (ja) | 2016-02-23 | 2016-02-23 | メンテナンス領域を有する装置 |
TW106101027A TWI697378B (zh) | 2016-02-23 | 2017-01-12 | 具有維修區域的裝置 |
KR1020170019828A KR102493113B1 (ko) | 2016-02-23 | 2017-02-14 | 메인터넌스 영역을 갖는 장치 |
CN201710088953.1A CN107104066B (zh) | 2016-02-23 | 2017-02-20 | 具有维护区域的装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016031901A JP6695625B2 (ja) | 2016-02-23 | 2016-02-23 | メンテナンス領域を有する装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017148888A JP2017148888A (ja) | 2017-08-31 |
JP6695625B2 true JP6695625B2 (ja) | 2020-05-20 |
Family
ID=59675880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016031901A Active JP6695625B2 (ja) | 2016-02-23 | 2016-02-23 | メンテナンス領域を有する装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6695625B2 (ja) |
KR (1) | KR102493113B1 (ja) |
CN (1) | CN107104066B (ja) |
TW (1) | TWI697378B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7446668B2 (ja) * | 2019-08-23 | 2024-03-11 | 株式会社ディスコ | 加工廃液処理装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000269299A (ja) * | 1999-03-18 | 2000-09-29 | Kokusai Electric Co Ltd | 半導体製造装置 |
JP2000325292A (ja) * | 1999-05-24 | 2000-11-28 | Olympus Optical Co Ltd | 内視鏡用医療装置 |
US6424097B1 (en) * | 2000-05-12 | 2002-07-23 | Infocus Corporation | Projection lamp safety interlock apparatus and method |
JP4119762B2 (ja) * | 2003-01-31 | 2008-07-16 | 富士フイルム株式会社 | 記録メデイア保護機構 |
JP4961168B2 (ja) | 2006-06-14 | 2012-06-27 | 株式会社ディスコ | 加工装置 |
TWM327903U (en) * | 2007-09-19 | 2008-03-01 | Taian Etacom Technology Co Ltd | Protective door lock of an insertion-type power distribution box |
JP5086123B2 (ja) * | 2008-02-15 | 2012-11-28 | 株式会社ディスコ | 加工廃液処理装置 |
TWM366229U (en) * | 2009-05-22 | 2009-10-01 | Taian Etacom Technology Co Ltd | Safety interlocking mechanism of jack-in type distribution box |
JP5707240B2 (ja) * | 2010-10-25 | 2015-04-22 | オリジン電気株式会社 | 電源装置 |
CN102312624B (zh) * | 2011-07-01 | 2013-11-13 | 广东北江开关厂有限公司 | 一种用于开关柜的前门与电缆室门的闭锁结构 |
CN103367059B (zh) * | 2013-08-02 | 2016-03-16 | 胡俊兵 | 一种高压智能断路器 |
CN203480647U (zh) * | 2013-09-18 | 2014-03-12 | 刘雪东 | 一种电力检修安全保护器 |
-
2016
- 2016-02-23 JP JP2016031901A patent/JP6695625B2/ja active Active
-
2017
- 2017-01-12 TW TW106101027A patent/TWI697378B/zh active
- 2017-02-14 KR KR1020170019828A patent/KR102493113B1/ko active IP Right Grant
- 2017-02-20 CN CN201710088953.1A patent/CN107104066B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TWI697378B (zh) | 2020-07-01 |
CN107104066B (zh) | 2022-05-03 |
KR102493113B1 (ko) | 2023-01-27 |
TW201741067A (zh) | 2017-12-01 |
JP2017148888A (ja) | 2017-08-31 |
KR20170099366A (ko) | 2017-08-31 |
CN107104066A (zh) | 2017-08-29 |
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