TW201929124A - Bundling buffer body of semiconductor wafer storage container capable of preventing a bag for packaging the semiconductor wafer storage container from breakage - Google Patents

Abstract

The present invention provides a bundling buffer body capable of preventing a bag for packaging the semiconductor wafer storage container from breakage. When the box-shaped storage container 3 packaged by the flexible bag 4 for storing the semiconductor wafer W is bundled in the bundling box 5, the first buffer body 1 contacts the upper surface of the storage container packaged by the bag, the inner surface of the upper plate 51 of the bundling box, and the inner surface of the side plate 52 of the bundling box, respectively, and is disposed among them. The first buffer body has a first surface 11 contacting the inner surface of the upper plate of the bundling box, a second surface 12 contacting the upper surface of the storage container packaged by the bag as the back surface side of the first surface, and a third surface 13 contacting the inner surface of the side plate of the bundling box. The first recessed portion 121 fitted into the rectangular upper surface portion of the storage container in a state of including the bag is formed on the second surface. The recessed portion 122 facing outward is formed at each of the four corners of the first recessed portion.

Description

Buffer buffer for semiconductor wafer storage container

The present invention relates to a buffer for packing a semiconductor wafer storage container.

When a semiconductor wafer produced in a semiconductor wafer production plant is transported to a component manufacturing factory or the like, a plurality of wafers are placed in a wafer container, and the wafer container is further placed in a corrugated cardboard box or the like. Transportation in the middle. In this case, a buffering body for packaging is provided between the storage container of the wafer and the corrugated cardboard box so as not to adversely affect the semiconductor wafer due to an impact during transportation.

As such a buffer body, a buffer body for a wafer container in which a wafer container containing a plurality of semiconductor wafers is housed in an outer casing is disposed, and is disposed in an outer casing and a wafer container. A buffer body made of a foamed resin between the upper and lower sides is provided in the outer casing so that the cushioning projections at the bottom and the top of the outer casing are protruded from the set of foamed resin cushioning bodies. The buffer protrusion is formed in a closed ring shape on the base portion, and a protrusion supporting the wafer container is disposed on the base portion of the group of the foamed resin buffer body, and the buffer protrusion is located at the protrusion portion with the center line thereof Configuration on the center line (Patent Document 1). [Prior Art Document] [Patent Literature]

[Patent Document 1] Japanese Patent No. 4193472

[Problems to be Solved by the Invention] However, when the wafer container shown in the prior art is housed in an outer casing, in order to maintain the antistatic property of the wafer container or the cleanliness of the wafer, sometimes the use will be The wafer container is laminated in a laminated bag formed by laminating an aluminum foil and a resin film, and is stored in the outer casing in this state. Such a laminated bag is not intimately attached to the wafer container, but has a certain margin for packaging. Therefore, the size of the fitting recess of the cushion body is set to a size considering the thickness of the laminated bag.

However, the wafer container has a box shape, so if the buffer is to be forcibly embedded, there is a problem that stress concentrates on the remaining portions of the four corners of the laminated bag, and the laminated bag is damaged or broken. Conversely, if the size of the entire recessed portion of the cushioning body is set to take into consideration the thickness of the laminated bag and the wide size of the remaining portion in order to prevent damage or breakage of the remaining portion of the laminated bag, the wafer container is produced. Keep this other problem firmly.

An object of the present invention is to provide a buffering body for packaging which can prevent breakage of a bag in which a storage container for a semiconductor wafer is packaged. [Technical means to solve the problem]

The present invention solves the above problems by a buffering body for packaging a semiconductor wafer storage container in which a buffer for packaging a semiconductor wafer is packaged in a flexible bag. When the box-shaped storage container is bundled in the packing box, the cushion body is disposed between the storage container and the packing box in a state of being packed in the bag, and includes: a first cushion body; The upper surface of the storage container in the state of the bag packaging, the inner surface of the upper plate of the packaging box, and the inner surface of the side plate of the packaging box are respectively in contact with and interposed therebetween; the first buffer body The first surface that is in contact with the inner surface of the upper plate of the packaging box, the second surface that is in contact with the upper surface of the storage container in a state of being wrapped by the bag, and the second surface that is the back surface side of the first surface, And a third surface that is in contact with the inner surface of the side plate of the packing box, and the second surface is formed in a rectangular upper surface portion of the storage container in a state including the bag. a first recess and an orientation formed at each of four corners of the first recess Recessed portion side.

In the invention, it is preferable that a chamfered portion is formed in a predetermined range of the four corners of the first recess including the recessed portion.

In the present invention, it is more preferable that the upper plate of the packing box includes an outer flap and a pair of inner flaps, and a total length of the flapping directions of the pair of inner flaps is formed. The first surface of the first buffer body has a base portion whose main surface is flat, and the first convex portion protrudes from the base portion when the length of the edge of the outer shaker cover is shorter than The pair of inner flaps are not in contact with the inner flap to contact the inner surface of the outer flap when folded; and the second protrusions protrude from the base portion when the pair is internally shaken The cover is in contact with the inner surface of the front end of the pair of inner flaps when folded.

In the present invention, it is preferable that the first surface of the first cushion body further includes: a third convex portion that protrudes from the base portion and that is folded when the pair of inner flaps are folded The inner surfaces of the second convex portion are respectively in contact with the inner surface of the base portion, and the protruding height of the second convex portion from the base portion is formed at the same height as the height of the third protruding portion from the base portion. The protruding height of the first convex portion from the base portion is formed to be higher than the protruding height of the second convex portion and the third convex portion from the base portion by the thickness of the inner flap.

In the present invention, the buffering body for packaging a semiconductor wafer storage container may be further provided, and further comprising: a second buffer body, and a bottom surface of the storage container in a state of being packed by the bag, the package The inner surface of the bottom plate of the box and the inner surface of the side plate of the packing box are respectively in contact with and interposed therebetween; the second buffer body has: a first contact with the inner surface of the bottom plate of the packing box a first surface that is in contact with a bottom surface of the storage container in a state in which the bag is wrapped, and a third surface that is in contact with an inner surface of the side plate of the packaging box on the back surface side of the first surface, a second recessed portion that is fitted into the rectangular bottom surface portion of the storage container in a state including the bag, and an inclined surface is formed at each of the four corners of the second recessed portion. . [Effects of the Invention]

When the first recessed portion of the first cushioning body is to be fitted into the upper surface portion of the box-shaped storage container in which the semiconductor wafer is housed in the flexible bag, the remaining portion of the bag is collected on the storage container. The tendency in at least any of the four corners of the surface portion. However, according to the cushion body of the present invention, since the recessed portions facing outward are formed at the four corners of the first recessed portion of the first cushioning body, the remaining portion of the bag is accommodated in the recessed portion, and stress concentration is alleviated. Thereby, the bag is prevented from being damaged or broken.

Hereinafter, an embodiment of the present invention will be described based on the drawings. Fig. 1 is a perspective view showing an embodiment of a packing method of a cushion body to which the present invention is applied, and Fig. 2 is a cross-sectional view showing a packing state of Fig. 1. As shown in FIG. 1 and FIG. 2, the buffer body of the present embodiment includes the first cushion body 1 and the second buffer body 2, and is housed in a box shape in which the semiconductor wafer W is housed in the flexible laminated bag 4. When the container 3 (see FIG. 5) is bundled in the packing box 5, it is disposed between the storage container 4 and the packing box 5 in a state of being packed by the laminated bag 4. Further, as shown in the packing state of FIG. 2, the first cushioning body 1 is disposed between the upper surface 33 of the storage container 4 in a state of being packed in the laminated bag 4 and the upper plate 51 of the packing box 5, and the second cushioning is provided. The body 2 is disposed between the bottom surface 34 of the storage container 4 in a state of being packed in the laminated bag 4 and the bottom plate 53 of the packing box 5. Thereby, the vibration or impact applied to the packing box 5 during transportation is absorbed by the first buffer body 1 and the second buffer body 2, and the adverse effect on the semiconductor wafer W can be prevented.

FIG. 5 is a perspective view showing an example of a storage container 3 of a semiconductor wafer. The configuration of the storage container 3 of the semiconductor wafer to which the buffer of the present invention is applied is not particularly limited, but is generally used for, for example, a storage container 3 called a front opening transport box (FOSB). The schematic configuration will be described. The storage container 3 shown in Fig. 5 includes a box-shaped body 31 having an open upper surface 33 and having a bottom surface 34 and four side surfaces 35, and a lid body 32 that closes the opening of the upper surface 33. Foot portions 36 are respectively provided at the four corners of the bottom surface 34. In addition, the posture of the storage container 3 shown in FIG. 5 is a posture when being bundled in the packing box 5, and is referred to as an upper surface 33, a bottom surface 34, and a side surface 35 in this sense, but is in a component production factory or the like. When the storage container 3 is used, it is often used in such a manner that 90° is rotated by 90° with respect to the posture shown in FIG. 5 to make any one side surface 35 a bottom surface, and the upper surface 33 provided with the lid body 32 is turned into a side surface by The cover 32 is opened/closed to access the semiconductor wafer W. In the specification and patent application scope and drawings of the present application, the upper surface, the bottom surface, and the side surface are referred to on the basis of the posture at the time of packaging shown in Figs. 1, 2, and 5.

The laminated bag 4 of the package storage container 3 shown in FIG. 1 is, for example, a flexible bag formed by laminating a resin film such as polyethylene or polypropylene on both surfaces or one surface of an aluminum foil, and is placed in the storage container 3 . Thereafter, the opening is folded as shown in FIG. 1, whereby the storage container 3 is packaged. Instead of being tightly sealed to the storage container 3 as a vacuum package, the package is sealed to a certain extent with the storage container 3, and is used for maintaining the antistatic of the storage container 3 or the cleaning of the semiconductor wafer W. Sex.

The packing box 5 is a paper corrugated box or a plastic box, and has an upper plate 51, four side plates 52, and a bottom plate 53. Each of the upper plate 51 and the bottom plate 53 is provided with an outer rocking cover 511, an outer rocking cover 511, an outer rocking cover 531, an outer rocking cover 531, and a self-extending edge. A pair of inner flaps 512, inner flaps 512, inner flaps 532, and inner flaps 532 extend from opposite sides of the other side. The outer flap and the inner flap of the bottom plate are omitted in FIG. 1, but as shown in FIG. 2, the outer flap 531, the outer flap 531, the inner flap 532, and the inner flap 532 of the bottom plate 53 are fixed in advance. . On the other hand, the outer flap 511, the outer flap 511, the pair of inner flaps 512, and the inner flap 512 of the upper plate 51 are in the storage container 4 in a state in which the second cushion body 2 is wrapped by the laminated bag 4. After the first buffer body 1 is placed in this order, it is folded inwardly and fixed. In addition, if the outer flap 511 and the outer flap 511 of the upper plate 51 are folded, the front ends of the outer flap 511 and the outer flap 511 are in contact with each other or are in close contact with each other, but the pair of inner flaps 512 and the inner flap 512 are not overlapped even when folded. The way is formed short. That is, as shown in FIG. 6, the total length L1+L1 of the pair of inner flaps 512 and the inner flap 512 in the flap direction is formed shorter than the length L2 of the edge of the outer flap 511. Furthermore, the outer flap 511 shown in FIG. 1 is composed of an outer flap 511 and an outer flap 511, but can also be set to have a flap length from the edge of either side to the opposite edge. Shake the cover outside.

Next, the first buffer body 1 will be described. 3A(a) to 3A(d) are four-side views showing the first buffer body 1 disposed in the upper portion of the storage container 3 in the buffer body of the present invention, and FIG. 3B is a view along line IIIB-IIIB of FIG. 3A. 3C is a cross-sectional view taken along line IIIC-IIIC of FIG. 3A. 3A(a) is a bottom view of the first cushion body 1, FIG. 3A(b) is a right side view of the first cushion body 1, and FIG. 3A(c) is a front view of the first cushion body 1, and FIG. 3A(d) It is a plan view of the first buffer body 1. The left side view of the first buffer body 1 is shown symmetrically with the right side view of FIG. 3A(b), and the rear view of the first buffer body 1 and the front view of FIG. 3A(c) are shown. It is represented symmetrically, and thus the illustration is omitted. Further, the bottom view shown in FIG. 3A(a) is a view in which the first buffer body 1 is viewed in the +Z-axis direction of FIG. 1, and the plan view shown in FIG. 3A(d) is -Z in FIG. A view of the first buffer body 1 is observed in the axial direction.

The first cushion body 1 contains a foamable resin such as foamed styrene, and has a first surface 11 that comes into contact with the inner surface of the upper plate 51 of the packing box 5, and a back side of the first surface 11 and a laminated bag. The second surface 12 in contact with the upper surface of the storage container 3 in the packaged state, and the third surface 13 that is in contact with the inner surface of the side plate 52 of the packing box 5. The first surface 11 shown in FIG. 3A(d) has a base portion 114 constituting a general surface, and a first convex portion 111 extending in the Y-axis direction across the opening portion 14 formed at the center of the base portion 114, and is formed on the first surface 11 Two pairs of second convex portions 112 on both sides in the X-axis direction of the first convex portion 111 and third convex portions 113 formed at four corners of the first surface 11 . The first convex portion 111, the second convex portion 112, and the third convex portion 113 are formed to protrude from the base portion 114 in the +Z-axis direction, and the first convex portion 111 abuts against the outer flap 511 and the outer flap 511. On the inner surface, the second convex portion 112 and the third convex portion 113 abut against the inner flap 512 and the inner flap 512.

The first convex portion 111 is formed to be located between the front ends of the inner rocking cover 512 and the inner rocking cover 512 as shown in FIG. Further, as shown in FIG. 6, the second convex portion 112 is formed to be equal to the protruding height H1 of the third convex portion 113 from the base portion 114, and the protruding height H2 of the first convex portion 111 from the base portion 114 is formed to be larger than that of the first convex portion 111. The convex portion 112 and the third convex portion 113 have only the thickness t1 of the inner inner flap 512 and the inner flap 512. As a result, as shown in FIG. 6, when the inner flap 512 and the inner flap 512 are folded toward each other, the inner flap 512 and the inner flap 512 abut against the second projection 112 and the third projection. Level 113 is supported by the level. On the other hand, when the outer flap 511 and the outer flap 511 are folded toward each other, the center of the inner surfaces of the outer flap 511 and the outer flap 511 abuts against the first projection 111 and is supported. Most of the outer surface is abutted on the outer surfaces of the inner rocker cover 512 and the inner rocker cover 512. Thereby, the inner surfaces of the outer flap 511 and the outer flap 511 are in contact with the first convex portion 111 and the outer surfaces of the inner flap 512 and the inner flap 512 which are at the same height, so that the outer flap 511, Most of the outer flap 511 is horizontally supported.

The second surface 12 shown in FIG. 3A (a) is formed with the first concave portion 121 almost entirely, and the rectangular upper surface portion of the storage container 3 packaged by the laminated bag 4 is fitted into the first concave portion 121. Further, recessed portions 122 that are recessed toward the outside are formed at the four corners of the first recessed portion 121, and chamfered portions 123 are formed in a predetermined range from the four corners where the recessed portion 122 is formed. If the first recessed portion 121 of the first cushioning body 1 is to be fitted into the rectangular upper surface portion of the storage container 3 that is packed in the laminated bag 4, the remaining portion 41 of the laminated bag 4 is present (see FIG. 1). The tendency to gather in the four corners. Therefore, the recessed portion 122 is provided at the four corners of the first recessed portion 121 of the first cushioning body 1 of the present embodiment, whereby the remaining portion 41 can be housed in the recessed portion 122 and accommodated therein. Further, the chamfered portion 123 is formed in a predetermined range including the four corners of the first recessed portion 121, whereby the remaining portion 41 of the laminated bag 4 collected at the four corners can be prevented from being caught by the edge of the first recessed portion 121 and damaged. Further, since the package of the laminated bag 4 has a margin with respect to the storage container 3 as described above, it is not possible to specify which of the four corners of the remaining portion 41 is generated. Therefore, it is preferable to form the depressed portion 122 and the chamfered portion 123 at the four corners of the first recessed portion 121, respectively.

The third surface 13 shown in FIGS. 3A(b) and 3A(c) is the four side faces of the first cushion body 1, and the pair of first protrusions 131 and the first one are formed on the four third faces 13 respectively. The protrusion 131 and the second protrusion 132 and the second protrusion 132 are provided. Each of the first projections 131, the first projections 131, the second projections 132, and the second projections 132 has a shape in which the tips are tapered from the third surface 13 and the tips are closer to each other. On the inner surface of the side panel 52 of the box 5. By the first protrusion 131, the first protrusion 131, the second protrusion 132, and the second protrusion 132, the lateral external force acting on the side plate 52 of the packing box 5 is absorbed, and the lateral direction of the container 3 is accommodated. The vibration or shock is alleviated.

Next, the second buffer body 2 will be described. 4A(a) to 4(c) are a three-side view showing the second buffer body 2 disposed in the lower portion of the storage container 3 in the buffer body of the present invention, and FIG. 4B is a view along line IVB-IVB of FIG. 4A. FIG. 4C is a cross-sectional view taken along line IVC-IVC of FIG. 4A. 4A(a) is a plan view of the second buffer body 2, FIG. 4A(b) is a right side view of the second buffer body 2, and FIG. 4(c) is a front view of the second buffer body 2, and the second buffer body 2 The left side view is symmetrically shown in the right side view of FIG. 4A(b), and the rear view of the second buffer body 2 is shown symmetrically with the front view of FIG. 4A(c), and thus the illustration is omitted. Further, the plan view shown in FIG. 4A(a) is a view in which the second buffer body 2 is viewed in the -Z-axis direction of FIG.

The second cushion body 2 includes a foamable resin such as foamed styrene, and has a first surface 21 that comes into contact with the inner surface of the bottom plate 53 of the packing box 5, and a back side of the first surface 21 and the laminated bag 4 The second surface 22 in contact with the bottom surface of the storage container 3 in the packaged state and the third surface 33 that is in contact with the inner surface of the side plate 52 of the packaging box 5 are provided. Although the rear view of the second cushion body 2 is omitted, as shown in the side view of FIG. 4A(b) and the front view of FIG. 4A(c), the center is raised in a flat shape, and four leg portions 211 are formed in the vicinity of the four corners. The four leg portions 211 abut on the inner surface of the bottom plate 53 of the bale case 5.

The second surface 22 shown in FIG. 4A (a) is formed with the second concave portion 222 almost entirely except for the central opening portion 24, and the bottom surface portion of the storage container 3 packaged by the laminated bag 4 is fitted to the second concave portion 222. In the second recess 222. Further, an inclined surface 221 is formed at each of the four corners of the second recessed portion 222, and a protruding portion of the lower portion of the side surface 35 of the storage container 3 shown in Fig. 5 is accommodated.

The third surface 23 shown in FIGS. 4A(a) to 4A(c) is the four side faces of the second cushion body 2, and the pair of first protrusions 231 and the first one are formed on the four third faces 23, respectively. The protrusion 231 and the second protrusion 232 and the second protrusion 232. The first projection 231, the first projection 231, the second projection 232, and the second projection 232 are both formed toward the distal end from the third surface 23, and the tips are tapered. The distal ends thereof are in contact with the bundle. On the inner surface of the side panel 52 of the box 5. By the first protrusion 231, the first protrusion 231, the second protrusion 232, and the second protrusion 232, the lateral external force acting on the side plate 52 of the packing box 5 is absorbed, and the lateral direction of the container 3 is accommodated. The vibration or shock is alleviated.

As described above, according to the buffer body of the present embodiment, as shown in FIG. 1, the first concave portion 121 of the first cushion body 1 is fitted to the rectangular upper surface of the storage container 3 packaged by the laminated bag 4. In the portion, the remaining portion 41 of the laminated bag 4 tends to be gathered at the four corners. However, the recessed portion 122 is provided at the four corners of the first recessed portion 121 of the first cushioning body 1 of the present embodiment, so that the remaining portion 41 can be provided. It is inserted into the recessed portion 122 to be accommodated therein. Thereby, even if the size of the first recessed portion 121 is set to be small, the side is generally firmly fitted, so that the sway is prevented, and the damage or breakage of the laminated bag 4 caused by stress concentration is prevented against the four corners.

Further, according to the cushion body of the present embodiment, since the chamfered portion 123 is formed in the predetermined range including the four corners of the first recessed portion 121 of the first cushion body 1, the remaining portion of the laminated bag 4 collected at the four corners can be prevented. 41 is stuck at the edge of the first recess 121 and is damaged.

Further, according to the buffer body of the present embodiment, the second convex portion 112 of the first cushion body 1 is formed to be equal to the protruding height H1 of the third convex portion 113 from the base portion 114, and the base portion 114 of the first convex portion 111 is formed from the base portion 114. The protruding height H2 is formed to be higher than the thicknesses t1 of the inner flap 512 and the inner flap 512 by the second convex portion 112 and the third convex portion 113. As a result, as shown in FIG. 6, when the inner flap 512 and the inner flap 512 are folded toward each other, the inner flap 512 and the inner flap 512 abut against the second projection 112 and the third projection. 113 is firmly secured horizontally. Further, when the outer flap 511 and the outer flap 511 are folded inwardly, the center of the inner surface of the outer flap 511 and the outer flap 511 abuts against the first projection 111 and is supported. Most of the inner surface abuts against the outer surface of the inner rocker cover 512 and the inner rocker cover 512. Thereby, the inner surfaces of the outer flap 511 and the outer flap 511 are in contact with the first convex portion 111 and the outer surfaces of the inner flap 512 and the inner flap 512 which are at the same height, so that the outer flap 511, Most of the outer rocking cover 511 is firmly horizontally supported.

1‧‧‧1st buffer

2‧‧‧2nd buffer

3‧‧‧ storage container

4‧‧‧ laminated bags

5‧‧‧Bundle box

11, 21‧‧‧ first side

12, 22‧‧‧ second side

13, 23‧‧‧3rd

14, 24‧‧‧ openings

31‧‧‧Ontology

32‧‧‧ Cover

33‧‧‧ upper surface

34‧‧‧ bottom

35‧‧‧ side

36‧‧‧foot

41‧‧‧ remaining parts

51‧‧‧Upper board

52‧‧‧ side panels

53‧‧‧floor

111‧‧‧1st convex

112‧‧‧2nd convex

113‧‧‧3rd convex

114‧‧‧ base

121‧‧‧1st recess

122‧‧‧Depression

123‧‧‧Chamfering

131‧‧‧1st protrusion

132‧‧‧2nd protrusion

211‧‧‧ feet

221‧‧‧ sloped surface

222‧‧‧2nd recess

231‧‧‧1st protrusion

232‧‧‧2nd protrusion

511, 531‧‧ ‧ outer flap

512, 532‧‧ ‧ inner flap

513‧‧‧ edges

H ₁ , H ₂ ‧‧‧ protruding height

L ₁ , L ₂ ‧‧‧ length

t ₁ ‧‧‧thickness

W‧‧‧Semiconductor Wafer

Lines IIIB-IIIB, IIIC-IIIC, IVB-IVB, IVC-IVC‧‧

Fig. 1 is a perspective view showing an embodiment of a packing method of a cushion body to which the present invention is applied. Fig. 2 is a cross-sectional view showing the state of the package of Fig. 1; 3A(a) to 3A(d) are plan views showing a first buffer body disposed in an upper portion of a storage container among the buffer bodies of the present invention. Fig. 3B is a cross-sectional view taken along line IIIB-IIIB of Fig. 3A. Fig. 3C is a cross-sectional view taken along line IIIC-IIIC of Fig. 3A. 4A(a) to 4(c) are a three-side view showing a second cushion body disposed in a lower portion of the storage container among the cushion bodies of the present invention. Fig. 4B is a cross-sectional view taken along line IVB-IVB of Fig. 4A. Fig. 4C is a cross-sectional view taken along line IVC-IVC of Fig. 4A. 5 is a perspective view showing an example of a storage container of a semiconductor wafer to which a buffer body of the present invention is applied. Fig. 6 is an enlarged cross-sectional view showing a portion VI of Fig. 5;

Claims (5)

A buffering body for packaging a semiconductor wafer storage container, which is disposed in a packaging case when a box-shaped storage container for storing a semiconductor wafer packaged in a flexible bag is bundled in a packaging box The buffer body between the storage container and the packing box includes: a first cushion body, and an upper surface of the storage container in a state of being packed by the bag, and an upper plate of the packing box The surface and the inner surface of the side plate of the packing box are respectively in contact with and interposed therebetween; the first buffer body has a first surface that is in contact with the inner surface of the upper plate of the packing box, and a second surface on the back surface side of the first surface that is in contact with the upper surface of the storage container in the state of the pouch package, and a third surface that is in contact with the inner surface of the side panel of the packaging box, a first recessed portion that is fitted into a rectangular upper surface portion of the storage container in a state including the bag, and a recess that faces outward is formed at each of four corners of the first recessed portion. unit. The buffering body for packaging a semiconductor wafer storage container according to the first aspect of the invention, wherein a chamfered portion is formed in a predetermined range of four corners of the first concave portion including the recessed portion. The buffering body for packaging a semiconductor wafer storage container according to the first or second aspect of the invention, wherein the upper plate of the packaging box includes an outer flap and a pair of inner flaps, the pair The total length of the flapping direction of the inner flap is formed to be shorter than the length of the edge of the outer flap, and the first surface of the first cushioning body includes: a base portion whose main surface is flat; the first convex a portion protruding from the base portion, when the pair of inner flaps are folded, not in contact with the inner flap to contact the inner surface of the outer flap; and a second protrusion from the base The protrusion protrudes from the inner surfaces of the front ends of the pair of inner flaps when the pair of inner flaps are folded. The buffering body for packaging a semiconductor wafer storage container according to the third aspect of the invention, wherein the first surface of the first buffer body further includes: a third convex portion protruding from the base portion; When the pair of inner flaps are folded, respectively, contact with an inner surface other than the front end of the inner flap; a protrusion height of the second protrusion from the base portion and a self of the third protrusion The protruding height of the base portion is formed to be the same height, and the protruding height of the first convex portion from the base portion is formed to be larger than the base portion of the second convex portion and the third convex portion The protruding height of the portion is only higher than the thickness of the inner flap. The buffering body for packaging a semiconductor wafer storage container according to the first aspect of the invention, further comprising: a second buffer body, a bottom surface of the storage container in a state of being packed by the bag, and the packing box The inner surface of the bottom plate and the inner surface of the side plate of the packing box are respectively in contact with and interposed therebetween; the second buffer body has: the first contact with the inner surface of the bottom plate of the packing box a second surface that is in contact with a bottom surface of the storage container in a state in which the bag is packaged on the back surface side of the first surface, and a third surface that is in contact with an inner surface of the side plate of the packaging box The second surface is formed with a second concave portion that is fitted into the rectangular bottom surface portion of the storage container in a state including the bag, and an inclined surface is formed at each of the four corners of the second concave portion.