TWI691011B - 基板盒、收納部及基板搬運器 - Google Patents

基板盒、收納部及基板搬運器 Download PDF

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Publication number
TWI691011B
TWI691011B TW105125311A TW105125311A TWI691011B TW I691011 B TWI691011 B TW I691011B TW 105125311 A TW105125311 A TW 105125311A TW 105125311 A TW105125311 A TW 105125311A TW I691011 B TWI691011 B TW I691011B
Authority
TW
Taiwan
Prior art keywords
substrate
locking
tray
portions
storage
Prior art date
Application number
TW105125311A
Other languages
English (en)
Chinese (zh)
Other versions
TW201727805A (zh
Inventor
石田信悟
鳥越紀男
Original Assignee
日商東京應化工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京應化工業股份有限公司 filed Critical 日商東京應化工業股份有限公司
Publication of TW201727805A publication Critical patent/TW201727805A/zh
Application granted granted Critical
Publication of TWI691011B publication Critical patent/TWI691011B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Stackable Containers (AREA)
TW105125311A 2015-09-30 2016-08-09 基板盒、收納部及基板搬運器 TWI691011B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-194701 2015-09-30
JP2015194701A JP6652362B2 (ja) 2015-09-30 2015-09-30 基板ケース、収納部、及び、基板搬送器

Publications (2)

Publication Number Publication Date
TW201727805A TW201727805A (zh) 2017-08-01
TWI691011B true TWI691011B (zh) 2020-04-11

Family

ID=58495148

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105125311A TWI691011B (zh) 2015-09-30 2016-08-09 基板盒、收納部及基板搬運器

Country Status (3)

Country Link
JP (1) JP6652362B2 (ko)
KR (1) KR20170038683A (ko)
TW (1) TWI691011B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI685050B (zh) * 2017-12-26 2020-02-11 日商Ｓｕｍｃｏ股份有限公司 半導體晶圓收納容器的捆包用緩衝體
DE202019101793U1 (de) * 2018-06-27 2019-10-09 Murata Machinery, Ltd. Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung
DE202019101794U1 (de) * 2018-06-27 2019-10-09 Murata Machinery, Ltd. Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung
JP6964952B2 (ja) * 2020-04-01 2021-11-10 旭テック株式会社 シート状トレイ
TWI728922B (zh) 2020-10-07 2021-05-21 頎邦科技股份有限公司 捲帶封裝的儲放構造及其載盤

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302272B1 (en) * 1998-11-30 2001-10-16 Nippon Shokubai Co., Ltd Package, packing method and transporting method for brittle sheets
JP2002002695A (ja) * 2000-06-15 2002-01-09 Kyocera Corp 基板収納トレイ及びこれを用いた基板梱包体
JP2005191419A (ja) * 2003-12-26 2005-07-14 Achilles Corp 半導体ウェハーの収納具

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0427819Y2 (ko) * 1985-03-20 1992-07-03
JPH0817903A (ja) 1994-07-01 1996-01-19 Ryoden Semiconductor Syst Eng Kk 基板ケース
JPH08236605A (ja) 1995-02-28 1996-09-13 Komatsu Electron Metals Co Ltd 半導体ウェハ収納ケース
JP2000226087A (ja) * 1998-11-30 2000-08-15 Nippon Shokubai Co Ltd 脆性薄板材の包装体、包装方法および輸送方法
JP2001148417A (ja) 1999-11-22 2001-05-29 Mitsubishi Electric Corp 収容ケース
JP2002145380A (ja) 2000-11-08 2002-05-22 Sony Corp ウエハー梱包方法
JP4999597B2 (ja) 2007-08-08 2012-08-15 ミライアル株式会社 枚葉式ウエハケース

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302272B1 (en) * 1998-11-30 2001-10-16 Nippon Shokubai Co., Ltd Package, packing method and transporting method for brittle sheets
JP2002002695A (ja) * 2000-06-15 2002-01-09 Kyocera Corp 基板収納トレイ及びこれを用いた基板梱包体
JP2005191419A (ja) * 2003-12-26 2005-07-14 Achilles Corp 半導体ウェハーの収納具

Also Published As

Publication number Publication date
JP6652362B2 (ja) 2020-02-19
JP2017069444A (ja) 2017-04-06
TW201727805A (zh) 2017-08-01
KR20170038683A (ko) 2017-04-07

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