TWI685050B - Buffer body for packaging semiconductor wafer storage container - Google Patents

Abstract

The present invention provides a cushioning body for packaging that can prevent damage to a bag of a storage container for packaging semiconductor wafers. When the box-shaped storage container 3 for storing the semiconductor wafer W packaged in the flexible bag 4 is packed in the packing box 5, the first buffer body 1 and the upper surface of the storage container in the packaged state, The inner surface of the upper plate 51 of the packing box and the inner surface of the side plate 52 of the packing box are in contact with and interposed therebetween, and have a first surface 11 that contacts the inner surface of the upper plate of the packing box. A second surface 12 that is in contact with the upper surface of the storage container in a bag-packed state and a third surface 13 that is in contact with the inner surface of the side plate of the packing box are formed on the second surface There is a first recess 121 fitted into the rectangular upper surface portion of the storage container in a state including a bag, and outwardly directed recesses 122 are formed at the four corners of the first recess.

Description

Buffer body for packaging semiconductor wafer storage container

The invention relates to a buffer body for packaging a semiconductor wafer storage container.

When transporting semiconductor wafers produced in a semiconductor wafer production plant to a component production plant, etc., multiple wafers are placed in a wafer container, and the wafer container is further placed in a corrugated cardboard box, etc. In transit. In this case, a buffer body for packing is provided between the storage container of the wafer and the corrugated cardboard box so as not to adversely affect the semiconductor wafer due to impact during transportation.

As such a buffer body, there is known a buffer body of a wafer container which is arranged between the outer packaging box and the wafer container when a wafer container containing a plurality of semiconductor wafers is stored in the outer packaging box A group of foam resin cushions above and below the room, the buffer protrusions that will contact the bottom and top of the outer packaging box in the outer packaging box are protrudingly provided on the set of foam resin cushioning bodies On the base portion, the buffer protrusion is formed into a closed ring shape, and a protrusion portion supporting the wafer container is provided on the base portion of a group of foamed resin buffer bodies, and the buffer protrusion is located on the protrusion portion with its center line Center line configuration (Patent Literature 1). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent No. 4193472

[Problems to be Solved by the Invention] However, when the wafer container shown in the prior art is stored in an outer packaging box, in order to maintain the antistatic of the wafer container or the cleanliness of the wafer, sometimes the A laminated bag formed by laminating aluminum foil and a resin film packages a wafer container, and is stored in an outer packaging box in this state. This kind of laminated bag is not tightly attached to the wafer container, but has a certain degree of surplus for packaging. Therefore, the size of the recessed portion of the cushion body is set to a size considering the thickness of the laminated bag.

However, since the wafer container has a box shape, if the buffer body is to be forcibly inserted, there is a problem that stress is concentrated on the remaining portions of the four corners of the laminated bag, and the laminated bag is damaged or broken. On the contrary, in order to prevent damage or breakage of the remaining part of the laminated bag, if the entire size of the recessed portion of the buffer body is taken into consideration of the thickness of the laminated bag and the wide size of the remaining part, the wafer container may be damaged. Keep this other issue firmly.

The problem to be solved by the present invention is to provide a cushioning body for packaging which can prevent the breakage of the bag of the storage container for packaging semiconductor wafers. [Technical means to solve the problem]

The present invention solves the above-mentioned problem by a buffer body for packing semiconductor wafer storage containers, which is used for packaging semiconductor wafers packed in flexible bags When the box-shaped storage container is packed in the packaging box, a buffer body arranged between the storage container in the state of being packed in the bag and the packaging box includes: a first buffer body and The upper surface of the storage container in the bag-packed state, the inner surface of the upper plate of the packing box, and the inner surface of the side plate of the packing box are in contact and interposed therebetween; the first buffer body It has: a first surface that is in contact with the inner surface of the upper plate of the packing box, and a second surface that is in contact with the upper surface of the storage container in the state of being packed in the bag as the back surface side of the first surface, And a third surface that is in contact with the inner surface of the side plate of the packing box, and the second surface is formed with a rectangular upper surface portion fitted to the storage container in a state including the bag The first concave portion is formed with a concave portion facing outward at four corners of the first concave portion.

In the present invention, it is more preferable that the chamfered portion is formed within a predetermined range of the four corners of the first recessed portion including the recessed portion.

In the present invention, it is more preferable that the upper plate of the packing box includes an outer flap and a pair of inner flaps, and the total length of the pair of inner flaps in the direction of the flap is formed It is shorter than the length of the edge of the outer swing cover, and the first surface of the first buffer body has: a base portion with a flat main surface; a first convex portion protruding from the base portion, when the The pair of inner rocker covers is not in contact with the inner rocker cover but is in contact with the inner surface of the outer rocker cover when folded; and a second convex portion protruding from the base portion when the pair of inner rocker covers is shaken When the cover is folded, it contacts with the inner surfaces of the front ends of the pair of inner swing covers, respectively.

In the present invention, it is more preferable that the first surface of the first cushion body further includes: a third convex portion protruding from the base portion, and folded when the pair of inner rocker covers are folded Inner surfaces other than the front end of the rocker cover are in contact; the protrusion height of the second convex portion from the base portion and the protrusion height of the third convex portion from the base portion are formed at the same height, and the The protrusion height of the first convex portion from the base portion is formed to be higher than the protrusion height of the second convex portion and the third convex portion from the base portion by only the thickness of the inner swing cover.

In the present invention, it may also be a buffer body for packaging a semiconductor wafer storage container, which further includes a second buffer body, the bottom surface of the storage container in the state of being packed in the bag, and the packaging The inner surface of the bottom plate of the box and the inner surface of the side plate of the packing box are in contact with and interposed therebetween; the second buffer body has: a second piece that contacts the inner surface of the bottom plate of the packing box One side, a second side which is in contact with the bottom surface of the storage container packaged in the bag, and a third side which is in contact with the inner surface of the side plate of the packing box, which is the back side of the first surface, Second recesses are formed on the second surface and fitted into the rectangular bottom portion of the storage container in a state including the bag, and inclined surfaces are formed at four corners of the second recess . [Effect of invention]

If the first concave portion of the first buffer body is to be fitted into the upper surface of the box-shaped storage container for storing semiconductor wafers packed in a flexible bag, the remaining portion of the bag is collected on the storage container The tendency of at least any one of the four corners of the surface portion. However, according to the cushioning body of the present invention, since the four recessed portions of the first recessed portion of the first cushioning body are formed toward the outside, the remaining portion of the bag is accommodated in the recessed portion, and the stress concentration is relaxed. By this, the bag is prevented from being damaged or broken.

Hereinafter, an embodiment of the present invention will be described based on the drawings. FIG. 1 is a perspective view showing an embodiment of a packing method using a buffer body of the present invention, and FIG. 2 is a cross-sectional view showing a packing state of FIG. 1. As shown in FIGS. 1 and 2, the buffer body of the present embodiment includes a first buffer body 1 and a second buffer body 2. When the semiconductor wafer W is housed in a box-shaped storage packaged in a flexible laminated bag 4, When the container 3 (refer to FIG. 5) is packed in the packing box 5, it is arranged between the storage container 4 and the packing box 5 in the state of being packed with the laminated bag 4. Moreover, as shown in the packed state of FIG. 2, the first buffer body 1 is disposed between the upper surface 33 of the storage container 4 in the state of being packed in the laminated bag 4 and the upper plate 51 of the packing box 5, and the second buffer The body 2 is arranged between the bottom surface 34 of the storage container 4 and the bottom plate 53 of the packing box 5 packed in the laminated bag 4. As a result, the vibration or impact applied to the packing box 5 during transportation is absorbed by the first buffer body 1 and the second buffer body 2, which can prevent adverse effects on the semiconductor wafer W.

5 is a perspective view showing an example of a storage container 3 of a semiconductor wafer. The configuration of the storage container 3 of the semiconductor wafer to which the buffer body of the present invention is applied is not particularly limited, but for the storage container 3 commonly used, for example, a front opening shipping box (FOSB) The outline configuration will be described. The storage container 3 shown in FIG. 5 includes: a box-shaped body 31 having an upper surface 33 opening and having a bottom surface 34 and four side surfaces 35; and a cover 32 blocking the opening of the upper surface 33. Leg portions 36 are provided at the four corners of the bottom surface 34, respectively. In addition, the posture of the storage container 3 shown in FIG. 5 is the posture when it is packed in the packing box 5, which is referred to as the upper surface 33, the bottom surface 34, and the side surface 35 in this meaning, but when it is used in a component production factory, etc. When the storage container 3 is used in many cases, it is mostly used in such a manner that by turning 90° with respect to the posture shown in FIG. 5, any one of the side surfaces 35 becomes the bottom surface, and the upper surface 33 provided with the cover 32 becomes the side surface, and by The lid 32 is opened/closed to access the semiconductor wafer W. In the description, the scope of the patent application, and the drawings of this application, the postures shown in FIGS. 1, 2, and 5 are referred to as the upper surface, the bottom surface, and the side surfaces as a reference.

The laminated bag 4 of the packaging storage container 3 shown in FIG. 1 is, for example, a flexible bag body formed by stacking resin films such as polyethylene or polypropylene on both sides or one side of an aluminum foil, and placed in the storage container 3 After that, the opening is folded as shown in FIG. 1, thereby packaging the storage container 3. Instead of being tightly sealed to the storage container 3 like vacuum packaging for sealing, it is packaged with some degree of surplus to the storage container 3 to maintain the antistatic of the storage container 3 or the cleanness of the semiconductor wafer W Sex.

The packing box 5 is a corrugated cardboard box or a plastic box, and has an upper plate 51, four side plates 52, and a bottom plate 53. On each of the upper plate 51 and the bottom plate 53, an outer swing cover 511, an outer swing cover 511 and an outer swing cover 531, an outer swing cover 531, and a A pair of inner rocking cover 512, inner rocking cover 512 and inner rocking cover 532, inner rocking cover 532 extending from the opposite edges on the other side. In FIG. 1, the outer rocker cover and the inner rocker cover of the bottom plate are omitted, but as shown in FIG. 2, the outer rocker cover 531, the outer rocker cover 531 and the inner rocker cover 532, and the inner rocker cover 532 of the bottom plate 53 are fixed in advance . On the other hand, the pair of outer swing lid 511, outer swing lid 511 and a pair of inner swing lid 512, inner swing lid 512 of the upper plate 51 are in the storage container 4 in a state where the second buffer body 2 and the laminated bag 4 are packed After the first buffer body 1 is put in this order, it is folded inward and fixed. In addition, if the outer rocker cover 511 and the outer rocker cover 511 of the upper plate 51 are folded, their front ends touch or almost touch each other, but the pair of inner rocker cover 512 and inner rocker cover 512 do not touch their front ends even if they are folded The way is formed short. That is, as shown in FIG. 6, the total length L1 + L1 of the pair of inner swing cover 512 and the inner swing cover 512 in the swing direction is formed to be shorter than the length L2 of the edge of the outer swing cover 511. Furthermore, the outer swing cover 511 shown in FIG. 1 is composed of a pair of outer swing cover 511 and outer swing cover 511, but it can also be set to have a length of the swing cover from the edge on either side to the opposite edge Shake the outer cover.

Next, the first buffer body 1 will be described. FIGS. 3A(a) to 3A(d) are four-side views showing the first buffer body 1 disposed above the storage container 3 among the buffer bodies of the present invention, and FIG. 3B shows the line IIIB-IIIB along FIG. 3A. 3C is a cross-sectional view taken along line IIIC-IIIC of FIG. 3A. 3A(a) is a bottom view of the first buffer body 1, FIG. 3A(b) is a right side view of the first buffer body 1, FIG. 3A(c) is a front view of the first buffer body 1, FIG. 3A(d ) Is a plan view of the first buffer body 1, the left side view of the first buffer body 1 is shown symmetrically with the right side view of FIG. 3A(b), the back view of the first buffer body 1 and the front view of FIG. 3A(c) Since it is shown symmetrically, the illustration is omitted. In addition, the bottom view shown in FIG. 3A(a) is a view of the first buffer body 1 viewed in the +Z axis direction of FIG. 1, and the plan view shown in FIG. 3A(d) is -Z of FIG. The first buffer body 1 is viewed in the axial direction.

The first buffer body 1 contains a foaming resin such as foamed styrene, and has a first surface 11 that is in contact with the inner surface of the upper plate 51 of the packing box 5 and a laminated bag made from the back surface of the first surface 11. 4. The second surface 12 in contact with the upper surface of the storage container 3 in the packaged state, and the third surface 13 in contact with the inner surface of the side plate 52 of the packing box 5. The first surface 11 shown in FIG. 3A(d) has a base portion 114 constituting a general surface, a first convex portion 111 extending in the Y-axis direction across the opening 14 formed in the center of the base portion 114, and formed in Two pairs of second convex portions 112 on both sides of the first convex portion 111 in the X-axis direction, and third convex portions 113 formed at the four corners of the first surface 11. The first convex portion 111, the second convex portion 112, and the third convex portion 113 are formed to protrude in the +Z axis direction from the base portion 114, and the first convex portion 111 abuts on the outer swing cover 511 and the outer swing cover 511 On the inner surface of, the second convex portion 112 and the third convex portion 113 abut on the inner swing cover 512 and the inner swing cover 512.

The first convex portion 111 is formed so as to be positioned between the front ends of the inner swing cover 512 and the inner swing cover 512 when they are folded inward as shown in FIG. 6. Further, as shown in FIG. 6, the second convex portion 112 and the third convex portion 113 are formed to have the same protrusion height H1 from the base portion 114, and the first convex portion 111 is formed to have a higher protrusion height H2 from the base portion 114 than the first The second convex portion 112 and the third convex portion 113 are only higher than the inner swing cover 512 and the thickness t1 of the inner swing cover 512. Thereby, as shown in FIG. 6, if the inner rocking cover 512 and the inner rocking cover 512 are folded toward each other, the inner rocking cover 512 and the inner rocking cover 512 abut on the second convex portion 112 and the third convex portion 113 up to get horizontal support. On the other hand, if the outer swing cover 511 and the outer swing cover 511 are folded toward each other, the center of the inner surfaces of the outer swing cover 511 and the outer swing cover 511 abuts on the first convex portion 111 to be supported. Most of the inner surfaces other than the inner abutment cover 512 and the outer surface of the inner cover 512. As a result, the inner surfaces of the outer swing cover 511 and the outer swing cover 511 abut on the outer surfaces of the first convex portion 111 and the inner swing cover 512 and the inner swing cover 512 at the same height. Most of the outer swing cover 511 is supported horizontally.

The second surface 12 shown in FIG. 3A(a) is formed with a first recess 121 almost entirely, and a rectangular upper surface portion of the storage container 3 packaged in the laminated bag 4 is fitted into the first recess 121. In addition, at the four corners of the first recess 121 are formed recesses 122 that are recessed toward the outside, and further from the four corners where the recess 122 is formed toward both sides, chamfers 123 are respectively formed within a predetermined range. If the first concave portion 121 of the first buffer body 1 is to be fitted into the rectangular upper surface portion of the storage container 3 packed in the laminated bag 4, there is the remaining portion 41 of the laminated bag 4 (see FIG. 1) The tendency to gather in the four corners. Therefore, the concave portion 122 is provided at the four corners of the first concave portion 121 of the first buffer body 1 of the present embodiment, whereby the remaining portion 41 can be accommodated in the concave portion 122 and accommodated therein. In addition, the chamfered portion 123 is formed within the predetermined range of the first concave portion 121 including the four corners, thereby preventing the remaining portion 41 of the laminated bag 4 collected at the four corners from being caught on the edge of the first concave portion 121 and being damaged. Furthermore, since the packaging using the laminated bag 4 has a surplus relative to the storage container 3 as described above, it is impossible to specify in which corner of the four corners the remaining portion 41 is generated. Therefore, it is preferable to form the concave portion 122 and the chamfered portion 123 at the four corners of the first concave portion 121, respectively.

The third surface 13 shown in FIGS. 3A(b) and 3A(c) is the four side surfaces of the first buffer body 1, and a pair of first protrusions 131 and first The protrusion 131 and the second protrusion 132 and the second protrusion 132. The first protruding portion 131, the first protruding portion 131, the second protruding portion 132, and the second protruding portion 132 are all shaped from the third surface 13 toward the front end, and the tip becomes thinner and narrower, and their respective front ends abut on the bundle On the inner surface of the side plate 52 of the box 5. By the first protrusion 131, the first protrusion 131 and the second protrusion 132, the second protrusion 132, the lateral external force acting on the side plate 52 of the packing box 5 is absorbed, and the lateral direction of the storage container 3 The vibration or shock is alleviated.

Next, the second buffer body 2 will be described. FIGS. 4A(a) to 4A(c) are three-side views showing the second buffer body 2 disposed at the lower part of the storage container 3 of the buffer body of the present invention, and FIG. 4B is taken along the line IVB-IVB of FIG. 4A 4C is a cross-sectional view taken along line IVC-IVC of FIG. 4A. 4A(a) is a plan view of the second buffer body 2, FIG. 4A(b) is a right side view of the second buffer body 2, FIG. 4(c) is a front view of the second buffer body 2, and the second buffer body 2 The left side view of FIG. 4A(b) is shown symmetrically to the right side view, and the back view of the second buffer body 2 is shown symmetrically to the front view of FIG. 4A(c), so the illustration is omitted. In addition, the plan view shown in FIG. 4A(a) is a view of the second buffer body 2 viewed in the -Z axis direction of FIG. 1.

The second buffer body 2 contains a foaming resin such as foamed styrene, and has a first surface 21 that is in contact with the inner surface of the bottom plate 53 of the packing box 5 and a laminated bag 4 that is the back surface side of the first surface 21. The second surface 22 in contact with the bottom surface of the storage container 3 in the packaged state and the third surface 33 in contact with the inner surface of the side plate 52 of the packing box 5. Although the rear view of the second cushion body 2 is omitted, as shown in the side view of FIG. 4A(b) and the front view of FIG. 4A(c), the center is raised flatly, and four legs 211 are formed near the four corners The four legs 211 abut on the inner surface of the bottom plate 53 of the packing box 5.

The second surface 22 shown in FIG. 4A(a) has a second recess 222 formed almost entirely over the opening 24 formed in the center, and the bottom surface of the storage container 3 wrapped in the laminated bag 4 is fitted to this In the second concave portion 222. In addition, inclined surfaces 221 are formed at the four corners of the second concave portion 222, respectively, and accommodate a protruding portion of the lower portion of the side surface 35 of the storage container 3 shown in FIG.

The third surfaces 23 shown in FIGS. 4A(a) to 4A(c) are the four side surfaces of the second buffer body 2, and a pair of first protrusions 231 and first The protrusion 231 and the second protrusion 232 and the second protrusion 232. The first protruding portion 231, the first protruding portion 231, the second protruding portion 232, and the second protruding portion 232 are all shaped from the third surface 23 toward the front end, and the tip becomes thinner and narrower, and the respective front ends abut on the bundle On the inner surface of the side plate 52 of the box 5. By the first protrusion 231, the first protrusion 231 and the second protrusion 232, the second protrusion 232, the lateral external force acting on the side plate 52 of the packing box 5 is absorbed, and the lateral direction of the storage container 3 The vibration or shock is alleviated.

As described above, according to the buffer body of the present embodiment, as shown in FIG. 1, if the first concave portion 121 of the first buffer body 1 is to be fitted into the rectangular upper surface of the storage container 3 packed in the laminated bag 4 In the portion, the remaining portion 41 of the laminated bag 4 tends to gather at the four corners. However, the recessed portion 122 is provided at the four corners of the first recess 121 of the first buffer body 1 of this embodiment, so the remaining portion 41 can be It fits into the recess 122 and is accommodated therein. Thereby, even if the size of the first concave portion 121 is set to be slightly small, generally, the sides are firmly fitted, so as to prevent wobbling, and at the same time prevent the four corners of the laminated bag 4 from being damaged or broken due to stress concentration.

In addition, according to the cushion body of the present embodiment, since the first concave portion 121 of the first cushion body 1 has the chamfered portion 123 formed within a predetermined range including the four corners, it is possible to prevent the remaining portion of the laminated bag 4 gathered at the four corners 41 is stuck at the edge of the first recess 121 and is damaged.

In addition, according to the buffer body of the present embodiment, the second convex portion 112 of the first buffer body 1 and the third convex portion 113 are formed to have the same height H1 from the base portion 114, and the first convex portion 111 is formed from the base portion 114 The protruding height H2 is formed to be higher than the second convex part 112 and the third convex part 113 by only the inner tumbler 512 and the thickness t1 of the inner tumbler 512. Thereby, as shown in FIG. 6, if the inner rocking cover 512 and the inner rocking cover 512 are folded toward each other, the inner rocking cover 512 and the inner rocking cover 512 abut on the second convex portion 112 and the third convex portion 113 is firmly supported horizontally. Furthermore, if the outer swing cover 511 and the outer swing cover 511 are folded toward each other, the center of the inner surfaces of the outer swing cover 511 and the outer swing cover 511 abuts on the first convex portion 111 to be supported. Most of the inner surface abuts on the inner rocking cover 512 and the outer surface of the inner rocking cover 512. As a result, the inner surfaces of the outer swing cover 511 and the outer swing cover 511 abut on the outer surfaces of the first convex portion 111 and the inner swing cover 512 and the inner swing cover 512 at the same height. Most of the outer swing cover 511 is firmly supported horizontally.

1‧‧‧ 1st buffer body 2‧‧‧ 2nd buffer body 3‧‧‧ storage container 4‧‧‧ laminated bag 5‧‧‧ packing box 11, 21‧‧‧ 1st surface 12, 22‧‧ ‧Second face 13, 23‧‧‧‧ Third face 14, 24‧‧‧ Opening 31‧‧‧Body 32‧‧‧Cover 33‧‧‧Upper face 34‧‧‧Bottom face 35‧‧‧Side 36‧ ‧‧Foot part 41‧‧‧Remaining part 51‧‧‧Upper plate 52‧‧‧Side plate 53‧‧‧Bottom plate 111‧‧‧‧First convex part 112‧‧‧Second convex part 113‧‧‧ Third convex part 114‧‧‧Base part 121‧‧‧First concave part 122‧‧‧Concave part 123‧‧‧Chamfered part 131‧‧‧First protruding part 132‧‧‧Second protruding part 211‧‧‧Foot part 221‧ ‧‧Slanted surface 222‧‧‧Second concave part 231‧‧‧First protruding part 232‧‧‧Second protruding part 511,531‧‧‧Outer swing cover 512,532‧‧‧Inner swing cover 513 Side H ₁ , H ₂ ‧‧‧ Protrusion height L ₁ , L ₂ ‧‧‧ Length t ₁ ‧‧‧ Thickness W‧‧‧ Semiconductor wafer IIIB-ⅢB, IIIC-ⅢC, IVB-ⅣB, IVC-ⅣC ‧line

FIG. 1 is a perspective view showing an embodiment of a packing method using a buffer body of the present invention. FIG. 2 is a cross-sectional view showing the state of packing in FIG. 1. 3A(a) to FIG. 3A(d) are four-side views showing a first buffer body disposed above the storage container among the buffer bodies of the present invention. 3B is a cross-sectional view taken along line IIIB-IIIB of FIG. 3A. 3C is a cross-sectional view taken along line IIIC-IIIC of FIG. 3A. 4A(a) to FIG. 4A(c) are three-side views showing a second buffer body disposed in a lower portion of a storage container among the buffer bodies of the present invention. 4B is a cross-sectional view taken along line IVB-IVB of FIG. 4A. 4C is a cross-sectional view taken along line IVC-IVC of FIG. 4A. 5 is a perspective view showing an example of a semiconductor wafer storage container to which the buffer body of the present invention is applied. 6 is an enlarged cross-sectional view showing the VI portion of FIG. 5.

1‧‧‧First buffer

11‧‧‧ Face 1

12‧‧‧ 2nd side

13‧‧‧ 3rd

14‧‧‧ opening

111‧‧‧1st convex part

112‧‧‧The second convex part

113‧‧‧3rd convex part

114‧‧‧Base

121‧‧‧The first recess

122‧‧‧Depression

123‧‧‧Chamfer

131‧‧‧1st protrusion

132‧‧‧ 2nd protrusion

Ⅲ B-Ⅲ B, Ⅲ C-Ⅲ C‧‧‧ line

Claims (4)

A buffer body for packaging a semiconductor wafer storage container, which is arranged to be packed in the bag when a box-shaped storage container for storing semiconductor wafers packed in a flexible bag is packed in a packaging box The buffer body between the storage container in the state and the packing box includes: a first buffer body, an upper surface of the storage container in the state packed in the bag, and an inner surface of the upper plate of the packing box The surface and the inner surface of the side plate of the packing box are in contact and interposed therebetween; the first buffer body has a first surface that contacts the inner surface of the upper plate of the packing box as The second surface on the back side of the first surface that is in contact with the upper surface of the storage container in the state of being packed in the bag, and the third surface that is in contact with the inner surface of the side plate of the packing box are The second surface is formed with a first concave portion fitted into the rectangular upper surface portion of the storage container in a state including the bag, and outwardly facing depressions are formed at four corners of the first concave portion The upper plate of the packing box includes an outer swing cover and a pair of inner swing covers. The total length of the pair of inner swing covers in the swing direction is formed to be shorter than the length of the edge of the outer swing cover. The first surface of the first buffer body includes: a base portion with a main surface that is flat; a first convex portion that protrudes from the base portion and does not interact with the inner portion when the pair of inner rocker covers are folded Shaking the cover in contact with the inner surface of the outer shaking cover; and The second convex portion protrudes from the base portion and contacts the inner surfaces of the front ends of the pair of inner rocker covers when the pair of inner rocker covers are folded. The buffer body for packaging a semiconductor wafer storage container according to the first item of the patent scope, wherein a chamfered portion is formed within a predetermined range of four corners of the first recessed portion including the recessed portion. The buffer body for packing a semiconductor wafer storage container as described in Item 1 of the patent scope, wherein the first surface of the first buffer body further includes a third convex portion protruding from the base portion, When the pair of inner rocker covers are folded, they are in contact with inner surfaces other than the front end of the inner rocker cover respectively; the height of the protrusion of the second convex portion from the base portion and the freeness of the third convex portion The protrusion height of the base portion is formed to be the same height, and the protrusion height of the first convex portion from the base portion is formed to be higher than that of the second convex portion and the third convex portion from the base The protruding height of the part is only higher than the thickness of the inner rocker cover. The buffer body for packaging a semiconductor wafer storage container as described in item 1 of the patent scope, further comprising: a second buffer body, the bottom surface of the storage container in the state of being packed in the bag, and the packaging box The inner surface of the bottom plate and the inner surface of the side plate of the packing box are in contact with and interposed therebetween; the second buffer body has: a first that contacts the inner surface of the bottom plate of the packing box Surface, which is the back surface side of the first surface and is in contact with the bottom surface of the storage container in the state packed in the bag A second surface and a third surface that is in contact with the inner surface of the side plate of the packing box, and a rectangular shape that fits into the storage container in a state including the bag is formed on the second surface A second concave portion in the bottom surface portion, and inclined surfaces are formed at the four corners of the second concave portion, respectively.

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