JPS61156674U - - Google Patents
Info
- Publication number
- JPS61156674U JPS61156674U JP4030885U JP4030885U JPS61156674U JP S61156674 U JPS61156674 U JP S61156674U JP 4030885 U JP4030885 U JP 4030885U JP 4030885 U JP4030885 U JP 4030885U JP S61156674 U JPS61156674 U JP S61156674U
- Authority
- JP
- Japan
- Prior art keywords
- lid
- receiver
- packaged
- outer periphery
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Stackable Containers (AREA)
- Closures For Containers (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図乃至第３図は本考案の第１実施例を示し
、第１図は電子部品の収納状態で示す縦断面図、
第２図は受容器を示す斜視図、第３図は蓋の斜視
図、第４図は本考案の第２実施例を示す電子部品
の収納状態での概略的縦断面図、第５図は第３実
施例を示す第４図相当図、第６図は第４実施例を
示す第４図相当図、第７図は第５実施例を示す第
４図相当図、第８図は従来例を示す第４図相当図
である。
図面中、１０は受容器、１１は収納凹部、１５
は薄膜混成集積回路基板（被梱包物）、１６は蓋
、１７は突部、１７ａ，２１ａは斜面部である。
1 to 3 show a first embodiment of the present invention, and FIG. 1 is a longitudinal cross-sectional view showing electronic components in a stored state;
Fig. 2 is a perspective view of the receiver, Fig. 3 is a perspective view of the lid, Fig. 4 is a schematic vertical sectional view of the second embodiment of the present invention in a state in which electronic components are stored, and Fig. 5 is a perspective view of the lid. 4 shows the third embodiment, FIG. 6 shows the fourth embodiment, FIG. 4 shows the fifth embodiment, FIG. 8 shows the conventional example. FIG. 4 is a diagram corresponding to FIG. In the drawing, 10 is a receiver, 11 is a storage recess, 15
16 is a lid, 17 is a protrusion, and 17a and 21a are sloped portions.
Claims (1)
品等の被梱包物を収納する受容器及びこれに被せ
る蓋から成るものにおいて、前記蓋に前記被梱包
物の外周側に向つて広がる斜面部を有する突部を
一体に設け、前記蓋の被着時、前記斜面部を前記
被梱包物の外周稜角部に接触させるようにしたこ
とを特徴とする電子部品等の収納容器。 A container formed by molding any material into a predetermined shape and comprising a receiver for storing an object to be packaged such as an electronic component, and a lid to be placed over the receiver, wherein a sloped portion of the lid that widens toward the outer periphery of the object to be packaged. 1. A storage container for electronic components, etc., characterized in that a protrusion having a projection is integrally provided, and when the lid is attached, the slope portion is brought into contact with an outer periphery corner portion of the object to be packed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4030885U JPH0427819Y2 (en) | 1985-03-20 | 1985-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4030885U JPH0427819Y2 (en) | 1985-03-20 | 1985-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61156674U true JPS61156674U (en) | 1986-09-29 |
| JPH0427819Y2 JPH0427819Y2 (en) | 1992-07-03 |
Family
ID=30549075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4030885U Expired JPH0427819Y2 (en) | 1985-03-20 | 1985-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427819Y2 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000062749A (en) * | 1998-08-14 | 2000-02-29 | Kokuyo Co Ltd | Storage case |
| JP2002002695A (en) * | 2000-06-15 | 2002-01-09 | Kyocera Corp | Substrate storage tray and substrate packaging body using the same |
| JP2002370744A (en) * | 2001-06-15 | 2002-12-24 | Fujitsu Kasei Kk | Transport tray |
| JP2011189974A (en) * | 2010-03-16 | 2011-09-29 | Ngk Spark Plug Co Ltd | Tray for wiring substrate and container for wiring substrate |
| JP2012012089A (en) * | 2010-07-02 | 2012-01-19 | Fujitsu Semiconductor Ltd | Storage container for electronic device |
| JP2012099631A (en) * | 2010-11-02 | 2012-05-24 | Fujitsu Semiconductor Ltd | Semiconductor chip tray, and method of conveying semiconductor chip |
| KR200463094Y1 (en) * | 2007-09-17 | 2012-10-16 | (주)엘지하우시스 | Portable case of receiving handle for windows and door |
| JP2013184713A (en) * | 2012-03-06 | 2013-09-19 | Mitsubishi Electric Corp | Storage container |
| JP2017069444A (en) * | 2015-09-30 | 2017-04-06 | 東京応化工業株式会社 | Substrate case, housing section, and substrate transporter |
| CN114291424A (en) * | 2020-10-07 | 2022-04-08 | 颀邦科技股份有限公司 | Storage structure for tape packaging and carrier tray thereof |
-
1985
- 1985-03-20 JP JP4030885U patent/JPH0427819Y2/ja not_active Expired
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000062749A (en) * | 1998-08-14 | 2000-02-29 | Kokuyo Co Ltd | Storage case |
| JP2002002695A (en) * | 2000-06-15 | 2002-01-09 | Kyocera Corp | Substrate storage tray and substrate packaging body using the same |
| JP2002370744A (en) * | 2001-06-15 | 2002-12-24 | Fujitsu Kasei Kk | Transport tray |
| KR200463094Y1 (en) * | 2007-09-17 | 2012-10-16 | (주)엘지하우시스 | Portable case of receiving handle for windows and door |
| JP2011189974A (en) * | 2010-03-16 | 2011-09-29 | Ngk Spark Plug Co Ltd | Tray for wiring substrate and container for wiring substrate |
| JP2012012089A (en) * | 2010-07-02 | 2012-01-19 | Fujitsu Semiconductor Ltd | Storage container for electronic device |
| JP2012099631A (en) * | 2010-11-02 | 2012-05-24 | Fujitsu Semiconductor Ltd | Semiconductor chip tray, and method of conveying semiconductor chip |
| JP2013184713A (en) * | 2012-03-06 | 2013-09-19 | Mitsubishi Electric Corp | Storage container |
| JP2017069444A (en) * | 2015-09-30 | 2017-04-06 | 東京応化工業株式会社 | Substrate case, housing section, and substrate transporter |
| CN114291424A (en) * | 2020-10-07 | 2022-04-08 | 颀邦科技股份有限公司 | Storage structure for tape packaging and carrier tray thereof |
| KR20220046466A (en) * | 2020-10-07 | 2022-04-14 | 칩본드 테크놀러지 코포레이션 | Storage device for flexible circuit packages and carrier thereof |
| JP2022061949A (en) * | 2020-10-07 | 2022-04-19 | ▲き▼邦科技股▲分▼有限公司 | Accommodation device for tape carrier package and carrier thereof |
| CN114291424B (en) * | 2020-10-07 | 2023-09-01 | 颀邦科技股份有限公司 | Storage structure of coiled tape package and carrying disc thereof |
| US11792923B2 (en) | 2020-10-07 | 2023-10-17 | Chipbond Technology Corporation | Storage device for flexible circuit packages and carrier thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0427819Y2 (en) | 1992-07-03 |
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