TWI691011B - Substrate case, compartment, and substrate transfer container - Google Patents

Substrate case, compartment, and substrate transfer container Download PDF

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TWI691011B
TWI691011B TW105125311A TW105125311A TWI691011B TW I691011 B TWI691011 B TW I691011B TW 105125311 A TW105125311 A TW 105125311A TW 105125311 A TW105125311 A TW 105125311A TW I691011 B TWI691011 B TW I691011B
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substrate
locking
tray
portions
storage
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TW105125311A
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TW201727805A (en
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石田信悟
鳥越紀男
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日商東京應化工業股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67379Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67383Closed carriers characterised by substrate supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Stackable Containers (AREA)

Abstract

提供具備可以防止在基板之上面產生刮傷, 並可以縮小用以搬運基板之型態之收納部的新穎基板盒。 Provided to prevent scratches on the substrate, It can also reduce the size of the novel substrate box for the storage part of the type used to carry the substrate.

具有複數用以收納基板之收納部的基板 盒(30),具有複數托盤(10),在一個托盤(10)之表面部中的卡止部(11a~11d)之內側,支撐基板(20),藉由位於該托盤(10)之上方之另外的托盤(10)之背面部中的卡止凸部(13b、13d、13f)及(13h),卡止基板(20)之端部,來保持基板(20)。 Substrate with a plurality of storage parts for accommodating the substrate The box (30) has a plurality of trays (10), inside the locking portions (11a to 11d) in the surface portion of one tray (10), supports the substrate (20) by being located above the tray (10) The locking projections (13b, 13d, 13f) and (13h) in the back of the other tray (10) lock the ends of the substrate (20) to hold the substrate (20).

Description

基板盒、收納部及基板搬運器 Substrate box, storage part and substrate carrier

本發明係關於基板盒、構成基板盒之收納部及具備有基板盒之基板搬運器。 The present invention relates to a substrate box, a storage portion constituting the substrate box, and a substrate carrier provided with the substrate box.

隨著行動電話、數位AV機器及IC卡等之高功能化,使被搭載之半導體矽晶片(以下,記為晶片)小型化及薄型化,依此越來越要求在封裝體內使該晶片高積體化。例如,在以CSP(chip size package)或MCP(multi-chip package)為代表,將複數晶片一次性封裝化之積體電路中,則要求薄型化。為了實現封裝體內之晶片之高積體化,必須使晶片之厚度薄至25~150μm之範圍。如此一來,當搬運被高度薄化之晶圓基板等時,使用收納基板之盒體。 As mobile phones, digital AV equipment, IC cards, etc. become more functional, the mounted semiconductor silicon chips (hereinafter referred to as chips) have become smaller and thinner. Therefore, there is an increasing demand for the chip to be higher in the package Integration. For example, in an integrated circuit in which a plurality of chips are packaged at one time, represented by CSP (chip size package) or MCP (multi-chip package), thinning is required. In order to achieve high integration of the chip in the package, the thickness of the chip must be as thin as 25 to 150 μm. In this way, when conveying a highly thinned wafer substrate or the like, a box housing the substrate is used.

例如,在專利文獻1中記載著在能夠收納基板之溝狀之收納室內,在較其底面淺之位置,跨設略覆蓋其開口剖面之彈性膜,藉由該彈性膜,支撐基板之基板盒。 For example, Patent Document 1 describes that in a trench-shaped storage chamber capable of accommodating a substrate, at a position shallower than the bottom surface, an elastic film slightly covering the opening cross section is straddled, and the elastic film supports the substrate cassette of the substrate .

在專利文獻2中記載著藉由前端開口之剖面被形成「ㄑ」字形的保持器,夾持半導體晶圓之周緣部之半導體晶圓收納盒。 Patent Document 2 describes a semiconductor wafer storage box that holds a holder formed in a “ㄑ” shape with a cross section opened at the front end and sandwiches the peripheral portion of a semiconductor wafer.

在專利文獻3中記載著保持碟體之周緣部之保持部,被設置在收容碟片之碟片收容空間之內側的收容盒。 Patent Document 3 describes that a holding portion that holds a peripheral portion of a disc body is provided in a storage box inside a disc storage space that stores a disc.

在專利文獻4中記載著單片式晶圓盒,其係於收納晶圓之時,藉由下側晶圓壓具及上側晶圓壓具夾持晶圓周緣部,將晶圓固定且保持在晶圓盒的晶圓盒。 Patent Document 4 describes a monolithic wafer cassette, which holds a wafer peripheral edge by a lower wafer clamp and an upper wafer clamp to hold and hold the wafer when storing the wafer Wafer box in the wafer box.

在專利文獻5中記載著以框架保持黏貼晶圓之膠帶,同時於將具有該框架之捆包構件堆疊在捆包箱內之時,藉由隔著緩衝材進行堆疊,以防止由於運送中之衝擊等,膠帶從框架剝離之情形的晶圓之捆包方法。 Patent Document 5 describes that a frame is used to hold a tape for adhering wafers, and at the same time, when a packing member having the frame is stacked in a packing box, stacking is carried out through a buffer material to prevent damage due to transportation. The method of packing wafers when the tape is peeled off from the frame, such as impact.

[先行技術文獻] [Advanced technical literature] [專利文獻] [Patent Literature]

專利文獻1:日本特開平8-17903號公報(1996年1月19日公開) Patent Document 1: Japanese Patent Laid-Open No. 8-17903 (published on January 19, 1996)

專利文獻2:日本特開平8-236605號公報(1996年9月13日公開) Patent Document 2: Japanese Patent Laid-Open No. 8-236605 (published on September 13, 1996)

專利文獻3:日本特開2001-148417號公報(2001年5月29日公開) Patent Document 3: Japanese Patent Laid-Open No. 2001-148417 (published on May 29, 2001)

專利文獻4:日本特開2009-43862號公報(2009年2月26日公開) Patent Document 4: Japanese Patent Laid-Open No. 2009-43862 (published on February 26, 2009)

專利文獻5:日本特開2002-145380號公報(2002年5月22日公開) Patent Document 5: Japanese Patent Laid-Open No. 2002-145380 (published on May 22, 2002)

但是,在專利文獻1~4所記載之基板盒中,藉由夾持或保持在基板之上面和底面的周緣部,固定該基板。再者,在專利文獻5所記載之技術中,基板之底面藉由切割膠帶被固定。 However, in the substrate cassettes described in Patent Documents 1 to 4, the substrate is fixed by being sandwiched or held by the peripheral portions of the top and bottom surfaces of the substrate. In addition, in the technique described in Patent Document 5, the bottom surface of the substrate is fixed by dicing tape.

在專利文獻1~4所記載之技術中,基板之上面及底面之一部分與用以固定基板之構件接觸。因此,在將基板收納於基板盒,且進行搬運之時,有在該基板之上面產生刮傷之問題。再者,以較專利文獻5所記載之基板盒,可以簡便地收納基板,並且可以防止在基板之上面產生刮傷的新穎基板盒為更有效用。 In the technologies described in Patent Documents 1 to 4, a part of the upper surface and the bottom surface of the substrate is in contact with the member for fixing the substrate. Therefore, when the substrate is stored in the substrate cassette and transported, there is a problem of scratches on the upper surface of the substrate. In addition, a novel substrate cassette that can store a substrate more easily than the substrate cassette described in Patent Document 5 and can prevent scratches on the substrate is more effective.

另外,在專利文獻1~5所記載之基板盒等中,由於將複數基板收納於個別的空間,故於搬運多數基板時,有其搬運型態變大之問題。 In addition, in the substrate cassettes and the like described in Patent Documents 1 to 5, since a plurality of substrates are accommodated in individual spaces, there is a problem in that when a large number of substrates are conveyed, their conveyance type becomes large.

本案發明係鑒於上述問題而創作出,其主要目的在於提供具備可以防止在基板之上面產生刮傷,且縮小搬運基板之型態的收納部,且新穎的基板盒。 The invention of the present invention was created in view of the above-mentioned problems, and its main object is to provide a novel substrate cassette provided with a storage portion that can prevent scratches on the upper surface of the substrate and reduce the shape of conveying the substrate.

為了解決上述課題,提供一種具有複數用以 收納基板之收納部的基板盒,其特徵在於:上述收納部具備:表面部,其具備擁有卡止上述基板之端部之階差的卡止部;和 背面部,其係具備卡止上述基板之端部的卡止凸部,在一個收納部之表面部的上述卡止部之內側,支撐上述基板,且藉由在位於該收納部之上方的另外的收納部之背面部的卡止凸部,卡止上述基板之端部,依此保持上述基板。 In order to solve the above-mentioned problem, provide a A substrate box for storing a storage portion of a substrate, wherein the storage portion includes: a surface portion having a locking portion having a step that locks an end of the substrate; and The back portion is provided with a locking convex portion that locks the end portion of the substrate, supports the substrate inside the locking portion of the surface portion of one storage portion, and is provided by another The locking protrusion on the back of the storage portion locks the end of the substrate, thereby holding the substrate.

若藉由本發明時,達到下述效果:可提供具備可以防止在基板之上面產生刮傷,並可以縮小用以搬運基板之型態之收納部的新穎基板盒。 According to the present invention, the following effect can be achieved: a novel substrate box having a storage portion that can prevent scratches on the top of the substrate and can be reduced in size for conveying the substrate can be provided.

10、10’、10”‧‧‧托盤(收納部) 10, 10’, 10” ‧‧‧ tray (storage section)

11a、11b、11c、11d‧‧‧卡止部 11a, 11b, 11c, 11d

11’a、11’c‧‧‧卡止部 11’a, 11’c ‧‧‧ locking part

11”a、11”b、11”c、11”d‧‧‧卡止部 11”a, 11”b, 11”c, 11”d ‧‧‧ locking part

12、12a、12b、12c、12d、12e‧‧‧支撐部 12, 12a, 12b, 12c, 12d, 12e‧‧‧support

12’d、12’e‧‧‧支撐部 12’d, 12’e‧‧‧support

12f‧‧‧支撐部 12f‧‧‧Support

13a、13c、13e、13g‧‧‧卡止凹部 13a, 13c, 13e, 13g

13’a、13’e‧‧‧卡止凹部 13’a, 13’e‧‧‧ locking recess

13”a、13”c、13”e、13”g‧‧‧卡止凹部 13”a, 13”c, 13”e, 13”g ‧‧‧ locking recess

13b、13d、13f、13h‧‧‧卡止凸部 13b, 13d, 13f, 13h

13’b、13’f‧‧‧卡止凸部 13’b, 13’f ‧‧‧ locking protrusion

13”b、13”d、13”f、13”h‧‧‧卡止凸部 13”b, 13”d, 13”f, 13”h ‧‧‧ locking protrusion

14a、14b、14c、14d、14e、14e、14f、14g、14h、14J、14k、14l、14m、14n‧‧‧嵌合部 14a, 14b, 14c, 14d, 14e, 14e, 14f, 14g, 14h, 14J, 14k, 14l, 14m, 14n

15a、15b、15c、15d、15e、15e、15f、15g、15h、15i、15J、15k、15l、16a、16b、16c、16d、16e、16f‧‧‧第三抵接部 15a, 15b, 15c, 15d, 15e, 15e, 15f, 15g, 15h, 15i, 15J, 15k, 15l, 16a, 16b, 16c, 16d, 16e, 16f

17a、17c、17e、17g‧‧‧第一抵接部 17a, 17c, 17e, 17g

17’a、17’e‧‧‧第一抵接部 17’a, 17’e‧‧‧First contact part

17b、17d、17f、17h‧‧‧第二抵接部 17b, 17d, 17f, 17h

18a、18b、18c、18d、18e、18f、18g、18h‧‧‧第二抵接部 18a, 18b, 18c, 18d, 18e, 18f, 18g, 18h

20‧‧‧基板 20‧‧‧ substrate

20a‧‧‧端部(基板) 20a‧‧‧End (substrate)

20b‧‧‧底面(基板) 20b‧‧‧Bottom (substrate)

a1‧‧‧倒角部位(端部) a1‧‧‧Chamfered part (end)

a2‧‧‧倒角部位(端部) a2‧‧‧Chamfered part (end)

30、30’‧‧‧基板盒 30, 30’‧‧‧ substrate box

40‧‧‧平板(板部) 40‧‧‧ Tablet (Board)

40a‧‧‧缺口部(板部) 40a‧‧‧Notch (plate part)

41‧‧‧綑束帶(帶部) 41‧‧‧Bundle strap (belt section)

50‧‧‧基板搬運器 50‧‧‧ substrate carrier

圖1為說明與本發明之一實施型態(第一實施型態)有關之收納部之概略的圖示。 FIG. 1 is a schematic diagram illustrating a storage portion related to an embodiment (first embodiment) of the present invention.

圖2為說明與本發明之一實施型態(第一實施型態)有關之收納部及基板盒之概略的剖面圖。 FIG. 2 is a schematic cross-sectional view illustrating a storage portion and a substrate box related to an embodiment (first embodiment) of the present invention.

圖3為說明與本發明之一實施型態(第一實施型態)有關之收納部及基板盒之概略的剖面圖。 FIG. 3 is a schematic cross-sectional view illustrating a storage portion and a substrate box related to an embodiment (first embodiment) of the present invention.

圖4為說明與本發明之一實施型態(第一實施型態)有關之收納部及基板盒之概略的剖面圖。 FIG. 4 is a schematic cross-sectional view illustrating a storage portion and a substrate box related to an embodiment (first embodiment) of the present invention.

圖5為說明與本發明之一實施型態有關之收納部及基板盒之概略的側面圖。 FIG. 5 is a schematic side view illustrating a storage portion and a substrate box related to an embodiment of the present invention.

圖6為說明與本發明之一實施型態有關之收納部及基板盒之概略的另外的側面圖。 FIG. 6 is another side view illustrating the outline of the storage portion and the substrate cassette related to one embodiment of the present invention.

圖7為說明與本發明之一實施型態有關之基板搬運器之概略的圖示。 7 is a schematic diagram illustrating a substrate carrier related to an embodiment of the present invention.

圖8為說明與本發明之一實施型態(第二實施型態)有關之收納部及基板盒之概略的剖面圖。 FIG. 8 is a schematic cross-sectional view illustrating a storage portion and a substrate box related to an embodiment (second embodiment) of the present invention.

圖9為說明與本發明之一實施型態(第三實施型態)有關之收納部之概略的圖示。 9 is a schematic diagram illustrating a storage portion related to an embodiment (third embodiment) of the present invention.

圖10為說明與本發明之一實施型態(第三實施型態)有關之收納部及基板盒之概略的剖面圖。 FIG. 10 is a schematic cross-sectional view illustrating a storage portion and a substrate box related to an embodiment (third embodiment) of the present invention.

[與第一實施型態有關之基板盒] [Substrate box related to the first embodiment]

以下,針對與一實施型態(第一實施型態)有關之基板盒30,進行詳細說明。 Hereinafter, the substrate cassette 30 related to an embodiment (first embodiment) will be described in detail.

與本實施型態有關之基板盒30具有複數圖1所示之用以收納基板之托盤(收納部)10。 The substrate cassette 30 related to the present embodiment has a plurality of trays (storage parts) 10 for storing substrates shown in FIG. 1.

基板盒30係在一個托盤10之表面部,和另外之托盤10之背面部之間,保持基板20(圖2及圖3)。 基板盒30係在一個托盤10之表面部,一面支撐基板20之底面20c之一部分,一面在卡止部11c之階差卡止基板 20之端部20a(圖2之(c))。再者,如圖2(c)所示般,在支撐基板20之狀態下,如圖3(c)所示般,藉由位於上述一個托盤10之上方的另外之托盤10之背面部,卡止基板20之端部20a。 The substrate cassette 30 is held between the front portion of one tray 10 and the back portion of another tray 10 and holds the substrate 20 (FIGS. 2 and 3 ). The substrate cassette 30 is on the surface portion of one tray 10, while supporting a part of the bottom surface 20c of the substrate 20, and locking the substrate at the step difference of the locking portion 11c The end 20a of 20 (FIG. 2(c)). Furthermore, as shown in FIG. 2(c), in the state where the substrate 20 is supported, as shown in FIG. 3(c), by the back of the other tray 10 located above the one tray 10, the card The end 20a of the substrate 20 is stopped.

依此,基板盒30不使位於基板20之上方的托盤10之背面部,接觸於較基板20之上面20b更內側,可以收納基板20(圖2(c)及圖3(c))。依此,可以防止於搬運基板20之時,在基板20之上面20b產生刮傷之情形。 Accordingly, the substrate cassette 30 can store the substrate 20 without contacting the back portion of the tray 10 above the substrate 20 with the inner surface of the upper surface 20b of the substrate 20 (FIG. 2(c) and FIG. 3(c)). According to this, it is possible to prevent scratches on the upper surface 20b of the substrate 20 when the substrate 20 is transported.

再者,基板盒30係交互堆疊托盤10和基板20,依此在各托盤10之間,一片一片地收納基板20。因此,基板盒30係被設置在個別的基板盒之內部的空間一片一片地收納基板,比起堆疊該基板盒而進行搬運之型態,可以防止盒體本身變成大體積。因此,基板盒30可以大幅度地刪減收納基板20之空間,並且可以縮小用以搬運基板20之型態(圖2(b)及圖3(b))。 Furthermore, the substrate cassette 30 stacks the trays 10 and the substrates 20 alternately, and thus the substrates 20 are stored one by one between the trays 10. Therefore, the substrate cassette 30 is provided in the space inside the individual substrate cassettes to store the substrates one by one, and compared to the type of stacking and transporting the substrate cassettes, the cassette body itself can be prevented from becoming bulky. Therefore, the board cassette 30 can greatly reduce the space for storing the board 20, and can reduce the type for transporting the board 20 (FIG. 2(b) and FIG. 3(b)).

另外,基板盒30係當在一個托盤10上堆疊另外之托盤10時,對位於下方之托盤10,每次平行地改變180°方向,堆積位於上方之托盤10。由於在托盤10之俯視下的外周部之形狀為略正方形,故容易配合外周部之形狀,每次平行地改變180°方向而堆疊各托盤10。另外,即使對托盤10賦予表示特定方向之標示(無圖示)亦可。 In addition, when stacking another tray 10 on one tray 10, the substrate cassette 30 changes the direction of 180° parallel to the tray 10 located below each time, and stacks the trays 10 located above. Since the shape of the outer peripheral portion of the tray 10 in a plan view is slightly square, it is easy to fit the shape of the outer peripheral portion, and the trays 10 are stacked each time the direction of 180° is changed in parallel. In addition, the tray 10 may be provided with a mark (not shown) indicating a specific direction.

[基板] [Substrate]

基板20係在俯視下之形狀為圓形之例如玻璃基板。再者,基板20被施予倒角。更具體而言,如圖2(d)所示般,基板20係從端部20a之全周上的上面20b側,及從底面20c側之雙方,被倒c角。依此,在基板20中的端部20a設置有倒角部位a1和倒角部位a2。 The substrate 20 is, for example, a glass substrate having a circular shape in plan view. Furthermore, the substrate 20 is chamfered. More specifically, as shown in FIG. 2(d), the substrate 20 is chamfered from both the upper surface 20b side and the bottom surface 20c side of the entire circumference of the end portion 20a. Accordingly, the end portion 20a of the substrate 20 is provided with a chamfered portion a1 and a chamfered portion a2.

另外,在被收納於基板盒之基板中,被倒c角之去角部位的傾斜之角度並不限定於圖2(d)所示之角度。再者,雖然被收納在基板盒30之基板20,使用被倒c角之基板,但是被收納於與本發明之一實施型態有關之基板盒的基板並不限定於被倒c角之基板。基板盒也可以收納例如端部被倒r角之基板。 In addition, the angle of inclination of the chamfered part of the substrate stored in the substrate case is not limited to the angle shown in FIG. 2(d). Furthermore, although the substrate 20 accommodated in the substrate case 30 uses a chamfered substrate, the substrate accommodated in the substrate case related to one embodiment of the present invention is not limited to the substrate with a chamfered corner. . The substrate cassette may store, for example, substrates whose edges are chamfered.

被收納於基板盒30,且被搬運之基板20,之後從基板盒30被取出,能在上面20b形成電路。再者,雖然在與本實施型態有關之基板盒30收納之基板20為玻璃基板,但是基板並不限定於玻璃基板。收納於基板盒之基板的材質不被限定,除玻璃基板以外,可以收納矽基板、陶瓷基板及樹脂基板等。 The substrate 20 that is accommodated in the substrate case 30 and is conveyed is then taken out from the substrate case 30 to form a circuit on the upper surface 20b. Furthermore, although the substrate 20 housed in the substrate cassette 30 related to this embodiment is a glass substrate, the substrate is not limited to the glass substrate. The material of the substrate accommodated in the substrate case is not limited, and in addition to the glass substrate, a silicon substrate, a ceramic substrate, a resin substrate, etc. can be accommodated.

[托盤] [tray]

圖1為說明構成與本實施型態有關之基板盒30之托盤10之概略的圖示。圖1(a)為由托盤10之俯視圖及三方向之側視圖所構成的4面圖,圖1(b)為托盤10之沿A-A’箭號線剖面圖,圖1(c)為托盤10之沿B-B’箭號線剖面圖。 FIG. 1 is a schematic diagram illustrating a tray 10 constituting a substrate cassette 30 related to this embodiment. FIG. 1(a) is a four-side view composed of a top view of a tray 10 and a side view in three directions. FIG. 1(b) is a cross-sectional view of the tray 10 taken along line AA′, and FIG. 1(c) is The cross-sectional view of the tray 10 along the arrow line BB'.

如圖1(a)所示般,托盤10係在俯視下之形狀為略正方形。另外,在本說明書中,托盤(收納部)之表面部係指設置有卡止部、支撐部及卡止凹部之側的面,在收納部的背面部係指設置有卡止凸部之側的面。 As shown in FIG. 1(a), the tray 10 has a slightly square shape in plan view. In addition, in this specification, the surface portion of the tray (storage portion) refers to the surface on the side where the locking portion, the support portion, and the locking recess are provided, and the back portion of the storage portion refers to the side on which the locking convex portion is provided Face.

如圖1(a)所示般,托盤10在其表面部形成卡止部11a~11d、支撐部12a~12e、卡止凹部13a、13c、13e及13g及第一抵接部17a、17c、17e及17g。 As shown in FIG. 1(a), the tray 10 has locking portions 11a to 11d, support portions 12a to 12e, locking recesses 13a, 13c, 13e and 13g and first abutting portions 17a and 17c on its surface. 17e and 17g.

如圖1(b)所示般,支撐部12a~12e被形成在形成於托盤10之表面部之卡止部11a及卡止部11c階差的內側。支撐部12a~12e同樣位於卡止部11b及11d之階差的內側。托盤10係在其表面部,卡止基板20之端部20a,且支撐基板20之底面20c之一部分。 As shown in FIG. 1( b ), the support portions 12 a to 12 e are formed inside the step difference of the locking portion 11 a and the locking portion 11 c formed on the surface portion of the tray 10. The support parts 12a-12e are also located inside the step difference of the locking parts 11b and 11d. The tray 10 is attached to the surface of the tray 10, and locks the end 20a of the substrate 20, and supports a portion of the bottom surface 20c of the substrate 20.

如圖1(c)所示般,托盤10在其背面部形成有卡止凸部13b及13f。與卡止凸部13b及13f相同,在托盤10之背面部,形成有圖1(a)所示之卡止凸部13d及13h。托盤10係藉由被形成在其背面部之卡止凸部,卡止基板20之端部20a。 As shown in FIG. 1(c), the tray 10 has locking protrusions 13b and 13f formed on the rear surface thereof. Similar to the locking protrusions 13b and 13f, the locking protrusions 13d and 13h shown in FIG. 1(a) are formed on the back surface of the tray 10. The tray 10 locks the end portion 20a of the substrate 20 by the locking convex portion formed on the rear portion thereof.

再者,在托盤10之背面部,於該托盤10之表面部中的第一抵接部17a、17c、17e及17g之背側,形成有第二抵接部17b、17d、17f及17h(圖1(a))。 Furthermore, on the back of the tray 10, on the back side of the first contact portions 17a, 17c, 17e, and 17g in the surface portion of the tray 10, second contact portions 17b, 17d, 17f, and 17h ( Figure 1(a)).

再者,托盤10在其側面部具備當複數托盤10僅在相同方向對齊時,進行嵌合的嵌合部14a~14n(圖1、5及6)。 Furthermore, the tray 10 has fitting portions 14 a to 14 n (FIG. 1, 5 and 6) for fitting when the plurality of trays 10 are aligned only in the same direction on the side portion.

托盤10可以藉由例如真空成形或壓模成形 等,對平板進行成形而製造出。用以成形收納部之平板並不被限定,但是以樹脂製之平板為佳,例如可以舉出發泡聚苯乙稀等。再者,收納部即使藉由塗佈層被保護亦可。 The tray 10 can be formed by, for example, vacuum forming or compression molding And so on, the flat plate is formed and manufactured. The flat plate for forming the storage portion is not limited, but a flat plate made of resin is preferable, and examples include foamed polystyrene. Furthermore, the storage portion may be protected by the coating layer.

[卡止部] [Locking part]

使用圖1及圖2針對被設置在與本實施型態有關之托盤10之卡止部11a~11d,進行詳細說明。圖2(a)~(c)係根據圖1(a)中之沿A-A’箭號線剖面,說明藉由複數托盤10收納基板20之狀態的圖示。 The locking portions 11 a to 11 d provided in the tray 10 related to the present embodiment will be described in detail using FIGS. 1 and 2. FIGS. 2(a) to (c) are diagrams illustrating a state in which the substrate 20 is accommodated by the plurality of trays 10 according to the cross-section taken along line A-A' in FIG. 1(a).

如圖2(a)所示般,卡止部11a及11c之階差,傾斜成離支撐部12e越遠越寬。與卡止部11a及11c相同,卡止部11b及11d也傾斜成離支撐部12e越遠越寬。再者,卡止部11a~11d係沿著被卡止於卡止部11a~11d之內側的基板20之外周部之形狀而彎曲(圖1之(a))。即是,托盤10之卡止部11a~11d具有設為相同形狀之階差,在被形成在該階差之內側的區域,收納基板20。 As shown in FIG. 2(a), the step difference of the locking portions 11a and 11c is inclined so that the distance from the support portion 12e becomes wider. Similar to the locking portions 11a and 11c, the locking portions 11b and 11d are also inclined to be wider as they are further away from the support portion 12e. Furthermore, the locking portions 11a-11d are curved along the shape of the outer peripheral portion of the substrate 20 locked inside the locking portions 11a-11d (FIG. 1(a)). That is, the locking portions 11 a to 11 d of the tray 10 have a step having the same shape, and the substrate 20 is housed in the area formed inside the step.

再者,從另外之觀點來看,卡止部11a~11d係藉由以形成卡止凹部13a、13c、13e及13g,以及第一抵接部17a、17c、17e及17g,且將在托盤10之表面部形成包圍被支撐之基板20的階差,朝向配置該基板20之外周部的位置更外側施予缺口而形成。在拖盤10之表面部,形成卡止部11a~11d之合計4處的缺口,係互相相向之缺口彼此成為在托盤10之表面部夾著支撐基板20之區 域而成為對稱的形狀。 Furthermore, from another point of view, the locking portions 11a to 11d are formed by forming the locking recesses 13a, 13c, 13e, and 13g, and the first contact portions 17a, 17c, 17e, and 17g, and will be placed on the tray The surface portion of 10 forms a step difference surrounding the substrate 20 to be supported, and is formed by notching toward the outer side of the position where the outer peripheral portion of the substrate 20 is arranged. At the surface of the tray 10, a total of four notches at the locking portions 11a to 11d are formed, and the notches facing each other become a region sandwiching the support substrate 20 on the surface of the tray 10 The domain becomes a symmetrical shape.

如上述般被形成之卡止部11a~11d之階差,係保持基板20之時從該基板20之重心點以等間隔分離的位置,被設置在卡止基板20之端部20a的位置上。再者,互相鄰接之一個卡止部和另外的卡止部之間的距離相等(圖1之(a))。因此,如圖2(a)所示般,在堆疊複數托盤10之時,當每次平行地改變方向180°而堆疊各托盤10之時,交換設為相同形狀之卡止部11a和卡止部11c的配置,由於僅交換設為相同形狀之卡止部11b和卡止部11d之配置,藉由卡止部11a~11d,在卡止基板20之端部20a上不會產生變化。因此,如圖2(b)所示般,由複數托盤10所構成之基板盒30在各托盤10之表面部,可以在相同狀態下一片一片地卡止基板20。 The step difference of the locking portions 11a to 11d formed as described above is a position separated from the center of gravity of the substrate 20 at equal intervals when the substrate 20 is held, and is provided at the position of the end portion 20a of the locking substrate 20 . Furthermore, the distance between one of the locking portions adjacent to each other and the other locking portion are equal (FIG. 1(a)). Therefore, as shown in FIG. 2(a), when a plurality of trays 10 are stacked, each time the trays 10 are stacked in parallel by changing the direction by 180°, the locking portions 11a and the locking having the same shape are exchanged. Since the arrangement of the portion 11c is only exchanged for the arrangement of the locking portion 11b and the locking portion 11d having the same shape, the locking portion 11a to 11d does not change the end portion 20a of the locking substrate 20. Therefore, as shown in FIG. 2( b ), the substrate cassette 30 composed of a plurality of trays 10 can lock the substrates 20 one by one in the same state on the surface of each tray 10.

[支撐部] [Support]

在與本實施型態有關之托盤10中,支撐部12係由支撐部12a~12e所構成,該些係在托盤10之俯視下的形狀為以保持基板20之時的基板20之重心點為中心的圓狀之複數凸部(圖1(a)及(b))。依此,支撐部12a~12e被形成在托盤10之表面部,支撐基板20的底面20c之一部分(圖2及圖3)。因此,在托盤10之表面部,可以縮小支撐基板20之底面20c之面積,且可以使基板20之底面20c難以產生刮傷。再者,支撐部12a~12e由於藉由圓狀之凸部所構成,且其係以基板20之重心點為中心之圓狀的複數凸 部,故可以從其底面20c均等地支撐基板20。 In the tray 10 related to the present embodiment, the supporting portion 12 is composed of the supporting portions 12a to 12e. The shapes of the trays 10 in plan view are such that the center of gravity of the substrate 20 when the substrate 20 is held is A round complex convex part in the center (Fig. 1(a) and (b)). Accordingly, the support portions 12 a to 12 e are formed on the surface portion of the tray 10 and support a part of the bottom surface 20 c of the substrate 20 (FIGS. 2 and 3 ). Therefore, in the surface portion of the tray 10, the area of the bottom surface 20c of the support substrate 20 can be reduced, and the bottom surface 20c of the substrate 20 is less likely to be scratched. In addition, the support portions 12a to 12e are formed by round convex portions, and they are round complex convex portions centered on the center of gravity of the substrate 20 Part, the substrate 20 can be equally supported from the bottom surface 20c.

[卡止凹部] [Locking recess]

使用圖1及圖3,針對被設置在與本實施型態有關之托盤10的卡止凹部13a、13c、13e及13g,以及第一抵接部17a、17c、17e及17g,進行更詳細說明。 1 and 3, the locking recesses 13a, 13c, 13e, and 13g provided in the tray 10 related to this embodiment and the first contact portions 17a, 17c, 17e, and 17g will be described in more detail. .

圖3(a)係根據圖1(a)中之沿B-B’箭號線剖面,說明藉由複數托盤10收納基板20之狀態的圖示。 FIG. 3(a) is a diagram illustrating a state in which the substrate 20 is accommodated by the plurality of trays 10 according to the cross-section taken along the line B-B' in FIG. 1(a).

如圖3(a)所示般,互相相向之卡止凹部13a及13e係在形成卡止部11a~11d之計4處的缺口之內側,夾著在托盤10之表面部支撐基板20之區域而對稱性地被配置(圖1(a)及(c))。再者,卡止凹部13a及13e分別在略正方形的托盤10,夾著通過卡止凹部13a及卡止凹部13e之上方的對角線(即是,圖1(a)所示之B-B’線)而成為非對稱的形狀。 As shown in FIG. 3(a), the mutually facing locking recesses 13a and 13e are inside the gaps at the four places where the locking portions 11a to 11d are formed, sandwiching the area of the tray 10 that supports the substrate 20 They are arranged symmetrically (Figure 1 (a) and (c)). Furthermore, the locking recesses 13a and 13e are respectively sandwiched by diagonal lines passing above the locking recess 13a and the locking recess 13e in the slightly square tray 10 (that is, B-B shown in FIG. 1(a) 'Line) and become an asymmetric shape.

再者,如圖3(a)所示般,互相相向之卡止凹部13a及13e,係卡止部11a~11d具有的階差的部分,以比起位在遠離所保持的基板20之側的階差,位在接近該基板20之側的階差比較低之方式,形成其凹部。在此,卡止凹部13a及13e之凹部,係在水平配置托盤10之時,被形成在較支撐部12a~12e低之位置。因此,藉由把持基板20之端部20a,而將手部放入卡止凹部13a及13e中之任一者,可以將基板20頭尾良好地配置在卡止部11a~11d之內側的支撐部12a~12e上。再者,若將手部放 入至卡止凹部13a及13e中之任一者而把持該基板20之端部20a時,可以頭尾地取出藉由卡止部11a~11d包圍之基板20。 Furthermore, as shown in FIG. 3(a), the mutually facing locking concave portions 13a and 13e are the stepped portions of the locking portions 11a to 11d, so as to be located on the side farther from the held substrate 20 than The step difference is formed in such a manner that the step difference on the side close to the substrate 20 is relatively low. Here, the concave portions of the locking concave portions 13a and 13e are formed at positions lower than the support portions 12a to 12e when the tray 10 is horizontally arranged. Therefore, by holding the end portion 20a of the substrate 20 and placing the hand in any one of the locking recesses 13a and 13e, the substrate 20 can be well arranged at the inside of the locking portions 11a to 11d for support Department 12a~12e. Furthermore, if you put your hand When one of the locking recesses 13a and 13e is inserted to hold the end 20a of the substrate 20, the substrate 20 surrounded by the locking portions 11a to 11d can be taken out end to end.

另外,卡止凹部13c及13g與卡止凹部13a及13e相同,被設置成互相相向,夾著在托盤10之表面部支撐基板20之區域而對稱性地被配置(圖1(a)及(c))。再者,卡止凹部13a及13e分別夾著通過被支撐於卡止凹部13a、卡止凹部13e、托盤10之表面部之基板20的重心點的對角線(無圖示),成為非對稱性的形狀。再者,卡止凹部13c及13g,係卡止部11a~11d具有的階差的部分,以比起位在遠離所保持的基板20之側的階差,位在接近該基板20之側的階差比較低之方式,形成其凹部。因此,即使在卡止凹部13c及13g,當然也與卡止凹部13a及13e相同,可以用於基板20對托盤10之表面部的配置或取出。 In addition, the locking recesses 13c and 13g are the same as the locking recesses 13a and 13e, and are arranged to face each other, and are arranged symmetrically with the area of the support substrate 20 sandwiched on the surface of the tray 10 (FIG. 1(a) and ( c)). Further, the locking recesses 13a and 13e are asymmetrical across the diagonal line (not shown) passing through the center of gravity of the substrate 20 supported by the locking recess 13a, the locking recess 13e, and the surface of the tray 10, respectively. Sexual shape. Furthermore, the locking recesses 13c and 13g are the steps of the locking portions 11a to 11d, and are located closer to the substrate 20 than the steps located on the side away from the substrate 20 to be held. The recess is formed in a way that the level difference is relatively low. Therefore, even in the locking recesses 13c and 13g, it is of course the same as the locking recesses 13a and 13e, and can be used for the placement or removal of the substrate 20 on the surface portion of the tray 10.

[第一抵接部] [First contact part]

第一抵接部17a、17c、17e及17g在托盤10之俯視下,沿著所保持之基板20之外周部之形狀,形成各別地與卡止凹部13a、13c、13e及13g相鄰接。 The first contact portions 17a, 17c, 17e, and 17g are formed adjacent to the locking recesses 13a, 13c, 13e, and 13g along the shape of the outer periphery of the substrate 20 held in the plan view of the tray 10, respectively. .

在形成卡止部11a~11d之計4處的缺口之內側,互相相向之第一抵接部17a及17e,夾著在托盤10之表面部支撐基板20之區域而對稱性地被配置(圖1(a))。 The first contact portions 17a and 17e facing each other inside the gaps at the four places where the locking portions 11a to 11d are formed are arranged symmetrically with the area supporting the substrate 20 sandwiched between the surface portions of the tray 10 (FIG. 1(a)).

再者,如圖3(a)所示般,在沿B-B’箭號線剖 面中,互相相向之第一抵接部17a及17e被設置在較卡止凹部13a及13e更朝向紙張深側,在水平配置托盤10之時,被設置在較卡止凹部13a及13e之凹部高,較支撐部12a~12e低之位置上。 In addition, as shown in FIG. 3(a), it is cut along the arrow line B-B’ In the surface, the first abutting portions 17a and 17e facing each other are provided on the deeper side of the paper than the locking recesses 13a and 13e, and when the tray 10 is horizontally arranged, they are provided in the recesses of the locking recesses 13a and 13e High, lower than the support parts 12a~12e.

另外,互相相向之第一抵接部17c及17g與第一抵接部17a及17e相同,夾著托盤10之表面部支撐基板20之區域而對稱性地被配置,在水平配置托盤10之時,被配置在較卡止凹部13c及13g之凹部高,較支撐部12a~12e低之位置上。 In addition, the first abutting portions 17c and 17g facing each other are the same as the first abutting portions 17a and 17e, and are arranged symmetrically with the area supporting the substrate 20 sandwiching the surface portion of the tray 10, when the tray 10 is horizontally arranged It is arranged at a position higher than the recesses of the locking recesses 13c and 13g and lower than the support portions 12a to 12e.

[卡止凸部] [Locking protrusion]

如圖3(a)所示般,卡止凸部13b及13f係藉由使卡止凹部13a及13e之背面突出而形成的凸部,以做為嵌合於卡止凹部13a及13e的凸部。 As shown in FIG. 3(a), the locking convex portions 13b and 13f are convex portions formed by protruding the back surfaces of the locking concave portions 13a and 13e, as the convex portions fitted into the locking concave portions 13a and 13e unit.

再者,卡止凸部13b及卡止凸部13f分別在略正方形的托盤10,夾著通過卡止凸部13b及卡止凸部13f之上方的對角線(即是,圖1(a)所示之B-B’線)而成為非對稱的形狀。 Further, the locking convex portion 13b and the locking convex portion 13f are respectively sandwiched in a slightly square tray 10, passing through the diagonal line above the locking convex portion 13b and the locking convex portion 13f (that is, FIG. 1(a ) Shown in the BB' line) into an asymmetric shape.

再者,在卡止凸部13b及13f的互相相向之兩面,係沿著被配置在托盤10之表面部之基板20之外周部的形狀而彎曲,具有離托盤10之背面部越遠越寬的傾斜(圖1(c))。在此,當在基板盒30保持基板20之時,以接觸於在圖2(d)所示之基板20的端部20a之倒角部位a1之方式,在卡止凸部13b及13f的互相相向之兩面分別設 置有傾斜。 In addition, the two opposing surfaces of the locking protrusions 13b and 13f are curved along the shape of the outer peripheral portion of the substrate 20 disposed on the front surface portion of the tray 10, and have a width as far away from the back surface portion of the tray 10 as possible Tilt (Figure 1(c)). Here, when the substrate cassette 30 holds the substrate 20, the locking protrusions 13b and 13f are in contact with each other so as to contact the chamfered portion a1 of the end 20a of the substrate 20 shown in FIG. 2(d). Set on the opposite sides With tilt.

再者,在卡止凸部13b及13f的互相相向之兩面,係從被配置在托盤10之表面部的基板20之重心點以等間隔分離。因此,即使每次平行地改變180°方向而堆疊各托盤10,僅藉由在卡止凸部13b及13f中的互相相向之兩面交換配置,就可以卡止基板20之端部20a之倒角部位a1(圖3)。 In addition, the two opposing surfaces of the locking protrusions 13b and 13f are separated from each other at regular intervals from the center of gravity of the substrate 20 disposed on the surface of the tray 10. Therefore, even if the trays 10 are stacked each time the direction is changed 180° in parallel, the chamfering of the end portion 20a of the substrate 20 can be locked only by swapping the mutually opposing surfaces of the locking protrusions 13b and 13f Part a1 (Figure 3).

另外,如圖1(a)所示般,卡止凸部13d及13h係藉由使卡止凹部13c及13g之背面突出而形成,以作為嵌合於卡止凹部13c及13g的凸部。再者,在卡止凸部13d及13h的互相相向之兩面,係沿著被配置在托盤10之表面部之基板20之外周部的形狀而彎曲,具有離托盤10之背面部越遠越寬的傾斜。在此,當在基板盒30收納基板20之時,以接觸在該基板20的端部20a之倒角部位a1之方式,在卡止凸部13d及13h的互相相向之兩面分別設置有傾斜。再者,與卡止凸部13b及13f相同,卡止凸部13d及13h夾著通過卡止凸部13d及13h之上方的對角線(無圖示)而成為非對稱之形狀。再者,在卡止凸部13d及13h的互相相向之兩面,係從被配置在托盤10之表面部的基板20之重心點以等間隔分離。 In addition, as shown in FIG. 1(a), the locking convex portions 13d and 13h are formed by protruding the back surfaces of the locking concave portions 13c and 13g to serve as the convex portions fitted into the locking concave portions 13c and 13g. In addition, the two opposing surfaces of the locking protrusions 13d and 13h are curved along the shape of the outer peripheral portion of the substrate 20 disposed on the front surface portion of the tray 10, and have a width as far as possible from the back surface portion of the tray 10 Tilt. Here, when the substrate 20 is stored in the substrate cassette 30, the two opposing surfaces of the locking protrusions 13d and 13h are provided with inclination so as to contact the chamfered portion a1 of the end portion 20a of the substrate 20. In addition, similar to the locking protrusions 13b and 13f, the locking protrusions 13d and 13h have an asymmetrical shape with a diagonal line (not shown) passing above the locking protrusions 13d and 13h. In addition, the mutually facing surfaces of the locking projections 13d and 13h are separated at equal intervals from the center of gravity of the substrate 20 arranged on the surface of the tray 10.

(卡止凹部、卡止凸部及第一抵接部之配置) (Arrangement of locking concave portion, locking convex portion and first contact portion)

使用圖3及圖4,針對堆疊複數托盤10之時的卡止凹部、卡止凸部及第一抵接部之配置進行說明。圖 4(a)~(d)係根據圖1(a)所示之沿C-C’箭號線剖面,說明堆疊複數托盤10之狀態的圖示。另外,在圖4中,托盤10每次平行地改變180°方向而進行堆疊。因此,在如圖4(a)及(b)所示之3個托盤10中,位於正中間之托盤10配置有根據沿D-D’箭號線剖面之剖面。 3 and 4, the arrangement of the locking concave portion, the locking convex portion, and the first contact portion when stacking the plurality of trays 10 will be described. Fig 4(a) to (d) are diagrams illustrating a state in which a plurality of trays 10 are stacked according to the cross-section taken along line C-C' shown in FIG. 1(a). In addition, in FIG. 4, the trays 10 are stacked in parallel by changing the direction of 180° each time. Therefore, in the three pallets 10 shown in FIGS. 4(a) and (b), the pallet 10 positioned in the middle is arranged with a cross-section according to the cross-section along the arrow line D-D'.

卡止凸部13b及13f在略正方形的托盤10,夾著通過卡止凸部13b及卡止凸部13f之上方的對角線(即是,圖1(a)所示之B-B’線)而成為非對稱的形狀。因此,如圖4(a)所示般,當每次平行地改變180°方向而堆疊各托盤10時,在位於最上方之托盤10中的卡止凸部13b之下方,配置有位於正中央之托盤10中的第一抵接部17e。再者,在位於正中央之托盤10的卡止凸部13f之下方,配置有位於其下方之托盤10中的第一抵接部17a。因此,當堆疊各托盤10時,如圖4(b)所示般,位於最上方之托盤10之卡止凸部13b之一部分,抵接於位於正中央之托盤10中的第一抵接部17e,且卡止凸部13b和卡止凹部13a不嵌合。同樣,位於正中央之托盤10中的卡止凸部13f,抵接於位於其下方之托盤10中的第一抵接部17a,卡止凸部13f和卡止凹部13e不嵌合。 The locking projections 13b and 13f are in a slightly square tray 10, and a diagonal line passing through the locking projections 13b and the locking projections 13f is sandwiched (that is, BB' shown in FIG. 1(a) Line) into an asymmetric shape. Therefore, as shown in FIG. 4(a), each time the trays 10 are stacked in parallel by changing the direction of 180°, the tray 10 is positioned under the locking protrusion 13b in the uppermost tray 10, and is positioned in the center. The first contact portion 17e in the tray 10. In addition, below the locking convex portion 13f of the tray 10 located at the center, the first contact portion 17a of the tray 10 located below is arranged. Therefore, when stacking each tray 10, as shown in FIG. 4(b), a part of the locking convex portion 13b of the tray 10 located at the uppermost portion abuts on the first abutting portion in the tray 10 located at the center 17e, and the locking convex portion 13b and the locking concave portion 13a are not fitted. Similarly, the locking convex portion 13f in the tray 10 located at the center abuts on the first contact portion 17a in the tray 10 located below it, and the locking convex portion 13f and the locking concave portion 13e are not fitted.

同樣,如圖4(c)所示般,當每次平行地改變180°方向而堆疊各托盤10時,位於最上方之托盤10中的卡止凸部13h之下方,配置有位於正中央之托盤10中的第一抵接部17c。再者,在位於正中央之托盤10中的卡止凸部13d之下方,配置有位於其下方之托盤10中的第 一抵接部17g。因此,當堆疊各托盤10時,如圖4(d)所示般,位於最上方之托盤10之卡止凸部13h之一部分,抵接於位於正中央之托盤10中的第一抵接部17c,且卡止凸部13h和卡止凹部13c不嵌合。同樣,位於正中央之托盤10中的卡止凸部13d,抵接於位於其下方之托盤10中的第一抵接部17g,卡止凸部13d和卡止凹部13g不嵌合。 Similarly, as shown in FIG. 4(c), each time the trays 10 are stacked parallel to each other by changing the direction of 180°, the locking projection 13h in the uppermost tray 10 is arranged below the locking protrusion 13h. The first contact portion 17c in the tray 10. In addition, under the locking convex portion 13d in the tray 10 located in the center, the first One contact portion 17g. Therefore, when stacking each tray 10, as shown in FIG. 4(d), a part of the locking convex portion 13h of the tray 10 located at the uppermost portion abuts on the first contact portion in the tray 10 located at the center 17c, and the locking convex portion 13h and the locking concave portion 13c are not fitted. Similarly, the locking convex portion 13d in the tray 10 located at the center is in contact with the first contact portion 17g in the tray 10 located below it, and the locking convex portion 13d and the locking concave portion 13g are not fitted.

如此一來,在托盤10之背面部,藉由使沿著基板20之外周之形狀而形成的卡止凸部13b、13d、13f及13h,在托盤10之表面部,抵接於第一抵接部17a、17c、17e及17g,可以在各托盤10中的表面部和背面部之間,於保持基板20之區域取得充分之空間(圖3(b))。另外,如圖4(a)~(d)所示般,在各托盤10中之第二抵接部17b、17d、17f及17h抵接於位於該些下方之托盤10之表面部之一部分。 In this way, at the back of the tray 10, the locking protrusions 13b, 13d, 13f, and 13h formed along the shape of the outer periphery of the substrate 20 abut the first contact on the surface of the tray 10 The contact portions 17a, 17c, 17e, and 17g can obtain a sufficient space in the region where the substrate 20 is held between the front and back portions of each tray 10 (FIG. 3(b)). In addition, as shown in FIGS. 4( a) to (d ), the second contact portions 17 b, 17 d, 17 f, and 17 h in each tray 10 abut on a part of the surface portion of the tray 10 located below these.

(基板盒30中之基板20的配置) (Configuration of substrate 20 in substrate cassette 30)

如圖4(a)~(d)所示般,在堆疊之各托盤10之間,基板20係在一個托盤10之表面部和另外托盤10之背面部之間,收納基板20(圖2(b)及圖3(b))。 As shown in FIGS. 4(a) to (d), between the stacked trays 10, the substrate 20 is placed between the surface of one tray 10 and the back of the other tray 10, and the substrate 20 is stored (FIG. 2( b) and Figure 3(b)).

在該狀態下,如圖3(c)所示般,被設置在位於上方之托盤10之背面部之卡止凸部13b,在較位於其下方之另外的托盤10之支撐部12e低之位置,抵接於第一抵接部17e。即使針對其他卡止凸部,同樣也在被設置 在較位於其下方之另外的托盤10之支撐部12e低之位置,抵接於第一抵接部。因此,當堆疊各托盤之時,藉由被設置在一個托盤10之背面部的卡止凸部13b、13d、13f及13h之傾斜的面,在從上面20b側卡止基板20之端部20a的狀態下,可以藉由使卡止凸部13b、13d、13f及13h抵接於第一抵接部而防止被施加該一個托盤10(或是被堆疊之複數托盤10及複數基板20)。因此,被收納於基板盒30之基板20之端部20a可以防止破損。 In this state, as shown in FIG. 3(c), the locking convex portion 13b provided on the back portion of the tray 10 located above is lower than the support portion 12e of the other tray 10 located below it To contact the first contact portion 17e. Even for other locking protrusions, they are also provided At a position lower than the support portion 12e of the other tray 10 located below it, it contacts the first contact portion. Therefore, when stacking the trays, the end portions 20a of the substrate 20 are locked from the upper surface 20b side by the inclined surfaces of the locking convex portions 13b, 13d, 13f, and 13h provided on the back surface of one tray 10 In a state where the locking projections 13b, 13d, 13f, and 13h are in contact with the first abutting portion, the application of the one tray 10 (or the plurality of trays 10 and the plurality of substrates 20 stacked) can be prevented. Therefore, the end portion 20a of the substrate 20 housed in the substrate cassette 30 can be prevented from being damaged.

再者,由於被形成在一個托盤10之背面部的卡止凸部13b、13d、13f及13h,在位於其下方之另外的托盤10之表面部卡止被支撐於支撐部12a~12e之基板20之端部20a之倒角部位a1,故不使托盤10接觸於基板20之上面20b,可以保持基板20,可以防止在基板20之上面20b產生刮傷(圖3(c))。 Furthermore, since the locking projections 13b, 13d, 13f, and 13h formed on the back surface of one tray 10, the substrates supported by the support portions 12a to 12e are locked on the surface portion of the other tray 10 located below it. The chamfered portion a1 of the end portion 20a of 20 prevents the tray 10 from contacting the upper surface 20b of the substrate 20, the substrate 20 can be held, and the upper surface 20b of the substrate 20 can be prevented from being scratched (FIG. 3(c)).

[嵌合部] [Fitting part]

使用圖5及圖6針對被設置在與本實施型態有關之托盤10所具有之嵌合部14a~14n,進行詳細說明。圖5(a)及(b)係將另外的托盤10改變180°方向而堆疊在一個托盤10上之狀態的側面圖。圖6(a)及(b)係從與圖5(a)及(b)不同之側面,說明將另外的托盤10改變180°方向而堆疊在一個托盤10上之狀態之另外的側面圖。 The fitting parts 14 a to 14 n provided in the tray 10 related to the present embodiment will be described in detail using FIGS. 5 and 6. 5 (a) and (b) are side views of a state where another tray 10 is stacked on one tray 10 by changing the direction of 180°. 6(a) and (b) are different side views illustrating a state in which another tray 10 is stacked on one tray 10 by changing the direction of another 180° from a side different from that of FIGS. 5(a) and (b).

圖5(a)及圖5(a)所示之被設置在托盤10之側面部的嵌合部14a~14n藉由朝向各圖之紙張之前方而突出 之凸部,和被形成在托盤10之背面部與該凸部嵌合之凹部而構成。再者,嵌合部14a~14n在側面視下,成為至少具有一個2層階差的凸形。 The fitting portions 14a to 14n provided on the side portions of the tray 10 shown in FIGS. 5(a) and 5(a) protrude toward the front of the paper in each drawing The convex portion is formed by a concave portion formed on the back surface of the tray 10 and fitted with the convex portion. In addition, the fitting portions 14a to 14n have a convex shape having at least one two-step difference in side view.

在圖5(a)所示之側面部中,由於位於一個托盤10上之另外的托盤10,改變180°方向而被配置,故位於上方之托盤10之嵌合部14a~14e,和位於下方之托盤10之嵌合部14h、14i、14l~14n被配置成相同方向。另外,在位於圖5(a)所示之一側面之相反側的側面部,於位於上方之托盤10,配置嵌合部14h、14i、14l~14n,在位於下方之托盤10,配置嵌合部14a~14e。因此,即使在位於圖5(a)之紙張之前方側及深側的側面部中之任一者,嵌合部之形狀也不會一致。 In the side portion shown in FIG. 5(a), since the other trays 10 located on one tray 10 are arranged by changing the direction of 180°, the fitting portions 14a to 14e of the tray 10 located above and below The fitting portions 14h, 14i, and 14l to 14n of the tray 10 are arranged in the same direction. In addition, on the side portion located opposite to one of the side surfaces shown in FIG. 5(a), the fitting portions 14h, 14i, 14l to 14n are arranged on the tray 10 located above, and the fitting is arranged on the tray 10 located below Department 14a~14e. Therefore, even if any of the side portions located on the front side and the deep side of the paper in FIG. 5(a), the shape of the fitting portion does not match.

如此一來,當平行地改變180°方向而配置托盤10時,在圖6(a)所示之另外的側面部,位於上方之托盤10之嵌合部14e~14h,和位於下方之托盤10之嵌合部14i~14k及14a被配置成相同方向。另外,在位於圖6(a)所示之側面部之相反側的側面部,於位於上方之托盤10,配置嵌合部14i~14k及14a,在位於下方之托盤10,配置嵌合部14e~14h。因此,即使在位於圖6(a)之紙張之前方側及深側的側面部中之任一者,嵌合部之形狀也不會一致。 In this way, when the tray 10 is arranged in parallel by changing the 180° direction, on the other side portions shown in FIG. 6(a), the fitting portions 14e to 14h of the tray 10 located above and the tray 10 located below The fitting portions 14i to 14k and 14a are arranged in the same direction. In addition, on the side portion located opposite to the side portion shown in FIG. 6(a), the fitting portions 14i to 14k and 14a are arranged on the tray 10 located above, and the fitting portion 14e is arranged on the tray 10 located below. ~14h. Therefore, even if any of the side portions located on the front side and the deep side of the paper in FIG. 6(a), the shape of the fitting portion does not match.

即是,當平行地改變180°方向而堆疊托盤10時,被形成在外周部之形狀為略正方形之托盤10之4側面的嵌合部14a~14n被配置成不會互相嵌合。 That is, when the trays 10 are stacked in parallel by changing the 180° direction, the fitting portions 14a to 14n formed on the four sides of the tray 10 having a slightly square shape on the outer peripheral portion are arranged so as not to be fitted to each other.

[第三抵接部] [Third contact part]

在圖5(a)所示之一側面,嵌合部14a~14e、14h、14i、14l~14n分別設為具有2層之階差的凸形,在嵌合部14h、14i、14l~14n之從上方數起第1層之階差和第2層之階差之間,設置有第三抵接部15b、15d、15f及15h。 On one of the side surfaces shown in FIG. 5(a), the fitting portions 14a to 14e, 14h, 14i, and 14l to 14n are respectively convex with two steps, and the fitting portions 14h, 14i, 14l to 14n Between the step difference of the first layer and the step difference of the second layer from the top, third contact portions 15b, 15d, 15f, and 15h are provided.

再者,在圖6(a)所示之另外的側面,嵌合部14e~14h、14i、14k及14a分別設為至少具有一個2層之階差的凸形,在嵌合部14i、14k、14a之從上方數起第1層之階差和第2層之階差之間,設置有第三抵接部16b、16d及16f。 In addition, on the other side shown in FIG. 6(a), the fitting portions 14e to 14h, 14i, 14k, and 14a are respectively formed with a convex shape having at least one step difference of two layers, and the fitting portions 14i, 14k And 14a, between the step difference of the first layer and the step difference of the second layer from the top, third contact portions 16b, 16d, and 16f are provided.

如圖5(a)所示般,當如此平行地改變180°方向而配置兩個托盤時,被設置在位於上方之托盤10之第三抵接部15a、15c、15e及15g,和被配置在位於上方之托盤10之嵌合部14h、14l~14n之第三抵接部15b、15d、15f及15h被配置成對。 As shown in FIG. 5(a), when two trays are arranged in parallel by changing the 180° direction in this way, the third contact portions 15a, 15c, 15e, and 15g provided on the tray 10 located above are arranged The third contact portions 15b, 15d, 15f, and 15h of the fitting portions 14h, 141l to 14n of the tray 10 located above are arranged in pairs.

同樣,如圖6(a)所示般,被設置在位於上方之托盤10之第三抵接部16a、16c及16e,和被設置在位於下方之托盤10之嵌合部14h、14l~14n之第三抵接部16b、16d及16f被設置成對。另外,即使在圖5(a)及圖6(a)中無圖示之側面部,被設置在嵌合部14a~14n之抵接部也被配置成對。 Similarly, as shown in FIG. 6(a), the third contact portions 16a, 16c, and 16e provided on the tray 10 located above, and the fitting portions 14h, 14l~14n provided on the tray 10 located below The third contact portions 16b, 16d, and 16f are provided in pairs. In addition, even in the side portions not shown in FIGS. 5( a) and 6 (a ), the contact portions provided in the fitting portions 14 a to 14 n are arranged in pairs.

當從圖5(a)所示之狀態,重疊上下兩個托盤10時,如圖6(b)所示般,第三抵接部15a和15b、第三抵 接部15c和15d、第三抵接部15e和15f、第三抵接部15g和15h成對被抵接。 When the two upper and lower trays 10 are stacked from the state shown in FIG. 5(a), as shown in FIG. 6(b), the third contact portions 15a and 15b, the third contact The contact portions 15c and 15d, the third contact portions 15e and 15f, and the third contact portions 15g and 15h are contacted in pairs.

同樣,從圖6(a)所示之狀態,當重疊上下兩個托盤10時,如圖6(b)所示般,第三抵接部16a和16b、第三抵接部16c及16d、第三抵接部16e和16f成對而被抵接。再者,即使在圖5(b)及圖6(b)中無圖示之側面部,被設置在嵌合部14a~14n之抵接部,和被設置在托盤10之側面部之底面的抵接部抵接。如此一來,藉由在外周部之形狀為略正方形之托盤10之4側面部,抵接各第三抵接部,並且,使在各嵌合部14a~14n之2層之階差中,位於上側之階差卡合於位於上方之托盤10之嵌合部14a~14n之內側之一部分,卡合位於上方之托盤10和位於下方之托盤10。 Similarly, from the state shown in FIG. 6(a), when the upper and lower trays 10 are overlapped, as shown in FIG. 6(b), the third contact portions 16a and 16b, the third contact portions 16c and 16d, The third contact portions 16e and 16f are contacted in pairs. Furthermore, even the side portions not shown in FIG. 5(b) and FIG. 6(b) are provided at the abutting portions of the fitting portions 14a to 14n and at the bottom surface of the side portion of the tray 10 The abutment part abuts. In this way, by contacting the third contact portions with the four side portions of the tray 10 having a slightly square shape on the outer peripheral portion, and making the step difference of the two layers of the fitting portions 14a to 14n, The step on the upper side is engaged with a part of the inner side of the fitting portions 14a to 14n of the tray 10 on the upper side, and the tray 10 on the upper side and the tray 10 on the lower side are engaged.

再者,如圖5(b)所示般,在第三抵接部15c和15d互相抵接之狀態下,如圖4(b)所示般,卡止凸部13f抵接於第一抵接部17a,卡止凸部13b抵接於第一抵接部17e。同樣,第三抵接部15i和15j成對而被抵接。即是,在第三抵接部互相抵接之狀態下,第一抵接部和卡止凸部互相抵接。如此一來,在與本實施型態有關之基板盒30中,第一抵接部和卡止凸部互相抵接,藉由使成對之第三抵接部互相抵接,可以防止由於位於上方之托盤10(或是被堆疊之複數托盤10及複數基板20)之重量,而使得力經由端部20a對被支撐於位在下方之托盤10之支撐部12a~12e的基板20過度施加。 Further, as shown in FIG. 5(b), in a state where the third contact portions 15c and 15d are in contact with each other, as shown in FIG. 4(b), the locking convex portion 13f abuts on the first contact The contact portion 17a and the locking convex portion 13b contact the first contact portion 17e. Similarly, the third contact portions 15i and 15j are contacted in pairs. That is, in a state where the third abutting portions abut against each other, the first abutting portion and the locking convex portion abut against each other. In this way, in the substrate case 30 related to the present embodiment, the first abutting portion and the locking convex portion abut against each other. By making the paired third abutting portions abut against each other, it is possible to prevent the The weight of the upper tray 10 (or the plurality of stacked trays 10 and the plurality of substrates 20) causes the force to be excessively applied to the substrate 20 supported by the support portions 12a-12e of the tray 10 located below via the end portion 20a.

(藉由嵌合部之托盤的嵌合) (By fitting the tray of the fitting part)

如圖4(c)所示般,當使上下配置之兩個托盤10成為相同方向而配置時,在托盤10之側面部之嵌合部14a~14e(在相向之側面部,為嵌合部14h、14i、14l~14n)之配置一致。因此,如圖5(d)所示般,可以使位於上下之兩個托盤10互相嵌合。 As shown in FIG. 4(c), when the two trays 10 arranged vertically are arranged in the same direction, the fitting portions 14a to 14e on the side portions of the tray 10 (on the opposite side portions are the fitting portions 14h, 14i, 14l~14n) have the same configuration. Therefore, as shown in FIG. 5(d), the two trays 10 located above and below can be fitted to each other.

同樣,如圖6(c)所示般,當使上下配置之兩個托盤10成為相同方向而配置時,在托盤10之側面部之嵌合部14e~14h(在相向之側面部,為嵌合部14i~14k及14a)之配置一致。因此,如圖6(d)所示般,可以使位於上下之兩個托盤10互相嵌合。 Similarly, as shown in FIG. 6(c), when the two trays 10 arranged vertically are arranged in the same direction, the fitting portions 14e to 14h on the side portions of the tray 10 (on the opposite side portions are embedded The configuration of the joints 14i to 14k and 14a) are the same. Therefore, as shown in FIG. 6(d), the two trays 10 located above and below can be fitted to each other.

再者,如圖5(c)及圖6(c)所示般,當使複數托盤10成為相同方向而疊層時,卡止凹部13a和卡止凸部13b卡合。同樣,可以卡合凹部13c和卡止凸部13d、卡止凹部13e和卡合凸部13f、卡止凹部13g和卡止凸部13h互相嵌合。而且,藉由被形成在托盤10之表面部的卡止部11a~11d所具有的階差包圍而形成的凹部,在托盤10之背面部,可以與藉由該階差所形成之凸部嵌合。 Furthermore, as shown in FIGS. 5(c) and 6(c), when the plurality of trays 10 are stacked in the same direction, the locking concave portion 13a and the locking convex portion 13b are engaged. Similarly, the engagement concave portion 13c and the engagement convex portion 13d, the engagement concave portion 13e and the engagement convex portion 13f, the engagement concave portion 13g, and the engagement convex portion 13h may be fitted to each other. Moreover, the concave portion formed by the step difference formed by the locking portions 11a to 11d formed on the front surface portion of the tray 10 can be fitted with the convex portion formed by the step difference on the back surface portion of the tray 10 Together.

因此,可以將複數托盤10收納成以成為相同方向之方式重疊複數托盤10而不會成為鬆厚(圖5(d)及圖6(d))。 Therefore, the plurality of trays 10 can be stored so as to overlap the plurality of trays 10 in the same direction without becoming bulky (FIG. 5(d) and FIG. 6(d)).

[基板搬運器] [Substrate Carrier]

使用圖7,針對與本實施型態有關之基板搬運器50,進行更詳細說明。圖7(a)係與本實施型態有關之基板搬運器50之俯視圖,圖7(b)係與本實施型態有關之基板搬運器50之側面圖。 Using FIG. 7, the substrate carrier 50 related to this embodiment will be described in more detail. FIG. 7(a) is a top view of the substrate carrier 50 related to this embodiment, and FIG. 7(b) is a side view of the substrate carrier 50 related to this embodiment.

如圖7(a)及(b)所示般,基板搬運器50具備基板盒30、一對平板(板部)40及綑束帶(帶部)41。 As shown in FIGS. 7( a) and (b ), the substrate carrier 50 includes a substrate cassette 30, a pair of flat plates (plate portions) 40 and a binding belt (belt portion) 41.

如此一來,藉由一對平板40把持由複數托盤10所構成之基板盒30,藉由綑束帶41進行綑束。依此,可以使基板盒30不會崩塌而適宜搬運。 In this way, the substrate cassette 30 composed of the plurality of trays 10 is held by the pair of flat plates 40, and bundled by the binding band 41. According to this, the substrate cassette 30 can be suitably transported without collapsing.

[平板] [flat]

如圖7(a)所示般,平板40在俯視下之形狀為略正方形,在構成平板40之外周的4邊之中央部分設置有缺口部40a。平板40係以鋁等之金屬而被製作出。平板40係為了不使基板盒30崩塌而搬運,同時防止搬運時等基板盒30之破損,被配置在基板盒30之上下。缺口部40a之形狀並不特別限定,若為適宜進行藉由綑束帶41進行綑束之形狀即可。 As shown in FIG. 7( a ), the flat plate 40 has a slightly square shape in plan view, and a notch 40 a is provided in the central portion of the four sides constituting the outer circumference of the flat plate 40. The flat plate 40 is made of metal such as aluminum. The flat plate 40 is disposed above and below the substrate cassette 30 in order to prevent the substrate cassette 30 from being collapsed and to be transported while preventing damage to the substrate cassette 30 during transportation. The shape of the notch 40a is not particularly limited, and it may be a shape suitable for bundling by the bundling band 41.

藉由使綑束帶41通過被設置在平板40之缺口部40a,可以防止藉由平板40上下把持基板盒30而進行綑束時,綑束帶41在平板40產生位置偏移之情形。依此,在搬運基板搬運器50之時,可以防止基板盒30之綑束鬆弛。 By passing the binding tape 41 through the notch portion 40 a provided in the flat plate 40, it is possible to prevent the binding tape 41 from shifting in position on the flat plate 40 when the flat plate 40 grips the substrate cassette 30 up and down. Accordingly, when the substrate carrier 50 is transported, the bundle of the substrate cassette 30 can be prevented from slackening.

[綑束帶] [Bundle]

綑束帶41係經由平板40而綑束基板盒30。綑束帶41若為可以綑束基板盒30和一對平板40時則並不加以限定,例如可以使用一般包裝所使用之扣帶型的綑束帶,或藉由加熱熔接之聚丙烯帶、橡膠等。 The binding belt 41 bundles the substrate cassette 30 via the flat plate 40. The binding band 41 is not limited as long as it can bind the substrate box 30 and the pair of flat plates 40. For example, a buckle type binding band used for general packaging, or a polypropylene band welded by heating, Rubber, etc.

在與本實施型態有關之基板搬運器50中,使用兩條綑束帶,綑束一對平板40和基板盒30。在基板搬運器50中,在基板盒30之最上面和最下面配置平板40,使綑束帶通過在最上面之平板40的互相相向之缺口部40a,和相對於該相向之缺口部40a,在最下面之平板40中互相相向之缺口部40a,綑束基板盒30。 In the substrate carrier 50 related to the present embodiment, two binding straps are used to bundle a pair of flat plates 40 and the substrate cassette 30. In the substrate carrier 50, a flat plate 40 is arranged on the uppermost and lowermost surfaces of the substrate cassette 30 so that the binding tape passes through the notch 40a facing each other of the uppermost plate 40, and the notch 40a facing the opposite, The notch 40a facing each other in the lowermost flat plate 40 bundles the substrate cassette 30.

如圖7(b)所示般,基板搬運器50係藉由一對平板40,經由該基板盒30之最上面和最下面把持由以樹脂成形之托盤10所構成的基板盒30。依此,可以防止為了搬運基板盒30而抬起時,基板盒30由於自重而撓曲的情形。依此,可以藉由基板盒30,適宜地搬運基板20。再者,由於藉由綑束帶41,經由一對平板40綑束基板盒30,故為了綑束基板盒30,藉由綑束帶41被施加之力均等地被施加在基板盒30之最上面及最下面。因此,可以適當地防止由於藉由綑束帶41被施加之力集中於基板盒30之一部分,使得構成基板盒30之托盤10破損之情形。 As shown in FIG. 7( b ), the substrate carrier 50 uses a pair of flat plates 40 to hold the substrate cassette 30 composed of the resin-made tray 10 via the uppermost and lowermost surfaces of the substrate cassette 30. According to this, it is possible to prevent the substrate box 30 from being bent due to its own weight when the substrate box 30 is lifted for carrying. Accordingly, the substrate cassette 30 can appropriately transport the substrate 20. In addition, since the substrate cassette 30 is bound by the pair of flat plates 40 by the strap 41, in order to bind the substrate cassette 30, the force applied by the strap 41 is evenly applied to the most of the substrate cassette 30 Top and bottom. Therefore, it is possible to appropriately prevent the tray 10 constituting the substrate cassette 30 from being damaged due to the force applied by the binding band 41 being concentrated on a part of the substrate cassette 30.

[與第二實施型態有關之基板盒] [Substrate box related to the second embodiment type]

與本發明有關之基板盒並不限定於上述實施型態(第一實施型態)。例如,與一實施型態(第二實施型態)有關之基板盒中,一個托盤(收納部)係藉由其表面部所具備之卡止部之階差,從該基板之底面側支撐基板之端部,且藉由在位於該收納部之上方的另外的收納部之背面部的卡止凸部,從該基板之上面側卡止基板之端部,依此保持基板。 The substrate cassette related to the present invention is not limited to the above-mentioned embodiment (first embodiment). For example, in a substrate box related to one embodiment (second embodiment), one tray (storage portion) supports the substrate from the bottom surface side of the substrate by the step difference of the locking portion provided on the surface portion thereof The end portion of the substrate, and the end portion of the substrate is locked from the upper side of the substrate by the locking protrusion on the back portion of the other storage portion located above the storage portion, thereby holding the substrate.

與本實施型態有關之基板盒30’在一個托盤10’之表面部的卡止部之階差之途中卡止基板20之端部20a之點,與托盤10不同(圖8(a)及(c))。再者,托盤10’係以將在一個托盤10’之卡止部之階差之途中被卡止之基板20之端部20a,從該基板20之上面側予以卡止的方式,調整被設置在位於該托盤10’之上方的另外托盤10’之背面部的卡止凸部之配置,隨此,在調整卡止凸部與表背一體成形之卡止凹部之配置之點,與托盤10不同(圖8(b)及(d))。除該些2點之外,托盤10’針對第一抵接部、第三抵接部及支撐部,具有與圖1所示之托盤10相同之配置。 The point where the substrate cassette 30' related to the present embodiment locks the end 20a of the substrate 20 on the way of the step difference of the locking portion of the surface portion of one tray 10' is different from that of the tray 10 (FIG. 8(a) and (c)). In addition, the tray 10' is adjusted in such a manner that the end 20a of the substrate 20 that is locked in the middle of the step difference of the locking portion of one tray 10' is locked from the upper side of the substrate 20. The arrangement of the locking projections on the back of the other tray 10' located above the tray 10' is adjusted to the position of the locking recesses integrally formed by the locking projections and the front and back. Different (Figure 8(b) and (d)). Except for these two points, the tray 10' has the same arrangement as the tray 10 shown in FIG. 1 with respect to the first contact portion, the third contact portion, and the support portion.

因此,托盤10’與托盤10相同,可以每次平行地改變180°方向而進行堆疊。另外,針對在具有與托盤10相同功能之托盤10’的嵌合部、第一抵接部、第三抵接部及卡止凹部,省略其說明。 Therefore, the tray 10' is the same as the tray 10, and can be stacked in parallel by changing the 180° direction each time. In addition, the description of the fitting portion, the first contact portion, the third contact portion, and the locking recess in the tray 10' having the same function as the tray 10 will be omitted.

如圖8(a)所示般,在基板盒30’中的托盤10’係在被設置在各托盤10’之表面部的階差之途中,從底面側卡止基板20之端部。再者,在圖8(a)所示之狀態下, 在一個托盤10’之表面部中,藉由位於支撐在基板20中的端部的托盤10上的另外托盤10’之卡止凸部,將基板之端部從上面側卡止該基板20之端部(圖8(b))。依此,基板20被收納在一個托盤10’之表面部,和位於該一個托盤10’之上方的另外托盤10’之背面部之間(圖8(a)及(b))。 As shown in FIG. 8(a), the tray 10' in the substrate cassette 30' is locked at the end of the substrate 20 from the bottom surface side in the middle of the step provided on the surface of each tray 10'. Furthermore, in the state shown in FIG. 8(a), In the surface portion of one tray 10', the end portion of the substrate 20 is locked from the upper side by the locking convex portion of another tray 10' located on the tray 10 supported at the end of the substrate 20 End (Figure 8(b)). Accordingly, the substrate 20 is accommodated between the front surface portion of one tray 10' and the back surface portion of another tray 10' located above the one tray 10' (FIG. 8(a) and (b)).

在一個托盤10’中的卡止部11’c之階差,沿著基板20之外周部之形狀而彎曲,具有離支撐部12’e越遠越寬之傾斜。在此,卡止部11’c之階差係當基板20被收納於托盤10’之表面部之時,傾斜成圖2(d)所示之基板20中的端部20a之倒角部位a2被平行配置。另外,其他之卡止部也與圖8(c)所示之卡止部11’c相同,沿著基板20之外周部之形狀而彎曲,具有離支撐部12’e越遠越寬之傾斜。再者,其他之卡止部之階差也傾斜成在圖2(d)所示之基板20的端部20a之倒角部位a2被平行配置。依此,在該托盤10’之表面部,使基板20中的端部20a從該基板20之底面20c側經由倒角部a2而予以卡止(圖8(c))。 The step difference of the locking portion 11'c in one tray 10' is curved along the shape of the outer peripheral portion of the base plate 20, and has a slope which is wider as it goes away from the supporting portion 12'e. Here, the step difference of the locking portion 11'c is that when the substrate 20 is stored in the surface portion of the tray 10', it is inclined to the chamfered portion a2 of the end portion 20a in the substrate 20 shown in FIG. 2(d) It is configured in parallel. In addition, the other locking portions are the same as the locking portions 11'c shown in FIG. 8(c), and are curved along the shape of the outer peripheral portion of the substrate 20, and have a wider and wider inclination from the support portion 12'e . In addition, the steps of the other locking portions are also inclined so that they are arranged in parallel at the chamfered portion a2 of the end portion 20a of the substrate 20 shown in FIG. 2(d). In accordance with this, the end portion 20a of the substrate 20 is locked from the bottom surface 20c side of the substrate 20 via the chamfered portion a2 on the surface portion of the tray 10' (FIG. 8(c)).

再者,如圖8(d)所示般,卡止凸部13’b係在抵接於第一抵接部17’e之狀態下,在具有其傾斜之面,卡止基板20之端部20a之倒角部位a1。再者,與卡止凸部13’b相同,其他卡止凸部也在具有其傾斜之面,卡止基板20之端部20a之倒角部位a1。在該狀態下,基板盒30’係在位於下方之托盤10’之支撐部12’d及12’e和基板20之底面20c之間,及位於該基板20之上面20b和該基 板20之上方的托盤10’之背面部之間的雙方,設置有空間。因此,基板盒30’可以藉由托盤10’接觸於較基板20之端部20a的倒角部位a1及a2更內側,防止在基板20之上面20b及底面20c產生刮傷。再者,由於即使在托盤10’,也設置有第一抵接部,故可以防止在基板20之端部20a由於托盤10’(或是,被堆疊之複數托盤10’及複數基板20)之重量,而使得力經由端部20a對被卡止於位在下方之托盤10’之卡止部的階差的基板20過度施加。 Furthermore, as shown in FIG. 8(d), the locking convex portion 13'b is in a state of contacting the first contact portion 17'e, and has an inclined surface to lock the end of the substrate 20 The chamfered portion a1 of the portion 20a. In addition, like the locking convex portion 13'b, the other locking convex portion also has its inclined surface and locks the chamfered portion a1 of the end portion 20a of the substrate 20. In this state, the substrate cassette 30' is between the support portions 12'd and 12'e of the tray 10' located below and the bottom surface 20c of the substrate 20, and the upper surface 20b of the substrate 20 and the base Spaces are provided on both sides of the back portion of the tray 10' above the board 20. Therefore, the substrate cassette 30' can be contacted with the inner side of the chamfered portions a1 and a2 of the end portion 20a of the substrate 20 by the tray 10' to prevent scratches on the upper surface 20b and the bottom surface 20c of the substrate 20. Furthermore, since the first contact portion is provided even in the tray 10', it is possible to prevent the end portion 20a of the substrate 20 from being caused by the tray 10' (or the plurality of stacked trays 10' and the plurality of substrates 20) The weight causes the force to be excessively applied to the substrate 20 that is locked to the step of the locking portion of the tray 10' located below via the end portion 20a.

另外,在與本實施型態有關之基板盒30’中,被設置在托盤10’之支撐部,並非隨時與被收納之基板20之底面20c接觸而進行支撐的構件。支撐部係當搬運基板盒30’時,由於衝擊使得基板20撓曲之時,或基板20由於自重撓曲等,以為了從背面支撐基板20而設置為佳。 In addition, in the substrate cassette 30' according to this embodiment, the support portion provided in the tray 10' is not a member that is always in contact with the bottom surface 20c of the accommodated substrate 20 to support it. The support portion is preferably provided to support the substrate 20 from the back when the substrate 20 is flexed due to an impact when the substrate cassette 30' is transported, or the substrate 20 is flexed due to its own weight, or the like.

[與第三實施型態有關之基板盒] [Substrate box related to the third embodiment type]

與本發明有關之基板盒並不限定於上述實施型態(第一實施型態及第二實施型態)。例如,在與一實施型態(第三實施型態)有關之基板盒,背面部係具備第二抵接部18a~18h的構成,該第二抵接部18a~18h係與卡止凸部13”b、13”d、13”f及13”h相鄰接,並且於水平配置托盤10”之時,可以在較背面部中之最低面還高,且較背面部之最高面還低之位置,抵接於在另外的托盤10”之表面部中的最高面之一部分a~h。 The substrate box related to the present invention is not limited to the above-mentioned embodiments (first embodiment and second embodiment). For example, in a substrate case related to an embodiment (third embodiment), the back portion is configured to include second contact portions 18a to 18h. The second contact portions 18a to 18h are connected to the locking protrusions 13"b, 13"d, 13"f and 13"h are adjacent, and when the tray 10" is arranged horizontally, it can be higher than the lowest surface of the rear surface and lower than the highest surface of the rear surface The position is in contact with a part a~h of the highest surface in the surface part of another tray 10".

依此,當每次平行地改變180°方向而堆疊複 數托盤10”時,在各托盤10”之表面部和背面部之間,於保持基板20之區域可以取得充分之空間。 According to this, each time the direction of 180° is changed in parallel and stacked When counting the trays 10", a sufficient space can be obtained between the front and back portions of each tray 10" in the area where the substrate 20 is held.

圖9(a)所示般,托盤10”在表面部具備具有階差之卡止部11”a~11”d、具備有複數凹部r之支撐部12f和卡止凹部13”a、13”c、13”e及13”h。托盤10”係在其背面部具備卡止凸部13”b、13”d、13”f及13”h和第二抵接部18a~18g。再者,托盤10”在其側面部與第一實施型態有關之托盤10相同具有嵌合部14a~14n,各嵌合部具備第三抵接部。 As shown in FIG. 9(a), the tray 10" includes locking portions 11"a to 11"d with a step difference on the surface, a supporting portion 12f including a plurality of recesses r, and locking recesses 13"a, 13" c, 13"e and 13"h. The tray 10" is provided with locking protrusions 13"b, 13"d, 13"f and 13"h and second abutting portions 18a to 18g on the back portion thereof. Furthermore, the tray 10" has fitting portions 14a to 14n at the side portions similar to the tray 10 according to the first embodiment, and each fitting portion includes a third abutting portion.

另外,由於托盤10”所具備之嵌合部及第三抵接部之形狀及功能與第一實施型態所涉及之托盤10具備的嵌合部及第三抵接部相同,故省略其說明。 In addition, since the shape and function of the fitting portion and the third abutting portion included in the tray 10" are the same as those of the tray 10 according to the first embodiment, their description is omitted. .

圖9(b)為圖9(a)中之托盤10”之沿E-E’箭號線剖面圖。如圖9(b)所示般,托盤10”係在沿E-E’箭號線剖面中,卡止部11”a之階差和卡止部11”c之階差互相相向,具有離支撐部12f越遠越寬之傾斜。再者,在圖9(a)中之卡止部11”b之階差和卡止部11”d之階差互相相向。即是,卡止部11”a~11d”除藉由卡止凹部13”a、13”c、13”e及13”g,將設置在表面部之階差形成缺口之外,其他與托盤10之卡止部11a~11d相同。 Fig. 9(b) is a cross-sectional view of the pallet 10" in FIG. 9(a) along the arrow line of EE'. As shown in Fig. 9(b), the pallet 10" is along the EE' arrow In the line cross section, the step difference of the locking portion 11"a and the step difference of the locking portion 11"c face each other, and have a slope that is wider as farther away from the support portion 12f. Furthermore, the step difference of the locking portion 11"b and the step difference of the locking portion 11"d in FIG. 9(a) are opposed to each other. That is, the locking portions 11"a to 11d" are not the same as the tray except that the recesses 13"a, 13"c, 13"e, and 13"g are used to form gaps in the steps of the surface portion. The locking portions 11a to 11d of 10 are the same.

圖9(c)為圖9(a)中之沿F-F’箭號線剖面圖。如圖9(c)所示般,在托盤10”之表面部形成有卡止凹部13”a及13”e。再者,在托盤10”之背面部,以使卡止凹部13”a及13”e之背面突出之方式,形成卡止凸部13”b及 13”f。再者,藉由使圖9(a)所示之被設置在托盤10”之表面部的卡止凹部13”c及13”g在背面部突出,形成有卡止凸部13”d及13”h。 Fig. 9(c) is a cross-sectional view taken along line F-F' in Fig. 9(a). As shown in FIG. 9(c), locking recesses 13"a and 13"e are formed on the surface of the tray 10". Furthermore, on the back of the tray 10", the locking recesses 13"a and 13"e's back surface protrudes to form a locking protrusion 13"b and 13"f. Furthermore, by making the locking concave portions 13"c and 13"g provided on the surface portion of the tray 10" shown in FIG. 9(a) project on the back portion, the locking convex portion 13 is formed "D and 13"h.

卡止凹部13”a、13”c、13”e及13”g除在俯視下之形狀為略正方形,及卡止凹部13”a和卡止凹部13”e夾著托盤10”之中心點而成為對稱性之形狀,卡止凹部13”c和卡止凹部13”g夾著托盤10”之中心點而成為對稱性的形狀之外,其他具有在托盤10中的與卡止凹部13a、13c、13e及13g相同的功能。 The locking recesses 13"a, 13"c, 13"e, and 13"g have a slightly square shape in plan view, and the locking recesses 13"a and the locking recesses 13"e sandwich the center point of the tray 10" It has a symmetrical shape, and the locking concave portion 13"c and the locking concave portion 13"g sandwich the center point of the tray 10" to become a symmetrical shape, and the other has the locking concave portion 13a in the tray 10, 13c, 13e and 13g have the same function.

同樣,卡止凸部13”b、13”d、13”f、13”h也除了為略正方形,及卡止凸部13”b和卡止部凸部13”f夾著托盤10”之中心點而成為對稱性之形狀,卡止凸部13”d和卡止部凸部13”h夾著托盤10”之中心點而成為對稱性之形狀外,其他具有與在托盤10中的卡止凸部13b、13d、13f、13h相同的功能。 Similarly, the locking protrusions 13"b, 13"d, 13"f, 13"h are not only slightly square, and the locking protrusion 13"b and the locking protrusion 13"f sandwich the tray 10" The center point becomes a symmetrical shape, the locking convex portion 13"d and the locking portion convex portion 13"h sandwich the center point of the tray 10" to become a symmetrical shape, and the other has a card with the tray 10 The protrusions 13b, 13d, 13f, and 13h have the same function.

[支撐部(第三實施型態)] [Support (third embodiment)]

如圖9(a)~(c)所示般,在與本實施型態有關之托盤10”中,藉由具備複數凹部r之支撐部12f,支撐基板20之底面20c。即使藉由如此之構成,在托盤10”之表面部,可以縮小支撐基板20之底面20c的面積。如圖9(b)及(c)所示般,被設置在支撐部12f之凹部r,雖然在托盤10”之背面部形成突出之凸部,但是該凸部不與被收納在位於下方之另外的托盤10”之表面部的基板20之上面20b 接觸。 As shown in FIGS. 9(a) to (c), in the tray 10" related to the present embodiment, the bottom surface 20c of the substrate 20 is supported by the support portion 12f provided with a plurality of recesses r. Even by this According to the configuration, the area of the bottom surface 20c of the support substrate 20 can be reduced on the surface of the tray 10". As shown in FIGS. 9(b) and (c), the concave portion r provided in the support portion 12f is formed with a protruding convex portion on the back surface of the tray 10", but the convex portion is not The upper surface 20b of the substrate 20 of the surface portion of the other tray 10" contact.

另外,在支撐部設置凹部之情況下,凹部之大小及數量因應收納之基板的形狀等而適當調整即可。 In addition, when the support portion is provided with a recessed portion, the size and number of the recessed portions may be appropriately adjusted according to the shape of the substrate to be housed and the like.

[第二抵接部] [Second contact part]

使用圖10,針對與本實施型態有關之托盤10”所具備之第二抵接部,進行更詳細說明。如圖10(a)所示般,第二抵接部分別在俯視下為略正方形的卡止凹部13”a、13”c、13”e及13”h各設置成與互相相向之兩邊相鄰接。即是,第二抵接部分別在成為略正方形的卡止凸部13”b、13”d、13”f及13”g各設置成與互相相向之兩邊相鄰接。在此,當每次平行地使托盤10”旋轉180°一面進行堆疊之時,位於上方之托盤10”中的第二抵接部分別不與位於下方之另外的托盤10”中的第二抵接部互相重疊,抵接於該另外的托盤10”之表面部之一部分。 Using FIG. 10, the second abutting portion provided in the tray 10" related to this embodiment will be described in more detail. As shown in FIG. 10(a), the second abutting portions are slightly The square locking concave portions 13"a, 13"c, 13"e, and 13"h are each provided adjacent to two sides facing each other. That is, the second abutting portions respectively form locking convex portions that become slightly square 13"b, 13"d, 13"f and 13"g are each arranged adjacent to the two sides facing each other. Here, when each time the tray 10" is rotated in parallel by 180° for stacking, it is located above The second abutting portions in the tray 10" do not overlap with the second abutting portions in the other tray 10" located below, but abut on a part of the surface portion of the other tray 10".

圖10(a)係根據圖9(a)中之托盤10”之沿G-G’箭號線剖面圖,和根據沿H-H’箭號線剖面圖,說明一面使複數托盤10”每次平行旋轉180°一面進行堆疊之時,第二抵接部和托盤10”之表面部之一部分的配置的概略圖。另外,圖10(a)所示之3個托盤10”中,從上數起第1個及第3個之托盤10”表示根據沿G-G’箭號線的剖面,從上數起第2個的托盤10”表示根據沿G-G’箭號線的剖面。 FIG. 10(a) is a cross-sectional view along the GG arrow line according to the pallet 10" in FIG. 9(a), and a cross-sectional view along the HV' arrow line illustrating that the plurality of trays 10" per side A schematic diagram of the arrangement of the second abutting portion and a part of the surface portion of the tray 10" when the stack is rotated parallel to one side by 180°. In addition, in the three trays 10" shown in FIG. 10(a), from the top The first and third pallets 10" from the top indicate the cross section along the GG arrow line, and the second pallet 10" from the top indicates the cross section along the GG arrow line.

如圖10(a)所示般,當每次平行地使3個托盤10”旋轉180°而配置時,被設置在位於上方之托盤10”之 背面的第二抵接部18g,被配置成位於處在正中央的托盤10”之表面部的最高面,且可以與卡止凹部13”g之開口之外周部分之一部分d抵接。在此,被設置在位於上方之托盤10”的卡止凹部13”e之一邊的第二抵接部18e,可以與被配置成位於正中央的另外的托盤10”之卡止凹部13”a之開口之外周部分之一部分h抵接。再者,被設置在位於上方之托盤10”的卡止凹部13”e之一邊的第二抵接部18f,被配置成可以與位於正中央的另外的托盤10”之卡止凹部13”a之開口之外周部分之一部分g抵接。 As shown in Fig. 10(a), when three trays 10" are rotated in parallel by 180° and arranged each time, they are placed on the upper tray 10". The second abutting portion 18g on the back side is arranged so as to be located at the highest surface of the surface portion of the tray 10" at the center, and can abut on a part d of the outer peripheral portion of the opening of the locking recess 13"g. Here, the second abutting portion 18e provided on one side of the locking recess 13"e of the tray 10" located above may be in contact with the locking recess 13"a of another tray 10" disposed in the center A part h of the outer peripheral portion of the opening abuts. Furthermore, the second contact portion 18f provided on one side of the locking recess 13"e of the tray 10" located above is configured to be able to engage with the locking recess 13"a of another tray 10" located in the center A part g of the outer peripheral portion of the opening abuts.

在該狀態下,被設置在位於正中央的托盤10”之背面的第二抵接部18a,被配置成位於處在下方的托盤10”之表面部之最高面,且可以與卡止凹部13”g之開口之外周部分之一部分a抵接。在此,被設置在位於正中央之托盤10”的卡止凹部13”c之一邊的第二抵接部18c,被配置成可以與位於下方的另外的托盤10”之卡止凹部13”g之開口之外周部分之一部分e抵接。再者,被設置在位於正中央之托盤10”的卡止凹部13”c之一邊的第二抵接部18d,被配置成可以與位於正中央的另外的托盤10”之卡止凹部13”a之開口之外周部分之一部分f抵接。 In this state, the second abutment portion 18a provided on the back surface of the tray 10" located in the center is arranged so as to be located on the highest surface of the surface portion of the tray 10" below, and can engage with the locking recess 13 A part a of the outer peripheral portion of the opening of "g" abuts. Here, the second abutting portion 18c provided on one side of the locking recess 13"c of the tray 10" located in the center is configured to be located below The other part of the outer peripheral part of the opening of the locking recess 13"g of the other tray 10" abuts. Furthermore, the second contact provided on one side of the locking recess 13"c of the tray 10" located in the center The contact portion 18d is configured to be able to contact with a part f of the outer peripheral portion of the opening of the locking recess 13"a of another tray 10" located in the center.

圖10(b)係根據圖9(a)中之托盤10”之沿I-I’箭號線剖面圖,和根據沿J-J’箭號線剖面圖,說明一面使複數托盤10”每次平行旋轉180°一面進行堆疊之時,第二抵接部和托盤10”之表面部之一部分的配置的概略圖。另外,圖10(a)所示之3個托盤10”中,從上數起第1個及第 3個之托盤10”表示根據沿I-I’箭號線的剖面,從上數起第2個的托盤10”表示根據沿J-J’箭號線的剖面。即是,如圖10(a)所示般,在重疊3個托盤10”之時,如圖10(b)所示般,根據沿I-I’箭號線剖面及沿J-J’箭號線剖面,複數托盤10”被重疊。 10(b) is a cross-sectional view taken along the line II-I of the tray 10" in FIG. 9(a), and a cross-sectional view taken along the line J-J' indicating that a plurality of trays 10" A schematic diagram of the arrangement of the second abutting portion and a part of the surface portion of the tray 10" when the stack is rotated parallel to one side by 180°. In addition, in the three trays 10" shown in FIG. 10(a), from the top 1st and first The three trays 10" indicate the cross section along the arrow line I-I', and the second tray 10" from the top indicates the cross section along the arrow line J-J'. That is, as shown in FIG. 10(a), when three trays 10" are stacked, as shown in FIG. 10(b), according to the section along the arrow line I-I' and the arrow along J-J' The cross section of the number line, the plural trays 10" are overlapped.

如圖10(b)所示般,當每次平行地使3個托盤10”旋轉180°而配置時,被設置在位於上方之托盤10”之卡止凹部13”a之背面的第二抵接部18a,被配置成位於處於正中央之托盤10”之表面部之最高面,且可以與卡止凹部13”e之開口之外周部分之一部分a抵接,且被配置成第二抵接部18b可以與表面部之一部分b抵接。同樣,被設置在位於上方之托盤10”之卡止凹部13”g之背面的第二抵接部18h,被配置成位於處在正中央之托盤10”之表面部的最高面,且可以與卡止凹部13”g之開口之外周部分之一部分c抵接,且被配置成第二抵接部18g可以與表面部之一部分d抵接。 As shown in FIG. 10(b), when three trays 10" are rotated in parallel by 180° and arranged each time, the second contact provided on the back of the locking recess 13"a of the tray 10" located above The contact portion 18a is configured to be located at the highest surface of the surface portion of the tray 10" at the center, and can contact with a part a of the outer peripheral portion of the opening of the locking recess 13"e, and is configured to be the second contact The portion 18b may be in contact with a portion b of the surface portion. Similarly, the second abutment portion 18h provided on the back of the locking recess 13"g of the tray 10" located above is configured to be located on the tray at the center The highest surface of the 10" surface portion, and can abut a part c of the outer peripheral portion of the opening of the locking recess 13"g, and is configured such that the second abutment portion 18g can abut a part d of the surface portion.

在該狀態下,被設置在位於正中央的托盤10”之卡止凹部13”e之背面的第二抵接部18e,被配置成位於處在下方的托盤10”之表面部之最高面,且可以與卡止凹部13”a之開口之外周部分之一部分h抵接。再者,同樣,被設置在位於正中央的托盤10”之卡止凹部13”c之背面的第二抵接部18d,被配置成位於處在下方的托盤10”之表面部之最高面,且可以與卡止凹部13”g之開口之外周部分之一部分f抵接。 In this state, the second contact portion 18e provided on the back of the locking recess 13"e of the tray 10" located in the center is arranged to be located on the highest surface of the surface portion of the tray 10" below, And it can contact with a part h of the outer peripheral part of the opening of the locking recess 13"a. Furthermore, similarly, the second contact portion 18d provided on the back of the locking recess 13"c of the tray 10" located in the center is arranged to be located on the highest surface of the surface portion of the tray 10" below, And it can contact with a part f of the outer peripheral part of the opening of the locking recess 13"g.

如上述般,藉由配置第二抵接部18a~18h,當每次平行地使托盤10”旋轉而重疊時,將第二抵接部18a~18h位於卡止凹部13”a、13”c、13”e、13”g之開口之外周部分,且可以在托盤10”之表面部與最高面之一部分a~g抵接。 As described above, by arranging the second contact portions 18a to 18h, each time the trays 10" are rotated in parallel and overlapped, the second contact portions 18a to 18h are located in the locking recesses 13"a, 13"c , 13"e, 13"g opening the outer peripheral part, and can be in contact with a part of the highest surface a ~ g in the surface part of the tray 10".

另外,即使在托盤10”中,也與托盤10及托盤10”之情況相同,藉由配合基板20之大小調整卡止部11”a~11”d之配置,使基板20之端部20a卡止於卡止部11”a~11”d當然亦可。 In addition, even in the tray 10", as in the case of the tray 10 and the tray 10", by adjusting the arrangement of the locking portions 11"a to 11"d according to the size of the substrate 20, the end 20a of the substrate 20 is stuck It is of course possible to stop at the locking portions 11"a to 11"d.

[與另外的實施型態有關之基板盒] [Substrate box related to other embodiments]

與本發明有關之基板盒並不限定於上述實施型態(第一實施型態及第二實施型態)。例如,被設置在收納部之卡止凸部並不限定於互相相向之兩對凸部。 The substrate box related to the present invention is not limited to the above-mentioned embodiments (first embodiment and second embodiment). For example, the locking convex portion provided in the storage portion is not limited to two pairs of convex portions facing each other.

收納部之卡止凸部若為適當設計成因應基板之外周的形狀而卡止該基板之端部時,其配置及數量不被限定。同樣,收納部之卡止部之配置及數量也不被限定。構成基板盒之收納部若為在其表面部支撐基板,可以藉由被設置在另外的收納部之背面部的卡止凸部,卡止基板之端部,來保持該基板時即可,並不限定卡止凸部及卡止部之配置及數量。 If the locking convex portion of the storage portion is appropriately designed to lock the end of the substrate in accordance with the shape of the outer periphery of the substrate, the arrangement and the number thereof are not limited. Similarly, the arrangement and number of locking portions of the storage portion are not limited. If the storage portion constituting the substrate cassette supports the substrate on its surface, the substrate may be held by the locking convex portion provided on the back portion of the other storage portion to lock the end of the substrate, and The arrangement and number of locking convex portions and locking portions are not limited.

因此,被收納於基板盒之基板之外周部的形狀也不被限定於圓形,及使為立方體或長方體亦可。收納部若為因應基板之形狀,適當地設計支撐部、卡止部及卡 止凸部之形狀及配置即可之故。 Therefore, the shape of the outer peripheral portion of the substrate housed in the substrate cassette is not limited to a circle, and may be a cube or a rectangular parallelepiped. If the storage part is in accordance with the shape of the substrate, the support part, the locking part and the card are appropriately designed The reason for the shape and arrangement of the convex stop is sufficient.

再者,與上述實施型態相同,在對位於下方的收納部,改變位於上方之收納部的方向而進行堆疊之構成的情況下,為從被各收納部之表面部支撐的基板之重心點等間隔分離的位置,若在配置基板20之外周端部的位置設置具有卡止凸部之傾斜的面即可。例如,在藉由被設置在合計3處的卡止凸部而卡止基板之構成中,若在該些3處之卡止凸部卡止基板的面,係以該基板之重心點為中心點,在配置基板之外周端部之圓周上,每次改變120°角度而配置即可。如此一來,在一面平行地改變方向一面堆疊各收納部之實施型態中,若形成具有各卡止凸部之傾斜的面,係以保持之基板之重心點為中心點,以等間隔分離,沿著該基板之外周之形狀時,被形成在收納部之卡止凸部之數量不被限定。 In addition, in the same manner as the above-described embodiment, in the case where the storage portions located below are stacked by changing the direction of the storage portions located above, it is the center of gravity of the substrate supported by the surface portion of each storage portion The positions separated at equal intervals may be provided as long as the inclined surface of the locking projection is provided at the position of the outer peripheral end of the arrangement substrate 20. For example, in a configuration in which the substrate is locked by the locking protrusions provided at a total of 3 locations, if the surface of the substrate is locked by the locking protrusions at these 3 locations, the center of gravity of the substrate is the center The point can be placed on the circumference of the outer peripheral end of the placement substrate by changing the angle of 120° each time. In this way, in the embodiment in which the storage portions are stacked on one side in a parallel change of direction, if an inclined surface with each locking convex portion is formed, the center of gravity of the substrate to be held is taken as the center point and separated at equal intervals When the shape of the outer periphery of the substrate is followed, the number of locking protrusions formed in the storage portion is not limited.

而且,與另外的實施型態有關之基板盒中,在收納部的支撐部之形狀並不限定於以保持基板20之時之基板20之重心點為中心的圓狀。支撐部之形狀若配合應支撐基板的形狀,適當設計即可,即使形成以被支撐之基板的重心點為中心的圓弧狀亦可。 In addition, in the substrate cassette related to another embodiment, the shape of the support portion of the storage portion is not limited to a circular shape centered on the center of gravity of the substrate 20 when the substrate 20 is held. If the shape of the supporting portion matches the shape of the supporting substrate, it may be appropriately designed, even if it is formed in an arc shape centered on the center of gravity of the supported substrate.

再者,在與又另外的實施型態有關之基板盒中,卡止凸部具有與在基板之上面之外周端部線接觸的傾斜。即使藉由該構成,亦可以防止收納部之背面部接觸於較基板之上面的外周端部更內側。因此,可以防止在較基板之上面的外周端部更內側上產生刮傷。 Furthermore, in a substrate case related to yet another embodiment, the locking convex portion has an inclination in line contact with the outer peripheral end portion on the upper surface of the substrate. Even with this configuration, it is possible to prevent the back surface portion of the storage portion from contacting the inner side of the outer peripheral end portion of the upper surface of the substrate. Therefore, it is possible to prevent scratches from being generated on the inner side of the outer peripheral end of the upper surface of the substrate.

再者,在與又另外的實施型態有關之基板盒中,即使在收納部之表面部形成卡止凸部,形成有在收納部之背面部具有階差之卡止部的構成亦可。在收納部中,顯然表面部和背面部不會過於相對性的表現,即使在上述構成中,藉由僅卡止基板之端部,可以適當地保持基板。 In addition, in the substrate box according to still another embodiment, even if the locking convex portion is formed on the front surface portion of the storage portion, a configuration may be formed in which the locking portion has a step difference on the back surface portion of the storage portion. In the storage portion, it is obvious that the surface portion and the back portion will not be too relativistic. Even in the above configuration, by only locking the end portion of the substrate, the substrate can be properly held.

本發明並不限定於上述各實施型態,能夠在請求項所示的範圍下做各種變更,即使針對將分別所揭示的技術手段與不同的實施型態做適當組合而得到的實施型態也包含在本發明之技術範圍內。 The present invention is not limited to the above-mentioned embodiments, and various changes can be made within the scope indicated in the claims, even for the embodiments obtained by appropriately combining the disclosed technical means with different embodiments. It is included in the technical scope of the present invention.

[產業上之利用可行性] [Industry use feasibility]

本發明係可以適當地利用半導體晶圓基板或玻璃基板之搬運。 The present invention can appropriately utilize the transportation of semiconductor wafer substrates or glass substrates.

10‧‧‧托盤(收納部) 10‧‧‧Tray (Storage Department)

11a、11b、11c、11d‧‧‧卡止部 11a, 11b, 11c, 11d

12、12a、12b、12c、12d、12e‧‧‧支撐部 12, 12a, 12b, 12c, 12d, 12e‧‧‧support

13a、13c、13e、13g‧‧‧卡止凹部 13a, 13c, 13e, 13g

13b、13d、13f、13h‧‧‧卡止凸部 13b, 13d, 13f, 13h

14a、14b、14c、14d、14e、14e、14f、14g、14h、14i、14J、14k‧‧‧嵌合部 14a, 14b, 14c, 14d, 14e, 14e, 14f, 14g, 14h, 14i, 14J, 14k

17a、17c、17e、17g‧‧‧第一抵接部 17a, 17c, 17e, 17g

17b、17d、17f、17h‧‧‧第二抵接部 17b, 17d, 17f, 17h

Claims (12)

一種基板盒,具有複數用以收納基板之收納部,該基板盒之特徵在於:上述收納部具備:表面部,其具備擁有卡止上述基板之端部之階差的卡止部;和背面部,其係具備卡止上述基板之端部的卡止凸部,上述階差具備卡止上述基板的面,該面具有離比在上述表面部的上述階差更內側的面越遠越寬的傾斜,一個收納部係藉由具有上述表面部所具備的上述卡止部之上述傾斜的面,從上述基板之底面側支撐上述基板之端部,且藉由在位於該收納部之上方的另外的收納部之背面部的卡止凸部,卡止上述基板之端部,依此保持上述基板。 A substrate box having a plurality of storage portions for storing substrates, the substrate box is characterized in that the storage portion includes: a surface portion having a locking portion having a step difference for locking an end of the substrate; and a back portion , Which is provided with a locking convex portion that locks the end of the substrate, and the step is provided with a surface that locks the substrate, the surface having a wider distance from a surface that is more inside than the step in the surface portion Inclined, one storage portion supports the end of the substrate from the bottom surface side of the substrate by the inclined surface having the locking portion provided in the surface portion, and by The locking protrusion on the back of the storage portion locks the end of the substrate, thereby holding the substrate. 如請求項1所記載之基板盒,其中上述表面部具備支撐上述基板之底面之一部分的支撐部,藉由在一個收納部之表面部的上述支撐部,支撐上述基板之底面之一部分,且藉由在位於該收納部之上方的另外的收納部之背面部的卡止凸部,卡止上述基板之端部,依此保持上述基板。 The substrate cassette according to claim 1, wherein the surface portion includes a support portion that supports a portion of the bottom surface of the substrate, and the portion of the bottom surface of the substrate is supported by the support portion on the surface portion of a storage portion, and The end of the substrate is locked by the locking protrusion on the back portion of another storage portion located above the storage portion, thereby holding the substrate. 如請求項2所記載之基板盒,其中上述支撐部係由在上述表面部之俯視下的形狀為以保持上述基板之時的該基板之重心點為中心的圓狀或圓弧狀 的複數凸部所構成。 The substrate cassette according to claim 2, wherein the support portion is formed in a circular or arc shape centered on the center of gravity of the substrate when the substrate is held in a plan view of the surface portion Composed of a plurality of convex parts. 如請求項1所記載之基板盒,其中上述卡止凸部係由複數凸部所構成,具有傾斜,以使卡止在各凸部之上述基板之端部的面,與保持上述基板之時的該基板之端部的倒角部位接觸。 The substrate cassette according to claim 1, wherein the locking convex portion is composed of a plurality of convex portions, and has a slope so as to be locked on the surface of the end of the substrate of each convex portion, and when holding the substrate The chamfered portion of the end of the substrate is in contact. 如請求項1所記載之基板盒,其中上述卡止凸部係由互相相向之兩對凸部所構成。 The substrate case according to claim 1, wherein the locking convex portion is composed of two pairs of convex portions facing each other. 如請求項1所記載之基板盒,其中上述表面部係在配置上述基板之端部的部位,具備可以嵌合被設置在上述另外的收納部之背面部的上述卡止凸部的卡止凹部,上述卡止凸部和上述卡止凹部僅在一個收納部和另外的收納部在特定之配置重疊之時,成為互相嵌合。 The substrate cassette according to claim 1, wherein the surface portion is located at a position where the end portion of the substrate is disposed, and includes a locking concave portion that can fit the locking convex portion provided on the back surface portion of the other storage portion The locking convex portion and the locking concave portion only fit into each other when one storage portion and another storage portion overlap in a specific arrangement. 如請求項6所記載之基板盒,其中上述表面部具備與上述卡止凹部相鄰接,並且於水平配置上述收納部之時,在較上述表面部中之最高面低,且較上述卡止凹部之底面高的位置,與被設置在上述另外的收納部之背面部的上述卡止凸部之端部抵接的第一抵接部,上述卡止凸部之端部和上述第一抵接部係在一個收納部和另外的收納部在與上述特定之配置不同的配置重疊之時,成為互相抵接。 The substrate cassette according to claim 6, wherein the surface portion is adjacent to the locking concave portion, and when the storage portion is arranged horizontally, it is lower than the highest surface of the surface portion and is locked than the locking portion A position where the bottom surface of the concave portion is high is in contact with an end portion of the locking convex portion provided on the back surface portion of the other storage portion, an end portion of the locking convex portion and the first contact portion The contact portion is such that when one storage portion and another storage portion overlap with a configuration different from the specific configuration described above, they come into contact with each other. 如請求項6或7所記載之基板盒,其中上述背面部具備於與上述卡止凸部相鄰接,並且水平 配置上述收納部之時,在較上述背面部中之最低面高,且較上述背面部之最高面低之位置,可以抵接於上述另外的收納部之表面部中之最高面之一部分的第二抵接部,上述第二抵接部和上述另外的收納部之表面部之一部分,係在一個收納部和另外的收納部在與上述特定之配置不同的配置重疊之時,成為互相抵接。 The substrate case according to claim 6 or 7, wherein the back surface portion is provided adjacent to the locking convex portion and is horizontal When arranging the storage portion, it may be in contact with a part of the highest surface of the surface portion of the other storage portion at a position higher than the lowest surface of the back surface portion and lower than the highest surface of the back surface portion The second abutting portion, a part of the surface portion of the second abutting portion and the other housing portion, when one housing portion and the other housing portion overlap with each other in a configuration different from the specific configuration, become abutting each other . 如請求項6所記載之基板盒,其中上述收納部具備在一個收納部之表面部和另外的收納部之背面部嵌合的複數嵌合部,僅在一個收納部和另外的收納部在上述特定之配置重疊之時,上述複數嵌合部嵌合,並且上述卡止凸部和上述卡止凹部嵌合。 The substrate cassette according to claim 6, wherein the storage section includes a plurality of fitting sections fitted on the surface of one storage section and the back section of another storage section, and only one storage section and another storage section When a specific arrangement overlaps, the plurality of fitting portions are fitted, and the locking convex portion and the locking concave portion are fitted. 如請求項9所記載之基板盒,其中上述複數嵌合部分別具備抵接於另外的收納部之嵌合部的第三抵接部,當在上述另外的配置重疊一個收納部和另外的收納部之時,藉由使上述複數嵌合部之第三抵接部和上述另外的收納部之第三抵接部抵接,使一個收納部和另外的收納部卡合。 The substrate cassette according to claim 9, wherein the plurality of fitting portions each include a third contact portion that abuts the fitting portion of another storage portion, and when one storage portion and another storage are superimposed on the other arrangement At the time of contacting, the third abutting portion of the plurality of fitting portions and the third abutting portion of the other housing portion are brought into contact, so that one housing portion and the other housing portion are engaged. 一種收納部,構成如請求項1所記載之基板盒。 A storage portion constitutes the substrate cassette as described in claim 1. 一種基板搬運器,其特徵在於具備:如請求項1所記載之基板盒;一對板部,其係把持上述基板盒之最上面和最下面;及 帶部,其係在藉由上述一對板部把持上述基板盒之狀態下進行綑束,上述一對板部分別在與各板部之端部中的互相相向之位置,設置有在內側配置上述帶部的缺口部。 A substrate carrier, characterized by comprising: a substrate box as described in claim 1; a pair of plate portions which hold the uppermost and lowermost parts of the substrate box; and The belt portion is bundled in a state where the substrate cassette is gripped by the pair of plate portions, and the pair of plate portions are provided on the inner side at positions opposed to each other at the ends of the plate portions The notch portion of the belt portion.
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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI685050B (en) * 2017-12-26 2020-02-11 日商Sumco股份有限公司 Buffer body for packaging semiconductor wafer storage container
DE202019101794U1 (en) * 2018-06-27 2019-10-09 Murata Machinery, Ltd. Devices for at least one of substrate handling, substrate storage, substrate treatment, and substrate processing
DE202019101793U1 (en) * 2018-06-27 2019-10-09 Murata Machinery, Ltd. Devices for at least one of substrate handling, substrate storage, substrate treatment, and substrate processing
JP6964952B2 (en) * 2020-04-01 2021-11-10 旭テック株式会社 Sheet tray
TWI728922B (en) * 2020-10-07 2021-05-21 頎邦科技股份有限公司 Storage device for flexible circuit packages and carrier thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302272B1 (en) * 1998-11-30 2001-10-16 Nippon Shokubai Co., Ltd Package, packing method and transporting method for brittle sheets
JP2002002695A (en) * 2000-06-15 2002-01-09 Kyocera Corp Substrate storage tray and substrate packaging body using the same
JP2005191419A (en) * 2003-12-26 2005-07-14 Achilles Corp Housing of semiconductor wafer

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0427819Y2 (en) * 1985-03-20 1992-07-03
JPH0817903A (en) 1994-07-01 1996-01-19 Ryoden Semiconductor Syst Eng Kk Board case
JPH08236605A (en) 1995-02-28 1996-09-13 Komatsu Electron Metals Co Ltd Semiconductor wafer case
JP2000226087A (en) * 1998-11-30 2000-08-15 Nippon Shokubai Co Ltd Packaging body of fragile thin plate material and packaging method and transportation method
JP2001148417A (en) 1999-11-22 2001-05-29 Mitsubishi Electric Corp Housing case
JP2002145380A (en) 2000-11-08 2002-05-22 Sony Corp Wafer packing method
JP4999597B2 (en) 2007-08-08 2012-08-15 ミライアル株式会社 Single wafer type wafer case

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6302272B1 (en) * 1998-11-30 2001-10-16 Nippon Shokubai Co., Ltd Package, packing method and transporting method for brittle sheets
JP2002002695A (en) * 2000-06-15 2002-01-09 Kyocera Corp Substrate storage tray and substrate packaging body using the same
JP2005191419A (en) * 2003-12-26 2005-07-14 Achilles Corp Housing of semiconductor wafer

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