TWI697378B - Device with maintenance area - Google Patents

Device with maintenance area Download PDF

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Publication number
TWI697378B
TWI697378B TW106101027A TW106101027A TWI697378B TW I697378 B TWI697378 B TW I697378B TW 106101027 A TW106101027 A TW 106101027A TW 106101027 A TW106101027 A TW 106101027A TW I697378 B TWI697378 B TW I697378B
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Taiwan
Prior art keywords
main power
frame
panel
power switch
maintenance area
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TW106101027A
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Chinese (zh)
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TW201741067A (en
Inventor
斎藤淳
吉田幹
風呂中武
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Abstract

提供即使不卸下框體之蓋體亦可以維修的具 有維修區域的裝置。 Provides tools that can be repaired even without removing the cover of the frame There are devices for maintenance areas.

為一種具有維修區域的裝置(2)，其具備： 框體(4)；主電源開關(70)，其係用以切換主電源之接通和斷開；維修區域，其係被形成在該框體內，於維修之時作業者檢修；開關門(64)，其係用以覆蓋該維修區域；面板，其係可以在將該主電源開關對準該主電源成為接通之接通位置之狀態下被固定在該框體，且在將該主電源開關對準該主電源成為斷開之斷開位置之狀態下從該框體卸下；桿體(74)，其一端在該面板被按壓卡止；及貫穿安裝部(82)，其被形成在該開關門，具有該桿體之另一端側被插入的貫通孔(82a)。 It is a device (2) with a maintenance area, which has: Frame (4); main power switch (70), which is used to switch the main power on and off; the maintenance area, which is formed in the frame, is inspected by the operator during maintenance; open and close the door ( 64), which is used to cover the maintenance area; the panel, which can be fixed on the frame with the main power switch being aligned with the main power to the on position, and the main power The power switch is aligned with the main power source and is removed from the frame when the main power is turned off; the rod body (74), one end of which is pressed and locked on the panel; and the penetrating installation part (82), which is The opening and closing door is formed with a through hole (82a) into which the other end of the rod body is inserted.

Description

具有維修區域的裝置 Device with maintenance area

本發明係關於具有於維修之時作業員檢修之維修區域的裝置。 The present invention relates to a device having a maintenance area that is checked by an operator during maintenance.

在加工半導體晶圓等之時所使用之各種裝置的框體，收容有各種構成要素。框體係以例如製作裝置之概略外形的骨架，覆蓋骨架之蓋體所構成，於維修內部之構成要素等之時，蓋體之一部分藉由作業員卸下(例如，參照專利文獻1)。 The housings of various devices used in processing semiconductor wafers, etc. contain various components. The frame system is composed of, for example, a skeleton of the outline shape of the manufacturing device and a cover covering the skeleton. When repairing internal components, a part of the cover is removed by an operator (for example, refer to Patent Document 1).

〔先前技術文獻〕 [Prior technical literature] 〔專利文獻〕 〔Patent Literature〕

[專利文獻1]日本特開2007-331050號公報 [Patent Document 1] JP 2007-331050 A

但是，每次維修卸下框體之蓋體，也不一定能夠充分提高作業之效率。在此，在此情況下，也有必須 與用以設置裝置之設置空間不同，另外確保用以暫時性保管卸下之蓋體的保管空間的問題。 However, removing the cover of the frame every time for maintenance may not be able to fully improve the efficiency of work. Here, in this case, there must be Different from the installation space for installing the device, there is also a problem of ensuring a storage space for temporarily storing the removed cover.

本發明係鑒於如此之問題點而創作出，其目的在於提供即使不卸下框體之蓋體亦可以維修之具有維修區域的裝置。 The present invention was created in view of such problems, and its purpose is to provide a device with a repair area that can be repaired even without removing the cover of the frame.

若藉由本發明之一態樣時，提供一種具有維修區域的裝置，其特徵在於，具備：框體；主電源開關，其係用以切換主電源之接通和斷開；維修區域，其係被形成在該框體內，於維修時作業者檢修；開關門，其係用以覆蓋該維修區域；面板，其係可以在將該主電源開關對準該主電源成為接通之接通位置之狀態下被固定在該框體，且在將該主電源開關對準該主電源成為斷開之斷開位置之狀態下從該框體卸下；桿體，其一端在該面板被按壓卡止；及貫穿安裝部，其被形成在該開關門，具有該桿體之另一端側被插入的貫通孔，在該關閉該開關門之狀態下，將該面板固定在該框體，且限制該桿體之一端的位置，依此該桿體被定位在另一端側被插入至該貫通孔之貫穿安裝位置，將該主電源開關對準該斷開位置而從該框體卸下該面板，依此該桿體被定位在另一端側從該貫通孔被拔去之拔去位置。 According to one aspect of the present invention, a device with a maintenance area is provided, which is characterized by having: a frame; a main power switch for switching the main power on and off; the maintenance area is It is formed in the frame for maintenance by the operator during maintenance; the door is opened and closed, which is used to cover the maintenance area; the panel, which can be positioned when the main power switch is aligned with the main power source to be turned on It is fixed to the frame in the state and removed from the frame with the main power switch aligned with the main power to the off position; the lever body, one end of which is pressed and locked on the panel And a penetrating mounting portion, which is formed in the opening and closing door, has a through hole into which the other end of the rod body is inserted, and in the state that the opening and closing door is closed, the panel is fixed to the frame and restricts the The position of one end of the rod body, whereby the rod body is positioned at the other end side to be inserted into the penetration installation position of the through hole, the main power switch is aligned to the off position and the panel is removed from the frame, Accordingly, the rod body is positioned at the unplugged position where the other end side is unplugged from the through hole.

在與本發明之一態樣有關的具有維修區域的裝置中，因具備有用以覆蓋被形成在框體之維修區域的開關門，故僅開啟該開關門即可以在維修區域檢修。即是，即使不卸下框體之蓋體亦可以維修裝置。 In the device with a maintenance area related to an aspect of the present invention, since the opening and closing door is provided to cover the maintenance area formed in the frame, the maintenance area can be inspected only by opening the opening and closing door. That is, the device can be repaired without removing the cover of the frame.

再者，在與本發明之一態樣有關之具有維修區域的裝置中，於開啟開關門之時，必須將主電源開關對準主電源成為斷開之斷開位置而使面板從框體卸下，且將另一端側被插入至貫通孔之桿體定位在拔去位置，而將該桿體之另一端側從貫通孔拔去。即是，因在主電源接通之狀態下，無法開啟開關門，故維修之時的安全性變高。 Furthermore, in a device with a maintenance area related to one aspect of the present invention, when opening and closing the door, the main power switch must be aligned with the main power source to be the off position to disconnect the panel from the frame. And position the rod with the other end inserted into the through hole at the removal position, and pull the other end of the rod from the through hole. That is, since the door cannot be opened and closed when the main power is turned on, the safety during maintenance becomes higher.

2:廢液處理裝置(具有維修區域的裝置) 2: Waste liquid treatment device (device with maintenance area)

4:框體 4: Frame

4a:第1開口部 4a: The first opening

4b:第2開口部 4b: The second opening

6:蓋體 6: Lid

8:配管 8: Piping

10:廢液槽 10: Waste tank

12:廢液泵 12: Waste liquid pump

14:配管 14: Piping

16:電磁閥 16: Solenoid valve

18:過濾單元 18: Filter unit

20:過濾器 20: filter

22:濾液承受盤 22: Filtrate receiving plate

24:配管 24: Piping

26:濾液槽 26: Filtrate tank

28:壓力感測器 28: Pressure sensor

30:濾液泵 30: Filtrate pump

32:配管 32: Piping

34:純水生成單元 34: Pure water generation unit

36:紫外線光源 36: Ultraviolet light source

38:配管 38: Piping

40‧‧‧第1離子交換器 40‧‧‧The first ion exchanger

42‧‧‧第2離子交換器 42‧‧‧The second ion exchanger

44‧‧‧電磁閥 44‧‧‧Solenoid valve

46‧‧‧電磁閥 46‧‧‧Solenoid valve

48‧‧‧配管 48‧‧‧Piping

50‧‧‧精密過濾器 50‧‧‧Precision filter

52‧‧‧壓力感測器 52‧‧‧Pressure sensor

54‧‧‧比電阻計 54‧‧‧Resistance Meter

56‧‧‧配管 56‧‧‧Piping

58‧‧‧溫度調整單元 58‧‧‧Temperature adjustment unit

60‧‧‧配管 60‧‧‧Piping

62‧‧‧蓋體 62‧‧‧Cover body

64‧‧‧開關門 64‧‧‧Open and close the door

66‧‧‧輸入墊 66‧‧‧Input Pad

68‧‧‧螢幕 68‧‧‧Screen

70‧‧‧主電源開關 70‧‧‧Main power switch

70a‧‧‧旋轉部 70a‧‧‧Rotating part

72‧‧‧面板 72‧‧‧Panel

72a‧‧‧承受部 72a‧‧‧Receiving Department

74‧‧‧桿體 74‧‧‧Pole body

74a‧‧‧第1凸緣部 74a‧‧‧First flange

74b‧‧‧第2凸緣部 74b‧‧‧Second flange

76‧‧‧第1保持部 76‧‧‧The first holding part

78‧‧‧第2保持部 78‧‧‧Second Holding Part

80‧‧‧線圈彈簧 80‧‧‧Coil spring

82‧‧‧貫穿安裝部 82‧‧‧through the installation department

82a‧‧‧貫通孔 82a‧‧‧Through hole

84‧‧‧螺絲 84‧‧‧Screw

圖1為表示示意性表示廢液處理裝置之外觀的斜視圖。 Fig. 1 is a perspective view schematically showing the appearance of a waste liquid treatment device.

圖2為示意性表示被收容在框體之構成要素之例的圖示。 Fig. 2 is a diagram schematically showing an example of constituent elements housed in a housing.

圖3為用以針對開關門之鎖定機構進行說明的一部分剖面俯視圖。 Fig. 3 is a partial cross-sectional plan view for explaining the locking mechanism for opening and closing doors.

圖4(A)及圖4(B)為用以針對安全機構進行說明的側面圖。 4(A) and 4(B) are side views for explaining the safety mechanism.

圖5為示意性表示開關門之鎖定被解除之狀態的一部分剖面俯視圖。 Fig. 5 is a partial cross-sectional plan view schematically showing a state where the lock of the opening and closing door is released.

參照附件圖面，針對與本發明之一態樣有關之實施型態進行說明。圖1為示意性表示用以處理於半導體晶圓之加工時產生的廢液等之廢液處理裝置之外觀的斜視圖。另外，在本實施型態中，作為具有維修區域之裝置，雖然舉出廢液處理裝置作為例而進行說明，但是與本發明有關之裝置即使為切削裝置、雷射加工裝置、研削裝置、研磨裝置、洗淨裝置等亦可。 With reference to the attached drawings, the implementation type related to one aspect of the present invention will be described. FIG. 1 is a perspective view schematically showing the appearance of a waste liquid processing apparatus for processing waste liquid and the like generated during the processing of semiconductor wafers. In addition, in this embodiment, as a device with a maintenance area, although a waste liquid treatment device is used as an example, the device related to the present invention is even a cutting device, a laser processing device, a grinding device, and a grinding device. Devices, washing devices, etc. are also possible.

如圖1所示般，廢液處理裝置(具有維修區域之裝置)2具備收容、搭載複數之構成要素，被搭載的框體4。框體4以代表例而言係由製作廢液處理裝置2之概略外形的骨架(無圖示)，和覆蓋骨架之複數的蓋體6所構成。在框體4之內部形成有用以收容構成要素之收容空間。 As shown in FIG. 1, the waste liquid treatment device (device with a maintenance area) 2 includes a housing 4 in which plural components are housed and mounted. As a representative example, the frame 4 is composed of a skeleton (not shown) that forms the outline of the waste liquid treatment device 2 and a plurality of covers 6 covering the skeleton. A storage space for accommodating components is formed inside the frame 4.

圖2為示意性表示被收容在框體4之構成要素之例的圖示。在框體4之收容空間如圖2所示般，收容有通過配管8而與切削裝置等之加工裝置(無圖示)連接的廢液槽10。該廢液槽10係通過配管8而貯留從加工裝置接取到的廢液。 FIG. 2 is a diagram schematically showing an example of the constituent elements housed in the housing 4. As shown in FIG. 2, in the housing space of the frame 4, a waste liquid tank 10 connected to a processing device (not shown) such as a cutting device through a pipe 8 is stored. The waste liquid tank 10 stores the waste liquid received from the processing device through the pipe 8.

在廢液槽10之上部，設置有用以將被貯留在廢液槽10之廢液送出至後段的廢液泵12。藉由廢液泵12而從廢液槽10被送出之廢液，通過配管14、電磁閥16等而被供給至過濾單元18。過濾單元18具備有用以過濾從廢液槽10被供給之廢液的過濾器20。 On the upper part of the waste liquid tank 10, a waste liquid pump 12 for sending the waste liquid stored in the waste liquid tank 10 to a later stage is provided. The waste liquid sent from the waste liquid tank 10 by the waste liquid pump 12 is supplied to the filter unit 18 through the pipe 14, the solenoid valve 16, and the like. The filtering unit 18 includes a filter 20 for filtering the waste liquid supplied from the waste liquid tank 10.

在過濾器20之下方，設置有接受過濾後之液體(濾液)之濾液承受盤22。在該濾液承受盤22，經由配管24等連接有濾液槽26，以過濾器20過濾廢液而取得的濾液，通過濾液承受盤22而被貯留在濾液槽26。 Below the filter 20, a filtrate receiving plate 22 for receiving the filtered liquid (filtrate) is provided. The filtrate receiving pan 22 is connected to a filtrate tank 26 via a pipe 24 or the like. The filtrate obtained by filtering the waste liquid with the filter 20 passes through the filtrate receiving pan 22 and is stored in the filtrate tank 26.

另外，在朝過濾單元18供給廢液之配管14，設置有用以檢測出廢液之壓力的壓力感測器28。壓力感測器28被連接於控制單元(無圖示)，包含以壓力感測器28所檢測出之壓力之資訊的訊號被送至控制單元。 In addition, the pipe 14 for supplying waste liquid to the filter unit 18 is provided with a pressure sensor 28 for detecting the pressure of the waste liquid. The pressure sensor 28 is connected to a control unit (not shown), and a signal containing information about the pressure detected by the pressure sensor 28 is sent to the control unit.

控制單元係例如當以壓力感測器28所檢測出之廢棄的壓力大於臨界值時，判斷成過濾器20之功能下降而將該訊息通知至作業員。如此之通知係可以以警告燈(無圖示)之發光、通知音之產生、顯示至螢幕68(圖1)等之方法來進行。 For example, when the pressure of the waste detected by the pressure sensor 28 is greater than the critical value, the control unit determines that the function of the filter 20 is reduced and notifies the operator of the message. Such notification can be performed by lighting of a warning light (not shown), generating a notification sound, and displaying it on the screen 68 (FIG. 1).

濾液槽26連接有用以將貯留之濾液送出至後段的濾液泵30。藉由濾液泵30而從濾液槽26被送出之濾液，通過配管32而被供給至純水生成單元34。純水生成單元34具備有用以對從濾液槽26被供給之濾液照射紫外線(紫外光)之紫外線光源36。 The filtrate tank 26 is connected to a filtrate pump 30 for sending the stored filtrate to the subsequent stage. The filtrate sent from the filtrate tank 26 by the filtrate pump 30 is supplied to the pure water generating unit 34 through the pipe 32. The pure water generating unit 34 includes an ultraviolet light source 36 for irradiating the filtrate supplied from the filtrate tank 26 with ultraviolet rays (ultraviolet light).

利用從紫外線光源36被照射之紫外線被殺菌的濾液，通過配管38等而被供給至第1離子交換器40及第2離子交換器42。第1離子交換器40係經電磁閥44而被連接於配管38，第2離子交換器42係經電磁閥46而被連接於配管38。利用控制該些兩個電磁閥44、46，可以將濾液供給至第1離子交換器40及第2離子交換器 42之一方。 The filtrate sterilized by the ultraviolet rays irradiated from the ultraviolet light source 36 is supplied to the first ion exchanger 40 and the second ion exchanger 42 through the pipe 38 and the like. The first ion exchanger 40 is connected to the pipe 38 via the solenoid valve 44, and the second ion exchanger 42 is connected to the pipe 38 via the solenoid valve 46. By controlling these two solenoid valves 44, 46, the filtrate can be supplied to the first ion exchanger 40 and the second ion exchanger One side of 42.

被供給至第1離子交換器40或第2離子交換器42之濾液，利用第1離子交換器40或第2離子交換器42所包含的離子交換樹脂，被離子交換，成為純水。另外，以如此之方法所生成之純水，也有混入從離子交換樹脂產生之微細的樹脂片等的碎屑之情形。於是，利用經由配管48連接於第1離子交換器40及第2離子交換器42之後段的精密過濾器50除去該碎屑。 The filtrate supplied to the first ion exchanger 40 or the second ion exchanger 42 is ion-exchanged by the ion exchange resin contained in the first ion exchanger 40 or the second ion exchanger 42 to become pure water. In addition, the pure water produced by such a method may be mixed with debris such as fine resin flakes generated from the ion exchange resin. Then, the fine filter 50 connected to the subsequent stage of the first ion exchanger 40 and the second ion exchanger 42 via the pipe 48 removes the debris.

另外，在朝精密過濾器50供給純水之配管48，設置有用以檢測出純水之壓力的壓力感測器52。壓力感測器52被連接於控制單元，包含以壓力感測器52所檢測出之壓力之資訊的訊號被送至控制單元。控制單元係例如當以壓力感測器52所檢測出之純水的壓力大於臨界值時，判斷成精密過濾器50之功能下降而將該訊息通知至作業員。 In addition, the piping 48 for supplying pure water to the precision filter 50 is provided with a pressure sensor 52 for detecting the pressure of the pure water. The pressure sensor 52 is connected to the control unit, and a signal containing information about the pressure detected by the pressure sensor 52 is sent to the control unit. For example, when the pressure of the pure water detected by the pressure sensor 52 is greater than the critical value, the control unit determines that the function of the precision filter 50 is reduced and notifies the operator of the message.

再者，在朝精密過濾器50供給純水之配管48，設置有用以檢測出純水之比電阻的比電阻計54。比電阻計54被連接於控制單元，包含以比電阻計54所檢測出之比電阻之資訊的訊號被送至控制單元。控制單元係例如當以比電阻計54所檢測出之純水之比電阻低於臨界值時，判斷成第1離子交換器40或第2離子交換器42之功能下降而將訊息通知至作業員。 Furthermore, the piping 48 for supplying pure water to the precision filter 50 is provided with a resistivity meter 54 for detecting the resistivity of pure water. The resistivity meter 54 is connected to the control unit, and a signal containing the information of the resistivity detected by the resistivity meter 54 is sent to the control unit. For example, when the specific resistance of pure water detected by the specific resistance meter 54 is lower than the critical value, the control unit determines that the function of the first ion exchanger 40 or the second ion exchanger 42 is reduced, and informs the operator of the message .

以純水生成單元34所生成之純水通過配管56等而被送至溫度調整單元58。以溫度調整單元58被調整 至特定之溫度的純水通過配管60等而被供給至加工裝置。 The pure water produced by the pure water production unit 34 is sent to the temperature adjustment unit 58 through the pipe 56 and the like. Adjusted by temperature adjustment unit 58 Pure water up to a specific temperature is supplied to the processing device through the pipe 60 and the like.

如圖1所示般，在框體4之上部前面側，形成有通往收容空間的第1開口部4a。在第1開口部4a內，配置有例如上述的過濾單元18。再者，在框體4之上面安裝有用以關閉該第1開口部4a之蓋體62。利用開啟蓋體62，作業員可以通過第1開口部4a而更換過濾單元18之過濾器20。 As shown in FIG. 1, on the front side of the upper portion of the housing 4, a first opening 4a leading to the storage space is formed. In the first opening 4a, for example, the aforementioned filter unit 18 is arranged. Furthermore, a cover 62 for closing the first opening 4a is attached to the upper surface of the frame 4. By opening the lid 62, the operator can replace the filter 20 of the filter unit 18 through the first opening 4a.

再者，在框體4之前面形成有與第1開口部4a鄰接而通往收容空間的第2開口部4b。於維修廢液處理裝置2之時，例如作業員可以通過第2開口部4b而在收容空間之一部分檢修。即是，該收容空間之一部分成為維修時作業員檢修之維修區域。 Furthermore, on the front surface of the frame 4, a second opening 4b is formed adjacent to the first opening 4a and leading to the storage space. When repairing the waste liquid treatment device 2, for example, an operator can inspect and repair a part of the storage space through the second opening 4b. That is, a part of the containment space becomes a maintenance area for operators to check during maintenance.

在維修區域收容例如維修區域之頻率高的電氣裝備零件或配管等之構成要素。但是，被收容在維修區域之構成要素並無限制。在第2開口部4b之前方側，設置有用以覆蓋維修區域之開關門64。開關門64之一方之側部以絞鏈等被連結於框體4，開關門64以該側部為中心旋轉。 In the maintenance area, components such as high-frequency electrical equipment parts or piping in the maintenance area are accommodated. However, there are no restrictions on the components contained in the maintenance area. On the front side of the second opening 4b, an opening and closing door 64 for covering the maintenance area is provided. One side of the door 64 is connected to the frame 4 by a hinge or the like, and the door 64 rotates around the side.

在開關門64之上部前面，設置有用以輸入對控制單元之指示等的輸入墊66。在與輸入墊66鄰接之位置，設置有用以顯示各種資訊的螢幕68。 An input pad 66 for inputting instructions to the control unit and the like is provided on the upper front of the opening and closing door 64. At a position adjacent to the input pad 66, a screen 68 for displaying various information is provided.

在框體4之側面，配置有用以切換廢液處理裝置2具備的主電源(無圖示)之接通和斷開的旋轉式之 主電源開關70。在主電源開關70之周圍，固定有包圍主電源開關70之面板72。該面板72成為用以鎖定開關門64之鎖定機構之一部分。 On the side of the frame 4, there is arranged a rotary type to switch the main power (not shown) of the waste liquid treatment device 2 on and off. Main power switch 70. Around the main power switch 70, a panel 72 surrounding the main power switch 70 is fixed. The panel 72 becomes a part of the locking mechanism for locking the opening and closing door 64.

圖3為用以針對開關門64之鎖定機構進行說明的一部分剖面俯視圖。在圖3中，表示鎖定開關門64之狀態。如圖3所示般，在面板72之背面側(框體4之蓋體6側)，接觸構成鎖定機構之圓柱狀之桿體74之一端側(基端側)。該桿體74係例如通過被形成在蓋體6之貫通孔(無圖示)，而被插入至框體4之內部。 FIG. 3 is a partial cross-sectional plan view for explaining the locking mechanism of the opening and closing door 64. In FIG. 3, the state where the door 64 is locked is shown. As shown in FIG. 3, the back side of the panel 72 (the side of the cover 6 of the frame 4) is in contact with one end side (base end side) of the cylindrical rod 74 constituting the locking mechanism. The rod 74 is inserted into the frame 4 through a through hole (not shown) formed in the lid 6, for example.

再者，桿體74係例如在藉由被固定在框體4之上部等之第1保持部76及第2保持部78而能夠滑動之狀態下被保持。在第1保持部76及第2保持部78，分別形成貫通孔(無圖示)，桿體74被插入至該貫通孔。 In addition, the rod 74 is held in a slidable state by, for example, the first holding portion 76 and the second holding portion 78 fixed to the upper portion of the frame 4. The first holding portion 76 and the second holding portion 78 are respectively formed with through holes (not shown), and the rod body 74 is inserted into the through holes.

在桿體74之一端側，設置有從桿體74之側面突出至徑向的第1凸緣部74a。在位於第1凸緣部74a和第1保持部76之間的桿體74之周圍，配置有線圈彈簧80。藉由該線圈彈簧80，桿體74朝向面板72之背面側被彈推。即是，在鎖定開關門64之狀態下，桿體74之一端側在面板72以按壓之方式被卡止(被按壓卡止)。 On one end side of the rod body 74, a first flange portion 74a protruding from the side surface of the rod body 74 in the radial direction is provided. A coil spring 80 is arranged around the rod body 74 located between the first flange portion 74a and the first holding portion 76. By the coil spring 80, the rod 74 is urged toward the back side of the panel 72. That is, in the state where the opening and closing door 64 is locked, one end side of the lever body 74 is locked by pressing on the panel 72 (locked by pressing).

在桿體74之另一端側(前端側)，設置有從桿體74之側面突出至徑向的第2凸緣部74b。藉由該第2凸緣部74b防止桿體74從第2保持部78脫落。另外，第2凸緣部74b被配置在從桿體74之另一端離開至一端側的位置上，桿體74之另一端之側面露出。 On the other end side (front end side) of the rod body 74, a second flange portion 74b protruding from the side surface of the rod body 74 in the radial direction is provided. The second flange portion 74b prevents the rod body 74 from falling off from the second holding portion 78. In addition, the second flange portion 74b is arranged at a position away from the other end of the rod body 74 to one end side, and the side surface of the other end of the rod body 74 is exposed.

在開關門64之內側設置有與桿體74之另一端側卡止的貫穿安裝部82。在貫穿安裝部82形成有可以插入桿體74之另一端側的貫通孔82a。依此，若在關閉開關門64之狀態下使桿體74滑動，使桿體74定位在另一端側被插入至貫通孔82a之貫穿安裝位置時，可以鎖定開關門64。 A penetration mounting portion 82 that is locked to the other end side of the rod body 74 is provided inside the opening and closing door 64. A through hole 82 a into which the other end of the rod body 74 can be inserted is formed in the through mounting portion 82. Accordingly, if the lever body 74 is slid while the door 64 is closed, and the lever body 74 is positioned at the other end side and inserted into the penetration installation position of the through hole 82a, the door 64 can be locked.

如上述般，桿體74之一端側在面板72之背面側以按壓之方式被卡止，桿體74之一端側之位置藉由面板72被限制。例如，將桿體74定位在開關門64被鎖定之貫穿安裝位置，係如圖3所示般，若將面板72固定在框體4(蓋體6)而限制桿體74之一端側之位置即可。 As described above, one end of the rod 74 is locked by pressing on the back side of the panel 72, and the position of the one end of the rod 74 is restricted by the panel 72. For example, positioning the rod 74 at the through installation position where the opening and closing door 64 is locked is as shown in FIG. 3, if the panel 72 is fixed to the frame 4 (cover 6) to limit the position of one end of the rod 74 OK.

對面板72之框體4(蓋體6)的固定例如藉由4個之螺絲84而被進行。另外，解除開關門64之鎖定，若從框體4(蓋體6)卸下面板72，且將桿體74定位在另一端側從貫通孔82a被拔去之拔去位置即可。 The frame 4 (the cover 6) of the panel 72 is fixed by, for example, four screws 84. In addition, to release the lock of the opening and closing door 64, remove the panel 72 from the frame 4 (cover 6) and position the rod 74 at the position where the other end is pulled out from the through hole 82a.

另外，在該鎖定機構，設置有利用將主電源開關70對準主電源成為斷開之斷開位置，使可以解除鎖定之安全機構。即是，只要主電源開關70不對準斷開位置，就算螺絲84鬆開，面板72也不會從框體4(蓋體6)卸下。 In addition, the lock mechanism is provided with a safety mechanism that can release the lock by aligning the main power switch 70 with the main power source to turn off the off position. That is, as long as the main power switch 70 is not aligned to the off position, even if the screw 84 is loosened, the panel 72 will not be removed from the frame 4 (cover 6).

圖4(A)及圖4(B)為用以針對安全機構進行說明的側面圖。另外，在圖4(A)中，表示將主電源開關70對準主電源成為接通之接通位置的狀態，在圖4(B)中，表示將主電源開關70對準主電源成為斷開之斷 開位置的狀態。 4(A) and 4(B) are side views for explaining the safety mechanism. In addition, in FIG. 4(A), it shows a state where the main power switch 70 is aligned with the main power source to be turned on. In FIG. 4(B), it is shown that the main power switch 70 is aligned with the main power source to turn off. Open break The state of the open position.

如圖4(A)及圖4(B)所示般，安全機構包含例如被連結、固定於主電源開關70之旋轉軸的棒狀之旋轉部70a。該旋轉部70a隨著主電源開關70之旋轉而旋轉。另外，在與旋轉部70a之前端對應之位置，配置有被固定於面板72側之承受部72a。 As shown in FIG. 4(A) and FIG. 4(B), the safety mechanism includes, for example, a rod-shaped rotating part 70a connected and fixed to the rotating shaft of the main power switch 70. The rotating portion 70a rotates with the rotation of the main power switch 70. In addition, a receiving portion 72a fixed to the side of the panel 72 is arranged at a position corresponding to the front end of the rotating portion 70a.

如圖4(A)所示般，承受部72a係被配置在將主電源開關70對準接通位置之狀態下旋轉部70a之前端卡合的位置。依此，在將主電源開關70對準接通位置之狀態下，旋轉部70a之前端卡合於承受部72a，主電源開關70和面板72之位置關係被固定。即是，在該狀態下，無法將面板72從框體4(蓋體6)卸下。 As shown in FIG. 4(A), the receiving portion 72a is arranged at a position where the front end of the rotating portion 70a is engaged with the main power switch 70 in the ON position. Accordingly, in the state where the main power switch 70 is aligned to the on position, the front end of the rotating portion 70a is engaged with the receiving portion 72a, and the positional relationship between the main power switch 70 and the panel 72 is fixed. That is, in this state, the panel 72 cannot be detached from the frame body 4 (lid body 6).

另外，當如圖4(B)所示般，使主電源開關70旋轉而對準斷開位置時，旋轉部70a也旋轉，旋轉部70a之前端和承受部72a之卡合被解除。依此，因主電源開關70和面板72之位置關係變成不被固定，故可以從框體4(蓋體6)卸下面板72，而解除開關門64之鎖定。 In addition, as shown in FIG. 4(B), when the main power switch 70 is rotated and aligned to the off position, the rotating portion 70a also rotates, and the engagement between the front end of the rotating portion 70a and the receiving portion 72a is released. Accordingly, since the positional relationship between the main power switch 70 and the panel 72 becomes unfixed, the panel 72 can be removed from the frame 4 (the cover 6), and the opening and closing door 64 can be unlocked.

圖5為示意性表示開關門64之鎖定被解除之狀態的一部分剖面俯視圖。如圖5所示般，若在將主電源開關70對準斷開位置之狀態下，鬆開螺絲84時，就可以從框體4(蓋體6)卸下面板72。 FIG. 5 is a partial cross-sectional plan view schematically showing a state where the lock of the opening and closing door 64 is released. As shown in FIG. 5, when the screw 84 is loosened with the main power switch 70 aligned to the off position, the panel 72 can be removed from the frame 4 (cover 6).

當從框體4(蓋體6)卸下面板72時，桿體74被定位在拔去位置，桿體74之另一端側從貫通孔82a被拔去。依此，作業員開啟開關門64而可以在維修區域 檢修。另外，在該狀態下，因主電源成為斷開，故安全性高。 When the panel 72 is removed from the frame 4 (lid body 6), the rod body 74 is positioned at the pull-out position, and the other end side of the rod body 74 is pulled out from the through hole 82a. According to this, the operator opens and closes the door 64 and can be in the maintenance area Overhaul. In addition, in this state, since the main power supply is turned off, the safety is high.

如上述般，在與本實施型態有關的廢液處理裝置(具有維修區域的裝置)2中，因具備有用以覆蓋被形成在框體4之維修區域的開關門64，故僅開啟該開關門64即可以在維修區域檢修。即是，即使不卸下框體4之蓋體6亦可以維修廢液處理裝置2。 As described above, in the waste liquid treatment device (device with a maintenance area) 2 related to this embodiment, since the opening and closing door 64 is provided to cover the maintenance area formed in the housing 4, only the switch is turned on The door 64 can be inspected in the maintenance area. That is, even if the cover 6 of the frame 4 is not removed, the waste liquid treatment device 2 can be repaired.

再者，與本實施型態有關之廢液處理裝置2中，於開啟開關門64之時，必須將主電源開關70對準成為斷開之斷開位置而將面板72從框體4(蓋體6)卸下，且將另一端側被插入至貫通孔82a之桿體74定位在拔去位置，而將該桿體74之另一端從貫通孔82a拔去。即是，因在主電源接通之狀態下，無法開啟開關門64，故維修之時的安全性變高。 Furthermore, in the waste liquid treatment device 2 related to this embodiment, when the switch door 64 is opened, the main power switch 70 must be aligned to the off position to disconnect the panel 72 from the frame 4 (cover The body 6) is removed, and the rod 74 with the other end inserted into the through hole 82a is positioned at the removal position, and the other end of the rod 74 is removed from the through hole 82a. That is, since the door 64 cannot be opened when the main power is turned on, the safety at the time of maintenance becomes high.

另外，本發明並不限定於上述實施型態之記載，能夠做各種變更而加以實施。例如，在上述實施型態中，雖然針對與旋轉式之主電源開關70對應的安全機構之一例進行說明，但是安全機構之構成並不特別限制。例如，亦可以使用與按鍵式之主電源開關連動，而電性地使旋轉部旋轉之安全機構等。當然即使在旋轉式之主電源開關組合電性地進行動作的安全機構等亦可。 In addition, the present invention is not limited to the description of the above-mentioned embodiment, and can be implemented with various changes. For example, in the foregoing embodiment, although an example of the safety mechanism corresponding to the rotary main power switch 70 is described, the structure of the safety mechanism is not particularly limited. For example, it is also possible to use a safety mechanism that is linked with a key-type main power switch to electrically rotate the rotating part. Of course, even a safety mechanism that operates electrically is combined with a rotary main power switch.

其他，與上述實施型態有關之構造、方法等只要不脫離本發明之目的的範圍，可以做適當變更而加以實施。 In addition, the structures, methods, etc. related to the above-mentioned embodiments can be implemented with appropriate changes as long as they do not depart from the scope of the object of the present invention.

2:廢液處理裝置(具有維修區域的裝置) 2: Waste liquid treatment device (device with maintenance area)

4:框體 4: Frame

4a:第1開口部 4a: The first opening

4b:第2開口部 4b: The second opening

6:蓋體 6: Lid

62:蓋體 62: Lid

64:開關門 64: open and close the door

66:輸入墊 66: input pad

68:螢幕 68: screen

70:主電源開關 70: Main power switch

72:面板 72: Panel

Claims (1)

一種具有維修區域的裝置，其係藉由蓋體覆蓋成為製作概略外形之基礎的骨架而所構成的裝置，其特徵在於，具備：框體；主電源開關，其係用以切換主電源之接通和斷開；維修區域，其係被形成在該框體內，於維修時作業者檢修；開關門，其係用以覆蓋該維修區域；面板，其係可以在將該主電源開關對準該主電源成為接通之接通位置之狀態下被固定在該框體，且在將該主電源開關對準該主電源成為斷開之斷開位置之狀態下從該框體卸下；桿體，其一端在該面板被按壓卡止；及貫穿安裝部，其被形成在該開關門，具有該桿體之另一端側被插入的貫通孔，在該關閉該開關門之狀態下，將該面板固定在該框體，且限制該桿體之一端的位置，依此該桿體被定位在另一端側被插入至該貫通孔之貫穿安裝位置，將該主電源開關對準該斷開位置而從該框體卸下該面板，依此該桿體被定位在另一端側從該貫通孔被拔去之拔去位置。 A device with a maintenance area, which is constructed by covering the skeleton that forms the basis for making the outline shape by a cover, and is characterized by having: a frame; a main power switch for switching the connection of the main power supply On and off; the maintenance area, which is formed in the frame, is inspected by the operator during maintenance; the door is opened and closed, which is used to cover the maintenance area; the panel, which can align the main power switch to the The main power supply is fixed to the frame when the main power supply is in the on position, and the main power switch is aligned with the main power supply to the off position, and removed from the frame; the lever body , One end of which is pressed and locked on the panel; and a penetrating installation part, which is formed in the opening and closing door, has a through hole into which the other end of the rod body is inserted, and when the opening and closing door is closed, the The panel is fixed to the frame body and restricts the position of one end of the rod body, whereby the rod body is positioned at the other end side and inserted into the penetration installation position of the through hole, and the main power switch is aligned with the off position When the panel is removed from the frame, the rod is positioned at the unplugged position where the other end is unplugged from the through hole.
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TW201741067A (en) 2017-12-01
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JP6695625B2 (en) 2020-05-20
CN107104066B (en) 2022-05-03

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