JPH0427819Y2 - - Google Patents

Description

[Detailed description of the invention] [Purpose of the invention] (Field of industrial application) The present invention relates to a container for storing electronic components, etc., which is composed of a receiver and a lid, and in particular, it has an improved structure for preventing the objects to be packaged from slipping. related to things.

(Prior art) For example, electronic components such as thin-film or thick-film hybrid integrated circuit boards and ceramic packages for mounting semiconductor elements are protected from damage and foreign matter adhesion by storing them in storage containers during the manufacturing stage and product shipment. be done. As a storage container for this purpose, a structure as shown in FIG. 8 has conventionally been provided. Here, the receiver 1 is formed from a thin plate such as a plastic sheet or an aluminum sheet and has a plurality of rectangular recesses 2, and also serves as a lid. An electronic component (for example, a thin film hybrid integrated circuit board) 3 to be packaged is housed in the recess 2 of the receiver 1, and by placing another receiver 1 over it,
The upper surface of the electronic component 3 is pressed by the outer bottom surface of the recess 2 of the upper receiver 1, and the electronic component 3 is housed in a state where it is prevented from slipping.

(Problem to be solved by the invention) However, some of the items to be packed in this type of storage container have surfaces that are easily damaged, and if foreign matter adheres to the surface, the properties may not be maintained properly. There is something. For example, hybrid integrated circuit boards and ceramic packages made of thin or thick films for mounting semiconductor elements have thick or thin film circuit patterns, passive elements, metallized parts for mounting semiconductor elements, etc., and if these parts are damaged, they will fail. It will be a good product. Furthermore, if the mold release agent used during molding of the receptor 1 adheres to the surface, bonding properties will deteriorate, so there is a risk that the product will be defective.

However, in the conventional storage container described above, in order to prevent the electronic components 3, which are the items to be packed, from shifting,
Since the outer bottom surface of the recess 2 is in contact with the entire upper surface of the electronic component 3, there are problems in that the surface of the electronic component 3 may be damaged or foreign matter may adhere to the surface.

In order to deal with this, attempts have been made to sandwich a protective sheet between the packaged items and the lid, or to apply a protective coating to the surface of the packaged items, but even these methods are not perfect and are expensive. It has the disadvantage of becoming

Therefore, the purpose of the present invention is to sufficiently protect the packaged items by preventing damage to the surface of the packaged items or adhesion of foreign substances to the surfaces, and at the same time, using a protective sheet or the like. To provide a storage container for electronic parts, etc., which does not cause an increase in cost unlike when a protective coating is applied.

[Structure of the invention] (Means for solving the problem) The storage container for electronic components, etc. of the present invention consists of a container for storing an object to be packed, such as an electronic component, and a lid to cover the container. It is characterized by a structure in which a protrusion having a sloped part that widens toward the outer circumference of the object is integrally provided, and the sloped part is brought into contact with the outer circumferential corner part of the object to be packed when the lid is attached.

(Function) According to the above means, when the object to be packed is housed in the container and the lid is covered, the sloped portion forming the protrusion of the lid comes into contact with the outer periphery of the object from above. It becomes a form. Therefore, the object to be packaged is in a state in which vertical rattling and horizontal displacement are restricted by the sloped portion, and the object is securely held within the receiver. In addition, although rattling can be reliably prevented in this way, the sloped part of the lid comes into contact with the periphery of the object rather than the top surface of the object, so it is possible to damage the surface of the object or cause foreign matter to come into contact with the surface. It does not cause any adhesion.

(Embodiment) A first embodiment of the present invention will be described below with reference to FIGS. 1 to 3. First, in FIGS. 1 and 2, reference numeral 10 denotes a receiver, which is formed by molding a thin plate of plastic, such as polystyrene or polyvinyl chloride, into a predetermined shape. Reference numeral 11 denotes a plurality of rectangular storage recesses for storing objects to be packed, which are arranged in rows and columns in the receiver 10, and a substantially rectangular bulge 12 is formed in the center of these recesses. Relief recesses 14 are formed in the lattice-shaped partition frame 13 left after forming the storage recess 11 in the receiver 10, located at the center of each side of the storage recess 11. In this embodiment, the electronic component 15 that is the object to be packaged is, for example, a thin film hybrid integrated circuit board. This thin film hybrid integrated circuit board 15 is housed in the housing recess 11 of the receiver 10, as shown in FIG. on the other hand,
The lid 16 shown in FIGS. 1 and 4 is also formed by molding a thin plate of plastic such as polystyrene or polyvinyl chloride into a predetermined shape, and has a peripheral wall portion extending diagonally downward on the outer periphery. 16a, and by fitting this peripheral wall part 16a to a peripheral wall part 10a formed in the same shape as the outer peripheral part of the receiver 10, the lid 16 can be attached to the receiver 10 without slipping. That's what I do. 17 is the lid 16
This is a protrusion formed to bulge downward corresponding to each relief recess 14 of the receiver 10, and this is a slope that widens toward the outer circumference of the thin film hybrid integrated circuit board 15 housed in the storage recess 11. It has a section 17a. In addition, 18 is the receiver 10 in the upper surface part of the lid 16.
This is a positioning protrusion formed at a position corresponding to the bulge 12 in the same shape as the bulge 12 so as to bulge upward.

When packing the thin film hybrid integrated circuit board 15, the thin film hybrid integrated circuit board 15 is placed on the upper side of the bulge 12 of the receiver 10, as shown in FIG. It is stored in the recess 11 and the lid 16 is placed over the receiver 10. As a result, the lid 16
The slope portion 17a of the protrusion 17 comes into contact with the edge corner of the outer periphery of the thin film hybrid integrated circuit board 15, and the thin film hybrid integrated circuit board 15 is pressed against the receiver 10 side by the protrusion 17. When stacking containers 10 with lids 16 attached in this manner in multiple tiers, the inner and lower surfaces of the bulging portions 12 of the receptors 10 must be fitted into the positioning protrusions 17 of the lower lid 16. As a result, the lower lid 16 and the upper receiver 10 are kept in a non-slip state, and as a result, the spaces between each stage are kept in a non-slip state.

According to this embodiment having the above configuration, when the lid 16 is attached to the thin film hybrid integrated circuit board 15, the outer periphery edge corner portion is pressed down by the slope portion 17a of the protrusion 17 to restrict movement, and the circuit pattern formed by the thin film is The lid 16 does not come into contact with the upper surface side where passive elements, metallized parts for mounting semiconductor elements, etc. are formed. Therefore,
It is possible to reliably prevent circuit patterns, metallized parts for mounting semiconductor elements, etc. from being scratched and mechanically damaged even if they are subjected to vibrations during transportation, and the receiver 10 and lid 16 can be molded, for example, from plastic. The mold release agent used during molding is
Even if there is a situation where the mold release agent remains attached to the thin film hybrid integrated circuit board 15, it will not adhere to the upper surface side where the circuit pattern, passive elements, metallized parts for mounting semiconductor elements, etc. are formed. First, there is no problem of deterioration of bonding properties or deterioration of characteristics. This makes it possible to eliminate the need for a protective sheet or protective coating to prevent adverse effects on the thin film hybrid integrated circuit board 15, thereby reducing costs. Moreover, since the outer edge corner of the thin film hybrid integrated circuit board 15 is held down by the slope part 17a, it is possible to reliably prevent movement in the lateral direction, unlike simply holding down by a protrusion. The protection of the integrated circuit board 15 becomes even more reliable.

FIG. 4 shows a second embodiment of the present invention, which differs from the first embodiment in that the bulge 19 located approximately in the center of the storage recess 11 of the receiver 10 is bulged downward. and lid 1 correspondingly.
The positioning protrusion 20 of No. 6 is also formed to bulge downward. This also produces the same effects as the first embodiment.

FIG. 5 shows a third embodiment of the present invention, in which the first
The difference from the embodiment is that the bulging portion 21 of the storage recess 11
is formed into a large size, and the inner and lower surfaces of this bulging portion 21 are covered with the lid 1.
The second embodiment is designed so that it can be fitted into the upwardly bulging portion formed between the protrusions 17 of No. 6, and other effects are similar to those of the first embodiment.

FIG. 6 shows a fourth embodiment of the present invention, in which the second
The difference from the embodiment is that a slope portion 11a that widens toward the outer circumference of the electronic component 15 is also formed on the inner bottom portion of the storage recess 11 near the outer circumference. According to this, since the lower surface of the electronic component 15 can be received at the outer peripheral ridge corner, the lower surface side can be reliably protected, and other points have the same effects as the first embodiment.

FIG. 7 shows a fifth embodiment of the present invention, which differs from the previous embodiments in that the receiver 10 can also be used as a lid. For this purpose, the side surface of the bulging portion 21 of the storage recess 11 is inclined so as to widen toward the outer circumferential side of the electronic component 15.
1a, and this sloped portion 21a is the lower receiver 1.
It is made to come into contact with the outer periphery edge corner of the electronic component 15 housed in the housing. If you configure it like this,
While the receiver 10 can also be used as a lid, the first
As in the embodiment, the electronic components 15 can be reliably protected.

In addition, in each of the above embodiments, the receiver 10 and the lid 16
Although it is formed from a thin plastic plate, the present invention is not limited thereto, and may be formed from a thin metal plate such as aluminum, or a material with a certain degree of thickness may be used. In addition, the present invention is not limited to the embodiments described above and shown in the drawings, but can be implemented with various modifications within the scope of the invention.

[Effects of the invention] As described above, in the present invention, the lid is integrally provided with a protrusion having a sloped portion that widens toward the outer periphery of the object to be packed, and when the lid is attached, the sloped portion is attached to the object to be packed. Since the package is brought into contact with the outer ridge corner, which has less impact on the objects, the objects to be packaged are prevented from shaking vertically and shifting from side to side by the slopes that come into contact with them while avoiding the top surface of the objects. This has an excellent practical effect of being able to prevent damage and characteristic deterioration of electronic components without increasing costs.

[Brief explanation of the drawing]

1 to 3 show a first embodiment of the present invention, in which FIG. 1 is a longitudinal cross-sectional view showing the electronic components in a stored state, FIG. 2 is a perspective view showing the receiver, and FIG. 3 is a view of the lid. FIG. 4 is a schematic vertical cross-sectional view showing the second embodiment of the present invention in a state in which electronic components are stored, FIG. 5 is a view corresponding to FIG. 4 showing the third embodiment, and FIG. FIG. 7 is a diagram equivalent to FIG. 4 showing the fourth embodiment, FIG. 7 is a diagram equivalent to FIG. 4 showing the fifth embodiment, and FIG. 8 is a diagram equivalent to FIG. 4 showing a conventional example. In the drawing, 10 is a receptor, 11 is a storage recess, 15
16 is a thin film hybrid integrated circuit board (packaged item), 16 is a lid,
17 is a protrusion, and 17a and 21a are sloped portions.

Claims (1)

[Scope of utility model registration request] A container formed by molding any material into a predetermined shape and comprising a receiver for storing an object to be packaged such as an electronic component, and a lid to be placed over the receiver, wherein a sloped portion of the lid that widens toward the outer periphery of the object to be packaged. 1. A storage container for electronic components, etc., characterized in that a protrusion having a projection is integrally provided, and when the lid is attached, the slope portion is brought into contact with an outer periphery corner portion of the object to be packed.