TWI690753B - Display panel and method of fabricating the same - Google Patents

Abstract

A display panel having a display region and a peripheral region includes an active device array substrate, an isolation structure layer and a light emitting structure layer. The isolation structure layer is disposed on the active device array substrate and defines a plurality of first recesses disposed in the display region. The light emitting structure layer includes a first dummy material part, a second dummy material part and a plurality of light emitting material patterns. The light emitting material patterns are respectively disposed in the first recesses. The first dummy material part and the second dummy material part are disposed in the peripheral region and respectively positioned at a first side and a second side of the display region. A first material edge of the first dummy material part farthest away from the display region and the first side of the display region are separated by a first distance. A second material edge of the second dummy material part farthest away from the display region and the second side of the display region are separated by a second distance. The first distance is different from the second distance. A method of fabricating the display panel is also provided.

Description

Display panel and its manufacturing method

The present invention relates to a display panel and a manufacturing method thereof, and particularly to a self-luminous display panel and a manufacturing method thereof.

In recent years, organic light-emitting diode (Organic light-emitting diode, OLED) display panels have gradually attracted various technologies due to their high color saturation, fast response, and high contrast performance compared to current mainstream liquid crystal display panels. The investment vision of big factories. However, under the circumstances that its manufacturing cost is high and its service life cannot compete with current mainstream displays, even if the OLED display panel has the above-mentioned excellent display quality, the market share on the consumer side cannot be significantly improved.

In order to seek a lower-cost manufacturing method, the development of production equipment and related materials is one of the efforts of many manufacturers. Among them, the use of inkjet printing (Ikjet printing, IJP) technology to make a luminescent material layer is one of the research priorities. Since the luminescent material needs to be dropped or injected into the corresponding groove through the printing head (printing head), the luminescent material needs to be evenly distributed in a suitable solvent in order to eject. However, in the process of inkjet printing, the droplets that have been sprayed on the substrate will continue to evaporate the solvent, so that the droplets sprayed in different regions in sequence have different degrees of volatilization, resulting in the formation of the luminescent material layer in different regions. The film thickness is also different, which further affects the uniformity of light emission of the display panel. Therefore, how to overcome the above-mentioned technical bottlenecks is an issue that the technology plant is desperately trying to solve.

The invention provides a display panel with good luminous uniformity.

The invention provides a method for manufacturing a display panel, which has a high production yield.

The display panel of the present invention has a display area and a peripheral area surrounding the display area. The display panel includes an active element array substrate, an isolation structure layer, and a light emitting structure layer. The isolation structure layer is disposed on the active device array substrate. The isolation structure layer defines a plurality of first grooves, and the plurality of first grooves are disposed in the display area. The luminescent material layer is disposed on the active device array substrate. The light emitting structure layer includes a first dummy material portion, a second dummy material portion, and a plurality of light emitting material patterns. The plurality of luminescent material patterns are respectively disposed in the plurality of first grooves. The first dummy material portion is disposed in the peripheral area, and the first dummy material portion is located on the first side of the display area. The second dummy material portion is disposed in the peripheral area, and the second dummy material portion is located on the second side of the display area. The first side and the second side are opposite sides of the display area in the first direction. The first material edge of the first dummy material part farthest from the display area is separated from the first side of the display area by a first distance, and the second material edge farthest from the display area is separated from the second side of the display area by a second distance Distance, and the first distance is different from the second distance.

The manufacturing method of the display panel of the present invention includes providing an active element array substrate, forming an isolation structure material layer on the active element array substrate, performing an etching step, and removing multiple portions of the isolation structure material layer overlapping the display area to form a definition The isolation structure layers of the plurality of first grooves and the inkjet printing process are performed on the active device array substrate. The active device array substrate has a display area and a peripheral area surrounding the display area. The inkjet printing process includes spraying the first luminescent material droplets in the peripheral area, moving the nozzle in the first direction so that the nozzle enters the display area from the first side of the display area, and spraying the second luminescent material droplets and the first Three luminescent material droplets, and continue to move the spray head in the first direction, so that the spray head leaves the display area from the second side of the display area and sprays fourth luminescent material droplets in the peripheral area. The second luminescent material droplets and the third luminescent material droplets are sprayed into two of the first grooves that are closest to the first side and the second side, respectively. The distance between the first luminescent material droplet and the second luminescent material droplet is greater than the distance between the third luminescent material droplet and the fourth luminescent material droplet.

In an embodiment of the invention, the light-emitting structure layer of the display panel further includes a third dummy material portion and a fourth dummy material portion. The third dummy material portion is disposed in the peripheral area and located on the third side of the display area. The fourth dummy material portion is disposed in the peripheral area and located on the fourth side of the display area. The third side and the fourth side are opposite sides of the display area in the vertical first direction. The third material edge of the third dummy material portion farthest from the display area is separated from the third side of the display area by a third distance, and the fourth material edge of the fourth dummy material portion farthest from the display area is separated from the fourth side of the display area by a fourth Distance, and the third distance is different from the fourth distance.

In an embodiment of the invention, the light-emitting structure layer of the display panel further includes a third dummy material portion and a fourth dummy material portion. The third dummy material portion is disposed in the peripheral area and located on the first side of the display area. The fourth dummy material portion is disposed in the peripheral area and located on the second side of the display area. The third material edge of the third dummy material portion farthest from the display area is separated from the first side of the display area by a third distance, and the fourth material edge of the fourth dummy material portion farthest from the display area is separated from the second side of the display area by a fourth distance. The third distance is smaller than the fourth distance, and the first distance is larger than the second distance.

In an embodiment of the invention, the isolation structure layer of the display panel is located between the first dummy material portion and the active device array substrate, and the isolation structure layer is located between the second dummy material portion and the active device array substrate.

In an embodiment of the invention, at least one of the first dummy material portion and the second dummy material portion of the display panel partially overlaps the isolation structure layer.

In an embodiment of the invention, the isolation structure layer of the display panel further defines a plurality of second grooves and a plurality of third grooves. The plurality of second grooves and the plurality of third grooves are disposed in the peripheral area and respectively located on the first side and the second side of the display area. The first dummy material portion is disposed in the plurality of second grooves. The second dummy material portion is disposed in the plurality of third grooves. The widths of the vertical projections of the first grooves, the second grooves, and the third grooves on the active device array substrate in the first direction are substantially equal.

In an embodiment of the invention, the isolation structure layer of the display panel further defines a plurality of second grooves and a plurality of third grooves. The plurality of second grooves and the plurality of third grooves are disposed in the peripheral area and respectively located on the first side and the second side of the display area. The first dummy material portion is disposed in the plurality of second grooves. The second dummy material portion is disposed in the plurality of third grooves. The vertical projection of the area occupied by each first groove on the active device array substrate has a width in the first direction smaller than the area occupied by the plurality of second grooves and the plurality of third grooves respectively on the active device array substrate The width of the vertical projection in the first direction.

In an embodiment of the invention, the above-mentioned isolation structure layer of the display panel further defines a second groove surrounding the display area. The second groove has a first groove segment and a second groove segment located on opposite sides of the display area. The vertical projection of the area occupied by the first groove segment and the second groove segment on the active device array substrate has a first width and a second width in the first direction, respectively, and the first width is greater than the second width.

In an embodiment of the invention, the above-mentioned second groove of the display panel further has third groove segments and fourth groove segments located on opposite sides of the display area in the vertical first direction. The third groove segment and the fourth groove segment are respectively connected between the first groove segment and the second groove segment. The vertical projection of the area occupied by the third groove segment and the fourth groove segment on the active device array substrate has a third width and a fourth width perpendicular to the first direction, respectively, and the third width is greater than the fourth width.

In an embodiment of the invention, the above-mentioned display panel further includes a plurality of first electrodes and dummy conductive patterns. The plurality of first electrodes are respectively disposed in the plurality of first grooves, and each first electrode is located between the active device array substrate and the plurality of light emitting material patterns. The dummy conductive pattern is disposed in the peripheral area, and is located between at least one of the first dummy material portion and the second dummy material portion and the active device array substrate.

In an embodiment of the invention, the above-mentioned dummy conductive pattern of the display panel and the plurality of first electrodes belong to the same conductive layer.

In an embodiment of the invention, the above display panel further includes a flexible circuit board, which is bonded to the peripheral area of the active device array substrate. The first distance is greater than the second distance, and the flexible circuit board and the second dummy material portion are located on the second side of the display area.

In an embodiment of the invention, the first dummy material portion and the second dummy material portion of the above display panel each include a hole injection layer, a hole transport layer, a red light emitting layer, a green light emitting layer, a blue light emitting layer or Stacked layers of the above material combinations.

In an embodiment of the invention, each of the plurality of luminescent material patterns of the above-mentioned display panel includes a hole injection layer, a hole transmission layer and a light emitting layer stacked in sequence.

In an embodiment of the invention, the above-mentioned method for manufacturing a display panel further includes a drying and baking step to solidify the first luminescent material droplets into a first dummy material portion, and the fourth luminescent material droplets into a second dummy material Materials Department. The first material edge of the first dummy material part farthest from the display area is separated from the first side of the display area by a first distance, and the second material edge farthest from the display area is separated from the second side of the display area by a second distance Distance, and the first distance is different from the second distance. The first side and the second side are opposite sides of the display area in the first direction.

In an embodiment of the invention, the above-mentioned etching method of the manufacturing method of the display panel further includes removing two portions of the isolation structure material layer overlapping the peripheral area to form the second groove and the third groove. The first luminescent material droplets and the fourth luminescent material droplets are sprayed into the second groove and the third groove, respectively. The widths of the regions occupied by the first grooves, the second grooves, and the third grooves in the first direction are substantially equal.

In an embodiment of the present invention, the etching step of the above-mentioned method for manufacturing a display panel further includes removing a portion of the isolation structure material layer overlapping the peripheral region to form a second groove. The first luminescent material droplet is sprayed into the second groove. The width of the area occupied by the second groove in the first direction is greater than the width of the area occupied by each of the first grooves in the first direction.

In an embodiment of the invention, the method for manufacturing a display panel described above further includes forming a conductive pattern layer on the active device array substrate. The conductive pattern layer includes a plurality of first electrodes and dummy conductive patterns spaced apart from each other. The plurality of first electrodes are respectively arranged in the plurality of first grooves. The dummy conductive pattern is disposed in the peripheral area. The second luminescent material droplets and the third luminescent material droplets are respectively sprayed on two of the plurality of first electrodes, and the first luminescent material droplets and the fourth luminescent material droplets are sprayed on the dummy conductive pattern.

Based on the above, in the display panel of the embodiment of the present invention, the first dummy material portion and the second dummy material portion are arranged on the peripheral area, and the two dummy material portions are respectively located on the first side and the second side of the display area. In the method of manufacturing a display panel according to an embodiment of the present invention, the step of spraying luminescent material droplets on the first side of the display area to form the first dummy material portion is earlier than the luminescent material droplets sprayed on the second side of the display area To form a second dummy material portion. In addition, in the embodiment of the present invention, through the adjustment of the spraying step, the distance between the first material edge of the first dummy material portion furthest away from the display area and the first side is different from the second material edge of the second dummy material portion furthest away from the display area The distance from the second side. That is, the distribution width of the dummy material portion located on the first side of the display area is different from the distribution width of the dummy material portion located on the second side of the display area. In this way, it helps to improve the uniformity of the film thickness of the luminescent material layer disposed in the display area, thereby achieving better luminous uniformity, and improving production yield.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

As used herein, "about", "approximately", "essentially", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by those of ordinary skill in the art, considering The measurement in question and the specific number of errors associated with the measurement (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or for example within ±30%, ±20%, ±15%, ±10%, ±5%. Furthermore, the terms "approximately", "approximately", "essentially", or "substantially" as used herein can select a more acceptable range of deviation or standard deviation according to measurement properties, cutting properties, or other properties. All properties are applied without a standard deviation.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrical connection" may be that there are other components between the two components.

In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship between one element and another element, as shown. It should be understood that relative terms are intended to include different orientations of the device than those shown in the figures. For example, if the device in one drawing is turned over, the element described as being on the "lower" side of the other element will be oriented on the "upper" side of the other element. Thus, the exemplary term "lower" may include "lower" and "upper" orientations, depending on the particular orientation of the drawings. Similarly, if the device in one drawing is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "above" or "below" can include an orientation of above and below.

Exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Therefore, a change in the shape of the graph as a result of, for example, manufacturing techniques and/or tolerances can be expected. Therefore, the embodiments described herein should not be construed as being limited to the specific shapes of the regions as shown herein, but include deviations in shapes caused by manufacturing, for example. For example, an area shown or described as flat may generally have rough and/or non-linear characteristics. In addition, the acute angle shown may be round. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, and are not intended to limit the scope of the claims.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and the present invention, and will not be interpreted as idealized or excessive Formal meaning unless explicitly defined as such in this article.

Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

FIG. 1 is a schematic top view of a display panel 10 according to a first embodiment of the invention. 2A to 2F are schematic cross-sectional views of the manufacturing process of the display panel 10 of FIG. 1. 2A to 2F correspond to the section line A-A' and the section line B-B' of FIG. 1. It should be noted that, for the sake of clarity, FIG. 1 only shows the substrate 110, the isolation structure layer 181, the light emitting structure layer 200, and the flexible circuit board 250 of the display panel 10, and other possible components included in the display panel 10 will It is shown in FIGS. 2A to 2F. As can be seen from FIG. 1, the display panel 10 has a display area DA and a peripheral area PA surrounding the display area DA. The isolation structure layer 181 defines a plurality of first grooves in the display area DA. The plurality of first grooves includes, for example, grooves 181a and grooves 181b, and a plurality of second grooves and grooves are defined in the peripheral area PA A third groove, the plurality of second grooves include, for example, groove 181c, and the plurality of third grooves include, for example, groove 181d, where groove 181a and groove 181b in display area DA are located when display panel 10 performs display The area can emit light to present the picture. The manufacturing process of the display panel 10 shown in FIG. 1 will be exemplarily described below.

2A, first, an active device array substrate 100 is provided, wherein the active device array substrate 100 includes a substrate 110, a buffer layer 120, an active device T, a gate insulating layer 130, an interlayer insulating layer 140, an insulating layer 150, and a flat layer 160 . The active device T is disposed on the substrate 110 and has a gate G, a source S, a drain D, and a semiconductor pattern SC. The gate insulating layer 130 is disposed between the semiconductor pattern SC and the gate G. For example, in this embodiment, the gate G of the active device T can be selectively disposed above the semiconductor pattern SC to form a top-gate thin-film transistor (top-gate TFT), but the present invention does not This is the limit. According to other embodiments, the gate G of the active device T may also be disposed under the semiconductor pattern SC, that is, the gate G is located between the semiconductor pattern SC and the substrate 110 to form a bottom gate-type thin film transistor (bottom-gate) TFT). The buffer layer 120 is disposed between the substrate 110 and the active device T. In addition, the active element T is a component used to drive the display layer (for example, the light emitting structure layer 200) to display a picture. Therefore, it can be understood that the active element T is located in the display area DA of FIG. 1, and the peripheral area PA may not be active Element T.

In this embodiment, the semiconductor pattern SC may include a source region SR, a lightly doped source region LSR, a channel region CH, a lightly doped drain region LDR, and a drain region DR. The lightly doped source region LSR is located at the source Between the polar region SR and the channel region CH, the lightly doped drain region LDR is located between the channel region CH and the drain region DR, and the gate G overlaps the channel region CH of the semiconductor pattern SC, but the present invention does not use this Limited. According to other embodiments, the semiconductor pattern SC may include only the source region SR, the channel region CH, and the drain region DR.

The interlayer insulating layer 140 is disposed on the gate insulating layer 130 and covers the gate G of the active device T. The source S and the drain D of the active device T are disposed on the interlayer insulating layer 140 and overlap two different regions of the semiconductor pattern SC, respectively. In detail, the source S and the drain D of the active device T both penetrate the interlayer insulating layer 140 and the gate insulating layer 130 to electrically connect the source region SR and the drain region DR of the semiconductor pattern SC, respectively.

In this embodiment, the material of the semiconductor pattern SC is, for example, a low temperature poly-silicon (LTPS) semiconductor, that is, the active device T may be a low temperature poly-silicon thin film transistor (LTPS TFT). However, the invention is not limited to this. In other embodiments, the active element T may also be an amorphous silicon thin film transistor (a-Si TFT), a micro-Si thin film transistor (micro-Si TFT) or a metal Oxide transistor (Metal Oxide Transistor).

The insulating layer 150 covers the source S, the drain D of the active device T, and a part of the surface of the interlayer insulating layer 140, and may optionally have an opening 150a overlapping the drain D of the active device T. The flat layer 160 covers part of the surfaces of the insulating layer 150 and the drain D.

The gate electrode G, the source electrode S, the drain electrode D, the gate insulating layer 130, the interlayer insulating layer 140, the insulating layer 150, and the flat layer 160 can be any of those used in the display panel known to those skilled in the art. The gate, any source, any drain, any gate insulating layer, any interlayer insulating layer, any insulating layer and any flat layer are implemented, and the gate G, source S, drain D, The gate insulating layer 130, the interlayer insulating layer 140, the insulating layer 150, and the flat layer 160 can be formed by any method well known to those of ordinary skill in the art, so they are not described here.

As shown in FIG. 2A, a plurality of first electrodes 171 are formed on the active device array substrate 100, and the first electrodes 171 are arranged in the display area DA. A plurality of first electrodes 171 are disposed on the flat layer 160, and are electrically connected to the drain D of the corresponding active device T through the flat layer 160, respectively. Specifically, although FIG. 2A only shows one active element T for clarity, a plurality of active elements T may be formed on the substrate 110, and each first electrode 171 may be correspondingly connected to one of the active elements T. In some embodiments, the first electrode 171 is, for example, a light-transmissive electrode. The material of the light-transmissive electrode includes metal oxides, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide Substances, or other suitable oxides, or stacked layers of at least two of the above, but the invention is not limited thereto. In other embodiments, the first electrode 171 may also be a reflective electrode. The material of the reflective electrode includes metal, alloy, nitride of metal material, oxide of metal material, oxynitride of metal material, or other suitable materials. Materials, or stacked layers of metallic materials and other conductive materials.

Please refer to FIG. 2B. Next, an isolation structure material layer 180 is formed on the active device array substrate 100. The isolation structure layer 180 covers part of the surfaces of the first electrode 171 and the flat layer 160. 2C, after forming the isolation structure material layer 180, a patterning step is performed to remove the isolation structure material layer 180 overlapping multiple portions of the display area DA to form the isolation structure layer 181 and the isolation structure of the display panel 10 A plurality of first grooves (eg, groove 181a and groove 181b) defined by layer 181. The patterning step of this embodiment may also optionally include removing a plurality of portions of the isolation structure material layer 180 overlapping the peripheral area PA to form a plurality of second grooves (such as groove 181c) and a plurality of third recesses Groove (for example, groove 181d), but the invention is not limited thereto.

Following the above, the vertical projection of the area occupied by the groove 181a (or groove 181b), groove 181c, and groove 181d on the active device array substrate 100 has a width W1, a width W2, and a width W3 in the direction z, while the concave The width W2 of the groove 181c and the width W3 of the groove 181d may be selectively substantially equal to the width W1 of the groove 181a (or groove 181b). In this embodiment, both the groove 181c and the groove 181d in the peripheral area PA can extend through the isolation structure layer 181 and expose a part of the surface of the flat layer 160, and the groove 181a and the groove 181b in the display area DA also It extends through the isolation structure layer 181 and exposes a part of the surface of the first electrode 171.

As can be seen from FIG. 1, a plurality of grooves can be arranged on the substrate 110 in an array, and the plurality of grooves include, for example, grooves 181a, grooves 181b, grooves 181c, and grooves 181d. The groove 181a and the groove 181b are disposed in the display area DA and are respectively the first grooves of the first side DA-a and the second side DA-b that are closest to the display area DA. The groove 181c and the groove 181d are disposed in the peripheral area PA and respectively located on the first side DA-a and the second side DA-b of the display area DA, wherein the groove 181c is located on the first side DA-a of the display area DA Among the plurality of grooves, the second groove furthest away from the first side DA-a of the display area DA, the groove 181d is the farthest away from the display area DA among the plurality of grooves located on the second side DA-b of the display area DA The third groove of the second side DA-b. Specifically, all the grooves 181a and 181b are located in the display area DA and all the grooves 181c and 181d are not in the display area DA. The vertical projection area of the area occupied by each groove on the substrate 110 can be selectively the same, but the invention is not limited thereto.

After the patterning step is completed, an inkjet printing process is performed, and droplets to be formed into a light-emitting structure are sprayed in multiple grooves in sequence. For example, referring to FIG. 1, the inkjet printing process may start from one corner of the display panel 10, first traverse the width of the entire display panel 10 along the process path P1 and drip liquid into each groove on the process path P1 Droplets, and then perform the same process along the process path P2 until the width of the entire display panel 10 is traversed along the process path Pn and droplets are dropped into the grooves on the process path Pn, then the entire display panel 10 All of the grooves are filled with droplets. In this embodiment, the directions of two adjacent process paths (for example, process path P1 and process path P2) are the same, but in other embodiments, the directions of two adjacent process paths may be opposite.

In other words, please refer to FIG. 2D, the inkjet printing process of this embodiment, for example, sprays the first luminescent material droplet LD1, the second luminescent material liquid in the groove 181c, groove 181a, groove 181b and groove 181d in this order. The droplet LD2, the third luminescent material droplet LD3, and the fourth luminescent material droplet LD4. In detail, in the process of inkjet printing, the head HD carrying liquid droplets is sprayed in the groove 181c; then, the head HD is moved in the direction z so that the head HD moves from the first side DA of the display area DA -a enters the display area DA, and sprays in the groove 181a and the groove 181b; then continue to move the nozzle HD in the direction z, so that the nozzle HD leaves the display area DA from the second side DA-b of the display area DA and enters the periphery Area PA, then sprayed in the groove 181d. That is to say, the peripheral area PA between the first side DA-a of the display area DA and the edge of the active device array substrate 100 can be regarded as a pre-spray area, and this area is preferentially sprayed with droplets in the same process path. At the same time, the peripheral area PA between the second side DA-b of the display area DA and the edge of the active device array substrate 100 can be regarded as a tail spray area, and this area is the last spray droplet in the same process path.

It can be seen from FIG. 2D that the distance L1 between the first luminescent material droplet LD1 and the second luminescent material droplet LD2 is greater than the distance L2 between the third luminescent material droplet LD3 and the fourth luminescent material droplet LD4. In other words, the areas of the luminescent material droplets sprayed in the pre-spraying area and the tail spraying area are different, that is, the luminescent material droplets sprayed on the peripheral area PA exhibit an asymmetric distribution with respect to the display area DA. In detail, before the nozzle HD moves into the display area DA, the luminescent material droplets are sprayed in the peripheral area PA first, and the luminescent material droplets are discharged into the display area DA for spraying after being stabilized. In this way, it helps to improve the uniformity of the film formation of the light-emitting structure material in the display area DA after drying. It should be noted that, in this embodiment, the number of grooves 181c and grooves 181d located on the process path P1 and arranged in the direction z are exemplarily described by taking four and two as examples. Not limited to this.

In this embodiment, the materials of the first luminescent material droplets LD1, the second luminescent material droplets LD2, the third luminescent material droplets LD3, and the fourth luminescent material droplets LD4 may optionally include a light emitting structure material and a solvent, The light emitting structure materials include, for example, hole injection materials, hole transport materials, light emitting materials, electron transport materials, and electron injection materials. The solvent is, for example, a liquid that can be used to make the light emitting structure materials uniformly dispersed and have volatility.

Please refer to FIG. 2E. Next, drying and baking steps are carried out, so that the solvent dropped into or injected into the luminescent material droplets of each groove can be volatilized and removed, and the luminescent structure material is solidified to form the corresponding luminescent material layer 190. The thickness of the luminescent material layer 190 may gradually increase from the center to the edge, that is, the luminescent material layer 190 has a greater thickness at a portion near the groove edge than at a portion away from the groove edge.

As can be seen from FIG. 2F, the display panel 10 has a light emitting structure layer 200 formed on the active device array substrate 100. The light emitting structure layer 200 includes a plurality of light emitting material patterns 210 formed in a plurality of first grooves (for example, grooves 181a and grooves 181b) in the display area DA. In this embodiment, each light emitting material pattern 210 may include a hole injection layer 191, a hole transport layer 192, a light emitting layer 193, and an electron transport layer 194 that are sequentially stacked on the active device array substrate 100. In addition, the light emitting structure layer 200 further includes a first dummy material portion 211 and a second dummy material portion 212, wherein the first dummy material portion 211 can be selectively formed in a plurality of second grooves (for example, grooves 181c). The two dummy material portions 212 can be selectively formed in a plurality of third grooves (for example, groove 181d). In other words, the first dummy material portion 211 and the second dummy material portion 212 are respectively disposed on the first side of the display area DA DA-a and the second side DA-b.

Following the above, each of the first dummy material portion 211 and the second dummy material portion 212 may optionally include a hole injection layer 191, a hole transmission layer 192, a light emitting layer 193, and electrons sequentially stacked on the active device array substrate 100 Transport layer 194, but the invention is not limited to this. In some embodiments, the first dummy material portion 211 and the second dummy material portion 212 may also be a stack of the hole injection layer 191 and the hole transport layer 192, respectively Floor. In other embodiments, the first dummy material portion 211 and the second dummy material portion 212 may also be a stacked layer of a hole injection layer 191, a hole transport layer 192, and a plurality of light-emitting layers 193, of which a plurality of light-emitting layers 193 includes, for example, a red light-emitting layer, a blue light-emitting layer, and a green light-emitting layer.

In this embodiment, the hole injection layer 191, the hole transport layer 192, and the light-emitting layer 193 may each be formed by first dropping or injecting the corresponding light-emitting structure material into the isolation structure layer 181 as defined by the inkjet method. Multiple grooves, and then the dripped or injected material is dried and solidified to form a corresponding film layer. For example, the inkjet printing process includes first dropping the first luminescent material droplet LD1, the second luminescent material droplet LD2, and the fourth luminescent material LD4 each including the hole injection layer material into the groove 181c and the groove 181a, respectively And the groove 181d, and then the dripped material is dried and solidified to form a hole injection layer 191 corresponding to the first dummy material portion 211, the light emitting material pattern 210, and the second dummy material portion 212, respectively. It should be noted that the present invention does not limit the type and number of luminescent material layers formed by the inkjet printing process. Any person with ordinary knowledge in the technical field can adjust and adapt to the characteristics and requirements of the luminescent material process The number of luminescent material layers formed by inkjet printing.

In particular, in the manufacturing process of the display panel 10, the inkjet printing step of the hole transport layer 192 is performed after the hole injection layer 191 is cured, and the light emitting layer 193 is performed after the hole transport layer 192 is cured Inkjet printing step. As such, the thickness of each of the hole injection layer 191, the hole transport layer 192, and the light-emitting layer 193 can be controlled by the step of inkjet printing, and the materials of the hole injection layer 191, the hole transport layer 192, and the light-emitting layer 193 are mutually No contamination occurs during the inkjet printing process. In addition, the stacking of the hole injection layer 191, the hole transport layer 192, and the light emitting layer 193 is for illustrative purposes only. In other embodiments, the hole injection layer 191, the hole transport layer 192, and the light emitting layer 193 One or more other film layers can be optionally included between any two adjacent layers.

As shown in FIGS. 1 and 2F, in this embodiment, the first dummy material portion 211 is farthest from the first material edge 211a of the display area DA and is separated from the first side DA-a of the display area DA by a first distance d1, The second material edge 212 of the second dummy material part 212 farthest from the display area DA is separated from the second side DA-b of the display area DA by a second distance d2, and the first distance d1 is greater than the second distance d2. In addition, the light emitting structure layer 200 may optionally include a third dummy material portion 213 and a fourth dummy material portion 214. The third dummy material portion 213 and the fourth dummy material portion 214 are disposed in the peripheral area PA and located in the display area DA, respectively The third side DA-c and the fourth side DA-d, wherein the third side DA-c and the fourth side DA-d are opposite sides of the display area DA in the vertical direction z. For example, the third dummy material portion 213 is farthest from the third material edge 213a of the display area and the third side DA-c of the display area DA by a third distance d3, and the fourth dummy material portion 214 is farthest from the fourth of the display area The material edge 214a is separated from the fourth side DA-d of the display area DA by a fourth distance d4, and the third distance d3 can be selectively greater than the fourth distance d4, but the invention is not limited thereto.

On the other hand, after the inkjet printing process and the drying and baking step, the electron transport layer 194 may be formed on the light emitting layer 193 by, for example, thermal evaporation to complete the multilayer stacked light emitting structure 200. In some embodiments, the electron transport layer 194 can also be formed on the light-emitting layer 193 by inkjet printing similar to FIGS. 2D and 2E. Next, a second electrode 172 is formed on the isolation structure layer 181 and the light emitting structure 200. The second electrode 172 covers the isolation structure layer 181 and the light emitting structure 200. In detail, in this embodiment, the second electrode 172 may continuously extend from above the isolation structure layer 181, conform to the sidewall of the isolation structure layer 181, extend above the light emitting structure 200 and cover the light emitting structure 200. In particular, in some embodiments, the second electrode 172 may be formed in the same manner as the electron transport layer 194 on the light emitting structure 200, such as thermal evaporation. The second electrode 172 may have a substantially uniform film thickness.

Following the above, in this embodiment, the second electrode 172 is, for example, a light-transmitting electrode. The material of the light-transmitting electrode includes metal oxides, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, Aluminum zinc oxide, or other suitable oxide, or a stack of at least two of the above, but the invention is not limited thereto. In other embodiments, the second electrode 172 may also be a reflective electrode. The material of the reflective electrode includes metal, alloy, nitride of metal material, oxide of metal material, oxynitride of metal material, or other suitable materials. Materials, or stacked layers of metallic materials and other conductive materials. Thus, the display panel 10 of this embodiment is completed.

Referring to FIG. 1, the display panel 10 may optionally include a flexible circuit board 250 that is bonded to the peripheral area PA of the display panel 10. It should be noted that the number of flexible circuit boards 250 in this embodiment is exemplarily described by taking four as examples, which does not mean that the present invention is limited thereto. In this embodiment, the plurality of flexible circuit boards 250 may be disposed on the second side DA-b and the fourth side DA-d of the display area DA, respectively. In detail, the substrate 110 has an edge 110a, an edge 110b, an edge 110c located on the first side DA-a, the second side DA-b, the third side DA-c, and the fourth side DA-d of the display area DA, respectively. The edge 110d, wherein the edge 110a and the edge 110b are opposite edges of the substrate 110 in the direction z, and the edge 110c and the edge 110d are opposite edges of the substrate 110 in the vertical direction z.

Following the above, there is a first distance S1 between the edge 110 a of the substrate 110 and the first material edge 211 a of the first dummy material portion 211, which is larger than the edge 110 b of the substrate 110 and the second material edge 212 a of the second dummy material portion 212 There is a second spacing S2, and the first spacing S1 is greater than the second spacing S2. There is a third distance S3 between the edge 110c of the substrate 110 and the third material edge 213a of the third dummy material portion 213, and a fourth distance between the edge 110d of the substrate 110 and the fourth material edge 214a of the fourth dummy material portion 214 S4, and the third interval S3 can be selectively smaller than the fourth interval S4, but the invention is not limited thereto. In other words, the flexible circuit board 250 is bonded to an area in the peripheral area PA covered by fewer dummy material portions (for example, the peripheral area PA where the second dummy material portion 212 and the fourth dummy material portion 214 are arranged).

As can be seen from FIGS. 1 and 2F, the display panel 10 includes an active device array substrate 100, an isolation structure layer 181, a first electrode 171, a light emitting structure layer 200, and a second electrode 172. The isolation structure layer 181 defines a plurality of grooves in the display panel 10, and the light emitting structure layer 200 is filled in each groove. The light emitting structure layer 200 includes a plurality of light emitting material patterns 210, a first dummy material portion 211, and a second dummy material portion 212. The plurality of grooves include, for example, groove 181a, groove 181b, groove 181c, and groove 181d. The light emitting material patterns 210 filled in the groove 181a and the groove 181b are sandwiched between the first electrode 171 and the second electrode 172 and can emit light by driving the active element T to be used as a display element. Therefore, the area where the groove 181a and the groove 181b are located can be regarded as the display area DA. Neither the first dummy material portion 211 nor the second dummy material portion 212 filled in the groove 181c and the groove 181d is used as a display element. Therefore, the area where the groove 181c and the groove 181d are located can be regarded as the peripheral area PA, and the groove 181c and the groove 181d are respectively located on opposite sides of the display area DA. Here, the edge of the display area DA is defined by, for example, the outer edge of the outermost luminescent material pattern 210, or may be the outermost luminescent material pattern 210 and the adjacent first dummy material portion 211 or second dummy material portion The junction between 212.

In addition, since the light emitting layer 193 in the light emitting structure layer 200 can be made of an organic light emitting material, the display panel 10 is substantially an organic light emitting display panel. In this embodiment, for example, one of the first electrode 171 and the second electrode 172 is a light-transmissive electrode layer, and the other may be a light-transmissive electrode layer or a reflective electrode layer. The light emitting structure 200 includes a hole injection layer 191, a hole transport layer 192, a light emitting layer 193, and an electron transport layer 194 that are sequentially stacked on the first electrode 171. The display panel 10 of this embodiment is, for example, a top emission type display panel. However, the present invention is not limited to this, and according to other embodiments, the display panel 10 may also be a bottom emission type display panel.

3 is a schematic cross-sectional view of a display panel 11 according to a second embodiment of the invention. Please refer to FIG. 3. The difference between the display panel 11 of this embodiment and the display panel 10 of FIG. 2F is that the display panel 11 may optionally include a plurality of dummy conductive patterns 175. Each dummy conductive pattern 175 is disposed in a plurality of grooves in the peripheral area PA. In this embodiment, a part of the dummy conductive pattern 175 can be selectively disposed between the first dummy material portion 211 and the active device array substrate 100, and another part of the dummy conductive pattern 175 can be selectively disposed on the second dummy material Between the portion 212 and the active device array substrate 100, but the invention is not limited thereto. In other embodiments, the dummy conductive pattern 175 may only be disposed between the second dummy material portion 212 and the active device array substrate 100.

For example, in this embodiment, the manufacturing method of the display panel 11 may optionally further include forming a conductive pattern layer on the active device array substrate 100, the conductive pattern layer including a plurality of first electrodes 171 spaced apart from each other Multiple dummy conductive patterns 175. In other words, the dummy conductive pattern 175 and the first electrode 171 can selectively belong to the same conductive layer, but the invention is not limited thereto. In other embodiments, the dummy conductive pattern 175 and the first electrode 171 may also belong to different conductive layers. In the inkjet printing process, the first luminescent material droplet LD1 and the fourth luminescent material droplet LD4 are sprayed on the corresponding dummy conductive pattern 175, while the second luminescent material droplet LD2 and the third luminescent material droplet LD3 are sprayed on Corresponding to the first electrode 171. The difference between the dummy conductive pattern 175 and the first electrode 171 is that the dummy conductive pattern 175 is not connected to any active element and the first electrode 171 is connected to the corresponding active element T. Therefore, the light-emitting structure layer formed after the light-emitting material droplets on the first electrode 171 are dried and solidified can emit light under driving to realize the display function.

4 is a schematic cross-sectional view of a display panel 12 according to a third embodiment of the invention. Referring to FIG. 4, the difference between the display panel 12 of this embodiment and the display panel 10 of FIG. 2F is that the second groove (eg, groove 181c-1) and the third groove (eg, groove 181d- 1) The width W4 and the width W5 of the vertical projection of the area occupied by the respective areas on the active device array substrate 100 in the direction z can be selectively greater than the area occupied by the first groove (for example, groove 181a, groove 181b) in the active The width W1 of the vertical projection on the element array substrate 100 in the direction z. In addition, the width W4 of the groove 181c-1 can be selectively greater than the width W5 of the groove 181d-1, but the invention is not limited thereto. In addition, during the manufacturing process, the pitch of the nozzles of the luminescent material droplets may correspond to the pitch of the grooves in the display area DA, and the widths of the grooves 181c-1 and 181d-1 may be larger than those in the display area DA The spacing of the grooves. Therefore, several nozzles can all fill the luminescent material droplets in the groove 181c-1 and the groove 181d-1, and the luminescent material droplets in the groove 181a and the groove 181b can be dripped by different nozzles.

FIG. 5 is a schematic top view of a display panel 20 according to a fourth embodiment of the invention. FIG. 6 is a schematic cross-sectional view of the display panel 20 of FIG. 5. Fig. 6 corresponds to section line C-C' and section line D-D' of Fig. 5. It should be noted that, for the sake of clarity, FIG. 5 only shows the substrate 110, the isolation structure layer 181-1, the light-emitting structure layer 200, and the flexible circuit board 250 of the display panel 20, while the display panel 20 includes other possibilities. The components will be shown in FIG. 5.

5 and 6, the difference between the display panel 20 of this embodiment and the display panel 10 of FIG. 1 is that the isolation structure layer 181-1 of the display panel 20 defines a groove 181e surrounding the display area DA in the peripheral area PA . The groove 181e has a first groove segment 181e-1 and a second groove segment 181e-2 located on opposite sides of the display area DA in the direction z, and the area occupied by the first groove segment 181e-1 is in the active device The vertical projection on the array substrate 100 has a width W6 in the direction z greater than the width W7 on the active element array substrate 100 of the area occupied by the second groove segment 181e-2 in the direction z. In addition, in this embodiment, the groove 181e further has third groove segments 181e-3 and fourth groove segments 181e-4 located on opposite sides of the display area DA in the vertical direction z, and the third groove The vertical projection of the area occupied by the segment 181e-3 on the active device array substrate 100 has a width W8 in the vertical direction z that can be selectively greater than the area occupied by the fourth groove segment 181e-4 on the active device array substrate 100 The vertical projection of has a width W9 in the vertical direction z. That is to say, the groove 181e located in the peripheral area PA is an annular groove surrounding the display area DA, and the sections of the annular groove on different sides have different widths. In the manufacturing process, when the light-emitting structure layer is to be manufactured by an ink-jet process, the nozzle of the ink-jet device may start to instill the droplets of the luminescent material from the wider section of the groove 181e, and then enter the display area DA for the infusion step .

7 is a schematic top view of a display panel 30 according to a fifth embodiment of the invention. FIG. 8 is a schematic cross-sectional view of the display panel 30 of FIG. 7. Fig. 8 corresponds to section line E-E' and section line F-F' of Fig. 7. It should be noted that, for the sake of clarity, FIG. 7 only shows the substrate 110, the isolation structure layer 181-2, the light-emitting structure layer 200A, and the flexible circuit board 250 of the display panel 30, while the display panel 30 includes other possibilities. The components will be shown in FIG. 8.

7 and 8, the difference between the display panel 30 of this embodiment and the display panel 10 of FIG. 1 is that the first dummy material portion 211 and the second dummy material portion 212 of the display panel 30 of this embodiment are disposed in isolation The upper surface 181s of the structure layer 181-2, in other words, the isolation structure layer 181-2 is located between the first dummy material portion 211 and the active device array substrate 100, and the isolation structure layer 181-2 is located between the second dummy material portion 212 and the active device Between the array substrates 100. In addition, in this embodiment, the third dummy material portion 213 and the fourth dummy material portion 214 may also be disposed on the isolation structure layer 181-2, and the third dummy material portion 213 and the fourth dummy material portion 214 are each connected to Between the first dummy material portion 211 and the second dummy material portion 212. That is, the light emitting structure layer 200A of the display panel 30 has a dummy material portion surrounding the periphery of the display area DA in the peripheral area PA, and the isolation structure layer 181-2 may be continuous without being patterned with a plurality of grooves in the peripheral area PA Extends along a circular path around the display area DA, so that the installation surfaces of the first dummy material portion 211, the second dummy material portion 212, the third dummy material portion 213, and the fourth dummy material portion 214 are all higher than the light emitting material pattern 210 Setting surface.

9 is a schematic cross-sectional view of a display panel 31 according to a sixth embodiment of the invention. 9, the difference between the display panel 31 of this embodiment and the display panel 30 of FIG. 8 is that the first dummy material portion 211 of the display panel 31 partially overlaps the isolation structure layer 181-3, that is, the first The portion of the dummy material portion 211 that does not overlap the isolation structure layer 181-3 in a direction perpendicular to the substrate 110 directly covers a part of the surface of the flat layer 160. In some embodiments, the second dummy material portion 212 may also partially overlap the isolation structure layer.

10 is a schematic cross-sectional view of a display panel 32 according to a seventh embodiment of the invention. Referring to FIG. 10, the difference between the display panel 32 of this embodiment and the display panel 30 of FIG. 8 is that the first dummy material portion 211 and the second dummy material portion 212 of the light-emitting structure layer 200A of the display panel 32 in the peripheral area PA are both The first dummy material portion 211 and the second dummy material portion 212 are directly covered on the flat layer 160 and are disposed between the outer contour of the isolation structure layer 181-4 and the edge of the active device array substrate 100.

FIG. 11 is a schematic top view of a display panel 40 according to an eighth embodiment of the invention. It should be noted that, for the sake of clarity, FIG. 11 only shows the substrate 110 of the display panel 40, the isolation structure layer 181-5, the light emitting structure layer 200B, and the flexible circuit board 250. 11, the difference between the display panel 40 of this embodiment and the display panel 10 of FIG. 1 is that the third dummy material portion 213 and the fourth dummy material portion 214 of the display panel 40 are respectively disposed on the first side of the display area DA DA-a and the second side DA-b. The third material edge 213a of the third dummy material portion 213 is separated from the first side DA-a of the display area DA by a third distance d3-1, and the fourth material edge 214a of the fourth dummy material portion 214 and the second of the display area DA The side DA-b is separated by a fourth distance d4-1, and the third distance d3-1 is smaller than the fourth distance d4-1.

From another point of view, in the inkjet printing process of the display panel 40, the directions of two adjacent process paths (for example, the process path P1 and the process path P2) are opposite to each other, that is, the inkjet printing of the display panel 40 In the process, droplets are dropped into multiple grooves by spraying back and forth. In detail, the inkjet printing process can start from a corner of the display panel 40, first move the nozzle HD in the direction z so that it traverses the width of the display panel 40 and drop droplets into each groove on the process path P1, and then Move the nozzle HD in the opposite direction of the direction z and perform the same process until the nozzle HD is moved in the opposite direction of the direction z so that it traverses the entire width of the display panel 40 and drops liquid into each groove on the process path Pn After dropping, all the grooves on the entire display panel 40 can be filled with liquid drops.

In addition, in this embodiment, the light emitting structure layer 200B further includes a fifth dummy material portion 215 and a sixth dummy material portion 216. The fifth dummy material portion 215 and the sixth dummy material portion 216 are arranged in the peripheral area PA, and are located on the third side DA-c and the fourth side DA-d of the display area DA, respectively. The fifth dummy material portion 215 is farthest from the fifth material edge 215a of the display area DA and the third side DA-c of the display area DA by a fifth distance d5, and the sixth dummy material portion 216 is farthest from the sixth material edge of the display area DA 216a is separated from the fourth side DA-d of the display area DA by a sixth distance d6, and the fifth distance d5 and the sixth distance d6 may be substantially equal. For example, the fifth distance d5 and the sixth distance d6 can be selectively smaller than the first distance d1 and the fourth distance d4-1, therefore, the plurality of flexible circuit boards 250 can be selectively disposed in the third of the display area DA The side DA-c and the fourth side DA-d, that is, the areas in the peripheral area PA covered by fewer dummy material portions, but the present invention is not limited to this.

In summary, in the display panel of the embodiment of the present invention, the first dummy material portion and the second dummy material portion are arranged on the peripheral area, and these two dummy material portions are respectively located on the first side and the second side of the display area And the distance between the first material edge of the first dummy material portion farthest from the display area and the first side is different from the distance between the second material edge of the second dummy material portion farthest from the display area and the second side. In this way, it helps to improve the uniformity of the film thickness of the luminescent material layer disposed in the display area, thereby achieving better uniformity of luminescence. In addition, in the manufacturing method of the display panel according to the embodiment of the present invention, the luminescent material droplets are sprayed into the display area after the luminescent material droplets are pre-sprayed in the peripheral area. On the same manufacturing path, the luminescent material is sprayed earlier in the display area The side of the droplet is the first side, and the side of the luminescent material droplet that is sprayed later and the side opposite to the first side is the second side. In the peripheral area, the distance between the luminescent material droplets sprayed between the first side and the edge of the display panel furthest from the display area is greater than the distance between the first side and the edge of the display panel The distance between the light-emitting material droplets farthest from the display area and the second side. That is to say, the pre-spraying area for spraying luminescent material droplets in the peripheral area before entering the display area is larger, and the inkjet process pre-stabilizes the parameters of the droplets before spraying the droplets in the display area, which helps to improve the spraying In the case where the spraying amount of the luminescent material droplets in the display area is not uniform, the uniformity of the film thickness of the luminescent material layer located in the display area is improved, thereby improving the production yield.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

10~12, 20, 30~32, 40 ‧‧‧ display panel 100‧‧‧Active element array substrate 110‧‧‧ substrate 110a~110d‧‧‧edge 120‧‧‧buffer layer 130‧‧‧Gate insulation 140‧‧‧Interlayer insulation 150‧‧‧Insulation 150a‧‧‧ opening 160‧‧‧flat layer 171‧‧‧First electrode 172‧‧‧Second electrode 175‧‧‧Dummy conductive pattern 180‧‧‧Isolated structural material layer 181, 181-1~181-5‧‧‧ isolation structure layer 181a~181c, 181c-1, 181d, 181d-1, 181e‧‧‧groove 181e-1~181e-4‧‧‧The first groove section ~ the fourth groove section 181s‧‧‧upper surface 190‧‧‧luminescent material layer 191‧‧‧hole injection layer 192‧‧‧Electric tunnel transmission layer 193‧‧‧luminous layer 194‧‧‧Electronic transmission layer 200, 200A, 200B ‧‧‧ light emitting structure layer 210‧‧‧luminescent material pattern 211~216‧‧‧The first dummy materials department ~ the sixth dummy materials department 211a~216a‧‧‧The first material edge~the sixth material edge 250‧‧‧flexible circuit board CH‧‧‧Channel area D‧‧‧ Jiji DA‧‧‧Display area DA-a~DA-d‧‧‧First to fourth sides DR‧‧‧Drainage d1‧‧‧ First distance d2‧‧‧Second distance d3, d3-1‧‧‧third distance d4, d4-1‧‧‧ fourth distance d5‧‧‧ fifth distance d6‧‧‧Sixth distance G‧‧‧Gate HD‧‧‧ nozzle LDR‧‧‧Lightly doped drain region L1, L2‧‧‧Distance LD1~LD4‧‧‧‧Drop of the first luminescent material~Drop of the fourth luminescent material LSR‧‧‧Lightly doped source region PA‧‧‧ surrounding area P1, P2, Pn‧‧‧ process route S‧‧‧Source SC‧‧‧Semiconductor pattern SR‧‧‧Source S1~S4‧‧‧First pitch~Fourth pitch T‧‧‧Active components W1~W9‧‧‧Width z‧‧‧ direction A-A’~F-F’‧‧‧ Cut line

FIG. 1 is a schematic top view of a display panel according to a first embodiment of the invention. 2A to 2F are schematic cross-sectional views of the manufacturing process of the display panel of FIG. 1. 3 is a schematic cross-sectional view of a display panel according to a second embodiment of the invention. 4 is a schematic cross-sectional view of a display panel according to a third embodiment of the invention. 5 is a schematic top view of a display panel according to a fourth embodiment of the invention. 6 is a schematic cross-sectional view of the display panel of FIG. 5. 7 is a schematic top view of a display panel according to a fifth embodiment of the invention. 8 is a schematic cross-sectional view of the display panel of FIG. 7 9 is a schematic cross-sectional view of a display panel according to a sixth embodiment of the invention. 10 is a schematic cross-sectional view of a display panel according to a seventh embodiment of the invention. 11 is a schematic top view of a display panel according to an eighth embodiment of the invention.

10‧‧‧Display panel

100‧‧‧Active element array substrate

110‧‧‧ substrate

120‧‧‧buffer layer

130‧‧‧Gate insulation

140‧‧‧Interlayer insulation

150‧‧‧Insulation

160‧‧‧flat layer

171‧‧‧First electrode

172‧‧‧Second electrode

181‧‧‧Isolated structural layer

181a, 181b, 181c, 181d

191‧‧‧hole injection layer

192‧‧‧Electric tunnel transmission layer

193‧‧‧luminous layer

194‧‧‧Electronic transmission layer

200‧‧‧Light emitting structure layer

210‧‧‧luminescent material pattern

211‧‧‧ The first dummy materials department

211a‧‧‧The first material edge

212‧‧‧Second Dummy Material Department

212a‧‧‧Second material edge

CH‧‧‧Channel area

D‧‧‧ Jiji

DA‧‧‧Display area

DR‧‧‧Drainage

d1‧‧‧ First distance

d2‧‧‧Second distance

G‧‧‧Gate

LDR‧‧‧Lightly doped drain region

LSR‧‧‧Lightly doped source region

PA‧‧‧ surrounding area

S‧‧‧Source

SC‧‧‧Semiconductor pattern

SR‧‧‧Source

T‧‧‧Active components

A-A’, B-B’ ‧‧‧ section line

Claims (19)

A display panel has a display area and a peripheral area surrounding the display area, including: an active element array substrate; an isolation structure layer disposed on the active element array substrate, wherein the isolation structure layer defines a plurality of first A groove, and the first grooves are disposed in the display area; and a light emitting structure layer is disposed on the active device array substrate, the light emitting structure layer includes a first dummy material portion, a second dummy material portion and A plurality of luminescent material patterns, the luminescent material patterns are respectively disposed in the first grooves, the first dummy material portion is disposed in the peripheral area, and the first dummy material portion is located on a first side of the display area , The second dummy material portion is disposed in the peripheral area, and the second dummy material portion is located on a second side of the display area, the first side and the second side are the display area in a first direction On opposite sides, a first material edge of the first dummy material portion farthest from the display area is separated from the first side of the display area by a first distance, and a second dummy material portion is farthest from the display area The second material edge is separated from the second side of the display area by a second distance, and the first distance is different from the second distance, the luminescent material patterns have portions near the edges of the first grooves The thickness is greater than the thickness of the portion away from the edges of the first grooves. The display panel as described in item 1 of the patent application scope, wherein the light emitting structure layer further includes a third dummy material portion and a fourth dummy material portion, the third dummy material portion is disposed in the peripheral area, and the third The dummy material portion is located on a third side of the display area, the fourth dummy material portion is disposed on the peripheral area, and the fourth dummy material portion is located on a fourth side of the display area, the third side and the fourth The sides are opposite sides of the display area perpendicular to the first direction, wherein a third material edge of the third dummy material portion farthest from the display area is separated from the third side of the display area by a third distance, A fourth material edge of the fourth dummy material part farthest from the display area is separated from the fourth side of the display area by a fourth distance, and the third distance is different from the fourth distance. The display panel as described in item 1 of the patent application scope, wherein the light emitting structure layer further includes a third dummy material portion and a fourth dummy material portion, the third dummy material portion is disposed in the peripheral area, and the third The dummy material portion is located on the first side of the display area, the fourth dummy material portion is disposed on the peripheral area, and the fourth dummy material portion is located on the second side of the display area, wherein the third dummy material portion is the most A third material edge away from the display area is separated from the first side of the display area by a third distance, and a fourth material edge of the fourth dummy material portion farthest from the display area and the second edge of the display area The sides are separated by a fourth distance, the third distance is smaller than the fourth distance, and the first distance is larger than the second distance. The display panel according to item 1 of the patent application scope, wherein the isolation structure layer is located between the first dummy material portion and the active device array substrate, and the isolation structure layer is located between the second dummy material portion and the active device array Between substrates. The display panel according to item 1 of the patent application scope, wherein at least one of the first dummy material portion and the second dummy material portion partially overlaps the isolation structure layer. The display panel as described in item 1 of the patent application range, wherein the isolation structure layer further defines a plurality of second grooves and a plurality of third grooves, the second grooves and the third grooves are disposed in The peripheral area is located on the first side and the second side of the display area, respectively, the first dummy material portion is disposed in the second grooves, and the second dummy material portion is disposed in the third grooves The widths of the areas occupied by the first grooves, the second grooves, and the third grooves in the first direction of the vertical projection of the active device array substrate in the first direction are substantially equal. The display panel as described in item 1 of the patent application range, wherein the isolation structure layer further defines a plurality of second grooves and a plurality of third grooves, the second grooves and the third grooves are disposed in The peripheral area is located on the first side and the second side of the display area, respectively, the first dummy material portion is disposed in the second grooves, and the second dummy material portion is disposed in the third grooves The area where each of the first grooves occupy the vertical projection of the active device array substrate has a width in the first direction that is smaller than the area occupied by the second grooves and the third grooves respectively The vertical projection of the active element array substrate in the first direction The width of the above. The display panel as described in item 1 of the patent application range, wherein the isolation structure layer further defines a second groove, the second groove surrounds the display area, wherein the second groove has two opposite sides of the display area A first groove segment and a second groove segment on the side, and the vertical projection of the area occupied by the first groove segment and the second groove segment on the active device array substrate is respectively in the first direction It has a first width and a second width, and the first width is greater than the second width. The display panel as described in item 8 of the patent application range, wherein the second groove further has a third groove segment and a fourth groove segment located on opposite sides of the display area perpendicular to the first direction , Wherein the third groove segment and the fourth groove segment are respectively connected between the first groove segment and the second groove segment, and the third groove segment and the fourth groove segment occupy The vertical projection of the area on the active device array substrate has a third width and a fourth width respectively perpendicular to the first direction, and the third width is greater than the fourth width. The display panel as described in item 1 of the patent application scope further includes a plurality of first electrodes and a dummy conductive pattern, wherein the first electrodes are respectively disposed in the first grooves, and each of the first electrodes is located Between the active device array substrate and the luminescent material patterns, the dummy conductive pattern is disposed in the peripheral region, and is located between at least one of the first dummy material portion and the second dummy material portion and the active device array substrate between. The display panel according to item 10 of the patent application scope, wherein the dummy conductive pattern and the first electrodes belong to the same conductive layer. The display panel as described in item 1 of the patent application scope further includes a flexible circuit board bonded to the peripheral area of the active device array substrate, wherein the first distance is greater than the second distance, and the flexible circuit board and the The second dummy material portion is located on the second side of the display area. The display panel according to item 1 of the patent application scope, wherein the first dummy material portion and the second dummy material portion each include a hole injection layer, a hole transmission layer, a red light-emitting layer, and a green light-emitting layer , A blue light-emitting layer or a stacked layer of the above material combination. The display panel as described in item 1 of the patent application range, wherein each of the luminescent material patterns includes a hole injection layer, a hole transmission layer, and a light emitting layer that are sequentially stacked. A manufacturing method of a display panel includes: providing an active element array substrate, wherein the active element array substrate has a display area and a peripheral area surrounding the display area; forming an isolation structure material layer on the active element array substrate; An etching step, removing portions of the isolation structure material layer overlapping the display area to form an isolation structure layer defining a plurality of first grooves; and performing an inkjet printing process on the active device array substrate The inkjet printing process includes: after spraying a first luminescent material droplet in the peripheral area, moving a nozzle in a first direction so that the nozzle enters the display area from a first side of the display area Spraying a second luminescent material droplet and a third luminescent material droplet in the display area; and And continue to move the spray head in the first direction so that the spray head leaves the display area from a second side of the display area and sprays a fourth luminescent material droplet in the peripheral area, wherein the second luminescent material droplet And the third luminescent material droplets are sprayed into two of the first grooves closest to the first side and the second side respectively, and the first luminescent material droplets and the second luminescent material droplets The distance between is greater than the distance between the third luminescent material droplet and the fourth luminescent material droplet. The method for manufacturing a display panel as described in Item 15 of the patent application scope further includes: performing a drying and baking step to solidify the first luminescent material droplets into a first dummy material portion, and the fourth luminescent material droplets solidify Forming a second dummy material portion, and the first material edge of the first dummy material portion farthest from the display area is separated from a first side of the display area by a first distance, and the second dummy material portion is farthest away from the display area The second material edge is separated from a second side of the display area by a second distance, and the first distance is different from the second distance, wherein the first side and the second side are the display area at the first Opposite sides in direction. The method for manufacturing a display panel as recited in item 15 of the patent application range, wherein the etching step further includes removing two portions of the isolation structure material layer overlapping the peripheral area to form a second groove and a third groove Grooves, and the first luminescent material droplets and the fourth luminescent material droplets are sprayed into the second grooves and the third grooves respectively, wherein the first grooves, the second grooves and the first grooves The width of the area occupied by each of the three grooves in the first direction is substantially equal. The method for manufacturing a display panel as recited in item 15 of the patent application range, wherein the etching step further includes removing a portion of the isolation structure material layer overlapping the peripheral region to form a second groove, wherein the first light emitting Material droplets are sprayed into the second groove, and the width of the area occupied by the second groove in the first direction is greater than the width of the area occupied by each of the first grooves in the first direction. The method for manufacturing a display panel as described in item 15 of the patent application scope further includes: forming a conductive pattern layer on the active device array substrate, wherein the conductive pattern layer includes a plurality of first electrodes and a spaced apart from each other A dummy conductive pattern, the first electrodes are respectively arranged in the first grooves, the dummy conductive pattern is arranged in the peripheral area, and the second luminescent material droplets and the third luminescent material droplets are sprayed on the On two of the first electrodes, the first luminescent material droplet and the fourth luminescent material droplet are sprayed on the dummy conductive pattern.

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