^ 1284622 - Μ 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種玻璃基板包裝裝置，特別是關於用於運送 玻璃基板之玻璃基板包裝裝置。 【先前技彳标】 隨著數位科技的發展，液晶顯示產品已廣泛地應用於日常生 活之各個層面中。對於液晶顯示模組而言，玻璃基板所扮演的角 _ 色好比是半導體產業中的晶圓，因此，液晶顯示器產業對玻璃基 • 板的要求近乎完美。 玻璃是一種脆性材料，當受到外力碰撞或是掉落地面時，其 結構很容易破裂以致於不能使用。而在製作液晶顯示面板的過程 中’玻璃基板的運送問題至關重要。在玻璃基板的運送過程中， 其易受化學污染，且當基板之間發生摩擦而產生靜電感應時，玻 璃基板内部的電路會受到破壞。 _ 玻璃基板可以為液晶玻璃基板、電漿顯示用玻璃基板及一般 玻璃基板。現以液晶玻璃基板為例，該液晶玻璃基板的邊緣區域 通常設置有液晶密封口、薄膜電晶體引腳、積體電路晶片及軟性 電路板等重要元件，在液晶玻璃基板運送過程中，需要避免受到 外力撞擊以及相互摩擦造成對上述重要元件的損壞。 先前技術之玻璃基板包裝裝置通常是將玻璃基板放置在包裝 盒中，並由隔板分隔每個玻璃基板以運送。依據玻璃基板包裝盒 材料之不同，可分為下列兩種類型： 6 -1284622 一種玻璃基板包裝盒係採用丙烯腈-丁二稀-苯乙稀 (Acrylonitrile Butadiene Styrene，ABS)及聚氣乙烯（p〇iy Vinyl Chloride, PVC)製成，該種材料之包裝盒本身重量約為5-6公斤，也 同時造成在移動、堆積及輸送的不方便。。 另一種玻璃基板包裝盒係採用發泡倍率為3-30倍之樹脂發泡 材料製成。該包裝盒結構如第一圖所示，該包裝盒;[〇包括一盒體 120及一蓋體110，該盒體120與該蓋體11〇㈤相互嵌套配合，形成 一用以收容玻璃基板之容置空間。在該盒體12〇二相對内表面上設 置有用以支撑玻璃基板之複數溝槽130。運送過程中，將玻璃基板 安裝於盒體120之溝槽130，然後相互配合嵌套該盒體12〇及蓋體 110，當需要把玻璃基板抽出時，使該蓋體110脫離該盒體120，取 出玻璃基板即可。 該包裝盒之盒體120係由樹脂發泡材料所製成，該材料雖具有 緩衝性能佳、重量輕及模具成本稍低的優點，但仍然具有以下缺 點： 首先，該種包裝裝置採用之包裝盒10與該用於運送之玻璃基 板之間直接接觸，所以在運輸過程中，該包裝盒與該玻璃基板 摩擦產生之靜電容易造成對玻璃基板之破壞； 其次，該包裝盒10在製造過程中雖然摻雜抗靜電物質或者導 電性物質，但是隨著該包裝盒職使用時間增加，其抗靜電能力 會下降，使用壽命減短，從而造成包裝盒10的浪費，增加了包裝 7 -1284622 成本； 最後，該種包裝裝置在包裝過程中，玻璃基板係沿著該包裝 盒壁的溝槽設置，作業人員需要一片一片對應該溝槽放置，造成 包裝的不方便。 【發明内容】 有鑒於上述内容，有必要提供一種提高運送過程之安全係 數、成本低且方便包裝之玻璃基板包裝裝翠。 一種玻璃基板包裝裝置包括至少一用於層疊間隔放置玻璃基 板之隔板、一抗靜電膜片及一包裝盒，該抗靜電膜片設置在該隔 板外侧，該隔板及該抗靜電膜片收容於該包裝盒内。 相較於先前技術，本發明之玻璃基板包裝裝置採用一抗靜電膜 片鋪設在該包裝盒内側之方式，藉由該抗靜電膜片將該玻璃基板 與外部包裝物隔離，避免靜電積累對玻璃基板造成損壞；通過更 換該抗靜電膜片之方式延長包裝盒之使用壽命，從而降低包裝成 本；同時作業員不必對應溝槽--插放玻璃基板，只需要層疊間 隔放置，方便包裝。 【實施方式】 請參閱第二圖，係一種較佳實施方式所揭示之玻璃基板包裝 構造分解示意圖。該包裝構造2包括一包裝盒20(參閱第四圖）、一 疊合體21及一抗靜電膜片23。其中該疊合體21包括層疊設置之二 隔板212及一玻璃基板211。該抗靜電膜片23包設在該疊合體21外 8 1284622 側，使得該疊合體21與包裝盒2〇隔離。該包裝盒2〇包括一盒體2〇1 及—蓋體202，該盒體201及該蓋體202相互嵌套配合，並形成一容 置空間，該疊合體21及該抗靜電膜片23收容於該容置空間内。 請參閱第三圖，係第二圖所示之抗靜電膜片23之立體折疊示 意圖。該抗靜電模片23具有四個彎折區域231、一主區域232及彎 折輪廓線233，該主區域232之輪廓與該盒體2013之底部2〇12相匹 配，該彎折部231可以沿彎折輪廓線233自申彎折。經過彎折，可 以使得該彎折部231靠近該疊合體21之側面。 該抗靜電膜片23係採用高密度聚乙烯樹脂材料，採用含有導 電性聚合物或靜電防止性物質摻雜，製得獲得電阻系數為1〇9〜 10 Ω·«η之高抗靜電膜片，其使用壽命約為兩年。 該隔板212輪廓大小與該玻璃基板211之大小基本相匹配，形 狀了以為平板开々或者框形，且該隔板與該玻璃基板2u接觸的 表面具有空氣可流通之凹凸圖案，同時，該隔板212具有一定彈 性，起到緩衝外力作用。 备玻璃基板211與隔板212層疊時，玻璃基板211上的主要受力 區域為，、四週邊緣，為了達到安全運送並有效保護玻璃基板Mi上 重要το件之目的，將框形隔板212與該玻璃基板211依次交叉層疊 放置，最底層與最上層分別放置隔板212。當玻璃基板211尺寸較 大時’考慮其本身強度需要，採用平板形隔板212，以支撐該基板 211。且該隔板212與該玻璃基板211接觸的表面具有凹凸圖案之設 -1284622 計可避免空紐積齡賴紐211·^無法排除，醋成霧化現 象，甚至破碎。 該隔板212係由一種具較高抗靜電特性之高密度聚乙烯材質 壓模成型製得，其中該高密度聚乙烯(HDPE，（C^A)是以聚乙烯 原料裂解而成，不具毒性，不會危害搬運人員健康；具有較高耐 腐蝕性能，不會對玻璃基板211造成損害；且質輕，密度為〇·955 kg/cm3 ’易於搬運。而且，與先前技術相比，採用高密度聚乙烯材 料取代ABS樹酯或者聚氣乙烯材料，可保持玻璃基板211之潔淨 度。 考慮運送過程中貨櫃之重量及搬運方便性，通常將十片至三 十片玻璃基板211配合隔板212層疊設置為一疊合體21。該疊合體 21之疊合方式還有如下情況： 如果玻璃基板211之數量為n(n>2)片，則隔板數量可以為n+1 片為佳。 當該疊合體21收容於該包裝盒2〇時，該疊合體21之位於最上 層及最下層之隔板212抵接於該包裝盒20之蓋體2〇2之頂部内表面 及盒體201之底部内表面。 在該包裝盒20盒體201内表面鋪設有一抗靜電膜片23 ,並使得 該疊合體21與該盒體201内表面隔離。 該包裝盒20之盒體201係一有底盒體，該盒體2〇1包括四個内 侧壁2011、一底部2012及四個外侧壁2013。該内側壁2〇11及該外 1284622 側壁2013均垂直於該底部2012，該外侧壁2013首尾依次連接，且 配合該底部2012圍成一矩形無蓋收容空間，該内侧壁2011與該外 側壁2013係一體成型，並高於該外側壁2013。在二相鄰内側壁2021 内側交匯處，分別設置有四個凹槽2014。 該蓋體202係一有頂蓋體，該蓋體202具有一與該盒體201内側 壁2011相對應之内侧壁2021，一頂部2022及外側壁2023。同樣該 蓋體202之内侧壁2011及其外側壁2023均垂直於該頂部2022，該外 側壁2023首尾依次連接，且配合該頂部2022圍成一矩形無底收容 空間。該内侧壁2021與該外側壁2023係一體，且該内侧壁2021低 於該外侧壁2023。在二相鄰内側壁2021内侧交匯處，同樣分別設 置有四個凹槽2014。 再請參閱第四圖，係第二圖所示之包裝構造包裝後之立體示 意圖。藉由該凸沿2011及該凹槽2021使得該盒體201與該蓋體202 > 相互配合嵌套，並形成一用以收容該疊合體21之容置空間。在該 包裝盒20外表面，有兩條連續束槽205分佈於該盒體201及該蓋體 202對應位置，其用來容納二束帶204。在遠距離運送時，還可以 增加二束帶204，將該二束帶204設置在該包裝盒20外表面之該束 槽205内用來進一步束裝該包裝盒20。 該盒體201係採用樹脂發泡材料構成，如作為聚烯烴系發泡體 之高密度聚乙烯、聚丙烯、低密度聚乙烯、乙烯-乙酸乙烯g旨共聚 合物等。樹脂發泡材料係使含有發泡劑之聚烯烴系小球或其一次 11 1284622 發泡體填充於模具内，以一定溫度加熱而製造，其發泡倍率控制 在3〜30倍。該發泡方法可以採用低壓發泡法，所以可以使用低成 本之鋁型模具。樹脂發泡材料所形成之各部份厚度，根據強度需 求’以15〜適當。 該盒體201係採用含有導電性聚合物或抗靜電性物質摻雜發 泡之方法，獲得電阻系數為1〇3〜1〇12Ω·αη之樹脂發泡材料，使得 玻璃基板211不會因產生之靜電而破壞玻璃、基板211内部之電路。 由於包裝盒20之抗靜電性能隨著使用時間的增長而逐漸下 降，其中摻雜的消耗性抗靜電物質，使用年限平均為一年。通常 情況下，包裝盒20失去抗靜電性能將不再使用，導致物料損耗較 大’成本增加。增加抗靜電膜片23與包裝盒20内，以保證包裝盒 20之抗靜電性能可以延長三年以上，有效減少包材重複購置成 本。還可以抽換更新失去抗靜電性能之抗靜電膜片23，不必因為 包裝盒20本身抗靜電能力下降而不可使用，進一步節約成本。 採用該包裝盒20包裝該玻璃基板211之步驟為： 首先’提供一包裝盒盒體201，其底部2012内表面上鋪設一抗 靜電膜片22; 然後’將該隔板212及該玻璃基板212交叉層疊放置獲得一疊 合體21 ’其中該疊合體21之最上層為隔板212層； 最後’將蓋體202蓋合於該盒體201上，並使得該疊合體21之 最上層隔板22抵接於該蓋體2〇2頂部内表面。當玻璃基板211不滿 12 !284622 一包裝盒20時，通過填加其他填充物補充來避免包裝盒如之鬆動。 由於在盒體201内增加抗靜電膜片23，隔離盒體2〇1與疊合體 21，避免包裝盒20產生之粉塵碎屑影響玻璃基板211。 再請參閱第五圖，係本發明另—種較佳實施方式所揭示之玻 璃基板包裝構造分解示意圖。在該實施方式中，該包裝構造^之主 要結構與上-實施方式所揭示之包裝構造2不同之處在於：在本實 • 施方式所揭示之包賴造3中，該包裝盒300表面設置有複數凹 •凸結構，以緩衝外力引起的衝擊，避免應力集中。 該盒體301囉具有—底部·及四健直於底·12之内 1 則壁3011及外側壁3〇13，該外側壁·首尾依次相連，配合該底 43012構成-細;無蓋收容空間，該内側壁3⑽與該外側壁3犯 $體，其中該盒體3〇1底部3〇12内表面設置有複數凹凸結構，在 每二相鄰内侧壁3011交匯處，分別設置有四個凹槽3014。 • 肖蓋體3G2同樣具有—頂部迎2及四倾直於頂部3022之外 侧壁3023該外側壁3〇23依次首尾相連，配合該底部迎2構成一 矩开/無頂收谷空間，在該頂部3022内表面也同樣設置有複數凹凸 結構。 、該叹置於該包裝盒3〇頂部SOU及底部遍2内表面之凹凸結構 為高出内表面或者凹陷人内表面之具彈性結構 ，該複數凹凸結構 係與該包裝盒30— 其圖案可以為條狀 體成型。該凹凸結構厚度在〇·5〜lmm為適當。 、弧狀等。該種結構可以有效緩衝在外力衝擊 13 1284622 時’強力衝擊玻璃基板311 ’更可以避免包裝盒3〇撞擊時，引起的 應力集中，有效保護玻璃基板311。其角落之凹槽3014可以避免玻 璃基板311之稜角與側壁3013摩擦受損。 此時，玻璃基板311和隔板312可以採用如第六圖所示之疊合 體3Γ結構。該疊合體3Γ包括層疊設置之玻璃基板311及一隔板 312。 同樣考慮該疊合體3Γ在運送過程中肯櫃之重量及搬運方便 性’通常將十片至三十片玻璃基板311配合隔板312層疊設置而 成。該疊合體3Γ之疊合方式還有如下情況： 如果玻璃基板311之數量為n(n>2)片，則隔板數量可以為η—1 片為佳。 該種結構之疊合體3Γ可以減少隔板312之數量，如第七圖所 示，係包裝盒包裝該疊合體3Γ之立體組裝示意圖在該包裝盒30之 蓋體302與盒體301嵌套配合時，由於隔板312數量減少，可以降低 包裝盒30整體厚度，有利於搬運；在不減少包裝盒30之整體厚度 的情況下，可以增加玻璃基板數量，即每一包裝盒30在包裝玻璃 基板的數量上增加。在遠距離運輸時，同樣可以採用束帶304設置 在束槽305内，進一步保護疊合體31。 請一併參閱第八圖、第九圖，其中第八圖係再一較佳實施方 式所揭示之玻璃基板包裝構造分解示意圖，第九圖係第八圖所揭 示之盒體401另一角度立體示意圖。該包裝裝置4包括二疊合體 14 1284622 41 ’二抗靜電膜片43、一蓋體402以及二盒體401。該抗靜電膜片 43設置在該疊合體41外側。其中該包裝盒4〇與上一實施方式不同 之處在於··該盒體4〇1底部4012外表面設置有一凹陷部4014，該凹 陷部4014與其内側壁4011高出外側壁4013部份對應，在盒體4〇1底 部4012内表面及蓋體402頂部4022内表面同樣設置有複數具彈性 之凹凸結構，該複數凹凸結構與該包裝盒40—體成型。當二盒體 401層疊時，每一盒體401内表面鋪設有一疼靜電膜片43，上層盒 體401之底部4012外表面之凹陷部4014與下層盒體4〇1内侧壁4011 之南出部份相互嵌套配合，同時形成二容置空間，每一容置空間 收容一疊合體41及一抗靜電膜片43。 再請參閱第十圖，係第八圖所示之包裝盒4〇包裝玻璃基板411 後之立體組裝示意圖。當包裝錢組裝完錢，包裝盒辦表還 可以增加二束帶404沿其上之束槽4〇5進一步束缚該包裝盒4〇，便 於搬運及運送。 該實施方式可以同時運送多片玻璃基板411，方便大量玻璃基 板411運送。 综上所述，本發明符合發明專利要件，爰依法提出專利申請。 惟，以上所述者僅為本發明之較佳實施方式，舉凡熟悉本案技藝 之人士，在援依本案發明精神所作之等效修飾或變化，皆應包含 於以下之申請專利範圍内。 15 1284622 【圖式簡單說明】 第一圖係一種先前技術之玻璃基板包裝盒立體示意圖。 第一圖係本發明一種較佳實施方式所揭示之玻璃基板包裝構造分 解示意圖。 第二圖係本發明第二圖所示之抗靜電膜片立體折疊示意圖。 第四圖係本發明第二圖所示之包裝盒包裝後之立體組裝示意周。 第五圖係本發明另一種較佳實施方式所揭示之玻璃基板包裝構造 分解示意圖。 第六圖係本發明第二圖所示之疊合體另一結構分解示意圖。 第七圖係本發明第五圖所示包裝盒包裝後之立體組裝示意圖。 第八圖係本發明再一種較佳實施方式所揭示之玻璃基板包裝構造 分解示意圖。 第九圖係本發明第八圖所示盒體之另一角度立體示意圖。 第十圖係本發明第八圖所示之包裝盒包裝後之立體組裝示意圖。 【主要元件符號說明】 巴哀衮置2、3、4 束帶 204、304、404 包裝盒 20、30、40 束槽 205、305、405 盒體 201、301、401 疊合體 2 卜 31、31，、41 内側壁 2011、3011、4011 玻璃基板 211 ^ 311 ^ 411 底部 2012、3012、4012 隔板 212、312、412 凹槽 2014 > 3014 抗靜電膜片 23、43 凹陷部 4021 彎折區域 231 16 1284622 蓋體 202、302、402 主區域 232 頂部 2022、3022、4022 外輪廓線 233 外側壁 2013、2023、3013、3023、4013BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate packaging apparatus, and more particularly to a glass substrate packaging apparatus for transporting a glass substrate. [Previous technical standards] With the development of digital technology, liquid crystal display products have been widely used in all aspects of daily life. For the liquid crystal display module, the angle of the glass substrate is similar to that of the semiconductor industry. Therefore, the requirements of the liquid crystal display industry for the glass substrate are almost perfect. Glass is a brittle material that is easily broken when it is hit by an external force or dropped to the ground so that it cannot be used. In the process of fabricating a liquid crystal display panel, the problem of transporting the glass substrate is crucial. During the transportation of the glass substrate, it is susceptible to chemical contamination, and when friction occurs between the substrates to cause electrostatic induction, the circuit inside the glass substrate is damaged. _ The glass substrate may be a liquid crystal glass substrate, a glass substrate for plasma display, or a general glass substrate. Taking a liquid crystal glass substrate as an example, the edge region of the liquid crystal glass substrate is usually provided with important components such as a liquid crystal sealing port, a thin film transistor pin, an integrated circuit chip, and a flexible circuit board. In the process of transporting the liquid crystal glass substrate, it is necessary to avoid Damage to the above important components caused by external impact and mutual friction. Prior art glass substrate packaging devices typically place a glass substrate in a package and separate each glass substrate for transport by a separator. According to the material of the glass substrate packaging box, it can be divided into the following two types: 6 -1284622 A glass substrate packaging box is made of Acrylonitrile Butadiene Styrene (ABS) and polyethylene gas (p). Made of 〇iy Vinyl Chloride, PVC), the box itself has a weight of about 5-6 kg, which also causes inconvenience in moving, stacking and conveying. . Another glass substrate package is made of a resin foaming material having a foaming ratio of 3 to 30 times. The package structure is as shown in the first figure, the package; [〇 includes a box body 120 and a cover body 110, and the box body 120 and the cover body 11(5) are nested and nested to form a glass for receiving the glass. The housing space of the substrate. A plurality of grooves 130 for supporting the glass substrate are disposed on the opposite inner surfaces of the casing 12. During the transportation process, the glass substrate is mounted on the groove 130 of the casing 120, and then the casing 12 and the cover 110 are nested with each other. When the glass substrate needs to be taken out, the cover 110 is separated from the casing 120. Take out the glass substrate. The box body 120 of the packaging box is made of a resin foaming material, which has the advantages of good cushioning performance, light weight and slightly lower mold cost, but still has the following disadvantages: First, the packaging device of the packaging device is used. The box 10 is in direct contact with the glass substrate for transporting, so the static electricity generated by the friction between the package and the glass substrate during transportation is likely to cause damage to the glass substrate; secondly, the package 10 is in the manufacturing process. Although doped with antistatic substance or conductive substance, as the use time of the package is increased, the antistatic ability is lowered, and the service life is shortened, thereby causing waste of the package 10 and increasing the cost of the package 7-1284622; Finally, in the packaging process, the glass substrate is disposed along the groove of the wall of the package, and the operator needs to place a piece of the corresponding groove to make the packaging inconvenient. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a glass substrate package for improving the safety factor of the transportation process, low cost, and convenient packaging. A glass substrate packaging device includes at least one separator for laminating a glass substrate, an antistatic film, and a package, the antistatic film is disposed outside the separator, the separator and the antistatic film Contained in the box. Compared with the prior art, the glass substrate packaging device of the present invention adopts an antistatic film on the inner side of the package, and the glass substrate is separated from the outer package by the antistatic film to prevent static electricity from accumulating on the glass. The substrate is damaged; the service life of the package is extended by replacing the antistatic film, thereby reducing the packaging cost; at the same time, the operator does not have to correspond to the groove--the glass substrate is inserted, and only needs to be stacked at intervals to facilitate packaging. [Embodiment] Please refer to the second drawing, which is a schematic exploded view of a glass substrate package structure disclosed in a preferred embodiment. The package construction 2 includes a package 20 (see the fourth figure), a laminate 21 and an antistatic film 23. The stacked body 21 includes two separators 212 and a glass substrate 211 which are stacked. The antistatic film 23 is disposed on the outer side of the laminated body 21 on the side of 8 1284622, so that the laminated body 21 is isolated from the package 2 . The package 2 includes a box body 2〇1 and a cover body 202. The box body 201 and the cover body 202 are nested and nested with each other to form an accommodation space. The stack body 21 and the antistatic film sheet 23 are formed. It is housed in the accommodating space. Please refer to the third figure, which is a perspective view of the anti-static film 23 shown in the second figure. The antistatic die 23 has four bending regions 231, a main region 232 and a bending contour 233. The contour of the main region 232 matches the bottom 2〇12 of the casing 2013. The bending portion 231 can be It is bent along the bending contour 233. After bending, the bent portion 231 can be brought close to the side of the laminated body 21. The antistatic film 23 is made of a high-density polyethylene resin material and is doped with a conductive polymer or an antistatic substance to obtain a high antistatic film having a resistivity of 1〇9~10 Ω·«η. Its service life is about two years. The shape of the spacer 212 is substantially matched with the size of the glass substrate 211, and is shaped like a flat plate or a frame, and the surface of the spacer contacting the glass substrate 2u has an air permeable concave and convex pattern. The partition 212 has a certain elasticity and functions as a buffer external force. When the glass substrate 211 and the separator 212 are stacked, the main force-receiving area on the glass substrate 211 is the peripheral edge, and the frame-shaped separator 212 is used for the purpose of safely transporting and effectively protecting the important elements on the glass substrate Mi. The glass substrate 211 is stacked in this order, and the separator 212 is placed on the bottommost layer and the uppermost layer, respectively. When the size of the glass substrate 211 is large, the flat plate spacer 212 is used to support the substrate 211 in consideration of its own strength. Moreover, the surface of the separator 212 that is in contact with the glass substrate 211 has a concave-convex pattern. -1284622 can avoid the empty vacancy, and the vinegar can be atomized and even broken. The separator 212 is formed by compression molding of a high-density polyethylene material having high antistatic property, wherein the high-density polyethylene (HDPE, (C^A) is formed by cracking a polyethylene raw material, and is not toxic. It does not endanger the health of the carrier; it has high corrosion resistance and does not cause damage to the glass substrate 211; and it is light in weight and has a density of 955·955 kg/cm3 'easy to handle. Moreover, compared with the prior art, it is high. The density polyethylene material replaces the ABS resin or the polyethylene gas material to maintain the cleanliness of the glass substrate 211. Considering the weight of the container during transportation and the ease of handling, ten to thirty glass substrates 211 are usually matched with the separator 212. The laminate is arranged as a laminate 21. The superposition of the laminate 21 is also as follows: If the number of the glass substrates 211 is n (n > 2) sheets, the number of separators may preferably be n + 1 sheets. When the stacked body 21 is received in the package 2, the upper and lowermost partitions 212 of the stacked body 21 abut against the top inner surface of the cover 2〇2 of the package 20 and the casing 201. Bottom inner surface. 20 boxes in the box An antistatic film 23 is disposed on the inner surface of the 201, and the laminated body 21 is separated from the inner surface of the casing 201. The casing 201 of the package 20 is a bottomed casing, and the casing 2〇1 includes four The inner side wall 2011, the bottom part 2012 and the four outer side walls 2013. The inner side wall 2〇11 and the outer side 1284622 side wall 2013 are perpendicular to the bottom part 2012, and the outer side wall 2013 is connected end to end in sequence, and fits the bottom part 2012 to form a rectangle The inner side wall 2011 is integrally formed with the outer side wall 2013 and is higher than the outer side wall 2013. At the intersection of the inner sides of the two adjacent inner side walls 2021, four recesses 2014 are respectively provided. The cover body 202 is provided. The cover body 202 has an inner side wall 2021 corresponding to the inner side wall 2011 of the box body 201, a top portion 2022 and an outer side wall 2023. The inner side wall 2011 and the outer side wall 2023 of the cover body 202 are also the same. Vertically adjacent to the top portion 2022, the outer side wall 2023 is connected end to end, and a rectangular bottomless receiving space is formed in cooperation with the top portion 2022. The inner side wall 2021 is integrally formed with the outer side wall 2023, and the inner side wall 2021 is lower than the outer side wall. 2023. On two adjacent inner sidewalls 202 1 inside intersection, also provided with four grooves 2014. Please refer to the fourth figure, which is a perspective view of the packaging structure shown in the second figure. The convex edge 2011 and the groove 2021 make the The box body 201 and the cover body 202 > are nested with each other, and form an accommodation space for accommodating the stacked body 21. On the outer surface of the package 20, two continuous beam grooves 205 are distributed in the box body. 201 and the corresponding position of the cover 202 are used to accommodate the two straps 204. When transported over long distances, a second strap 204 can also be added, which is placed in the collar 205 on the outer surface of the package 20 for further loading of the package 20. The casing 201 is made of a resin foamed material, such as a high-density polyethylene, a polypropylene, a low-density polyethylene, or an ethylene-vinyl acetate-g copolymer which is a polyolefin-based foam. The resin foaming material is obtained by filling a polyolefin-based pellet containing a foaming agent or a foam of the first 11 1284622 in a mold and heating it at a constant temperature, and the expansion ratio is controlled to be 3 to 30 times. The foaming method can employ a low pressure foaming method, so that a low cost aluminum mold can be used. The thickness of each portion formed by the resin foamed material is suitably 15% depending on the strength requirement. The case 201 is made of a conductive polymer or an antistatic substance doped and foamed, and a resin foamed material having a resistivity of 1〇3 to 1〇12Ω·αη is obtained, so that the glass substrate 211 is not generated. The static electricity destroys the circuit inside the glass or the substrate 211. Since the antistatic property of the package 20 gradually decreases as the use time increases, the consumption of the antistatic substance doped is on average for one year. Normally, the loss of antistatic properties of the package 20 will no longer be used, resulting in a large material loss, which increases the cost. The antistatic film 23 and the inside of the package 20 are added to ensure that the antistatic performance of the package 20 can be extended for more than three years, thereby effectively reducing the repeated purchase cost of the package. It is also possible to replace the antistatic film 23 which has lost the antistatic property, and it is not necessary to use it because the antistatic property of the package 20 itself is lowered, thereby further saving cost. The step of packaging the glass substrate 211 by using the package 20 is as follows: First, a package box 201 is provided, and an antistatic film 22 is laid on the inner surface of the bottom portion 2012; then the spacer 212 and the glass substrate 212 are disposed. Cross-stacking to obtain a laminated body 21' wherein the uppermost layer of the laminated body 21 is a layer of the separator 212; finally, the cover body 202 is covered on the casing 201, and the uppermost partition 22 of the laminated body 21 is made. It abuts against the inner surface of the top of the cover 2〇2. When the glass substrate 211 is not full of 12!284622 a package 20, it is supplemented by adding other fillers to prevent the package from being loose. Since the antistatic film 23 is added to the casing 201, the casing 2〇1 and the laminated body 21 are separated, and dust particles generated by the packaging 20 are prevented from affecting the glass substrate 211. Referring to FIG. 5 again, it is a schematic exploded view of the packaging structure of the glass substrate disclosed in another preferred embodiment of the present invention. In this embodiment, the main structure of the package structure is different from the package structure 2 disclosed in the above embodiment: in the package 3 disclosed in the embodiment, the surface of the package 300 is set. There are a plurality of concave and convex structures to cushion the impact caused by external forces and avoid stress concentration. The casing 301 has a bottom portion and a fourth wall 3011 and an outer side wall 3〇13 which are connected to the bottom and the bottom end. The outer side wall is connected in series with the first end and the bottom portion. The inner side wall 3 (10) and the outer side wall 3 are made of a body, wherein the inner surface of the bottom portion 3〇12 of the box body 3〇1 is provided with a plurality of concave and convex structures, and at the intersection of each two adjacent inner side walls 3011, four grooves 3014 are respectively provided. . • The slid cover 3G2 also has a top welcoming 2 and a 4 slanting to the top 3022 of the outer side wall 3023. The outer side wall 3 〇 23 is connected end to end in sequence, and the bottom welcoming 2 constitutes an open/no-top trough space. The inner surface of the top portion 3022 is also provided with a plurality of concave and convex structures. The embossed embossed on the inner surface of the top SOU and the bottom ridge 2 of the packaging box 3 is an elastic structure higher than the inner surface or the inner surface of the recessed person, and the plurality of concave and convex structures are associated with the package 30 - the pattern can be Formed for strips. The thickness of the uneven structure is suitably 〇·5 to 1 mm. , arc, etc. This kind of structure can effectively cushion the impact of the external force impact 13 1284622 on the 'strong impact glass substrate 311', and can avoid the stress concentration caused by the impact of the package 3 ,, and effectively protect the glass substrate 311. The corner groove 3014 prevents the edge of the glass substrate 311 from being damaged by the friction of the side wall 3013. At this time, the glass substrate 311 and the spacer 312 may have a laminated structure as shown in Fig. 6. The stacked body 3 includes a laminated glass substrate 311 and a separator 312. It is also considered that the weight and handling convenience of the laminated body 3 during transportation are generally carried out by laminating ten to thirty glass substrates 311 with the separator 312. The superimposing manner of the stacked body 3 is also as follows: If the number of the glass substrates 311 is n (n > 2) sheets, the number of separators may preferably be η -1 sheets. The stacked body 3 of the structure can reduce the number of the partitions 312. As shown in the seventh figure, the three-dimensional assembly diagram of the package 3 is assembled in the cover 302 of the package 30 and the casing 301 is nested. When the number of the partition plates 312 is reduced, the overall thickness of the package 30 can be reduced to facilitate handling; without reducing the overall thickness of the package 30, the number of glass substrates can be increased, that is, each package 30 is on the packaging glass substrate. The number has increased. In the case of long-distance transportation, the band 304 can also be disposed in the beam groove 305 to further protect the laminated body 31. Please refer to FIG. 8 and FIG. 9 together, wherein the eighth figure is a schematic exploded view of the glass substrate packaging structure disclosed in the further preferred embodiment, and the ninth figure is the third embodiment of the box body 401 disclosed by the eighth figure. schematic diagram. The packaging device 4 comprises a two-layered body 14 1284622 41 'two anti-static film 43 , a cover 402 and two boxes 401 . The antistatic film 43 is disposed outside the stacked body 41. The box 4 is different from the previous embodiment in that the outer surface of the bottom portion 4012 of the box body 412 is provided with a recess portion 4014 corresponding to the inner side wall 4011 of the inner side wall 4011. The inner surface of the bottom portion 4012 of the casing 4〇1 and the inner surface of the top portion 4022 of the lid 402 are also provided with a plurality of elastic concave-convex structures integrally formed with the package 40. When the two casings 401 are stacked, a surface of the inner surface of each of the casings 401 is provided with a painful electrostatic film 43, a recessed portion 4014 of the outer surface of the bottom portion 4012 of the upper casing 401 and a south portion of the inner side wall 4011 of the lower casing 4〇1. The plurality of accommodating spaces are formed in the nesting space, and each of the accommodating spaces accommodates a stack 41 and an antistatic film 43. Referring to the tenth figure, it is a three-dimensional assembly diagram of the packaging box 4 401 after packaging the glass substrate 411 shown in the eighth figure. When the packaged money is assembled, the package can also be further loaded with the second belt 404 along the groove 4〇5 to further secure the package 4〇 for handling and transportation. This embodiment can transport a plurality of glass substrates 411 at the same time, facilitating the transportation of a large number of glass substrates 411. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims. 15 1284622 [Simple description of the drawings] The first figure is a perspective view of a prior art glass substrate package. The first figure is a schematic diagram of the decomposition of the glass substrate packaging structure disclosed in a preferred embodiment of the present invention. The second figure is a schematic view of the three-dimensional folding of the antistatic film shown in the second figure of the present invention. The fourth figure is a three-dimensional assembly schematic week after packaging of the package shown in the second figure of the present invention. Fig. 5 is an exploded perspective view showing the packaging structure of a glass substrate disclosed in another preferred embodiment of the present invention. Fig. 6 is a schematic exploded view showing another structure of the laminate shown in Fig. 2 of the present invention. The seventh figure is a three-dimensional assembly diagram of the package shown in the fifth figure of the present invention. The eighth drawing is an exploded perspective view of a glass substrate packaging structure disclosed in still another preferred embodiment of the present invention. Figure 9 is a perspective view showing another angle of the casing shown in Figure 8 of the present invention. The tenth figure is a three-dimensional assembly diagram of the package shown in the eighth figure of the present invention. [Description of main components] Baah's placement 2, 3, 4 straps 204, 304, 404 Box 20, 30, 40 Beam grooves 205, 305, 405 Box 201, 301, 401 Stack 2 Bu 31, 31 , 41 inner side wall 2011, 3011, 4011 glass substrate 211 ^ 311 ^ 411 bottom 2012, 3012, 4012 partition 212, 312, 412 groove 2014 > 3014 antistatic film 23, 43 recess 4021 bending area 231 16 1284622 Cover 202, 302, 402 Main area 232 Top 2022, 3022, 4022 Outer contour 233 Outer sidewalls 2013, 2023, 3013, 3023, 4013
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