TW201741067A - Apparatus having maintenance area - Google Patents
Apparatus having maintenance area Download PDFInfo
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- TW201741067A TW201741067A TW106101027A TW106101027A TW201741067A TW 201741067 A TW201741067 A TW 201741067A TW 106101027 A TW106101027 A TW 106101027A TW 106101027 A TW106101027 A TW 106101027A TW 201741067 A TW201741067 A TW 201741067A
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- main power
- panel
- frame
- maintenance area
- rod body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Machine Tool Units (AREA)
- Inverter Devices (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Switch Cases, Indication, And Locking (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
本發明係關於具有於維修之時作業員檢修之維修區域的裝置。 The present invention relates to a device having a service area that is inspected by a worker at the time of maintenance.
在加工半導體晶圓等之時所使用之各種裝置的框體，收容有各種構成要素。框體係以例如製作裝置之概略外形的骨架，覆蓋骨架之蓋體所構成，於維修內部之構成要素等之時，蓋體之一部分藉由作業員卸下(例如，參照專利文獻1)。 The casing of various devices used in processing semiconductor wafers and the like accommodates various components. The frame system is formed by covering the skeleton of the skeleton, for example, in the skeleton of the outline of the apparatus, and one part of the lid is removed by the operator when repairing the internal components or the like (for example, refer to Patent Document 1).
[專利文獻1]日本特開2007-331050號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2007-331050
但是，每次維修卸下框體之蓋體，也不一定能夠充分提高作業之效率。在此，在此情況下，也有必須 與用以設置裝置之設置空間不同，另外確保用以暫時性保管卸下之蓋體的保管空間的問題。 However, it is not always possible to sufficiently improve the work efficiency by removing the cover of the frame every time. Here, in this case, there is also a need Unlike the installation space for installing the device, the problem of temporarily storing the storage space of the removed cover is ensured.
本發明係鑒於如此之問題點而創作出，其目的在於提供即使卸下框體之蓋體亦可以維修之具有維修區域的裝置。 The present invention has been made in view of such a problem, and an object thereof is to provide a device having a maintenance area that can be repaired even if the cover of the frame is removed.
若藉由本發明之一態樣時，提供一種具有維修區域的裝置，其特徵在於，具備：框體；主電源開關，其係用以切換主電源之接通和斷開；維修區域，其係被形成在該框體內，於維修時作業者檢修；開關門，其係用以覆蓋該維修區域；面板，其係可以在將該主電源開關對準該主電源成為接通之接通位置之狀態下被固定在該框體，且在將該主電原開關對準該主電源成為斷開之斷開位置之狀態下從該框體卸下；桿體，其一端在該面板被按壓卡止；及貫穿安裝部，其被形成在該開關門，具有該桿體之另一端側被插入的貫通孔，在該關閉該開關門之狀態下，將該面板固定在該框體，且限制該桿體之一端的位置，依此該桿體被定位在另一端側被插入至該貫通孔之貫穿安裝位置，將該主電源開關對準該斷開位置而從該框體卸下該面板，依此該桿體被定位在另一端側從該貫通孔被拔去之拔去位置。 According to one aspect of the present invention, a device having a maintenance area is provided, comprising: a frame; a main power switch for switching on and off of the main power source; and a maintenance area Formed in the frame, the operator overhauls during maintenance; the switch door is used to cover the service area; and the panel can be aligned with the main power switch to be turned on. In the state, it is fixed to the frame, and is detached from the frame in a state in which the main power switch is turned off to the disconnected position of the main power source; the rod body is pressed at one end of the panel And a through-mounting portion formed in the opening and closing door, having a through hole inserted into the other end side of the rod body, and fixing the panel to the frame in a state in which the opening and closing door is closed, and limiting a position of one end of the rod, whereby the rod is positioned at the other end side and inserted into the through-hole mounting position, and the main power switch is aligned with the disconnected position to remove the panel from the frame According to which the rod is positioned at the other end It is pulled out from the through hole of the pulling position.
在與本發明之一態樣有關的具有維修區域的裝置中，因具備有用以覆蓋被形成在框體之維修區域的開關門，故僅開啟該開關門即可以在維修區域檢修。即是，即使不卸下框體之蓋體亦可以維修裝置。 In the device having the maintenance area relating to one aspect of the present invention, since the switch door for covering the maintenance area formed in the frame body is provided, it is possible to perform maintenance in the maintenance area only by opening the switch door. That is, the device can be repaired without removing the cover of the frame.
再者，在與本發明之一態樣有關之具有維修區域的裝置中，於開啟開關門之時，必須將主電源開關對準主電源成為斷開之斷開位置而使面板從框體卸下，且將另一端側被插入至貫通孔之桿體定位在拔去位置，而將該桿體之另一端側從貫通孔拔去。即是，因在主電源接通之狀態下，無法開啟開關門，故維修之時的安全性變高。 Furthermore, in the device having the maintenance area related to one aspect of the present invention, when the opening and closing door is opened, the main power switch must be aligned with the main power source to be in the disconnected position to open the panel from the frame. Next, the rod body whose other end side is inserted into the through hole is positioned at the removal position, and the other end side of the rod body is pulled out from the through hole. That is, since the switch door cannot be opened in the state where the main power is turned on, the safety at the time of maintenance becomes high.
2‧‧‧廢液處理裝置(具有維修區域的裝置) 2‧‧‧Waste treatment unit (device with maintenance area)
4‧‧‧框體 4‧‧‧ frame
4a‧‧‧第1開口部 4a‧‧‧1st opening
4b‧‧‧第2開口部 4b‧‧‧2nd opening
6‧‧‧蓋體 6‧‧‧ Cover
8‧‧‧配管 8‧‧‧Pipe
10‧‧‧廢液槽 10‧‧‧ Waste tank
12‧‧‧廢液泵 12‧‧‧Waste pump
14‧‧‧配管 14‧‧‧Pipe
16‧‧‧電磁閥 16‧‧‧ solenoid valve
18‧‧‧過濾單元 18‧‧‧Filter unit
20‧‧‧過濾器 20‧‧‧Filter
22‧‧‧濾液承受盤 22‧‧‧Development tray
24‧‧‧配管 24‧‧‧Pipe
26‧‧‧濾液槽 26‧‧‧Development tank
28‧‧‧壓力感測器 28‧‧‧ Pressure Sensor
30‧‧‧濾液泵 30‧‧‧ filtrate pump
32‧‧‧配管 32‧‧‧Pipe
34‧‧‧純水生成單元 34‧‧‧ pure water generating unit
36‧‧‧紫外線光源 36‧‧‧UV light source
38‧‧‧配管 38‧‧‧Pipe
40‧‧‧第1離子交換器 40‧‧‧1st ion exchanger
42‧‧‧第2離子交換器 42‧‧‧Second ion exchanger
44‧‧‧電磁閥 44‧‧‧ solenoid valve
46‧‧‧電磁閥 46‧‧‧ solenoid valve
48‧‧‧配管 48‧‧‧Pipe
50‧‧‧精密過濾器 50‧‧‧Precision filter
52‧‧‧壓力感測器 52‧‧‧pressure sensor
54‧‧‧比電阻計 54‧‧‧Specific resistance meter
56‧‧‧配管 56‧‧‧Pipe
58‧‧‧溫度調整單元 58‧‧‧Temperature adjustment unit
60‧‧‧配管 60‧‧‧Pipe
62‧‧‧蓋體 62‧‧‧ cover
64‧‧‧開關門 64‧‧‧Opening door
66‧‧‧輸入墊 66‧‧‧ input pad
68‧‧‧螢幕 68‧‧‧ screen
70‧‧‧主電源開關 70‧‧‧Main power switch
70a‧‧‧旋轉部 70a‧‧‧Rotating Department
72‧‧‧面板 72‧‧‧ panel
72a‧‧‧承受部 72a‧‧‧Acceptance Department
74‧‧‧桿體 74‧‧‧ rod body
74a‧‧‧第1凸緣部 74a‧‧‧1st flange
74b‧‧‧第2凸緣部 74b‧‧‧2nd flange
76‧‧‧第1保持部 76‧‧‧1st Maintenance Department
78‧‧‧第2保持部 78‧‧‧2nd Maintenance Department
80‧‧‧線圈彈簧 80‧‧‧ coil spring
82‧‧‧貫穿安裝部 82‧‧‧through installation department
82a‧‧‧貫通孔 82a‧‧‧through hole
84‧‧‧螺絲 84‧‧‧ screws
圖1為表示示意性表示廢液處理裝置之外觀的斜視圖。 Fig. 1 is a perspective view schematically showing the appearance of a waste liquid processing apparatus.
圖2為示意性表示被收容在框體之構成要素之例的圖示。 Fig. 2 is a view schematically showing an example of components housed in a casing;
圖3為用以針對開關門之鎖定機構進行說明的一部分剖面俯視圖。 3 is a partial cross-sectional plan view for explaining a locking mechanism of a switch door.
圖4(A)及圖4(B)為用以針對安全機構進行說明的側面圖。 4(A) and 4(B) are side views for explaining the safety mechanism.
圖5為示意性表示開關門之鎖定被解除之狀態的一部分剖面俯視圖。 Fig. 5 is a partial cross-sectional plan view schematically showing a state in which the lock of the switch door is released.
參照附件圖面，針對與本發明之一態樣有關之實施型態進行說明。圖1為示意性表示用以處理於半導體晶圓之加工時產生的廢液等之廢液處理裝置之外觀的斜視圖。另外，在本實施型態中，作為具有維修區域之裝置，雖然舉出廢液處理裝置作為例而進行說明，但是與本發明有關之裝置即使為切削裝置、雷射加工裝置、研削裝置、研磨裝置、洗淨裝置等亦可。 Referring to the attached drawings, an embodiment relating to one aspect of the present invention will be described. FIG. 1 is a perspective view schematically showing an appearance of a waste liquid processing apparatus for treating waste liquid or the like generated during processing of a semiconductor wafer. Further, in the present embodiment, the apparatus having the maintenance area is described as an example of the waste liquid processing apparatus, but the apparatus according to the present invention is a cutting apparatus, a laser processing apparatus, a grinding apparatus, and a grinding apparatus. A device, a washing device, or the like may also be used.
如圖1所示般，廢液處理裝置(具有維修區域之裝置)2具備收容、搭載複數之構成要素，被搭載的框體4。框體4以代表例而言係由製作廢液處理裝置2之概略外形的骨架(無圖示)，和覆蓋骨架之複數的蓋體6所構成。在框體4之內部形成有用以收容構成要素之收容空間。 As shown in FIG. 1, the waste liquid processing apparatus (device which has a maintenance area) 2 is equipped with the housing|casing 4 which accommodates and mounts the several components. In the representative example, the casing 4 is composed of a skeleton (not shown) which is a rough outline of the waste liquid processing apparatus 2, and a cover body 6 which covers a plurality of skeletons. A housing space for accommodating components is formed inside the housing 4.
圖2為示意性表示被收容在框體4之構成要素之例的圖示。在框體4之收容空間如圖2所示般，收容有通過配管8而與切削裝置等之加工裝置(無圖示)連接的廢液槽10。該廢液槽10係通過配管8而貯留從加工裝置接取到的廢液。 FIG. 2 is a view schematically showing an example of components housed in the casing 4. As shown in FIG. 2, the storage space of the casing 4 accommodates a waste liquid tank 10 that is connected to a processing device (not shown) such as a cutting device via a pipe 8. The waste liquid tank 10 stores the waste liquid received from the processing apparatus through the pipe 8.
在廢液槽10之上部，設置有用以將被貯留在廢液槽10之廢液送出至後段的廢液泵12。藉由廢液泵12而從廢液槽10被送出之廢液，通過配管14、電磁閥16等而被供給至過濾單元18。過濾單元18具備有用以過濾從廢液槽10被供給之廢液的過濾器20。 In the upper portion of the waste liquid tank 10, a waste liquid pump 12 for discharging the waste liquid stored in the waste liquid tank 10 to the subsequent stage is provided. The waste liquid sent out from the waste liquid tank 10 by the waste liquid pump 12 is supplied to the filter unit 18 through the pipe 14, the electromagnetic valve 16, and the like. The filter unit 18 is provided with a filter 20 for filtering the waste liquid supplied from the waste liquid tank 10.
在過濾器20之下方，設置有接受過濾後之液體(濾液)之濾液承受盤22。在該濾液承受盤22，經由配管24等連接有濾液槽26，以過濾器20過濾廢液而取得的濾液，通過濾液承受盤22而被貯留在濾液槽26。 Below the filter 20, a filtrate receiving tray 22 that receives the filtered liquid (filtrate) is provided. In the filtrate receiving tray 22, the filtrate tank 26 is connected via a pipe 24 or the like, and the filtrate obtained by filtering the waste liquid by the filter 20 is stored in the filtrate tank 26 through the filtrate receiving tray 22.
另外，在朝過濾單元18供給廢液之配管14，設置有用以檢測出廢液之壓力的壓力感測器28。壓力感測器28被連接於控制單元(無圖示)，包含以壓力感測器28所檢測出之壓力之資訊的訊號被送至控制單元。 Further, a pressure sensor 28 for supplying the waste liquid to the filter unit 18 is provided with a pressure sensor 28 for detecting the pressure of the waste liquid. The pressure sensor 28 is connected to a control unit (not shown), and a signal containing information on the pressure detected by the pressure sensor 28 is sent to the control unit.
控制單元係例如當以壓力感測器28所檢測出之廢棄的壓力大於臨界值時，判斷成過濾器20之功能下降而將該訊息通知至作業員。如此之通知係可以以警告燈(無圖示)之發光、通知音之產生、顯示至螢幕68(圖1)等之方法來進行。 The control unit determines that the function of the filter 20 is lowered and notifies the operator of the message, for example, when the pressure of the waste detected by the pressure sensor 28 is greater than the threshold value. Such notification can be performed by a method of emitting a warning light (not shown), generating a notification sound, and displaying it on the screen 68 (FIG. 1).
濾液槽26連接有用以將貯留之濾液送出至後段的濾液泵30。藉由濾液泵30而從濾液槽26被送出之濾液，通過配管32而被供給至純水生成單元34。純水生成單元34具備有用以對從濾液槽26被供給之濾液照射紫外線(紫外光)之紫外線光源36。 The filtrate tank 26 is connected to a filtrate pump 30 which is used to deliver the retained filtrate to the subsequent stage. The filtrate sent out from the filtrate tank 26 by the filtrate pump 30 is supplied to the pure water generating unit 34 through the pipe 32. The pure water generating unit 34 is provided with an ultraviolet light source 36 for irradiating ultraviolet rays (ultraviolet light) to the filtrate supplied from the filtrate tank 26.
利用從紫外線光源36被照射之紫外線被殺菌的濾液，通過配管38等而被供給至第1離子交換器40及第2離子交換器42。第1離子交換器40係經電磁閥44而被連接於配管38，第2離子交換器42係經電磁閥46而被連接於配管38。利用控制該些兩個電磁閥44、46，可以將濾液供給至第1離子交換器40及第2離子交換器 42之一方。 The filtrate sterilized by the ultraviolet ray irradiated from the ultraviolet light source 36 is supplied to the first ion exchanger 40 and the second ion exchanger 42 through the pipe 38 or the like. The first ion exchanger 40 is connected to the pipe 38 via the electromagnetic valve 44, and the second ion exchanger 42 is connected to the pipe 38 via the electromagnetic valve 46. By controlling the two solenoid valves 44, 46, the filtrate can be supplied to the first ion exchanger 40 and the second ion exchanger. One of the 42 sides.
被供給至第1離子交換器40或第2離子交換器42之濾液，利用第1離子交換器40或第2離子交換器42所包含的離子交換樹脂，被離子交換，成為純水。另外，以如此之方法所生成之純水，也有混入從離子交換樹脂產生之微細的樹脂片等的碎屑之情形。於是，利用經由配管48連接於第1離子交換器40及第2離子交換器42之後段的精密過濾器50除去該碎屑。 The filtrate supplied to the first ion exchanger 40 or the second ion exchanger 42 is ion-exchanged by the ion exchange resin contained in the first ion exchanger 40 or the second ion exchanger 42 to become pure water. In addition, the pure water produced by such a method may be mixed with fine particles such as a resin sheet generated from the ion exchange resin. Then, the debris is removed by the precision filter 50 connected to the first ion exchanger 40 and the second ion exchanger 42 via the pipe 48.
另外，在朝精密過濾器50供給純水之配管48，設置有用以檢測出純水之壓力的壓力感測器52。壓力感測器52被連接於控制單元，包含以壓力感測器52所檢測出之壓力之資訊的訊號被送至控制單元。控制單元係例如當以壓力感測器52所檢測出之純水的壓力大於臨界值時，判斷成精密過濾器50之功能下降而將該訊息通知至作業員。 Further, a pipe 48 for supplying pure water to the precision filter 50 is provided with a pressure sensor 52 for detecting the pressure of pure water. The pressure sensor 52 is coupled to the control unit, and a signal including information on the pressure detected by the pressure sensor 52 is sent to the control unit. For example, when the pressure of the pure water detected by the pressure sensor 52 is greater than the critical value, the control unit determines that the function of the precision filter 50 is lowered to notify the operator of the message.
再者，在朝精密過濾器50供給純水之配管48，設置有用以檢測出純水之比電阻的比電阻計54。比電阻計54被連接於控制單元，包含以比電阻計54所檢測出之比電阻之資訊的訊號被送至控制單元。控制單元係例如當以比電阻計54所檢測出之純水之比電阻低於臨界值時，判斷成第1離子交換器40或第2離子交換器42之功能下降而將訊息通知至作業員。 Further, a pipe 48 for supplying pure water to the precision filter 50 is provided with a specific resistance meter 54 for detecting the specific resistance of pure water. The specific resistance meter 54 is connected to the control unit, and a signal including information on the specific resistance detected by the resistance meter 54 is sent to the control unit. For example, when the specific resistance of the pure water detected by the resistance meter 54 is lower than the critical value, the control unit determines that the function of the first ion exchanger 40 or the second ion exchanger 42 is lowered to notify the operator of the message. .
以純水生成單元34所生成之純水通過配管56等而被送至溫度調整單元58。以溫度調整單元58被調整 至特定之溫度的純水通過配管60等而被供給至加工裝置。 The pure water generated by the pure water generating unit 34 is sent to the temperature adjusting unit 58 through the piping 56 or the like. Adjusted by temperature adjustment unit 58 The pure water to a specific temperature is supplied to the processing apparatus through the piping 60 or the like.
如圖1所示般，在框體4之上部前面側，形成有通往收容空間的第1開口部4a。在第1開口部4a內，配置有例如上述的過濾單元18。再者，在框體4之上面安裝有用以關閉該第1開口部4a之蓋體62。利用開啟蓋體62，作業員可以通過第1開口部4a而更換過濾單元18之過濾器20。 As shown in Fig. 1, a first opening portion 4a that leads to the accommodating space is formed on the front side of the upper portion of the casing 4. In the first opening 4a, for example, the above-described filter unit 18 is disposed. Further, a lid body 62 for closing the first opening portion 4a is attached to the upper surface of the casing 4. By opening the lid body 62, the operator can replace the filter 20 of the filter unit 18 through the first opening portion 4a.
再者，在框體4之前面形成有與第1開口部4a鄰接而通往收容空間的第2開口部4b。於維修廢液處理裝置2之時，例如作業員可以通過第2開口部4b而在收容空間之一部分檢修。即是，該收容空間之一部分成為維修時作業員檢修之維修區域。 Further, a second opening portion 4b that is adjacent to the first opening portion 4a and that leads to the accommodating space is formed in front of the casing 4. When the waste liquid processing apparatus 2 is being repaired, for example, the worker can perform inspection in one of the storage spaces through the second opening 4b. That is, one of the accommodating spaces becomes a maintenance area for maintenance by the operator at the time of maintenance.
在維修區域收容例如維修區域之頻率高的電氣裝備零件或配管等之構成要素。但是，被收容在維修區域之構成要素並無限制。在第2開口部4b之前方側，設置有用以覆蓋維修區域之開關門64。開關門64之一方之側部以絞鏈等被連結於框體4，開關門64以該側部為中心旋轉。 In the maintenance area, components such as electrical equipment parts or piping having a high frequency, such as a maintenance area, are housed. However, there are no restrictions on the components that are contained in the maintenance area. On the front side of the second opening portion 4b, a switch door 64 for covering the maintenance area is provided. One side of the switch door 64 is coupled to the frame 4 by a hinge or the like, and the switch door 64 is rotated about the side.
在開關門64之上部前面，設置有用以輸入對控制單元之指示等的輸入墊66。在與輸入墊66鄰接之位置，設置有用以顯示各種資訊的螢幕68。 In front of the upper portion of the switch door 64, an input pad 66 for inputting an instruction to the control unit or the like is provided. At a position adjacent to the input pad 66, a screen 68 for displaying various information is provided.
在框體4之側面，配置有用以切換廢液處理裝置2具備的主電源(無圖示)之接通和斷開的旋轉式之 主電源開關70。在主電源開關70之周圍，固定有包圍主電源開關70之面板72。該面板72成為用以鎖定開關門64之鎖定機構之一部分。 On the side of the casing 4, a rotary type for switching on and off of a main power source (not shown) provided in the waste liquid processing apparatus 2 is disposed. Main power switch 70. A panel 72 surrounding the main power switch 70 is fixed around the main power switch 70. This panel 72 becomes part of the locking mechanism for locking the switch door 64.
圖3為用以針對開關門64之鎖定機構進行說明的一部分剖面俯視圖。在圖3中，表示鎖定開關門64之狀態。如圖3所示般，在面板72之背面側(框體4之蓋體6側)，接觸構成鎖定機構之圓柱狀之桿體74之一端側(基端側)。該桿體74係例如通過被形成在蓋體6之貫通孔(無圖示)，而被插入至框體4之內部。 3 is a partial cross-sectional plan view for explaining a locking mechanism of the opening and closing door 64. In Fig. 3, the state of the lock switch door 64 is shown. As shown in Fig. 3, on the back side of the panel 72 (on the side of the lid body 6 of the casing 4), one end side (base end side) of the cylindrical rod body 74 constituting the lock mechanism is contacted. The rod body 74 is inserted into the inside of the casing 4 by, for example, a through hole (not shown) formed in the lid body 6.
再者，桿體74係例如在藉由被固定在框體4之上部等之第1保持部76及第2保持部78而能夠滑動之狀態下被保持。在第1保持部76及第2保持部78，分別形成貫通孔(無圖示)，桿體74被插入至該貫通孔。 In addition, the rod body 74 is held in a state where it can be slid by being fixed to the first holding portion 76 and the second holding portion 78 which are fixed to the upper portion of the casing 4, for example. A through hole (not shown) is formed in each of the first holding portion 76 and the second holding portion 78, and the rod 74 is inserted into the through hole.
在桿體74之一端側，設置有從桿體74之側面突出至徑向的第1凸緣部74a。在位於第1凸緣部74a和第1保持部76之間的桿體74之周圍，配置有線圈彈簧80。藉由該線圈彈簧80，桿體74朝向面板72之背面側被彈推。即是，在鎖定開關門64之狀態下，桿體74之一端側在面板72以按壓之方式被卡止(被按壓卡止)。 On one end side of the rod body 74, a first flange portion 74a that protrudes from the side surface of the rod body 74 to the radial direction is provided. A coil spring 80 is disposed around the rod 74 located between the first flange portion 74a and the first holding portion 76. With the coil spring 80, the rod body 74 is pushed toward the back side of the panel 72. That is, in a state where the switch door 64 is locked, one end side of the rod body 74 is locked by the panel 72 (pressed and locked).
在桿體74之另一端側(前端側)，設置有從桿體74之側面突出至徑向的第2凸緣部74b。藉由該第2凸緣部74b防止桿體74從第2保持部78脫落。另外，第2凸緣部74b被配置在從桿體74之另一端離開至一端側的位置上，桿體74之另一端之側面露出。 On the other end side (front end side) of the rod body 74, a second flange portion 74b that protrudes from the side surface of the rod body 74 to the radial direction is provided. The rod body 74 is prevented from falling off from the second holding portion 78 by the second flange portion 74b. Further, the second flange portion 74b is disposed at a position away from the other end of the rod body 74 to the one end side, and the side surface of the other end of the rod body 74 is exposed.
在開關門64之內側設置有與桿體74之另一端側卡止的貫穿安裝部82。在貫穿安裝部82形成有可以插入桿體74之另一端側的貫通孔82a。依此，若在關閉開關門64之狀態下使桿體74滑動，使桿體74定位在另一端側被插入至貫通孔82a之貫穿安裝位置時，可以鎖定開關門64。 A through mounting portion 82 that is locked to the other end side of the rod body 74 is provided inside the opening and closing door 64. A through hole 82a that can be inserted into the other end side of the rod body 74 is formed in the through-mounting portion 82. Accordingly, when the lever body 74 is slid in a state where the opening and closing door 64 is closed, and the lever body 74 is positioned at the insertion position where the other end side is inserted into the through hole 82a, the opening and closing door 64 can be locked.
如上述般，桿體74之一端側在面板72之背面側以按壓之方式被卡止，桿體74之一端側之位置藉由面板72被限制。例如，將桿體74定位在開關門64被鎖定之貫穿安裝位置，係如圖3所示般，若將面板72固定在框體4(蓋體6)而限制桿體74之一端側之位置即可。 As described above, one end side of the rod body 74 is pressed against the back side of the panel 72, and the position of one end side of the rod body 74 is restricted by the panel 72. For example, the rod body 74 is positioned at the through-mounting position where the opening and closing door 64 is locked, as shown in FIG. 3, and the panel 72 is fixed to the frame body 4 (the cover body 6) to restrict the position of one end side of the rod body 74. Just fine.
對面板72之框體4(蓋體6)的固定例如藉由4個之螺絲84而被進行。另外，解除開關門64之鎖定，若從框體4(蓋體6)卸下面板72，且將桿體74定位在另一端側從貫通孔82a被拔去之拔去位置即可。 The fixing of the frame 4 (the cover 6) of the panel 72 is performed by, for example, four screws 84. Further, when the lock door 64 is unlocked, the panel 72 is removed from the casing 4 (the lid body 6), and the rod body 74 is positioned at the unplugged position where the other end side is removed from the through hole 82a.
另外，在該鎖定機構，設置有利用將主電源開關70對準主電源成為斷開之斷開位置，使可以解除鎖定之安全機構。即是，只要主電源開關70不對準斷開位置，就算螺絲84鬆開，面板72也不會從框體4(蓋體6)卸下。 Further, the lock mechanism is provided with a safety mechanism that can be unlocked by using the main power switch 70 in alignment with the main power source to be turned off. That is, as long as the main power switch 70 is not aligned with the off position, even if the screw 84 is loosened, the panel 72 will not be detached from the frame 4 (the cover 6).
圖4(A)及圖4(B)為用以針對安全機構進行說明的側面圖。另外，在圖4(A)中，表示將主電源開關70對準主電源成為接通之接通位置的狀態，在圖4(B)中，表示將主電源開關70對準主電源成為斷開之斷 開位置的狀態。 4(A) and 4(B) are side views for explaining the safety mechanism. 4(A) shows a state in which the main power switch 70 is aligned with the main power source being turned on, and FIG. 4(B) shows that the main power switch 70 is turned off to the main power source. Open The status of the open position.
如圖4(A)及圖4(B)所示般，安全機構包含例如被連結、固定於主電源開關70之旋轉軸的棒狀之旋轉部70a。該旋轉部70a隨著主電源開關70之旋轉而旋轉。另外，在與旋轉部70a之前端對應之位置，配置有被固定於面板72側之承受部72a。 As shown in FIGS. 4(A) and 4(B), the safety mechanism includes, for example, a rod-shaped rotating portion 70a that is coupled and fixed to the rotating shaft of the main power switch 70. The rotating portion 70a rotates in accordance with the rotation of the main power switch 70. Further, a receiving portion 72a fixed to the panel 72 side is disposed at a position corresponding to the front end of the rotating portion 70a.
如圖4(A)所示般，承受部72a係被配置在將主電源開關70對準接通位置之狀態下旋轉部70a之前端卡合的位置。依此，在將主電源開關70對準接通位置之狀態下，旋轉部70a之前端卡合於承受部72a，主電源開關70和面板72之位置關係被固定。即是，在該狀態下，無法將面板72從框體4(蓋體6)卸下。 As shown in FIG. 4(A), the receiving portion 72a is disposed at a position where the front end of the rotating portion 70a is engaged with the main power switch 70 aligned with the ON position. Accordingly, in a state where the main power switch 70 is aligned with the ON position, the front end of the rotating portion 70a is engaged with the receiving portion 72a, and the positional relationship between the main power switch 70 and the panel 72 is fixed. That is, in this state, the panel 72 cannot be detached from the casing 4 (the lid body 6).
另外，當如圖4(B)所示般，使主電源開關70旋轉而對準斷開位置時，旋轉部70a也旋轉，旋轉部70a之前端和承受部72a之卡合被解除。依此，因主電源開關70和面板72之位置關係變成不被固定，故可以從框體4(蓋體6)卸下面板72，而解除開關門64之鎖定。 Further, when the main power switch 70 is rotated and aligned with the off position as shown in FIG. 4(B), the rotating portion 70a also rotates, and the engagement between the front end of the rotating portion 70a and the receiving portion 72a is released. Accordingly, since the positional relationship between the main power switch 70 and the panel 72 is not fixed, the panel 72 can be removed from the casing 4 (the cover 6), and the lock of the opening and closing door 64 can be released.
圖5為示意性表示開關門64之鎖定被解除之狀態的一部分剖面俯視圖。如圖5所示般，若在將主電源開關70對準斷開位置之狀態下，鬆開螺絲84時，就可以從框體4(蓋體6)卸下面板72。 FIG. 5 is a partial cross-sectional plan view schematically showing a state in which the lock of the switch door 64 is released. As shown in FIG. 5, when the screw 84 is loosened while the main power switch 70 is aligned with the off position, the panel 72 can be removed from the casing 4 (the cover 6).
當從框體4(蓋體6)卸下面板72時，桿體74被定位在拔去位置，桿體74之另一端側從貫通孔82a被拔去。依此，作業員開啟開關門64而可以在維修區域 檢修。另外，在該狀態下，因主電源成為斷開，故安全性高。 When the panel 72 is removed from the casing 4 (the lid body 6), the rod body 74 is positioned at the removal position, and the other end side of the rod body 74 is pulled out from the through hole 82a. According to this, the operator opens the switch door 64 and can be in the maintenance area. Overhaul. Further, in this state, since the main power source is turned off, the safety is high.
如上述般，在與本實施型態有關的廢液處理裝置(具有維修區域的裝置)2中，因具備有用以覆蓋被形成在框體4之維修區域的開關門64，故僅開啟該開關門64即可以在維修區域檢修。即是，即使不卸下框體4之蓋體6亦可以廢液處理裝置2。 As described above, in the waste liquid processing apparatus (device having the maintenance area) 2 according to the present embodiment, since the switch door 64 is provided to cover the maintenance area formed in the housing 4, only the switch is turned on. The door 64 can be inspected in the repair area. That is, the waste liquid processing apparatus 2 can be used without removing the lid body 6 of the frame body 4.
再者，與本實施型態有關之廢液處理裝置2中，於開啟開關門64之時，必須將主電源開關70對準成為斷開之斷開位置而將面板72從框體4(蓋體6)卸下，且將另一端側被插入至貫通孔82a之桿體74定位在拔去位置，而將該桿體74之另一端從貫通孔82a拔去。即是，因在主電源接通之狀態下，無法開啟開關門64，故維修之時的安全性變高。 Further, in the waste liquid processing apparatus 2 according to the present embodiment, when the switch door 64 is opened, the main power switch 70 must be aligned to the disconnected open position to bring the panel 72 from the frame 4 (cover) The body 6) is detached, and the rod body 74 whose other end side is inserted into the through hole 82a is positioned at the unplugged position, and the other end of the rod body 74 is detached from the through hole 82a. That is, since the switch door 64 cannot be opened in the state where the main power is turned on, the safety at the time of maintenance becomes high.
另外，本發明並不限定於上述實施型態之記載，能夠做各種變更而加以實施。例如，在上述實施型態中，雖然針對與旋轉式之主電源開關70對應的安全機構之一例進行說明，但是安全機構之構成並不特別限制。例如，亦可以使用與按鍵式之主電源開關連動，而電性地使旋轉部旋轉之安全機構等。當然即使在旋轉式之主電源開關組合電性地進行動作的安全機構等亦可。 In addition, the invention is not limited to the description of the above-described embodiments, and various modifications can be made. For example, in the above-described embodiment, an example of a safety mechanism corresponding to the rotary main power switch 70 will be described, but the configuration of the safety mechanism is not particularly limited. For example, a safety mechanism that electrically rotates the rotating portion in conjunction with the push-type main power switch may be used. Of course, even a rotary main power switch can be combined with a safety mechanism that operates electrically.
其他，與上述實施型態有關之構造、方法等只要不脫離本發明之目的的範圍，可以做適當變更而加以實施。 In addition, the structures, methods, and the like according to the above-described embodiments may be modified as appropriate without departing from the scope of the invention.
2‧‧‧廢液處理裝置(具有維修區域的裝置) 2‧‧‧Waste treatment unit (device with maintenance area)
4‧‧‧框體 4‧‧‧ frame
4a‧‧‧第1開口部 4a‧‧‧1st opening
4b‧‧‧第2開口部 4b‧‧‧2nd opening
6‧‧‧蓋體 6‧‧‧ Cover
62‧‧‧蓋體 62‧‧‧ cover
64‧‧‧開關門 64‧‧‧Opening door
66‧‧‧輸入墊 66‧‧‧ input pad
68‧‧‧螢幕 68‧‧‧ screen
70‧‧‧主電源開關 70‧‧‧Main power switch
72‧‧‧面板 72‧‧‧ panel
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2016031901A JP6695625B2 (en) | 2016-02-23 | 2016-02-23 | Equipment with maintenance area |
| JP2016-031901 | 2016-02-23 |
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| Publication Number | Publication Date |
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| TW201741067A true TW201741067A (en) | 2017-12-01 |
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| KR (1) | KR102493113B1 (en) |
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| JP2000269299A (en) | 1999-03-18 | 2000-09-29 | Kokusai Electric Co Ltd | Semiconductor manufactureing device |
| JP2000325292A (en) * | 1999-05-24 | 2000-11-28 | Olympus Optical Co Ltd | Medical treatment apparatus for endoscope |
| US6424097B1 (en) * | 2000-05-12 | 2002-07-23 | Infocus Corporation | Projection lamp safety interlock apparatus and method |
| JP4119762B2 (en) * | 2003-01-31 | 2008-07-16 | 富士フイルム株式会社 | Recording media protection mechanism |
| JP4961168B2 (en) | 2006-06-14 | 2012-06-27 | 株式会社ディスコ | Processing equipment |
| TWM327903U (en) * | 2007-09-19 | 2008-03-01 | Taian Etacom Technology Co Ltd | Protective door lock of an insertion-type power distribution box |
| JP5086123B2 (en) | 2008-02-15 | 2012-11-28 | 株式会社ディスコ | Processing waste liquid treatment equipment |
| TWM366229U (en) * | 2009-05-22 | 2009-10-01 | Taian Etacom Technology Co Ltd | Safety interlocking mechanism of jack-in type distribution box |
| JP5707240B2 (en) * | 2010-10-25 | 2015-04-22 | オリジン電気株式会社 | Power supply |
| CN102312624B (en) | 2011-07-01 | 2013-11-13 | 广东北江开关厂有限公司 | Blocking structure for cubicle switchboard front door and cable chamber door |
| CN103367059B (en) * | 2013-08-02 | 2016-03-16 | 胡俊兵 | A kind of high-voltage intelligent circuit breaker |
| CN203480647U (en) * | 2013-09-18 | 2014-03-12 | 刘雪东 | Electric power overhaul safety protector |
-
2016
- 2016-02-23 JP JP2016031901A patent/JP6695625B2/en active Active
-
2017
- 2017-01-12 TW TW106101027A patent/TWI697378B/en active
- 2017-02-14 KR KR1020170019828A patent/KR102493113B1/en active IP Right Grant
- 2017-02-20 CN CN201710088953.1A patent/CN107104066B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107104066A (en) | 2017-08-29 |
| JP6695625B2 (en) | 2020-05-20 |
| JP2017148888A (en) | 2017-08-31 |
| KR102493113B1 (en) | 2023-01-27 |
| CN107104066B (en) | 2022-05-03 |
| TWI697378B (en) | 2020-07-01 |
| KR20170099366A (en) | 2017-08-31 |
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