JP7023763B2 - Processing liquid supply equipment, substrate processing equipment and processing liquid supply method - Google Patents

Description

The present invention relates to a processing liquid supply device and a processing liquid supply method for supplying a processing liquid to a processing unit that processes a substrate to be processed. The substrates to be processed include, for example, semiconductor wafers, glass substrates for liquid crystal displays, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, optomagnetic disk substrates, and photomasks. Includes substrates such as mask substrates, ceramic substrates, and solar cell substrates.

In the manufacturing process of a semiconductor device or a liquid crystal display device, a substrate processing device that processes a substrate such as a semiconductor wafer with a processing liquid is used. The single-wafer type substrate processing apparatus that processes substrates one by one is, for example, a spin chuck that holds the substrate horizontally and rotates it, and a processing liquid nozzle that discharges the processing liquid toward the substrate held by the spin chuck. The main body is provided with a processing unit having the above. In order to supply the treatment liquid to the treatment liquid nozzle, the substrate processing device is provided with a treatment liquid supply device separately from the main body. A treatment liquid supply pipe extending from the treatment liquid supply device is connected to the treatment liquid nozzle, and the treatment liquid stored in the treatment liquid tank of the treatment liquid supply device is supplied via the treatment liquid supply pipe (for example). , Patent Document 1).

Further, the substrate is also treated with a treatment liquid in which a predetermined gas is dissolved by a dissolution module. For example, when treating a substrate with a rinsing solution containing pure water as a main component, carbonated water in which carbon dioxide gas is dissolved in the pure water at a predetermined concentration may be used (for example, Patent Document 2). By rinsing the substrate with carbonated water, charging of the substrate is prevented.

Japanese Unexamined Patent Publication No. 2006-351709 Japanese Unexamined Patent Publication No. 2016-157895

However, there is a concern that particles (foreign substances) may be generated in the treatment liquid that has passed through the dissolution module due to deterioration over time due to long-term use of the dissolution module. Since the removal of the amount of particles in the treatment liquid is strongly required with the miniaturization of the semiconductor structure, there is a demand for a technique for reducing the amount of particles in the treatment liquid that has passed through the dissolution module.

Therefore, an object of the present invention is to provide a technique capable of reducing the amount of particles in the treatment liquid that has passed through the dissolution module.

In order to solve the above problems, the first aspect is a treatment liquid supply device for supplying a treatment liquid, in which a dissolution module that dissolves a gas in the stock solution of the treatment liquid and one end thereof are on the secondary side of the dissolution module. The connected primary side supply pipe, the filter connected to the other end of the primary side supply pipe and filtering the treatment liquid, and the treatment liquid connected to the secondary side of the filter and passed through the filter The secondary side supply pipe that forms a passing flow path, the drainage pipe that is connected to the primary side supply pipe and sends the treatment liquid to the drainage unit, and the primary side supply pipe that is provided in the primary side supply pipe and melts. A switching unit for switching between a state in which the module and the filter communicate with each other and a state in which the melting module and the drainage unit communicate with each other, and a switching unit provided on the primary side of the switching unit and passing through the primary side supply pipe. A particle measuring unit that measures the amount of particles in the processing liquid and a control unit that controls a switching operation by the switching unit according to the particle amount measured by the particle measuring unit are provided.

The second aspect is the processing liquid supply device of the first aspect, wherein the particle measuring unit is in the processing liquid passing through the primary side of the portion of the primary side supply pipe to which the drainage pipe is connected. The amount of the particles is measured.

The third aspect is the treatment liquid supply device of the first aspect or the second aspect, in which the switching portion is interposed in the primary side supply pipe and a supply valve that opens and closes a flow path in the primary side supply pipe. And a drainage valve interposed in the drainage pipe to open and close the flow path in the drainage pipe, and the control unit controls the opening and closing operation of the supply valve and the drainage valve.

The fourth aspect is the processing liquid supply device of the third aspect, in which the control unit closes the supply valve and opens the drain valve, and the particle amount measured by the particle measurement unit. The notification is output to the outside by the output device according to the above.

The fifth aspect is the treatment liquid supply device of the third aspect or the fourth aspect, in which the primary side supply pipe is branched into a plurality of branch pipes on the secondary side of the switching portion, and the plurality of branch pipes are branched. One filter is connected to each.

The sixth aspect is a substrate processing apparatus for processing a substrate, wherein the treatment liquid supply device according to any one of the first to fifth aspects and the treatment liquid filtered by the filter of the treatment liquid supply device. It is provided with a processing unit for processing the substrate.

A seventh aspect is a treatment liquid supply method for supplying a treatment liquid, wherein (a) a step of dissolving a gas in a stock solution of the treatment liquid by a dissolution module, and (b) the treatment liquid in which the gas is dissolved are said. A step of supplying from the melting module to the primary side supply pipe, (c) a step of filtering the treatment liquid passing through the primary side supply pipe with a filter connected to the primary side supply pipe, and (d) a step of filtering the primary side. The step of measuring the amount of particles in the treatment liquid passing through the supply pipe, and (e) the treatment of the filter in the step (c) according to the amount of the particles measured in the step (d). It includes a step of stopping the supply of the liquid and sending the treatment liquid that has passed through the dissolution module to the drainage unit through a drainage pipe that branches from the primary side supply pipe.

According to the treatment liquid supply device of the first aspect, the treatment liquid can be discharged until the amount of particles in the treatment liquid that has passed through the dissolution module is reduced. As a result, the amount of particles in the processing liquid that has passed through the dissolution module can be reduced. Further, by stopping the supply of the treatment liquid to the filter and communicating the primary side supply pipe with the drain pipe, the treatment liquid containing particles in the primary side supply pipe can be discharged without passing through the filter. As a result, it is possible to reduce the passage of the processing liquid containing particles through the filter, so that the life of the filter can be extended. Further, it is possible to reduce the diffusion of the treatment liquid containing particles to the secondary side of the filter.

According to the treatment liquid supply device of the second aspect, the amount of particles in the treatment liquid toward the drainage pipe can be measured in the primary side supply pipe. Therefore, it can be confirmed whether or not the amount of particles is reduced during the drainage process.

According to the treatment liquid supply device of the third aspect, the control unit automatically opens and closes the supply valve and the drainage valve based on the measured amount of particles to perform the drainage treatment, so that the burden on the operator can be reduced. ..

According to the treatment liquid supply device of the fourth aspect, the operator can appropriately recognize the maintenance / replacement time of the parts by notifying the outside according to the amount of particles measured during the drainage treatment.

According to the treatment liquid supply device of the fifth aspect, by draining the liquid on the primary side of a plurality of filters, it is possible to reduce the passage of high-concentration particles through each of the filters. Therefore, the life of each filter can be extended, and the diffusion of particles to the secondary side of each filter can be reduced.

According to the substrate processing apparatus of the sixth aspect, the processing liquid can be discharged until the amount of particles in the processing liquid that has passed through the dissolution module is reduced. As a result, the amount of particles in the processing liquid that has passed through the dissolution module can be reduced. Further, by stopping the supply of the treatment liquid to the filter and communicating the primary side supply pipe with the drain pipe, the treatment liquid containing particles in the primary side supply pipe can be discharged without passing through the filter. This makes it possible to extend the life of the filter. Further, it is possible to reduce the supply of the processing liquid containing the particles together with the particles to the processing unit.

According to the treatment liquid supply method of the seventh aspect, the treatment liquid can be discharged until the amount of particles in the treatment liquid that has passed through the dissolution module is reduced. As a result, the amount of particles in the processing liquid that has passed through the dissolution module can be reduced. Further, by stopping the supply of the treatment liquid to the filter and communicating the primary side supply pipe with the drain pipe, the treatment liquid containing particles in the primary side supply pipe can be discharged without passing through the filter. As a result, it is possible to reduce the passage of the processing liquid containing particles through the filter, so that the life of the filter can be extended. Further, it is possible to reduce the diffusion of the treatment liquid containing particles to the secondary side of the filter.

It is a figure which shows typically the substrate processing apparatus 1 of embodiment. It is a block diagram for demonstrating the electric structure of the main part of the substrate processing apparatus 1. FIG. It is a flowchart for demonstrating operation at the time of drainage processing of a processing liquid supply unit 3. It is a time chart for explaining the control content at the time of the drainage processing by a control unit 52.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that the components described in this embodiment are merely examples, and the scope of the present invention is not limited to them. In the drawings, the dimensions and numbers of each part may be exaggerated or simplified as necessary for easy understanding.

<1. Embodiment>
FIG. 1 is a diagram schematically showing the substrate processing apparatus 1 of the embodiment. The substrate processing apparatus 1 processes a semiconductor wafer W (hereinafter, simply referred to as “wafer W”) as an example of a substrate. The substrate processing device 1 includes a plurality of processing units 2 (processing units) and a processing liquid supply unit 3 (processing liquid supply device) that supplies the processing liquid to each processing unit 2. Here, the processing liquid is supplied from one processing liquid supply unit 3 to the four processing units 2, but a dedicated processing liquid supply unit may be provided for each processing unit.

The processing unit 2 is a single-wafer type device that processes wafers W one by one with a processing liquid. The processing unit 2 includes a spin chuck 4 that holds and rotates the wafer W horizontally, and a nozzle 5 that supplies the processing liquid as the processing liquid to the wafer W.

The spin chuck 4 includes a spin base 8 that holds the wafer W substantially horizontally and can rotate around the vertical axis, and a rotation drive mechanism 9 that rotates the spin base 8 around the vertical axis. The nozzle 5 may be a fixed nozzle in which the liquid landing position of the processing liquid on the wafer W is fixed, or the liquid landing position is moved in a range from the rotation center of the wafer W to the peripheral edge of the wafer W. It may be a movable nozzle (scan nozzle). The processing liquid is supplied to the nozzle 5 from the processing liquid supply unit 3.

The treatment liquid supply unit 3 includes a melting module 30, filters 31a to 31d, a primary side supply pipe 32, a supply valve 33, a secondary side supply pipe 34a to 34d, a pump 35, an air supply valve 36, a liquid drainage pipe 41, and a drainage liquid. It includes a valve 42, a particle measuring unit 51, a control unit 52, and discharge valves 53a to 53d.

The dissolution module 30 is a device for generating carbonated water in which carbon dioxide gas (CO ₂ ) and pure water (DIW) which is a stock solution of a treatment liquid are mixed. Pure water is supplied to the dissolution module 30 from a pure water source, and carbon dioxide gas is supplied from a carbon dioxide gas source (cylinder or the like). The pure water is supplied by the pump 35 provided in the pipe connecting the pure water source and the dissolution module 30. Further, the supply of carbon dioxide gas is controlled by an air supply valve 36 interposed in a pipe connecting the dissolution module 30 and the carbon dioxide gas source. The dissolution module 30 includes, for example, a hollow fiber membrane, and the carbon dioxide gas is dissolved in the pure water by supplying carbon dioxide gas to the pure water through the hollow fiber membrane. In the treatment unit 2, the charge of the wafer W is reduced by treating (rinsing) the wafer W with a treatment liquid (carbonated water) in which carbon dioxide gas is dissolved in pure water.

The filters 31a to 31d filter the processing liquid supplied to each of the processing units 2. The filters 31a to 31d are provided with, for example, innumerable pore holes, and the treatment liquid supplied to the treatment unit 2 is filtered to remove particles from the treatment liquid.

The primary side supply pipe 32 forms a flow path for the treatment liquid. One end of the primary side supply pipe 32 is connected to the melting module 30. Further, the other end side of the primary side supply pipe 32 is branched into a plurality of branch pipes 320a to 320d at a branch portion D1 in the middle. The branch pipes 320a to 320d are connected to each of the filters 31a to 31d.

The supply valve 33 is interposed in the primary side supply pipe 32. More specifically, the supply valve 33 is provided between the melting module 30 and the branch portion D1. The supply valve 33 controls the on / off of the processing liquid supply from the dissolution module 30 to the filters 31a to 31d by opening and closing the flow path formed by the primary side supply pipe 32.

One end of the secondary side supply pipe 34a is connected to the filter 31a, and the other end is connected to the nozzle 5 of one of the plurality of processing units 2. As for the other secondary side supply pipes 34b to 34d, one end is connected to one of the filters 31b to 31d, and the other end is connected to one nozzle 5 of the plurality of processing units 2. The secondary side supply pipes 34a to 34d supply the treatment liquid filtered by the filters 31a to 31d connected to each to the nozzle 5 of the treatment unit 2.

Discharge valves 53a to 53d are interposed in each of the secondary side supply pipes 34a to 34d. The discharge valves 53a to 53d control the on / off of the discharge of the treatment liquid from each of the nozzles 5 by opening and closing the flow path of the treatment liquid formed by the secondary side supply pipes 34a to 34d. The discharge valves 53a to 53d may be configured so that the opening degree of the flow path of the secondary side supply pipes 34a to 34d can be adjusted. By adjusting the opening degree, the discharge amount of the processing liquid from each of the nozzles 5 per unit time can be controlled.

The drainage pipe 41 branches from the branch portion D2 on the primary side of the supply valve 33 of the primary side supply pipe 32 and is connected to the drainage tank 90. The drainage tank 90 is provided to store the treatment liquid discharged from the treatment liquid supply unit 3. The processing liquid stored in the drainage tank 90 is drained to the outside of the substrate processing device 1 through the discharge pipe 92.

The drainage valve 42 is interposed in the drainage pipe 41. The drain valve 42 controls on / off of the processing liquid discharge from the inside of the primary side supply pipe 32 toward the drain tank 90 by opening and closing the flow path formed by the drain pipe 41.

The supply valve 33 and the drain valve 42 are provided in the primary side supply pipe 32, and the melting module 30 and the filters 31a to 34d communicate with each other, and the melting module 30 and the drain tank 90 (drainage portion) communicate with each other. This is an example of a switching unit that switches between the state and the state of switching.

The particle measuring unit 51 measures the amount of particles in the processing liquid passing through the primary side supply pipe 32. The particle measuring unit 51 is, for example, a measuring instrument (particle counter) that counts particles (dust, fine particles, impurities, etc.) existing in the processing liquid. The particle measuring unit 51 measures, for example, the intensity of light scattering from particles, and measures the amount of particles by extracting the light intensity proportional to the size of the particles as an electric signal.

The particle measuring unit 51 measures the amount of particles in the processing liquid passing through the piping portion 322 between the melting module 30 and the branch portion D2 in the primary side supply pipe 32. Here, the particle measuring unit 51 has a sampling pipe 510 that bypasses the pipe portion 322. The sampling pipe 510 has a smaller diameter than the primary side supply pipe 32. The particle measuring unit 51 measures the amount of particles in the processing liquid passing through the piping portion 322 by measuring the amount of particles passing through the sampling pipe 510.

FIG. 2 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus 1. The control unit 52 includes a microcomputer, and controls a control target provided in the substrate processing device 1 according to a predetermined control program. In particular, the control unit 52 controls the pump 35, the air supply valve 36, the supply valve 33, the drainage valve 42, and the discharge valves 53a to 53d. A particle measuring unit 51 is connected to the control unit 52. It is not essential that the pump 35 and the air supply valve 36 are controlled by the control unit 52. For example, the pump 35 may be constantly driven to pump pure water from the pure water source by constantly driving the treatment liquid supply unit 3 when the treatment liquid supply unit 3 is started.

Further, a storage unit 94 is connected to the control unit 52. The recipe 940 is stored in the storage unit 94. In the recipe 940, the processing conditions to be applied to the wafer W in the processing unit 2 are described in a predetermined data format. Specifically, the processing procedure or processing content (processing time, temperature, pressure or supply amount) and the like are described. The control unit 52 can access the storage unit 94 and appropriately read the recipe 940.

The control unit 52 determines whether to supply or stop the processing liquid to the filters 31a to 34d based on the amount of particles in the processing liquid passing through the primary side supply pipe 32 measured by the particle measuring unit 51. Specifically, the control unit 52 controls the opening and closing of the supply valve 33 and the drainage valve 42 when the amount of particles exceeds a predetermined drainage reference value, so as to be inside the dissolution module 30 and the primary side supply pipe 32. Perform drainage treatment to drain the treatment liquid. When performing the drainage process, the control unit 52 closes the supply valve 33 and opens the drainage valve 42. In this state, the processing liquid sent to the dissolution module 30 by the pump 35 flows into the drainage pipe 41 through the dissolution module 30 and the primary side supply pipe 32, and is drained. As a result, the particles accumulated in the melting module 30, the primary side supply pipe 32, and the like are appropriately washed away by the treatment liquid.

During the effluent treatment, by closing the air supply valve 36, only pure water containing no carbon dioxide passes through the dissolution module 30 and the primary side supply pipe 32. In this case, the inside of the dissolution module 30 and the primary side supply pipe 32 is purified mainly by pure water. However, by supplying carbon dioxide gas to the dissolution module 30 during the drainage treatment, the treatment liquid containing carbon dioxide may pass through the primary side supply pipe 32.

<Explanation of operation of the processing liquid supply unit 3>
When supplying the processing liquid to each of the processing units 2, the control unit 52 drives the pump 35 and opens the air supply valve 36. As a result, the treatment liquid (carbonated water) is generated in the dissolution module 30. Then, the control unit 52 keeps the supply valve 33 open and the drain valve 42 closed, and supplies the processing liquid generated by the dissolution module 30 to the filters 31a to 31d through the primary side supply pipe 32 (). Supply process). Then, the treatment liquid passes through each of the filters 31a to 31d, so that the treatment liquid is filtered (filtration step). When the processing liquid from which particles have been removed by this filtration is sent to each of the processing units 2, it is supplied to the wafer W from the nozzle 5 of each processing unit 2 to process the wafer W.

FIG. 3 is a flowchart for explaining the operation of the processing liquid supply unit 3 at the time of drainage processing. FIG. 4 is a time chart for explaining the control contents at the time of the drainage process by the control unit 52.

As shown in FIG. 3, the operation of the drainage treatment in the treatment liquid supply unit 3 includes a step S1 in which the control unit 52 determines whether or not the drainage treatment is necessary based on a predetermined determination criterion. In this step S1, as described above, the amount of particles is used as a determination criterion.

Specifically, the particle measuring unit 51 measures the particle amount (particle amount measuring step). Then, when the control unit 52 receives the information on the particle amount as the measurement result, the control unit 52 determines whether or not the particle amount exceeds a predetermined drainage reference value. If it does not exceed (No in step S1), step S1 is executed again. In this case, the determination in step S1 may be performed every cycle in which the particle measuring unit 51 measures the amount of particles. When the amount of particles exceeds the drainage reference value (Yes in step S1), the control unit 52 executes the next step S2.

In step S2, the control unit 52 changes the supply valve 33 from the open state to the closed state. As shown in FIG. 4, when the supply valve 33 is closed, the processing liquid is stopped from being supplied to the filters 31a to 31d.

When the supply valve 33 is closed, the control unit 52 releases the drainage valve 42 from the closed state to the open state with a slight delay or almost at the same time (see steps S3 and 4 in FIG. 3). As a result, the melting module 30, the primary side supply pipe 32 (specifically, the pipe portion 322) and the drainage pipe 41 are in a state of communicating with the drainage tank 90. At this time, as shown in FIG. 4, the pump 35 is in an operating state. Further, the air supply valve 36 is closed. Therefore, the undiluted solution (pure water) of the treatment liquid containing no carbon dioxide flows from the dissolution module 30 into the drainage pipe 41 through the primary side supply pipe 32 and is discharged toward the drainage tank 90 (drainage). Process). As described above, it is not essential to close the air supply valve 36 in the drainage process. That is, the treatment liquid containing carbon dioxide may be drained.

As shown in FIG. 4, in the drainage step of the present embodiment, after the drainage valve 42 is opened, the supply valve 33 remains closed, the drainage valve 42 is closed for a predetermined time T1 minutes, and the drainage valve 42 is closed again for a predetermined time. The cycle control to open is performed a plurality of times (here, 4 times). By periodically closing the drain valve 42 in this way, the flow of the processing liquid in the dissolution module 30 and the primary side supply pipe 32 can be intermittently stopped. Hereinafter, such a drainage treatment is referred to as a “flash drainage treatment”. According to the flash drainage treatment, the flow of the treatment liquid can be slowed down, so that the particles adhering to the inside of the dissolution module 30 and the primary side supply pipe 32 can easily fall off, and the removal efficiency of the particles can be improved. You can expect it.

When the control unit 52 controls the opening / closing of the drainage valve 42 in the flash drainage process, the drive of the pump 35 may be controlled on / off as shown by the broken line in FIG. That is, the pump 35 may be stopped at the timing of closing the drainage valve 42, and the pump 35 may be driven at the timing of opening the drainage valve 42. As a result, it is possible to suppress an increase in pressure inside the dissolution module 30 or the primary side supply pipe 32 when the drain valve 42 is closed. Therefore, the load on the melting module 30 and the pump 35 can be reduced.

Further, during the drainage step, the drainage valve 42 may be constantly opened to control the drive of the pump 35 on and off. Even in this case, it is possible to execute the flash drainage treatment. Also, it is not essential to perform a flash drainage process. That is, in the drainage step, the pump 35 may be constantly driven and the drainage valve 42 may be constantly opened.

Further, in the drainage step, when the control unit 52 determines that a specific condition is satisfied, the flash drainage process may be performed. The "specific condition" is, for example, when the amount of particles measured by the particle measuring unit 51 is an abnormal value exceeding a predetermined threshold value.

In step S3, after the drain valve 42 is opened, the control unit 52 determines whether or not the amount of particles measured by the particle measurement unit 51 is equal to or less than a predetermined allowable value (step S4). When the particles inside the dissolution module 30 and the primary side supply pipe 32 are removed by the discharge of the treatment liquid, it is expected that the amount of particles will decrease. Therefore, in step S5, by monitoring the amount of particles, it is determined whether or not to continue the drainage.

When the amount of particles exceeds a predetermined allowable value (No in step S4), the process returns to step S3, and the treatment liquid is continuously discharged. On the other hand, when the amount of particles becomes equal to or less than a predetermined allowable value due to the discharge of the treatment liquid (Yes in step S4), the control unit 52 closes the drain valve 42 (see steps S5 and 4 in FIG. 3). ). By closing the drain valve 42, the drainage of the treatment liquid is stopped. In this way, by monitoring the amount of particles and performing the drainage treatment by the control unit 52, it is possible to prevent the drainage treatment from being performed more than necessary.

In step S4, the control unit 52 may output a notification to the outside by an output device (display device, printing device, lamp, or the like) according to the amount of particles measured by the particle measuring unit 51. For example, it is conceivable to set a reference value in advance regarding the duration of the effluent treatment (or the amount of the effluent discharged). That is, in step S4, if the particle amount does not fall below the permissible value even if the duration of the drainage treatment (or the discharge amount of the treatment liquid) exceeds the reference value, the control unit 52 notifies the outside by the output device. It is good to output. By this notification, the operator can recognize the abnormality of the processing liquid supply unit 3, and therefore can appropriately recognize the maintenance / replacement time of the parts such as the dissolution module 30.

When the drainage valve 42 is closed, the control unit 52 sets the supply valve 33 from the closed state to the open state at a timing slightly delayed from or almost at the same time as that (see steps S6 and 4 in FIG. 3). ). Further, when the air supply valve 36 is opened, carbon dioxide gas is supplied to the melting module 30. As a result, the treatment liquid containing carbon dioxide flows again in the primary side supply pipe 32 and is supplied to each of the filters 31a to 31d (see FIG. 4). That is, the treatment liquid supply unit 3 is in a state where the treatment liquid can be supplied to the treatment unit 2.

As described above, according to the substrate processing apparatus 1 of the present embodiment, in the processing liquid supply unit 3, the supply valve 33 is closed (step S2) and the drainage valve 42 is opened (step S3). As a result, the amount of particles in the processing liquid that has passed through the dissolution module 30 can be reduced. Further, the treatment liquid can be discharged on the primary side (that is, the supply source side of the treatment liquid) of the filters 31a to 31d. Therefore, the particles generated in the melting module 30, the primary side supply pipe 32 or other dust generation sources are discharged to the outside without passing through the filters 31a to 31d. In this case, it is possible to reduce the passage of the processing liquid containing a large amount of particles generated on the primary side of the filters 31a to 31d through the filters 31a to 31d. As a result, the life of the filters 31a to 31d can be extended.

Further, since the treatment liquid containing many particles can be discharged on the primary side of the filters 31a to 31d, the risk of the treatment liquid containing the particles diffusing to the secondary side of the filters 31a to 31d can be reduced.

Further, when the drainage treatment is performed based on the amount of particles measured by the particle measuring unit 51, it is possible to appropriately prevent the treatment liquid containing high-concentration particles from passing through the filters 31a to 31d. Further, it is possible to prevent the processing liquid containing a large amount of particles from being used for processing the wafer W. In addition, it is possible to prevent the drainage treatment from being performed excessively.

<2. Modification example>
Although the embodiments have been described above, the present invention is not limited to the above, and various modifications are possible.

For example, with respect to the amount of particles measured by the particle measuring unit 51, a maintenance reference value that serves as a guide for maintaining or replacing parts such as the melting module 30 may be set in advance. Specifically, when the amount of particles exceeds a predetermined maintenance reference value, the control unit 52 may output a notification to the outside by an output device (display device, printing device, lamp, or the like). By notifying the outside, the operator can appropriately recognize the maintenance / replacement time of parts such as the melting module 30.

Further, the supply valve 33 and the drainage valve 42 may be configured to be electrically openable and closable under the control of the control unit 52 as in the above embodiment, but at least one of them may be configured to be manually openable and closable. .. However, the burden on the operator can be reduced by automatically controlling the opening and closing.

Further, instead of interposing the supply valve 33 and the drainage valve 42 in the primary side supply pipe 32 as the switching portion, it is conceivable to use a three-way valve having these functions. In this case, it is preferable to provide a three-way valve at the branch portion D2 connected to the drainage pipe 41 in the primary side supply pipe 32.

The treatment liquid supplied by the treatment liquid supply unit 3 is not limited to the one in which carbon gas is dissolved, and may be one in which other types of gas such as nitrogen gas are dissolved. Further, a liquid obtained by dissolving another type of gas such as carbonated water or nitrogen gas mixed with another liquid such as a chemical solution may be used as the treatment liquid.

The substrate processing device 1 of the above embodiment is a single-wafer type device that processes wafers W one by one with a processing liquid in the processing unit 2. However, the present invention is also applicable to a substrate processing apparatus provided with a batch type processing unit that processes a plurality of wafers W at the same time with a processing liquid.

Further, in the above-described embodiment, the wafer W is taken up as the substrate to be processed, but the wafer W is not limited to the wafer W. Other types of substrates such as a disk substrate, a photomagnetic disk substrate, a photomask substrate, a ceramic substrate, and a solar cell substrate may be processed.

Although the invention has been described in detail, the above description is exemplary in all aspects and the invention is not limited thereto. It is understood that innumerable variations not illustrated can be assumed without departing from the scope of the present invention. Each configuration described in each of the above-described embodiments and modifications can be appropriately combined or omitted as long as they do not conflict with each other.

1 Substrate processing device 2 Processing unit (processing unit)
3 Treatment liquid supply unit (treatment liquid supply device)
30 Melting module 31a to 31d Filter 32 Primary side supply piping 320a to 320d Branch piping 33 Supply valve 34a to 34d Secondary side supply piping 35 Pump 41 Drainage piping 42 Drainage valve 51 Particle measurement unit 52 Control unit 90 Drainage tank ( Drainage part)
92 Discharge piping D1, D2 Branch (connection)
W wafer

Claims (7)

It is a treatment liquid supply device that supplies the treatment liquid.
A dissolution module that dissolves gas in the undiluted solution of the treatment solution,
A primary side supply pipe whose one end is connected to the secondary side of the melting module,
A filter connected to the other end of the primary side supply pipe and filtering the treatment liquid,
A secondary side supply pipe that is connected to the secondary side of the filter and forms a flow path through which the treatment liquid that has passed through the filter passes.
A drainage pipe that is connected to the primary side supply pipe and sends the treatment liquid to the drainage unit,
A switching unit provided in the primary side supply pipe to switch between a state in which the dissolution module and the filter communicate with each other and a state in which the dissolution module and the drainage unit communicate with each other.
A particle measuring unit provided on the primary side of the switching unit and measuring the amount of particles in the processing liquid passing through the primary side supply pipe, and a particle measuring unit.
A control unit that controls the switching operation by the switching unit according to the amount of the particles measured by the particle measuring unit.
A treatment liquid supply device. The treatment liquid supply device according to claim 1.
The particle measuring unit is a processing liquid supply device that measures the amount of particles in the processing liquid that passes through the primary side of the primary side supply pipe to which the drainage pipe is connected. The processing liquid supply device according to claim 1 or 2.
The switching unit is
A supply valve that is interposed in the primary side supply pipe and opens and closes the flow path in the primary side supply pipe.
A drainage valve that is interposed in the drainage pipe and opens and closes the flow path in the drainage pipe.
Equipped with
The control unit is a processing liquid supply device that controls the opening / closing operation of the supply valve and the drainage valve. The treatment liquid supply device according to claim 3.
The control unit outputs a notification to the outside by an output device according to the amount of particles measured by the particle measurement unit in a state where the supply valve is closed and the drain valve is open. Device. The treatment liquid supply device according to claim 3 or 4.
A processing liquid supply device in which the primary side supply pipe is branched into a plurality of branch pipes on the secondary side of the switching portion, and one filter is connected to each of the plurality of branch pipes. It is a board processing device that processes boards.
The treatment liquid supply device according to any one of claims 1 to 5.
A processing unit that processes a substrate with the processing liquid filtered by the filter of the processing liquid supply device, and a processing unit.
A board processing device. It is a treatment liquid supply method that supplies the treatment liquid.
(A) A step of dissolving a gas in the undiluted solution of the treatment solution by the dissolution module,
(B) A step of supplying the treatment liquid in which the gas is dissolved from the dissolution module to the primary side supply pipe, and
(C) A step of filtering the treatment liquid that has passed through the primary side supply pipe with a filter connected to the primary side supply pipe.
(D) A step of measuring the amount of particles in the treatment liquid passing through the primary side supply pipe, and
(E) According to the amount of the particles measured in the step (d), the supply of the treatment liquid to the filter in the step (c) is stopped, and the treatment liquid that has passed through the dissolution module is transferred. The process of sending to the drainage section through the drainage pipe that branches from the primary side supply pipe,
A treatment liquid supply method including.

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