TWI692008B - 用於形成高品質薄膜的循環連續製程 - Google Patents
用於形成高品質薄膜的循環連續製程 Download PDFInfo
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- TWI692008B TWI692008B TW105104460A TW105104460A TWI692008B TW I692008 B TWI692008 B TW I692008B TW 105104460 A TW105104460 A TW 105104460A TW 105104460 A TW105104460 A TW 105104460A TW I692008 B TWI692008 B TW I692008B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/308—Oxynitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
- C23C16/345—Silicon nitride
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/36—Carbonitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using incoherent light, UV to IR, e.g. lamps
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
- C23C16/483—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using coherent light, UV to IR, e.g. lasers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562119714P | 2015-02-23 | 2015-02-23 | |
| US62/119,714 | 2015-02-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201705218A TW201705218A (zh) | 2017-02-01 |
| TWI692008B true TWI692008B (zh) | 2020-04-21 |
Family
ID=56693467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105104460A TWI692008B (zh) | 2015-02-23 | 2016-02-16 | 用於形成高品質薄膜的循環連續製程 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10041167B2 (enExample) |
| JP (1) | JP6761807B2 (enExample) |
| KR (1) | KR102655396B1 (enExample) |
| CN (1) | CN107430991A (enExample) |
| TW (1) | TWI692008B (enExample) |
| WO (1) | WO2016137606A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10790140B2 (en) * | 2017-02-14 | 2020-09-29 | Applied Materials, Inc. | High deposition rate and high quality nitride |
| KR102269470B1 (ko) * | 2017-04-04 | 2021-06-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 실리콘 갭충전을 위한 2-단계 프로세스 |
| JP7118512B2 (ja) * | 2017-04-07 | 2022-08-16 | アプライド マテリアルズ インコーポレイテッド | 反応性アニールを使用する間隙充填 |
| WO2018212999A1 (en) * | 2017-05-13 | 2018-11-22 | Applied Materials, Inc. | Cyclic flowable deposition and high-density plasma treatment proceses for high quality gap fill solutions |
| JP6997000B2 (ja) * | 2018-02-14 | 2022-01-17 | Sppテクノロジーズ株式会社 | シリコン窒化膜の製造方法及び製造装置 |
| KR20250041199A (ko) * | 2018-04-03 | 2025-03-25 | 어플라이드 머티어리얼스, 인코포레이티드 | H2 플라즈마를 사용하는 유동성 막 경화 |
| US20200090980A1 (en) * | 2018-09-13 | 2020-03-19 | Nanya Technology Corporation | Method for preparing semiconductor structures |
| TWI792005B (zh) * | 2019-07-23 | 2023-02-11 | 美商應用材料股份有限公司 | 可流動cvd薄膜之表面粗糙度 |
| JP7246284B2 (ja) * | 2019-08-15 | 2023-03-27 | 東京エレクトロン株式会社 | 成膜方法 |
| KR20210028093A (ko) * | 2019-08-29 | 2021-03-11 | 에이에스엠 아이피 홀딩 비.브이. | 유전체 층을 포함하는 구조체 및 이를 형성하는 방법 |
| TWI889919B (zh) * | 2020-10-21 | 2025-07-11 | 荷蘭商Asm Ip私人控股有限公司 | 用於可流動間隙填充之方法及裝置 |
| US11170994B1 (en) * | 2021-01-12 | 2021-11-09 | Applied Materials, Inc. | CD dependent gap fill and conformal films |
| US12094709B2 (en) | 2021-07-30 | 2024-09-17 | Applied Materials, Inc. | Plasma treatment process to densify oxide layers |
| JP7833911B2 (ja) * | 2022-03-04 | 2026-03-23 | 東京エレクトロン株式会社 | 絶縁膜の形成方法および基板処理システム |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20070281448A1 (en) * | 2006-05-30 | 2007-12-06 | Applied Materials, Inc. | Novel deposition-plasma cure cycle process to enhance film quality of silicon dioxide |
| US7888273B1 (en) * | 2006-11-01 | 2011-02-15 | Novellus Systems, Inc. | Density gradient-free gap fill |
| US20120238108A1 (en) * | 2011-03-14 | 2012-09-20 | Applied Materials, Inc. | Two-stage ozone cure for dielectric films |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH05259156A (ja) * | 1992-03-16 | 1993-10-08 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPH11135622A (ja) * | 1997-10-27 | 1999-05-21 | Canon Inc | 半導体装置及び液晶表示装置及び投射型液晶表示装置及び製造方法 |
| JP2956693B1 (ja) * | 1998-05-27 | 1999-10-04 | 日本電気株式会社 | 金属窒化膜形成方法 |
| US7446217B2 (en) | 2002-11-14 | 2008-11-04 | Advanced Technology Materials, Inc. | Composition and method for low temperature deposition of silicon-containing films |
| JP4265409B2 (ja) | 2003-02-13 | 2009-05-20 | 三菱マテリアル株式会社 | Si−Si結合を有する有機Si含有化合物を用いたSi含有薄膜の形成方法 |
| WO2005048337A1 (ja) * | 2003-11-14 | 2005-05-26 | Tokyo Electron Limited | プラズマ着火方法および基板処理方法 |
| US7524735B1 (en) * | 2004-03-25 | 2009-04-28 | Novellus Systems, Inc | Flowable film dielectric gap fill process |
| JP2006019366A (ja) * | 2004-06-30 | 2006-01-19 | Canon Inc | 半導体装置の絶縁膜形成方法 |
| US7790633B1 (en) | 2004-10-26 | 2010-09-07 | Novellus Systems, Inc. | Sequential deposition/anneal film densification method |
| US20060228898A1 (en) * | 2005-03-30 | 2006-10-12 | Cory Wajda | Method and system for forming a high-k dielectric layer |
| US8129290B2 (en) * | 2005-05-26 | 2012-03-06 | Applied Materials, Inc. | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure |
| US7498273B2 (en) * | 2006-05-30 | 2009-03-03 | Applied Materials, Inc. | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes |
| CN101454877B (zh) * | 2006-05-30 | 2012-07-04 | 应用材料公司 | 提高二氧化硅膜品质的新颖沉积-等离子硬化循环方法 |
| US7790634B2 (en) * | 2006-05-30 | 2010-09-07 | Applied Materials, Inc | Method for depositing and curing low-k films for gapfill and conformal film applications |
| KR20150036815A (ko) | 2007-09-18 | 2015-04-07 | 레르 리키드 쏘시에떼 아노님 뿌르 레뜌드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 | 규소 함유 막의 형성 방법 |
| US7803722B2 (en) * | 2007-10-22 | 2010-09-28 | Applied Materials, Inc | Methods for forming a dielectric layer within trenches |
| JP2009152303A (ja) * | 2007-12-19 | 2009-07-09 | Canon Inc | 絶縁膜の形成方法 |
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| KR101659303B1 (ko) * | 2009-07-15 | 2016-09-23 | 어플라이드 머티어리얼스, 인코포레이티드 | Cvd 챔버의 유동 제어 피쳐 |
| JP2011066187A (ja) * | 2009-09-17 | 2011-03-31 | Tokyo Electron Ltd | 成膜方法及び処理システム |
| TWI579916B (zh) * | 2009-12-09 | 2017-04-21 | 諾菲勒斯系統公司 | 整合可流動氧化物及頂蓋氧化物之新穎間隙填充 |
| WO2011074440A1 (ja) | 2009-12-14 | 2011-06-23 | コニカミノルタホールディングス株式会社 | ガスバリアフィルム、ガスバリアフィルムの製造方法及び有機光電変換素子 |
| US9257274B2 (en) * | 2010-04-15 | 2016-02-09 | Lam Research Corporation | Gapfill of variable aspect ratio features with a composite PEALD and PECVD method |
| US8470187B2 (en) * | 2010-11-05 | 2013-06-25 | Asm Japan K.K. | Method of depositing film with tailored comformality |
| US20120149213A1 (en) * | 2010-12-09 | 2012-06-14 | Lakshminarayana Nittala | Bottom up fill in high aspect ratio trenches |
| US9404178B2 (en) * | 2011-07-15 | 2016-08-02 | Applied Materials, Inc. | Surface treatment and deposition for reduced outgassing |
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| US8846536B2 (en) | 2012-03-05 | 2014-09-30 | Novellus Systems, Inc. | Flowable oxide film with tunable wet etch rate |
| US20150118863A1 (en) * | 2013-10-25 | 2015-04-30 | Lam Research Corporation | Methods and apparatus for forming flowable dielectric films having low porosity |
| US9029272B1 (en) * | 2013-10-31 | 2015-05-12 | Asm Ip Holding B.V. | Method for treating SiOCH film with hydrogen plasma |
| US20150140833A1 (en) * | 2013-11-18 | 2015-05-21 | Applied Materials, Inc. | Method of depositing a low-temperature, no-damage hdp sic-like film with high wet etch resistance |
| US9570287B2 (en) * | 2014-10-29 | 2017-02-14 | Applied Materials, Inc. | Flowable film curing penetration depth improvement and stress tuning |
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2016
- 2016-01-20 KR KR1020177026905A patent/KR102655396B1/ko active Active
- 2016-01-20 CN CN201680011251.7A patent/CN107430991A/zh active Pending
- 2016-01-20 WO PCT/US2016/014004 patent/WO2016137606A1/en not_active Ceased
- 2016-01-20 US US15/001,384 patent/US10041167B2/en active Active
- 2016-01-20 JP JP2017544598A patent/JP6761807B2/ja active Active
- 2016-02-16 TW TW105104460A patent/TWI692008B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20070281448A1 (en) * | 2006-05-30 | 2007-12-06 | Applied Materials, Inc. | Novel deposition-plasma cure cycle process to enhance film quality of silicon dioxide |
| US7888273B1 (en) * | 2006-11-01 | 2011-02-15 | Novellus Systems, Inc. | Density gradient-free gap fill |
| US20120238108A1 (en) * | 2011-03-14 | 2012-09-20 | Applied Materials, Inc. | Two-stage ozone cure for dielectric films |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170120157A (ko) | 2017-10-30 |
| TW201705218A (zh) | 2017-02-01 |
| WO2016137606A1 (en) | 2016-09-01 |
| US10041167B2 (en) | 2018-08-07 |
| JP2018512727A (ja) | 2018-05-17 |
| CN107430991A (zh) | 2017-12-01 |
| JP6761807B2 (ja) | 2020-09-30 |
| KR102655396B1 (ko) | 2024-04-04 |
| US20160244879A1 (en) | 2016-08-25 |
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