TW202002356A - Display panel and method of fabricating the same - Google Patents

Abstract

A display panel including an active device array substrate, an isolation structure layer, a first light emitting material layer and a second light emitting material layer is provided. The active device array substrate has a display region and a peripheral region surrounding the display region. The isolation structure layer is disposed on the active device array substrate. The display panel has a first recess and a second recess at least defined by the isolation structure layer. The first recess and the second recess are disposed in the peripheral region and the display region is disposed between the first recess and the second recess. The first light emitting material layer and the second light emitting material layer are respectively disposed in the first recess and the second recess. The shortest distance between the edge of the first recess defined by the isolation structure layer and the edge of the display region is substantially equal to the shortest distance between the edge of the second recess defined by the isolation structure layer and the edge of the display region. The volume of the first light emitting material layer is larger than the volume of the second light emitting material layer. A method of fabricating the display panel is also provided.

Description

Display panel and its manufacturing method

The present invention relates to a display panel and a manufacturing method thereof, and particularly to a self-luminous display panel and a manufacturing method thereof.

In recent years, organic light-emitting diode (Organic light-emitting diode, OLED) display panels have gradually attracted various technologies due to their high color saturation, fast response, and high contrast performance compared to current mainstream liquid crystal display panels. The investment vision of big factories. However, under the circumstances that its manufacturing cost is high and its service life cannot compete with current mainstream displays, even if the OLED display panel has the above-mentioned excellent display quality, the market share on the consumer side cannot be significantly improved.

In order to seek a lower-cost manufacturing method, the development of production equipment and related materials is one of the efforts of many manufacturers. Among them, the use of inkjet printing (Ikjet printing, IJP) technology to make a luminescent material layer is one of the research priorities. Since the luminescent material needs to be dropped or injected into the corresponding groove through the printing head (printing head), the luminescent material needs to be dissolved in a suitable solvent in order to eject. However, in the process of inkjet printing, the droplets that have been sprayed on the substrate will continue to evaporate the solvent, so that the droplets sprayed in different regions in sequence have different degrees of volatilization, resulting in the formation of the luminescent material layer in different regions. The film thickness is also different, which further affects the uniformity of light emission of the display panel. Therefore, how to overcome the above-mentioned technical bottlenecks is an issue that the technology plant is desperately trying to solve.

The invention provides a display panel with good luminous uniformity.

The invention provides a method for manufacturing a display panel, which has a high production yield.

The display panel of the present invention includes an active element array substrate, an isolation structure layer, a first luminescent material layer and a second luminescent material layer. The active device array substrate has a display area and a peripheral area surrounding the display area. The isolation structure layer is disposed on the active device array substrate. The display panel has a first groove and a second groove defined by at least the isolation structure layer. The first groove and the second groove are disposed in the peripheral area, and the display area is located between the first groove and the second groove. The first luminescent material layer and the second luminescent material layer are disposed on the active device array substrate and filled in the first groove and the second groove, respectively. The isolation structure layer defines the shortest distance between the edge of the first groove and the edge of the display area is substantially equal to the shortest distance between the edge of the second groove and the edge of the display area. The volume of the first luminescent material layer is greater than the volume of the second luminescent material layer.

The manufacturing method of the display panel of the present invention includes providing an active element array substrate, forming an isolation structure material layer on the active element array substrate, performing an etching step, and performing an inkjet printing process. The active device array substrate has a display area and a peripheral area surrounding the display area. The etching step includes removing two portions of the isolation structure material layer overlapping the peripheral area and located on opposite sides of the display area to form an isolation structure layer defining the first groove and the second groove. The inkjet printing process includes spraying the first droplet and the second droplet into the first groove and the second groove in sequence. The droplet volume of the first droplet is larger than the droplet volume of the second droplet.

In an embodiment of the invention, the first groove of the display panel has a first depth, the second groove has a second depth, and the first depth is greater than the second depth.

In an embodiment of the invention, the above-mentioned display panel further includes a flat layer. The flat layer is disposed between the active device array substrate and the isolation structure layer. The first groove extends through the isolation structure layer and into the flat layer. The second groove extends at least in the isolation structure layer. The portion of the flat layer below the first groove has a thickness smaller than the portion below the second groove.

In an embodiment of the present invention, the portion of the isolation structure layer of the display panel defining the first groove has a first thickness, and the portion of the isolation structure layer defining the second groove has a second thickness, and the first The thickness is greater than the second thickness.

In an embodiment of the invention, the above-mentioned display panel further includes a dummy pattern, disposed in the second groove, and located under the second luminescent material layer.

In an embodiment of the invention, the above display panel further includes a first electrode, which is disposed in the display area. The first electrode is located between the active device array substrate and the isolation structure layer. The dummy pattern is located between the active device array substrate and the second luminescent material layer, and the dummy pattern and the first electrode belong to the same film layer.

In an embodiment of the invention, the vertical projection area of the first groove on the active device array substrate of the display panel is larger than the vertical projection area of the second groove on the active device array substrate.

In an embodiment of the invention, the thickness of the first luminescent material layer of the above display panel is greater than the thickness of the second luminescent material layer.

In an embodiment of the invention, the above display panel further includes a third luminescent material layer, which is disposed on the active device array substrate and located in the display area. The volume of the third luminescent material layer is larger than the volume of the second luminescent material layer and smaller than the volume of the first luminescent material layer. The isolation structure layer further defines a third groove in the display area, and the third luminescent material layer is filled in the third groove.

In an embodiment of the invention, the above display panel further includes a third luminescent material layer, which is disposed on the active device array substrate. The isolation structure layer further defines a third groove in the peripheral area. The first groove, the second groove and the third groove surround the display area, and the third luminescent material layer is filled in the third groove. The volume of the third luminescent material layer is larger than the volume of the second luminescent material layer and smaller than the volume of the first luminescent material layer.

In an embodiment of the invention, the thicknesses of the first luminescent material layer and the second luminescent material layer of the above-mentioned display panel gradually increase from the center to the edge.

In an embodiment of the invention, the vertical projections of the first luminescent material layer and the second luminescent material layer on the active device array substrate of the display panel have a first width and a second width in the first direction, and The first width is greater than the second width.

In an embodiment of the invention, the etching step of the method for manufacturing a display panel described above further includes removing a portion of the isolation structure material layer overlapping the display area to form a third groove. The inkjet printing process further includes spraying the third droplet in the third groove after spraying the first droplet and before spraying the second droplet. The droplet volume of the third droplet is larger than the droplet volume of the second droplet and smaller than the droplet volume of the first droplet.

In an embodiment of the present invention, the above-mentioned method for manufacturing a display panel further includes a drying and baking step to solidify the first droplet and the second droplet to form a light-emitting material layer. The volume of the luminescent material layer located in the first groove is larger than the volume of the luminescent material layer located in the second groove.

In an embodiment of the invention, in the method for manufacturing a display panel described above, the active device array substrate further has a flat layer. The etching step further includes removing a portion of the planar layer overlapping at least one of the two portions of the isolation structure material layer. After the etching step is performed, the portion of the flat layer below the first groove has a thickness smaller than the portion below the second groove.

In an embodiment of the invention, the method for manufacturing a display panel described above further includes forming a dummy pattern on the active device array substrate. The dummy pattern is disposed in the second groove, and the second droplet covers the dummy pattern.

In an embodiment of the present invention, in the above method of manufacturing a display panel, after the etching step is performed, the area occupied by the first groove has a first width in the first direction. The area occupied by the second groove has a second width in the first direction, and the first width is greater than the second width.

Based on the above, in the display panel according to the embodiment of the present invention, the first groove and the second groove are provided on the peripheral area, and these two grooves are respectively provided on both sides of the display area and filled in one side of the display area The volume of the luminescent material layer in the first groove is larger than the volume of the luminescent material layer filled in the second groove on the other side of the display area. In this way, it helps to improve the uniformity of the film thickness of the luminescent material layer disposed in the display area, thereby achieving better uniformity of luminescence. In addition, in the method of manufacturing a display panel according to an embodiment of the present invention, the step of spraying the luminescent material droplets in the first groove is earlier than the spraying of the luminescent material droplets in the second groove, and the spraying into the first groove The amount of droplets is greater than the amount of droplets sprayed into the second groove, which helps to improve the uneven evaporation rate of the luminescent material droplets sprayed on the display area, so as to enhance the light emission in different grooves of the display area The uniformity of the film thickness of the material layer further improves the production yield.

In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

As used herein, "about", "approximately", "essentially", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by those of ordinary skill in the art, considering The measurement in question and the specific number of errors associated with the measurement (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or for example within ±30%, ±20%, ±15%, ±10%, ±5%. Furthermore, the terms "approximately", "approximately", "essentially", or "substantially" as used herein can select a more acceptable range of deviation or standard deviation according to measurement properties, cutting properties, or other properties. All properties are applied without a standard deviation.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrical connection" may be that there are other components between the two components.

Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

FIG. 1 is a schematic top view of a display panel 10 according to a first embodiment of the invention. 2A to 2F are schematic cross-sectional views of the manufacturing process of the display panel 10 of FIG. 1. FIGS. 2A to 2E correspond to section line AA′, section line BB′ and section line CC of FIG. 1, and FIG. 2F corresponds to section line AA′ and section line CC of FIG. 1 and Section line DD'. FIG. 3 is a schematic cross-sectional view of the display panel 10 of FIG. 1. It should be noted that, for the sake of clarity, FIG. 1 only shows the isolation structure layer 181 and the substrate 110 of the display panel 10, and other possible components included in the display panel 10 will be shown in FIGS. 2A to 2F. As can be seen from FIG. 1, the substrate 110 has a display area AA and a peripheral area PA surrounding the display area AA. The isolation structure layer 181 defines a plurality of first grooves and a plurality of second grooves in the peripheral area PA. The plurality of first grooves include, for example, grooves 181a, and the plurality of second grooves include, for example, grooves 181b, and A plurality of third grooves are defined in the display area AA. The plurality of third grooves include, for example, a groove 181c, where the area where the groove 181c in the display area AA is located when the display panel 10 is displaying can emit light to present a picture. The manufacturing process of the display panel 10 shown in FIG. 1 will be exemplarily described below.

Please refer to FIG. 2A. First, an active device array substrate 100 is provided. The active device array substrate 100 includes a substrate 110, an active device T, and a gate insulating layer 130. The active device T is disposed on the substrate 110 and has a gate G, a source S, a drain D, and a semiconductor pattern SC. The gate insulating layer 130 is disposed between the semiconductor pattern SC and the gate G. For example, in this embodiment, the gate G of the active device T can be selectively disposed above the semiconductor pattern SC to form a top-gate thin-film transistor (top-gate TFT), but the present invention does not This is the limit. According to other embodiments, the gate G of the active device T may also be disposed under the semiconductor pattern SC, that is, the gate G is located between the semiconductor pattern SC and the substrate 110 to form a bottom gate-type thin film transistor (bottom-gate) TFT). In this embodiment, the active device array substrate 100 may optionally include a buffer layer 120 disposed between the substrate 110 and the active device T. In addition, the area where the active element T is located is, for example, an area where a picture is to be displayed. Therefore, it can be understood that the active element T is located in the display area AA of FIG. 1, and the peripheral area PA can be regarded as an area without the active element T.

In this embodiment, the semiconductor pattern SC may include a source region SR, a lightly doped source region LSR, a channel region CH, a lightly doped drain region LDR, and a drain region DR. The lightly doped source region LSR is located at the source Between the polar region SR and the channel region CH, the lightly doped drain region LDR is located between the channel region CH and the drain region DR, and the gate G overlaps the channel region CH of the semiconductor pattern SC, but the present invention does not use this Limited. According to other embodiments, the semiconductor pattern SC may include only the source region SR, the channel region CH, and the drain region DR.

Following the above, the active device array substrate 100 further includes an interlayer insulating layer 140 disposed on the gate insulating layer 130 and covering the gate G of the active device T. The source S and the drain D of the active device T are disposed on the interlayer insulating layer 140 and overlap two different regions of the semiconductor pattern SC, respectively. In detail, the source S and the drain D of the active device T both penetrate the interlayer insulating layer 140 and the gate insulating layer 130 to electrically connect the source region SR and the drain region DR of the semiconductor pattern SC, respectively.

In this embodiment, the material of the semiconductor pattern SC is, for example, a low temperature poly-silicon (LTPS) semiconductor, that is, the active device T may be a low temperature poly-silicon thin film transistor (LTPS TFT). However, the invention is not limited to this. In other embodiments, the active element T may also be an amorphous silicon thin film transistor (a-Si TFT), a micro-Si thin film transistor (micro-Si TFT) or a metal Oxide transistor (Metal Oxide Transistor).

The active device array substrate 100 further includes an insulating layer 150 and a flat layer 160. The insulating layer 150 covers the source S, the drain D of the active device T, and a part of the surface of the interlayer insulating layer 140, and may optionally have an opening 150a overlapping the drain D of the active device T. The flat layer 160 covers part of the surfaces of the insulating layer 150 and the drain D.

It should be noted that the gate electrode G, the source electrode S, the drain electrode D, the gate insulating layer 130, the interlayer insulating layer 140, the insulating layer 150, and the flat layer 160 can be used by any person having ordinary knowledge in the art. Any gate electrode, any source electrode, any drain electrode, any gate insulating layer, any interlayer insulating layer, any insulating layer and any flat layer of the display panel, and the gate G and source S , The drain D, the gate insulating layer 130, the interlayer insulating layer 140, the insulating layer 150, and the flat layer 160 can be formed by any method well known to those of ordinary skill in the art, so I will not repeat them here. .

Next, a plurality of first electrodes 171 are formed on the active device array substrate 100 and arranged in the display area AA. A plurality of first electrodes 171 are disposed on the flat layer 160, and are electrically connected to the drain D of the corresponding active device T through the flat layer 160, respectively. Specifically, although FIG. 2A only shows one active element T for clarity, a plurality of active elements T may be formed on the substrate 110, and each first electrode 171 may be correspondingly connected to one of the active elements T. In some embodiments, the first electrode 171 is, for example, a light-transmissive electrode. The material of the light-transmissive electrode includes metal oxides, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide Substances, or other suitable oxides, or stacked layers of at least two of the above, but the invention is not limited thereto. In other embodiments, the first electrode 171 may also be a reflective electrode. The material of the reflective electrode includes metal, alloy, nitride of metal material, oxide of metal material, oxynitride of metal material, or other suitable materials. Materials, or stacked layers of metallic materials and other conductive materials.

On the other hand, the active device array substrate 100 can also optionally include multiple signal lines, including, for example, the signal line SL1 and the signal line SL2, where the signal line SL1 is, for example, a scanning line, a data line, or a power line, and the signal line SL2 is, for example, The peripheral wiring, but the present invention is not limited to this. In this embodiment, based on the consideration of conductivity, the materials of the signal lines SL1 and SL2 are generally metal materials. However, the present invention is not limited to this. According to other embodiments, the signal lines SL1 and SL2 may also use other conductive materials, such as alloys, nitrides of metal materials, oxides of metal materials, oxynitrides of metal materials, Or other suitable materials, or stacked layers of metal materials and other conductive materials.

Please refer to FIG. 2B. Next, an isolation structure material layer 180 is formed on the active device array substrate 100. The isolation structure layer 180 covers part of the surfaces of the first electrode 171 and the flat layer 160. Referring to FIG. 2C, after forming the isolation structure material layer 180, an etching step is performed to remove portions of the isolation structure material layer 180 to form the isolation structure layer 181 of the display panel 10 and at least defined by the isolation structure layer 181 Multiple grooves. In this embodiment, the etching step may optionally further include removing at least a portion of the plurality of portions of the planar layer 160 overlapping the isolation structure material layer 180, but the invention is not limited thereto.

As can be seen from FIG. 1, a plurality of grooves can be arrayed on the substrate 110, and the plurality of grooves include, for example, grooves 181a, grooves 181b, and grooves 181c, wherein the grooves 181c are disposed in the display area AA of the substrate 110, and The groove 181a and the groove 181b are respectively disposed in the peripheral areas PA on opposite sides of the display area AA. The vertical projection area of the area occupied by each groove on the substrate 110 can be selectively the same, but the invention is not limited thereto. In addition, the isolation structure layer 181 defines the shortest distance S1 between the edge of the groove 181a and the vertical projection of the area occupied by the display area AA on the substrate 110 is substantially equal to the edge of the groove 181b defined by the isolation structure layer 181 and the display area The shortest distance S2 between the edge of the area occupied by AA and the vertical projection on the substrate 110. All the grooves 181c are located in the display area AA and all the grooves 181a and 181b are not in the display area AA.

2C, in this embodiment, both the groove 181a and the groove 181b in the peripheral area PA can extend through the isolation structure layer 181, and the groove 181c in the display area AA also extends through the isolation structure layer 181 and is exposed A part of the surface of the first electrode 171 is exposed. In addition, the groove 181a can also selectively extend into the flat layer 160. For example, the portion of the flat layer 160 below the groove 181a has a thickness t1 that is less than the thickness t2 of the portion of the flat layer 160 below the groove 181b, but the invention is not limited thereto. In other words, the depth d1 of the groove 181a in the direction perpendicular to the substrate 110 is greater than the depth d2 of the groove 181b in the direction perpendicular to the substrate 110.

In some embodiments, the plurality of grooves in the peripheral area PA may not penetrate the isolation structure layer 181, but the depth d1 of the groove 181a is still greater than the depth d2 of the groove 181b. That is, the portion of the isolation structure layer 181 below the groove 181a has a thickness smaller than the thickness of the portion of the isolation structure layer 181 below the groove 181b. In this way, the groove 181a has a larger depth than the groove 181b, so it can provide a larger accommodating space.

After the etching step is completed, an inkjet printing process is performed, and droplets to be formed into a light-emitting structure are sprayed in multiple grooves in sequence. For example, referring to FIG. 1, the inkjet printing process may start from one corner of the display panel 10, first traverse the width of the entire display panel 10 along the process path P1 and drip liquid into each groove on the process path P1 Droplets, and then perform the same process along the process path P2 until the width of the entire display panel 10 is traversed along the process path Pn and droplets are dropped into the grooves on the process path Pn, then the entire display panel 10 All of the grooves are filled with droplets. In this embodiment, the directions of two adjacent process paths (for example, process path P1 and process path P2) are the same, but in other embodiments, the directions of two adjacent process paths may be opposite.

In other words, please refer to FIG. 2D, the inkjet printing process of this embodiment is, for example, spraying droplets LD1, LD2, and LD3 in the grooves 181a, 181c, and 181b in sequence. It can be seen from FIG. 2D that the droplet amount of the droplet LD1 is larger than the droplet amount of the droplet LD3. In this embodiment, the droplet amount of the droplet LD1 can be selectively greater than the droplet amount of the droplet LD2, and the droplet amount of the droplet LD3 can be selectively smaller than the droplet amount of the droplet LD2, but the present invention Not limited to this. In the process of inkjet printing, the head carrying the liquid of droplets is sprayed in the groove 181a, then sprayed in the groove 181c, and then sprayed in the groove 181b. That is to say, in the grooves 181a and 181b in the peripheral area PA, a larger amount of droplets will be dripped first, and then a relatively small amount of droplets will be dripped later. In addition, the groove 181c located in the display area AA can be dripped with a constant amount of droplets, and does not change due to the order of the ink-jetting steps.

In this embodiment, the material of the droplet LD1, the droplet LD2, and the droplet LD3 may optionally include a light emitting structure material and a solvent, wherein the light emitting structure material includes, for example, a hole injection material, a hole transmission material, a light emitting material, an electron The transport material and the electron injection material and the solvent are, for example, volatile liquids that can be used to dissolve the light emitting structure material. In detail, in the process of inkjet printing, since the groove 181a that is sprayed first is dropped into the liquid droplet LD1 with a larger droplet volume, the volatile solvent contained in the groove 181a is also large. After the droplet LD1 is dropped into the groove 181a, the volatile solvent of the droplet LD1 in the groove 181a may evaporate until all the grooves are dropped into the droplet. Because there are many volatile solvents contained in the groove 181a, a large vapor pressure can be generated near the groove 181a. In this way, although the groove 181c adjacent to the groove 181a in the display area AA is sprayed with the droplet LD2 earlier than the groove 181c in other areas of the display area AA, the droplet LD2 is not easy to evaporate due to the solvent during this period And dry prematurely. Therefore, although the plurality of grooves 181c in the display area AA are dropped into the liquid droplets LD2 at different times, after the inkjet printing process is completed, the solvent content of the liquid droplets LD2 in all the grooves 181c is not significantly different. In this way, it helps to improve the uniformity of the film formation of the light-emitting structure materials located in different regions after drying.

Please refer to FIG. 2E. Next, drying and baking steps are carried out, so that the solvent of the droplets dropped into or injected into each groove can be volatilized and removed, and the light emitting structure material is solidified to form the corresponding light emitting material layer 190. In this embodiment, the volume of the luminescent material layer 190 formed in the groove 181a is larger than the volume of the luminescent material layer 190 formed in the groove 181b. In addition, the volume of the luminescent material layer 190 formed in the groove 181c may be selectively smaller than the volume of the luminescent material layer 190 formed in the groove 181a, and may be selectively larger than the volume of the luminescent material layer formed in the groove 181b 190 volume, but the invention is not limited to this.

From another point of view, in this embodiment, the minimum thickness t3 of the luminescent material layer 190 located in the groove 181a can be selectively greater than the minimum thickness t4 of the luminescent material layer 190 located in the groove 181b , But the invention is not limited to this. It is worth mentioning that the thickness of the luminescent material layer 190 gradually increases from the center to the edge, that is to say, the luminescent material layer 190 has a greater thickness at the portion near the groove edge than at the portion away from the groove edge .

1 and 2F, the plurality of grooves defined in the peripheral area PA of the isolation structure layer 181 further includes a groove 181d, wherein the groove 181a, the groove 181b, and the groove 181d are respectively located in different parts of the peripheral area PA Copies and surround the display area AA. For example, in the inkjet printing process shown in FIG. 2D, the order of droplet spraying is the groove 181a, the groove 181d, and the groove 181b, and the luminescent material layer 190 filled in the groove 181d The volume is larger than the volume of the luminescent material layer 190 filled in the groove 181b, and smaller than the volume of the luminescent material layer 190 filled in the groove 181a. In some embodiments, the volume of the luminescent material layer 190 filled in the groove 181d can be selectively smaller than that of the luminescent material layer 190 filled in the groove 181c. In another part of the embodiments, the volume of the luminescent material layer 190 filled in the groove 181d may also be larger than that of the luminescent material layer 190 filled in the groove 181c.

As can be seen from FIG. 3, in this embodiment, the display panel 10 has a plurality of light emitting structures 200 formed in the grooves 181a, 181b, and 181c. Each light emitting structure 200 may include a hole injection layer 191, a hole transport layer 192, a light emitting layer 193, and an electron transport layer 194 that are sequentially stacked on the first electrode 171, wherein the hole injection layer 191, the hole transport layer 192, and the Each of the light-emitting layers 193 can be manufactured by using the method of manufacturing the light-emitting material layer 190 in FIGS. 2D and 2E. For example, in this embodiment, the hole injection layer 191, the hole transport layer 192, and the light emitting layer 193 are each formed by first dropping or injecting the corresponding light emitting structure material into the isolation structure layer 181 by inkjet The defined multiple grooves, and then the dripped or injected material is dried and solidified to form the corresponding film layer. It should be noted that the present invention does not limit the type and number of luminescent material layers formed by the inkjet printing process. Any person with ordinary knowledge in the technical field can adjust and adapt to the characteristics and requirements of the luminescent material process The number of luminescent material layers formed by inkjet printing.

In particular, in the manufacturing process of the display panel 10, the inkjet printing step of the hole transport layer 192 is performed after the hole injection layer 191 is cured, and the light emitting layer 193 is performed after the hole transport layer 192 is cured Inkjet printing step. As such, the thickness of each of the hole injection layer 191, the hole transport layer 192, and the light-emitting layer 193 can be controlled by the step of inkjet printing, and the materials of the hole injection layer 191, the hole transport layer 192, and the light-emitting layer 193 are mutually No contamination occurs during the inkjet printing process. In addition, the stacking of the hole injection layer 191, the hole transport layer 192, and the light emitting layer 193 is for illustrative purposes only. In other embodiments, the hole injection layer 191, the hole transport layer 192, and the light emitting layer 193 One or more other film layers can be optionally included between any two adjacent layers.

On the other hand, after the inkjet printing process and the drying and baking step, the electron transport layer 194 may be formed on the light emitting layer 193 by, for example, thermal evaporation to complete the multilayer stacked light emitting structure 200. In some embodiments, the electron transport layer 194 can also be formed on the light-emitting layer 193 by inkjet printing similar to FIGS. 2D and 2E. Next, a second electrode 172 is formed on the isolation structure layer 181 and the light emitting structure 200. The second electrode 172 covers the isolation structure layer 181 and the light emitting structure 200. In detail, in this embodiment, the second electrode 172 may continuously extend from above the isolation structure layer 181, conform to the sidewall of the isolation structure layer 181, extend above the light emitting structure 200 and cover the light emitting structure 200. In particular, in some embodiments, the second electrode 172 may be formed in the same manner as the electron transport layer 194 on the light emitting structure 200, such as thermal evaporation. The second electrode 172 may have a substantially uniform film thickness.

Following the above, in this embodiment, the second electrode 172 is, for example, a light-transmitting electrode. The material of the light-transmitting electrode includes metal oxides, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, Aluminum zinc oxide, or other suitable oxide, or a stack of at least two of the above, but the invention is not limited thereto. In other embodiments, the second electrode 172 may also be a reflective electrode. The material of the reflective electrode includes metal, alloy, nitride of metal material, oxide of metal material, oxynitride of metal material, or other suitable materials. Materials, or stacked layers of metallic materials and other conductive materials. Thus, the display panel 10 of this embodiment is completed.

As can be seen from FIGS. 1 and 3, the display panel 10 includes an active device array substrate 100, an isolation structure layer 181, a first electrode 171, a light emitting structure 200 and a second electrode 172. The isolation structure layer 181 defines a plurality of grooves in the display panel 10, and the light emitting structure 200 is filled in each groove. The plurality of grooves include, for example, groove 181a, groove 181b, and groove 181c. The light emitting structures 200 filled in the groove 181c are sandwiched between the first electrode 171 and the second electrode 172 and can emit light through the driving of the active element T to be used as a display element. Therefore, the area where the groove 181c is located can be regarded as the display area AA. Neither the light emitting structure 200 filled in the groove 181a nor the groove 181b serves as a display element. Therefore, the area where the groove 181a and the groove 181b are located can be regarded as the peripheral area PA, and the groove 181a and the groove 181b are respectively located on opposite sides of the display area AA. Since the light-emitting layer 193 in the light-emitting structure 200 can be made of organic light-emitting materials, the display panel 10 is essentially an organic light-emitting display panel.

In this embodiment, for example, one of the first electrode 171 and the second electrode 172 is a light-transmissive electrode layer, and the other may be a light-transmissive electrode layer or a reflective electrode layer. The light emitting structure 200 includes a hole injection layer 191, a hole transport layer 192, a light emitting layer 193, and an electron transport layer 194 that are sequentially stacked on the first electrode 171. The display panel 10 of this embodiment is, for example, a top emission type display panel. However, the present invention is not limited to this, and according to other embodiments, the display panel 10 may also be a bottom emission type display panel.

Here, the edge of the display area AA is defined by, for example, the outer edge of the outermost groove 181b, or may be the junction between the outermost groove 181b and the adjacent groove 181a or 181b. The isolation structure layer 181 defines the shortest distance S1 between the edge of the groove 181a and the edge of the display area AA is substantially equal to the minimum distance S2 between the edge of the groove 181b and the edge of the display area AA. In addition, the volume of the luminescent material layer located in the groove 181a is larger than the volume of the luminescent material layer located in the groove 181b. In other words, if the grooves 181a, 181b, and 181c can be arranged at equal intervals and intervals. However, the volume of the light emitting structure 200 filled in the grooves 181a, 181b, and 181c may be different.

4 is a schematic cross-sectional view of a display panel 20 according to a second embodiment of the invention. Please refer to FIG. 4. The difference between the display panel 20 of this embodiment and the display panel 10 of FIG. 2F is that the display panel 20 may optionally further include a dummy pattern 175 disposed in the groove 181 b and located under the light emitting structure 200. In addition, the plurality of grooves of the display panel 20 are only defined by the isolation structure layer 181. In other words, the manufacturing method of the display panel 20 may optionally include forming a dummy pattern 175 on the active device array substrate 100.

In this embodiment, the material of the dummy pattern 175 may include metals, alloys, nitrides of metal materials, oxides of metal materials, oxynitrides of metal materials, or other suitable materials, or metal materials and other conductive materials Stacked layers. In addition, the dummy pattern 175 and the first electrode 171 can selectively belong to the same film layer and are spaced apart from each other, that is, the dummy pattern 175 is electrically independent of the first electrode 171.

5 is a schematic cross-sectional view of a display panel 30 according to a third embodiment of the invention. Referring to FIG. 5, the difference between the display panel 30 of this embodiment and the display panel 10 of FIG. 2F is that the isolation structure layer 181-1 of the display panel 30 defines the groove 181a having a thickness t5, and the isolation structure layer 181-1 The portion defining the groove 181b has a thickness t6, and the thickness t5 is greater than the thickness t6.

6 is a schematic top view of a display panel 40 according to a fourth embodiment of the invention. 7 is a schematic cross-sectional view of the display panel 40 of FIG. 6. Referring to FIGS. 6 and 7, the difference between the display panel 40 of this embodiment and the display panel 10 of FIG. 2F is that the area occupied by the groove 181a defined by the isolation structure layer 181-2 of the display panel 40 is on the active device array substrate The vertical projection area on 100 is larger than the vertical projection area on the active device array substrate 100 of the area occupied by the groove 181b.

For example, the vertical projection of the area occupied by the groove 181a on the substrate 110 has a width W1 in the direction z, and the vertical projection of the area occupied by the groove 181b on the substrate 110 has a width W2 in the direction z, and the width W1 may be Selectively greater than width W2. In other words, the width of the vertical projection of the luminescent material layer 190 filled in the groove 181a on the substrate 110 in the direction z can be selectively greater than the vertical projection of the luminescent material layer 190 filled in the groove 181b on the substrate 110 The width in direction z.

In summary, in the display panel according to the embodiment of the present invention, the first groove and the second groove are provided on the peripheral area. The two grooves are respectively provided on both sides of the display area and filled in The volume of the luminescent material layer in the first groove on the side is larger than the volume of the luminescent material layer filled in the second groove on the other side of the display area. In this way, it helps to improve the uniformity of the film thickness of the luminescent material layer provided in the display area, and thus achieve a better uniformity of luminescence. In addition, in the method for manufacturing a display panel according to an embodiment of the present invention, the step of spraying the luminescent material droplets in the first groove is earlier than the step of spraying the luminescent material droplets in the second groove, and sprayed into the first groove The amount of droplets is greater than the amount of droplets sprayed into the second groove, which helps to improve the uneven evaporation rate of the luminescent material droplets sprayed on the display area, so as to enhance the different grooves located in the display area The thickness uniformity of the luminescent material layer further improves the production yield.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

10, 20, 30, 40‧‧‧ Display panel 100‧‧‧ Active element array substrate 110‧‧‧Substrate 120‧‧‧Buffer layer 130‧‧‧ Gate insulation layer 140‧‧‧Interlayer insulation layer 150‧‧‧ Insulation Layer 150a‧‧‧Open 160‧‧‧Flat layer 171‧‧‧First electrode 172‧‧‧Second electrode 175‧‧‧Dummy pattern 180‧‧‧Isolation structure material layer 181, 181-1, 181-2‧ ‧‧Isolation structure layer 181a, 181b, 181c ‧‧‧ groove 190‧‧‧ light emitting material layer 191‧‧‧ hole injection layer 192‧‧‧ hole transmission layer 193‧‧‧ light emitting layer 194‧‧‧ electron transmission Layer 200‧‧‧Lighting structure AA‧‧‧Display area CH‧‧‧Channel area D‧‧‧Drain DR‧‧‧Drain area d1, d2‧‧‧Depth G‧‧‧Gate LDR‧‧‧Light Doped drain region LD1~LD3 ‧‧‧ droplet LSR‧‧‧ lightly doped source region PA‧‧‧ peripheral region S‧‧‧ source SC‧‧‧semiconductor pattern SL1, SL2‧‧‧ signal line SR ‧‧‧ Source region S1, S2‧‧‧ Distance T‧‧‧ Active components t1, t2, t3, t4, t5, t6‧‧‧‧ Thickness W1, W2‧‧‧Width z‧‧‧ Direction A-A' , B-B', C-C', D-D', E-E', F-F', G-G' ‧‧‧ Pitch line P1, P2, Pn‧‧‧ Process path

FIG. 1 is a schematic top view of a display panel according to a first embodiment of the invention. 2A to 2F are schematic cross-sectional views of the manufacturing process of the display panel of FIG. 1. 3 is a schematic cross-sectional view of the display panel of FIG. 1. 4 is a schematic cross-sectional view of a display panel according to a second embodiment of the invention. 5 is a schematic cross-sectional view of a display panel according to a third embodiment of the invention. 6 is a schematic top view of a display panel according to a fourth embodiment of the invention. 7 is a schematic cross-sectional view of the display panel of FIG. 6.

10‧‧‧Display panel

100‧‧‧Active element array substrate

110‧‧‧ substrate

120‧‧‧buffer layer

130‧‧‧Gate insulation

140‧‧‧Interlayer insulation

150‧‧‧Insulation

160‧‧‧flat layer

171‧‧‧First electrode

172‧‧‧Second electrode

181‧‧‧Isolated structural layer

181a, 181b, 181c‧‧‧groove

191‧‧‧hole injection layer

192‧‧‧Electric tunnel transmission layer

193‧‧‧luminous layer

194‧‧‧Electronic transmission layer

200‧‧‧Lighting structure

AA‧‧‧Display area

CH‧‧‧Channel area

D‧‧‧ Jiji

DR‧‧‧Drainage

G‧‧‧Gate

LDR‧‧‧Lightly doped drain region

LSR‧‧‧Lightly doped source region

PA‧‧‧ surrounding area

S‧‧‧Source

SC‧‧‧Semiconductor pattern

SL1, SL2‧‧‧Signal cable

SR‧‧‧Source

T‧‧‧Active components

A-A’, B-B’, C-C’ ‧‧‧ section line

Claims (18)

A display panel includes: an active element array substrate having a display area and a peripheral area surrounding the display area; an isolation structure layer disposed on the active element array substrate, and the display panel having at least the isolation structure layer A defined first groove and a second groove, wherein the first groove and the second groove are disposed in the peripheral area, and the display area is located between the first groove and the second groove And a first luminescent material layer and a second luminescent material layer, which are arranged on the active device array substrate and filled in the first groove and the second groove respectively, wherein the isolation structure layer defines the The shortest distance between the edge of the first groove and the edge of the display area is substantially equal to the shortest distance between the edge of the second groove defined by the isolation structure layer and the edge of the display area, and the first light The volume of the material layer is greater than the volume of the second luminescent material layer. The display panel according to item 1 of the patent application scope, wherein the first groove has a first depth, the second groove has a second depth, and the first depth is greater than the second depth. The display panel as described in item 2 of the patent application scope further includes a flat layer disposed between the active device array substrate and the isolation structure layer, wherein the first groove extends through the isolation structure layer and Projecting into the flat layer, the second groove extends at least in the isolation structure layer, and a portion of the flat layer below the first groove has a smaller thickness than a portion below the second groove thickness. The display panel as described in item 2 of the patent application range, wherein the portion of the isolation structure layer defining the first groove has a first thickness, and the portion of the isolation structure layer defining the second groove has a first thickness Two thicknesses, and the first thickness is greater than the second thickness. The display panel as described in item 1 of the scope of the patent application further includes a dummy pattern disposed in the second groove and under the second luminescent material layer. The display panel as described in item 5 of the patent application scope further includes a first electrode disposed in the display area, and the first electrode is located between the active device array substrate and the isolation structure layer, wherein the dummy pattern is located Between the active device array substrate and the second luminescent material layer, the dummy pattern and the first electrode belong to the same film layer. The display panel according to item 1 of the patent application range, wherein the vertical projection area of the first groove on the active device array substrate is larger than the vertical projection area of the second groove on the active device array substrate. The display panel according to item 1 of the patent application scope, wherein the thickness of the first luminescent material layer is greater than the thickness of the second luminescent material layer. The display panel as described in item 1 of the patent application scope further includes: a third luminescent material layer disposed on the active device array substrate and located in the display area, the volume of the third luminescent material layer is larger than the first The volume of the two luminescent material layers is smaller than the volume of the first luminescent material layer, wherein the isolation structure layer further defines a third groove in the display area, and the third luminescent material layer fills the third recess In the slot. The display panel as described in item 1 of the patent application scope further includes: a third luminescent material layer disposed on the active device array substrate, wherein the isolation structure layer further defines a third groove in the peripheral area , The first groove, the second groove and the third groove surround the display area, and the third luminescent material layer is filled in the third groove, and the volume of the third luminescent material layer is larger than the The volume of the second luminescent material layer is smaller than the volume of the first luminescent material layer. The display panel as described in item 1 of the patent application range, wherein the thickness of each of the first luminescent material layer and the second luminescent material layer gradually increases from the center to the edge. The display panel according to item 1 of the patent application scope, wherein the vertical projection of the first luminescent material layer and the second luminescent material layer on the active device array substrate has a first width and a first width in a first direction, respectively A second width, and the first width is greater than the second width. A manufacturing method of a display panel, comprising: providing an active element array substrate, wherein the active element array substrate has a display area and a peripheral area surrounding the display area; forming an isolation structure material layer on the active element array substrate; An etching step, removing two portions of the isolation structure material layer overlapping the peripheral area and located on opposite sides of the display area to form an isolation structure layer defining a first groove and a second groove; and performing In an inkjet printing process, a first droplet and a second droplet are sprayed in the first groove and the second groove in sequence, wherein the amount of droplets of the first droplet is greater than that of the second droplet The amount of droplets. The method for manufacturing a display panel as recited in item 13 of the patent application range, wherein the etching step further includes removing a portion of the isolation structure material layer overlapping the display area to form a third groove, the inkjet printing process It further includes spraying a third droplet in the third groove after spraying the first droplet and before spraying the second droplet, wherein the droplet volume of the third droplet is greater than the liquid volume of the second droplet The droplet volume is smaller than the droplet volume of the first droplet. The method for manufacturing a display panel as described in item 13 of the patent application scope further includes: performing a drying and baking step to solidify the first droplet and the second droplet to form a luminescent material layer, in which is located The volume of the luminescent material layer in the first groove is larger than the volume of the luminescent material layer in the second groove. The method for manufacturing a display panel as recited in item 13 of the patent application range, wherein the active device array substrate has a flat layer, and the etching step further includes removing one of the two portions of the isolation structure material layer that overlaps the flat layer A portion of at least one, and after performing the etching step, the portion of the flat layer below the first groove has a thickness that is less than the thickness of the portion below the second groove. The method for manufacturing a display panel as described in item 13 of the patent application scope further includes: forming a dummy pattern on the active device array substrate, wherein the dummy pattern is disposed in the second groove and the second droplet Overwrite the dummy pattern. The method for manufacturing a display panel as described in item 13 of the patent application range, wherein after the etching step is performed, the area occupied by the first groove has a first width in a first direction, and the second groove The occupied area has a second width in the first direction, and the first width is greater than the second width.

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