KR20160072010A - Organic light emitting display apparatus and method for manufacturing the same - Google Patents

Abstract

According to an embodiment of the present invention, an organic light emitting display apparatus includes: a substrate having a first sub pixel and a second sub pixel; a first common layer disposed in the first sub pixel; a second common layer disposed in the second sub pixel; and a dummy common layer disposed between the first sub pixel and the second sub pixel. The first common layer, the second common layer, and the dummy common layer are made of the same material, and separated from one another. In the organic light emitting display device, a current leakage phenomenon caused by the common layer sharing a plurality of organic light emitting elements can be prevented.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting diode (OLED) display device and a method of manufacturing the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display and a method of manufacturing the same, and more particularly, to an organic light emitting display having a reduced current leakage due to a common layer sharing a plurality of organic light emitting devices, and a method of manufacturing the same.

An organic light-emitting display apparatus (OLED apparatus) is a self-luminance display apparatus, unlike a liquid crystal display apparatus (LCD), a separate light source is not required, . Further, the organic light emitting display device is not only advantageous from the viewpoint of power consumption by low voltage driving, but also excellent in color implementation, response speed, viewing angle, and contrast ratio (CR), and is being studied as a next generation display.

In the organic light emitting diode display, holes and electrons injected from two electrodes are recombined in an organic light emitting layer to form an exciton, and light of a specific wavelength is generated by energy release of excitons formed Is a display device using a phenomenon.

[Related Technical Literature]

1. White organic light emitting device (Patent Application No. 10-2007-0053472)

The organic light emitting display may have a patterned emission layer structure according to a design.

The organic light emitting display device of the pattern light emitting layer structure has a structure in which an organic light emitting layer that emits different colors between two electrodes is separated for each pixel. For example, a red organic light emitting layer for emitting red light, a green organic light emitting layer for emitting green light, and a blue organic light emitting layer for emitting blue light are respectively disposed on the red sub pixel, the green sub pixel, As shown in FIG. In each of the red organic light emitting layer, the green organic light emitting layer and the blue organic light emitting layer, holes and electrons supplied through two electrodes are coupled to each other to emit light. Each of the organic light emitting layers may be pattern-deposited using a mask that is opened per sub-pixel, for example, a fine metal mask (FMM).

In addition to the organic light emitting layer, additional organic layers such as an injecting layer and a transporting layer for improving the light emitting efficiency of the organic light emitting device may be further disposed between the two electrodes. At least some organic layers of such additional organic layers may have a common structure disposed in common to a plurality of sub-pixels to take advantage of the manufacturing process.

Here, the layer having the common structure can be formed using a common mask in which all the sub-pixels are opened, and can be stacked in the same structure in all the sub-pixels without a pattern for each sub-pixel. That is, the layer having a common structure is shared by a plurality of sub-pixels because it is connected or extended without a break from one sub-pixel to a neighboring sub-pixel. The layer having a common structure may be referred to below as a layer of a common layer or a common structure.

For example, a hole injecting layer or a hole transporting layer may be doped with a p-type dopant to smooth the movement of holes, in addition to the organic light emitting layer, between the two electrodes. And the hole injection layer or the p-type hole transporting layer may have a common structure that is disposed in common to a plurality of sub-pixels.

The problem is that at least a part of the organic layers of the additional organic layers such as the hole injection layer and the p-type hole transport layer are formed of a common structure sharing a plurality of sub-pixels, Or the current flows to other neighboring sub-pixels through the p-type hole transporting layer, that is, a current leakage phenomenon may occur. This current leakage phenomenon causes other unintended sub-pixels to emit light to cause color mixture between the sub-pixels and lower the luminance of the driven sub-pixels, thereby lowering the display quality of the organic light emitting display device and increasing the power consumption It is becoming a cause.

The problem of color mixture between the sub-pixels due to the current leakage phenomenon can be more seriously generated in the low gray scale driving of the organic light emitting display. That is, the color mixing problem between the sub-pixels occurs more seriously due to the turn-on voltage difference of the neighboring sub-pixels at the initial time when the voltage across the two electrodes exceeds the turn-on voltage .

Here, the turn-on voltage refers to a drive voltage applied to the organic light emitting element at a time when light is defined to emit light in one sub-pixel. The gray scale is a number of minimum luminance units that the organic light emitting element can express, And the level of the individual step. As the drive voltage increases from the time when the turn-on voltage is applied, the gradation gradually increases. In the present specification, a level corresponding to about 30% of the whole gradation of the organic light emitting element is referred to as a low gray scale.

The above-described organic light emitting display device of the pattern light emitting layer structure has a turn-on voltage which is different from each other due to the difference of the organic light emitting layers for each sub-pixel. For example, the turn-on voltage for driving the red sub-pixel in which the red organic light emitting layer is disposed may have a value smaller than the turn-on voltage for driving the blue sub-pixel in which the blue organic light emitting layer is disposed.

In the structure in which the turn-on voltages of neighboring sub-pixels are different from each other, when a sub-pixel having a large turn-on voltage is driven, light is unintentionally generated in a pixel having a small turn- . The reason for this is that the current leaked through the additional organic layer having a common structure has a large turn-on voltage because the sub-pixel having a small turn-on voltage has a lower barrier than the sub-pixel having a large turn- On voltage is smaller than that of the sub-pixel, light can be generated from the sub-pixel having a small turn-on voltage even though the drive voltage is not applied.

Further, when the sub-pixel is driven with a low gray scale, the luminance of the sub-pixel to be driven is low, so that the color mixture of the light can be easily recognized by the user when the light of the neighboring sub-pixel is undesirably emitted . That is, at the initial point of time when the drive voltage applied to the organic light emitting element exceeds the turn-on voltage, the color mixture between neighboring sub-pixels can be perceived more seriously.

Further, when a low current is applied to the red sub-pixel, the green sub-pixel and the blue sub-pixel in order to realize white light of a low gray level, a current is leaked through the additional organic layer commonly disposed in all the sub- The sub-pixel having the turn-on voltage may emit light first, and the brightest light may be emitted. For example, when the sub-pixel having the lowest turn-on voltage is a red sub-pixel, when the organic light emitting display device is driven at a low gray level, a problem that the brightest light is emitted first in the red sub- have. As a result, when a white light having a low gray level is realized, a redish phenomenon in which white light having a red color other than pure white is emitted may be caused.

Such a current leakage phenomenon can become more serious as the temperature increases. Specifically, when the organic light emitting display device is driven at a high temperature, a leakage current is increased as the movement of the charge is relatively accelerated, so that a sub-pixel having the lowest turn-on voltage, for example, The problem of light emission without light can be further increased. As a result, redish phenomenon may occur more seriously in the process of realizing white light.

The inventors of the present invention have invented a new structure of an organic light emitting diode display and a method of manufacturing the same, which can solve the above-mentioned problem, that is, the problem that a current is leaked because some organic layers are commonly disposed in all sub-pixels.

An object of the present invention is to provide an organic light emitting display device and a method of manufacturing the same, in which a phenomenon in which light is leaked and light is unintentionally emitted in neighboring sub pixels is minimized.

Another object of the present invention is to provide an organic light emitting display device and a method of manufacturing the same that can emit light only in a target sub-pixel to improve brightness and power consumption.

Another object of the present invention is to provide an organic light emitting display device and a method of manufacturing the same, in which organic layers having a common structure can be easily separated and arranged for each sub-pixel even using a common mask.

Another object of the present invention is to provide an organic light emitting display device capable of realizing pure white at a low gray level and a method of manufacturing the same.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

According to another aspect of the present invention, there is provided an organic light emitting diode display including a first pixel electrode arranged in a first sub pixel of a substrate, a second pixel electrode arranged in a second sub pixel of the substrate, Electrodes, a first common layer disposed on the first pixel electrode, a second common layer disposed on the second pixel electrode, and a dummy common layer disposed between the first sub-pixel and the second sub-pixel And the first common layer, the second common layer, and the dummy common layer are made of the same material and are separated from each other. The organic light emitting display according to an embodiment of the present invention has an effect of reducing a current leakage phenomenon through a common layer configured to share a plurality of sub pixel regions.

The OLED display according to an embodiment of the present invention may further include a first bank layer and a second bank layer disposed between the first pixel electrode and the second pixel electrode, Each of the second bank layers includes an undercut, and the dummy common layer may be disposed between the undercut of the first bank layer and the undercut of the second bank layer.

In the organic light emitting diode display according to an embodiment of the present invention, the minimum interval between the undercut of the first bank layer and the minimum interval between the undercuts of the second bank layer, Lt; RTI ID = 0.0 > thickness. ≪ / RTI >

The organic light emitting display according to an embodiment of the present invention may further include a conductive layer formed separately from the first pixel electrode and the second pixel electrode and made of the same material as the first pixel electrode or the second pixel electrode, Wherein an undercut of the first bank layer and an undercut of the second bank layer are respectively located above the edges of the conductive layer and the dummy common layer is disposed at an upper center of the conductive layer .

The OLED display according to an embodiment of the present invention may further include a common bank layer disposed between the first pixel electrode and the second pixel electrode and a barrier rib disposed on the common bank layer, A tapered first barrier rib and a second barrier rib disposed on the first barrier rib, and the dummy common layer may be disposed on the second barrier rib.

In the OLED display according to an embodiment of the present invention, the first bank may be formed of a metallic material, and the second bank may be formed of a heat or UV curable material.

The organic light emitting display according to an exemplary embodiment of the present invention may further include a common bank layer disposed between the first pixel electrode and the second pixel electrode and the common bank layer disposed close to the first pixel electrode, And the other side of the common bank layer located close to the second pixel electrode may each include an undercut, and the dummy common layer may be disposed on the common bank layer.

The organic light emitting display according to an embodiment of the present invention may further include a common electrode disposed in common to the first sub-pixel and the second sub-pixel, 1 common layer or the second common layer and has a smaller value than a distance between the common electrode and the first pixel electrode or between the common electrode and the second pixel electrode.

In the OLED display according to an embodiment of the present invention, the ends of the first pixel electrode and the second pixel electrode may not be covered by the common bank layer.

The OLED display according to an embodiment of the present invention may include a first bank layer disposed between the first pixel electrode and the second pixel electrode, and a second bank layer disposed between the first bank layer and the first bank layer, A second bank layer having a width greater than the first bank layer, and the dummy common layer may be disposed on the second bank layer.

The organic light emitting display according to an embodiment of the present invention may further include a common electrode disposed in common to the first sub-pixel and the second sub-pixel, Or the distance from the upper surface of the second pixel electrode to the upper surface of the first bank layer is greater than the thickness of the first common layer or the second common layer, And may have a smaller value than the distance between one pixel electrode or the common electrode and the second pixel electrode.

In the OLED display according to an embodiment of the present invention, the ends of the first pixel electrode and the second pixel electrode may not be covered by the first bank layer.

According to another aspect of the present invention, there is provided an organic light emitting display including a plurality of pattern electrodes, a common electrode disposed on the plurality of pattern electrodes, And a plurality of organic layers including at least one common layer having a structure separated for each of the neighboring sub-pixels so that current leakage to neighboring sub-pixels is minimized, And a bank member having a structure for separating the common layer. Accordingly, the problem of color mixing between neighboring sub-pixels is reduced, thereby improving the display quality of the OLED display.

In the organic light emitting diode display according to another embodiment of the present invention, the bank member may include a first bank layer and a second bank layer which are spaced apart from each other when viewed in cross section between two adjacent pattern electrodes of the plurality of pattern electrodes, Wherein one side of the first bank layer and one side of the second bank layer facing one side of the first bank layer each have an eave shape separating the common layer, A portion of the common layer separated by the shape may be disposed between the first bank layer and the second bank layer.

In the OLED display according to another embodiment of the present invention, the bank member may include a common bank layer disposed between two adjacent patterns of the plurality of pattern electrodes, a common bank layer disposed on the common bank layer, And a second bank disposed on the first bank, wherein a part of the common layer separated by the reverse tapered shape is disposed on the second bank .

In the organic light emitting diode display according to another embodiment of the present invention, the bank member is disposed between two adjacent patterns of the plurality of pattern electrodes, and has a common bank And a portion of the common layer separated by the undercut may be disposed on the common bank layer.

In the organic light emitting display according to another embodiment of the present invention, the bank member may include a first bank layer disposed between two adjacent patterns of the plurality of pattern electrodes, and a second bank layer disposed over the first bank layer And a second bank layer having a side projected from the first bank layer and a portion of the common layer separated by the projecting side of the second bank layer may be disposed on the second bank layer have.

According to another aspect of the present invention, there is provided a method of manufacturing an organic light emitting diode display, including forming first and second pixel electrodes on a first sub pixel and a second sub pixel of a substrate, Forming a bank member between the first pixel electrode and the second pixel electrode; forming a first common layer on the first pixel electrode, a second common layer on the second pixel electrode, And forming a dummy common layer on the bank member at the same time.

The forming of the bank member may include forming a sacrificial layer between the first pixel electrode and the second pixel electrode, forming a first sacrificial layer between the first pixel electrode and the second pixel electrode, Forming a first bank layer covering the pixel electrode and one end of the sacrificial layer, and a second bank layer covering the second pixel electrode and the other end of the sacrificial layer; and forming a second bank layer covering the first bank layer and the second bank layer, And removing the sacrificial layer so that an undercut is formed on a side surface of the sacrifice layer.

In the method of manufacturing an organic light emitting display according to an embodiment of the present invention, the step of forming the bank member may include forming a common bank layer covering one end of the first pixel electrode and one end of the second pixel electrode Forming a first bulkhead material layer and a second bulkhead material layer on the first pixel electrode, the second pixel electrode, and the common bank layer; etching the second common material layer to form a common Forming a second barrier rib on the bank layer, and etching the first barrier material layer using the second barrier rib as a mask to form a first barrier rib having an inverted taper shape.

In the method of manufacturing an organic light emitting display according to an embodiment of the present invention, the step of forming the bank member may include forming a first sacrificial layer and a second sacrificial layer overlapping the first pixel electrode and the second pixel electrode, Forming a common bank layer covering one end of the first sacrificial layer and one end of the second sacrificial layer and forming an undercut on both sides of the common bank layer; And removing the first sacrificial layer and the second sacrificial layer.

The forming of the bank member may include forming a first bank material layer on the first pixel electrode and the second pixel electrode, Exposing an A region overlapping the first pixel electrode and the second pixel electrode in the first bank material layer; forming a second bank material layer on the first bank material layer; Exposing a B region overlapping with the A region of the first bank material layer and having a width less than that of the A region in the bank material layer and exposing the A region of the first bank material layer and the B region of the second bank material layer And removing the B region to form a first bank layer and a second bank layer having a greater width than the first bank layer.

The details of other embodiments are included in the detailed description and drawings.

The present invention has an effect of suppressing driving of neighboring sub-pixels when a specific sub-pixel is driven by separately arranging organic layers having a common structure for each sub-pixel. Accordingly, light is emitted only in the target sub-pixel, and the luminance and power consumption of the organic light emitting display can be improved.

Since the organic layer having a common structure is disposed separately for each of the sub-pixels, the present invention reduces the color mixing problem between adjacent sub-pixels due to the current leakage phenomenon, thereby improving the display quality of the organic light emitting display.

Since the organic layer having a common structure can be independently arranged for each of a plurality of sub-pixels independently by using a common mask without a separate patterning process, the problem of color mixing between neighboring sub-pixels is improved, There is an effect that can be improved.

Since an organic layer having a common structure is disposed separately for each sub-pixel, when white light of a low gray level is realized, unwanted light is emitted from a pixel having the lowest turn-on voltage due to a current leakage phenomenon, It is possible to solve the problem that can not be implemented.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

1 is a schematic cross-sectional view of an OLED display according to a first embodiment of the present invention.
2 is a schematic cross-sectional view of an OLED display according to a second embodiment of the present invention.
3 is a flowchart illustrating a method of manufacturing an organic light emitting display according to a first embodiment of the present invention.
4A to 4F are cross-sectional views illustrating a method of manufacturing an OLED display according to a first embodiment of the present invention.
5 is a flowchart illustrating a method of manufacturing an organic light emitting display according to a second embodiment of the present invention.
6A to 6F are cross-sectional views illustrating a method of manufacturing an OLED display according to a second embodiment of the present invention.
7 is a schematic cross-sectional view of an OLED display according to a third embodiment of the present invention.
8 is a schematic cross-sectional view of an OLED display according to a fourth embodiment of the present invention.
9 is a flowchart illustrating a method of manufacturing an OLED display according to a third embodiment of the present invention.
10A to 10F are cross-sectional views illustrating a method of manufacturing an OLED display according to a third embodiment of the present invention.
11 is a flowchart illustrating a method of manufacturing an OLED display according to a fourth embodiment of the present invention.
12A to 12F are cross-sectional views illustrating a method of manufacturing an OLED display according to a fourth embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

An element or layer is referred to as being another element or layer "on ", including both intervening layers or other elements directly on or in between.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, technically various interlocking and driving, and that the embodiments may be practiced independently of each other, It is possible.

Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view of an OLED display 100 according to a first embodiment of the present invention. In FIG. 1, an organic light emitting display 100 having a patterned light emitting layer (patternd emission layer) structure is shown.

1, the OLED display 100 includes a substrate 110, a buffer layer 120, a thin film transistor 130, a gate insulating layer 140, an interlayer insulating layer 142, an overcoat layer 144, The first pixel electrode 152, the second pixel electrode 154, the conductive layer 156, the first bank layer 162, the second bank layer 164, the first common layer 172, A dummy common layer 176, a first organic luminescent layer 182, a second organic luminescent layer 184, and a common electrode 190.

The substrate 110 serves to support and protect various components of the OLED display 100. The substrate 110 may be made of an insulating material, and may be made of a material having flexibility such as glass or a polyimide-based material.

Referring to FIG. 1, the substrate 110 of the organic light emitting diode display 100 or the organic light emitting display 100 includes a plurality of sub pixels SP1 and SP2 adjacent to each other. A sub-pixel is an area for displaying one color, which is a minimum unit area in which light is emitted, and may be referred to as a sub-pixel area. In addition, a plurality of sub-pixels can be gathered to form one pixel capable of expressing white light. For example, a red sub-pixel, a green sub-pixel, A blue sub-pixel may be composed of one pixel. However, the present invention is not limited thereto, and various pixel designs are possible. In FIG. 1, only the first sub-pixel SP1 and the second sub-pixel SP2 neighboring each other are shown for convenience of explanation. In each of the first sub-pixel SP1 and the second sub-pixel SP2, light of different colors is emitted. For example, any one of red, green, and blue light may be emitted.

A buffer layer 120 is disposed on the substrate 110. The buffer layer 120 prevents penetration of moisture or impurities through the substrate 110 and flattens the top of the substrate 110. However, the buffer layer 120 is not necessarily required. Whether or not the buffer layer 120 is formed is determined based on the type of the substrate 110 and the type of the thin film transistor 130 used in the OLED display 100. [ The buffer layer 120 may be formed of a transparent material.

1, the OLED display 100 includes a thin film transistor 130 and an organic light emitting device (ED) for each of the sub-pixels SP1 and SP2.

The thin film transistor 130 is disposed on the buffer layer 120 and supplies a signal to the organic light emitting elements ED1 and ED2. The thin film transistor 130 includes an active layer 131, a gate electrode 132, a source electrode 133 and a drain electrode 134. Specifically, an active layer 131 is formed on the buffer layer 120, and a gate insulating layer 140 is formed on the active layer 131 to insulate the active layer 131 from the gate electrode 132. A gate electrode 132 is formed on the gate insulating layer 140 so as to overlap with the active layer 131 and an interlayer insulating layer 142 is formed on the gate electrode 132 and the gate insulating layer 140 A source electrode 133 and a drain electrode 134 are formed on the interlayer insulating layer 142. [ The source electrode 133 and the drain electrode 134 are electrically connected to the active layer 131.

The overlapping of two objects in this specification means that at least a part of the two objects overlap each other regardless of the presence or absence of another object in the vertical relationship between them and can also be referred to as various other names .

The driving thin film transistor 130 connected to the pixel electrodes 152 and 154 of the organic light emitting devices ED1 and ED2 among the various thin film transistors 130 included in the organic light emitting display 100, Respectively. Each of the sub-pixels SP1 and SP2 may further include a switching thin film transistor or a capacitor for driving the organic light emitting elements ED1 and ED2. Although the thin film transistor 130 is described as a coplanar structure in this specification, the thin film transistor 130 having an inverted staggered structure may also be used. Although the structure in which the pixel electrodes 152 and 154 of the organic light emitting devices ED1 and ED2 are connected to the source electrode 133 of the thin film transistor 130 is shown in the drawing, the organic light emitting devices ED1, The pixel electrodes 152 and 154 of the pixel electrodes ED1 and ED2 may be connected to the drain electrode 134 of the TFT 130. [

An overcoat layer 144 is disposed on the thin film transistor 130. The overcoat layer 144 functions as a planarization layer as a layer for planarizing an upper portion of the substrate 110. The overcoat layer 144 is formed on the first pixel electrode 152 and the second pixel electrode 154 to electrically connect the source electrode 133 of the thin film transistor 130 to the first pixel electrode 152 and the second pixel electrode 154 in each of the sub- Holes.

The organic light emitting devices ED1 and ED2 are disposed on the overcoat layer 144 and include the pixel electrodes 152 and 154, the common layers 172 and 174, the organic light emitting layers 182 and 184, do. 1, the first organic light emitting device ED1 is located in a first sub pixel SP1, the second organic light emitting device ED2 is located in a second sub pixel SP2, The first organic light emitting element ED1 and the second organic light emitting element ED2 emit light of different colors. The first organic light emitting device ED1 includes a first pixel electrode 152, a first common layer 172, a first organic light emitting layer 182, and a common electrode 190, A second common layer 174, a second organic light emitting layer 184, and a common electrode 190. The second pixel electrode 154, the second common layer 174, The turn-on voltage (turn-on voltage) of the first organic light emitting device ED1 and the second organic light emitting device ED1 may vary depending on the materials of the first organic light emitting layer 182 and the second organic light emitting layer 184, on voltage may be configured differently. For example, when the first organic luminescent layer 182 is a layer emitting red light and the second organic luminescent layer 184 is a layer emitting blue light, The voltage may have a value smaller than the turn-on voltage of the second organic light emitting element ED2. However, the present invention is not limited thereto, and the turn-on voltage may vary depending on the material of the organic light emitting layers 182 and 184. For example, according to the configuration of the organic luminescent layers 182 and 184, the turn-on voltage of an organic luminescent element including an organic luminescent layer that emits blue light is an organic luminescent layer including an organic luminescent layer that emits red light. And may be lower than the turn-on voltage of the light emitting element.

A first pixel electrode 152 and a second pixel electrode 154 are disposed on the overcoat layer 144. The first pixel electrode 152 and the second pixel electrode 154 serve to apply a voltage to the first organic emission layer 182 and the second organic emission layer 184, respectively. As shown in FIG. 1, the first pixel electrode 152 and the second pixel electrode 154 are separately arranged for the sub-pixels SP1 and SP2. Specifically, the first pixel electrode 152 is disposed in the first sub-pixel SP1 and the second pixel electrode 154 is disposed in the second sub-pixel SP2. Since the first pixel electrode 152 and the second pixel electrode 154 are separately arranged for the sub-pixels SP1 and SP2, they may be referred to as an electrode having a patterned electrode or a patterened structure. have.

Here, the layer having the pattern structure can be formed using a mask opened for each sub-pixel, for example, a fine metal mask (FMM), and has a separate structure for each sub-pixel. That is, the layer having the pattern structure has a structure that is disconnected from one sub-pixel to the neighboring sub-pixel without being connected to each other.

Each of the first pixel electrode 152 and the second pixel electrode 154 is an electrode for supplying holes to the organic light emitting layers 182 and 184 and may be formed of a transparent conductive material having a high work function. Here, the transparent conductive material may include indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO). 1, the first pixel electrode 152 and the second pixel electrode 154 may each include a reflection plate when the OLED display 100 is driven in a top emission mode. In FIG. 1, for convenience of illustration, the first pixel electrode 152 and the second pixel electrode 154 are expressed as one layer.

On the overcoat layer 144, the conductive layer 156 is disposed between the first sub-pixel SP1 and the second sub-pixel SP2. The first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 are separated from each other. The first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 may be simultaneously disposed in the same process. As a result, the first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 may be made of the same material and have the same thickness.

The first bank layer 162 and the second bank layer 164 divide the sub pixels SP1 and SP2 and divide the first pixel electrode 152 and the second pixel electrode 154 and the conductive layer 156 And exposes a part of each upper surface. 1, the first bank layer 162 is disposed so as to cover an edge of the first pixel electrode 152 and an edge of the conductive layer 156, and a conductive layer 156 is formed on the first bank layer 162. [ And the second bank layer 164 may be disposed so as to cover the edge of the first pixel electrode 154 and the edge of the second pixel electrode 154. The first bank layer 162 and the second bank layer 164 are formed between the first sub pixel SP1 and the second sub pixel SP2 or between the first pixel electrode 152 and the second pixel electrode 154 , And are spaced apart from each other when viewed in cross section. The first bank layer 162 and the second bank layer 164 may be made of any one of a transparent organic insulating material such as polyimide, photo acryl, benzocyclobutene (BCB) For example, a black resin.

" 형상을 가지고, 제2 뱅크층(164)의 언더컷(165)의 단면은 "

" 형상의 대칭 형상인 "ㄱ" 형상을 가질 수 있다. 제1 뱅크층(162)과 제2 뱅크층(164)으로 이루어진 구조는 뱅크 부재로 지칭될 수 있다. The first bank layer 162 includes an undercut 163 formed at the top of the edge of the conductive layer 156 and the second bank layer 164 also includes an undercut 165 formed at the top of the edge of the conductive layer 156 do. In the present specification, the undercut refers to a concave portion formed along the boundary line of the bank layer. 1, the lower region of the side surface of the first bank layer 162 overlapping with the conductive layer 156 and the lower region of the side surface of the second bank layer 164 are inwardly recessed Lt; / RTI > Or the upper region of the side surface of the first bank layer 162 and the upper side of the side surface of the second bank layer 164 may protrude toward the center of the conductive layer 156. [ Alternatively, the side surfaces of the first bank layer 162 and the side surfaces of the second bank layer 164 overlapping the conductive layer 156 may have an eave shape when viewed in cross section. Alternatively, one side of the first bank layer 162 and one side of the second bank layer 164 facing one side of the first bank layer 162 may have an eave shape. The undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164 may have a symmetrical structure with respect to the dummy common layer 176. [ For example, as shown in Figure 1, the cross section of the undercut 163 of the first bank layer 162 is "

Quot; and the cross section of the undercut 165 of the second bank layer 164 is "

The first bank layer 162 and the second bank layer 164 may have a shape of "a ", which is a symmetric shape of the first bank layer 162 and the second bank layer 164, respectively.

A first common layer 172 is disposed on the first pixel electrode 152 and a second common layer 174 is disposed on the second pixel electrode 154. The first common layer 172 extends to the top of the first bank layer 162 and the second common layer 174 extends to the top of the second bank layer 164. As shown in FIG. 1, the first common layer 172 and the second common layer 174 are separately arranged for each sub-pixel. Specifically, the first common layer 172 is disposed in the first sub-pixel SP1 and the second common layer 174 is disposed in the second sub-pixel SP2. A dummy common layer 176 is disposed above the center of the conductive layer 156. The dummy common layer 176 is disposed between the first sub-pixel SP1 and the second sub-pixel SP2 and is disposed separately from the first common layer 172 and the second common layer 174. [

The undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164 in the organic light emitting diode display device 100 according to the first embodiment of the present invention cause the first common The layer 172 and the second common layer 174 may be disposed separately from each other in a process using a common mask. The dummy common layer 176 separated from the first common layer 172 and the second common layer 174 is formed by the eaves of the first bank layer 162 and the second bank layer 164, May be disposed between the first bank layer 162 and the second bank layer 164. More specifically, the first common layer 172 and the second common layer 174 are formed on the first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 using a common mask Since the lower regions of the side surfaces of the first bank layer 162 and the second bank layer 164 overlapping the conductive layer 156 are depressed as the organic material is deposited on the entire surface, organic materials with low coverage can not be connected with each other and are broken. Here, the term step coverage refers to that a uniform thickness film can be deposited on the bottom and wall surfaces of a trench or hole having a large aspect ratio such as a reverse taper. Thus, the organic material having a low step coverage can not be deposited to the lower region of the side surfaces of the first bank layer 162 and the second bank layer 164 overlapping the conductive layer 156, and is broken. That is, since the side surfaces of the first bank layer 162 and the second bank layer 164 overlapping the conductive layer 156 have an eave shape, a part of the organic material can be formed in the sub-pixels SP1, SP2). The organic material disposed on the first pixel electrode 152 and the first bank layer 162 becomes the first common layer 172 and the organic material disposed on the second pixel electrode 154 and the second bank layer 164 The organic material disposed on the first common layer 174 and the organic material disposed on the conductive layer 156 between the first bank layer 162 and the second bank layer 164 is the first common layer 174, 172 and the second common layer 174 and the dummy common layer 176 are separated from each other.

The first common layer 172 and the second common layer 174 are additional organic layers disposed between the pixel electrodes 152 and 154 and the organic light emitting layers 172 and 174, Type hole transporting layer doped with a p-type dopant in a hole transporting layer or a hole injecting layer for more smoothly moving the light emitting layer. More specifically, each of the first common layer 172 and the second common layer 174 may serve to smoothly inject holes into the first organic light emitting layer 182 and the second organic light emitting layer 184, respectively have.

As mentioned above, the first common layer 172, the second common layer 174, and the dummy common layer 176 are made of the same material. For example, the first common layer 172, the second common layer 174, and the dummy common layer 176 may comprise the same host material and the same p-type dopant. N, N'-bis (phenyl) -benzidine, TPD (N, N'-bis- (3-methylphenyl) , s-TAD (2,2 ', 7,7'-tetrakis (N, N-diphenylamino) -9,9-spirofluorene) and MTDATA (4,4' phenyl-amino) -triphenylamine. The p-type dopant includes metal oxide, tetrafluoro-tetracyanoquinodimethane (F4-TCNQ), hexanitrile, hexaazatriphenylene, FeCl ₃ , FeF ₃ and SbCl ₅ , but are not limited thereto.

The first common layer 172, the second common layer 174, and the dummy common layer 176 may have the same thickness. For example, the first common layer 172, the second common layer 174, and the dummy common layer 176 may all have a thickness of 100 ANGSTROM to 1500 ANGSTROM, but are not limited thereto.

The first common layer 172 disposed in the first sub-pixel SP1, the second common layer 174 disposed in the second sub-pixel SP2, and the first sub-pixel SP1 and the second sub- The second common layer 174 and the dummy common layer 176 are formed of the same material using a common mask so that the dummy common layer 176 disposed between the first common layer 172, Can be seen simultaneously in the process. The first common layer 172, the second common layer 174, and the dummy common layer 176 may be referred to as a common layer.

A first organic emission layer 182 is disposed on the first common layer 172 and a second organic emission layer 184 is disposed on the second common layer 174. [ As shown in FIG. 1, the first organic emission layer 182 and the second organic emission layer 184 are separately arranged for each sub-pixel. Specifically, the first organic emission layer 182 is disposed in the first sub-pixel SP1 and the second organic emission layer 184 is disposed in the second sub-pixel SP2. Each of the first organic emission layer 182 and the second organic emission layer 184 may emit light with a voltage applied thereto. The first and second organic emission layers 182 and 184 may emit light of different colors Emitting layer. The first organic light emitting layer 182 and the second organic light emitting layer 184 may be referred to as a patternd emission layer because they have a patterend structure arranged separately for the sub-pixels SP1 and SP2 .

A common electrode 190 is disposed on the first organic light emitting layer 182, the second organic light emitting layer 184, and the dummy common layer 176. The common electrode 190 is disposed in common to the first sub-pixel SP1 and the second sub-pixel SP2. The common electrode 190 may be connected to a separate Vss voltage line to apply the same voltage to the first organic emission layer 182 and the second organic emission layer 184. The common electrode 190 is an electrode for supplying electrons and may be formed of a metallic material having a relatively low work function such as silver (Ag), titanium (Ti), aluminum (Al), molybdenum (Mo) May be composed of an alloy of silver (Ag) and magnesium (Mg). Although the common electrode 190 is shown as being disposed in common to the first sub-pixel SP1 and the second sub-pixel SP2 in FIG. 1, two common electrodes 190 may be disposed in the first sub- 2 sub-pixels SP2, and electrically connected through the conductive layer 156. [0064]

As described above, an additional organic layer, such as a hole injection layer or a p-type hole transport layer, disposed between the pixel electrodes 152 and 154 and the organic light emitting layers 172 and 174 is a common structure sharing a plurality of sub pixels SP1 and SP2. a current leakage phenomenon may occur in which current flows to other neighboring sub-pixels through an additional organic layer having a common structure when a current is applied to drive a specific sub-pixel. Specifically, the additional organic layer disposed between the pixel electrodes 152 and 154 and the organic light emitting layers 172 and 174 may be disposed in common to the first sub-pixel SP1 and the second sub-pixel SP2. Further, the additional organic layer can have a considerably high mobility due to the p-type dopant added to smooth the movement of the holes of the organic light emitting devices ED1 and ED2. Accordingly, when a current flows vertically between the first pixel electrode 152 and the common electrode 190 so that light is emitted from the first organic light emitting layer 182 of the first sub-pixel SP1, A current is leaked horizontally in the additional organic layer and current flows to the second organic light emitting layer 184, so-called current leakage phenomenon may occur. The current leakage phenomenon causes light to be emitted even in the neighboring second sub-pixel SP2 when the first sub-pixel SP1 is to be driven. Therefore, the brightness of the organic light emitting display 100 is lowered and the power consumption is increased It is becoming the main cause. That is, due to such a current leakage phenomenon, other undesired sub-pixels are emitted, resulting in color mixture between the sub-pixels SP1 and SP2 and lowering the luminance of the driven sub- Degradation and increased power consumption.

Further, when a low current is applied to both the first organic light emitting layer 182 and the second organic light emitting layer 184 in order to realize a low gradation white color, the first sub pixel SP1 and the second sub pixel SP2 The current is leaked through the additional organic layer, for example, the hole injection layer or the p-type hole transporting layer disposed in common, and the organic light emitting layer 182 and the second organic light emitting layer 182, , For example, the first organic light emitting layer 182 emitting red light may be firstly emitted and the phenomenon of emitting the brightest light may be generated. In this case, pure white light can not be realized at a low gray level, and a redish phenomenon in which white light having a red color is realized can be generated.

In addition, in the structure in which the turn-on voltages between neighboring sub-pixels are different from each other, when a pixel having a relatively large turn-on voltage is driven, The problem that unwanted light is emitted may occur more seriously in other pixels arranged, that is, pixels having a relatively small turn-on voltage. For example, in the structure in which the turn-on voltage of the first organic light emitting element ED1 has a value smaller than the turn-on voltage of the second organic light emitting element ED2, On voltage is low through the additional organic layer having a common structure, for example, the hole injection layer or the p-type hole transport layer, when the driving voltage is applied to the second sub-pixel SP2 for the second organic light emitting element A current can be leaked to the first organic light emitting device ED1 having a lower barrier to which a current can flow than the first organic light emitting device ED1. As a result, the first organic light emitting element ED1 of the first sub-pixel SP1, to which the driving voltage is not applied, is undesirably emitted, so that the color mixture problem between the neighboring sub-pixels SP1 and SP2 may be more seriously generated .

An additional organic layer having a common structure between the pixel electrodes 152 and 154 and the organic light emitting layers 182 and 184, for example, a hole injection layer or an organic light emitting layer having a common structure may be formed in the OLED display 100 according to the first embodiment of the present invention. Since the p-type hole transporting layer is independently disposed in each of the plurality of sub-pixels SP1 and SP2, the current leakage from the hole injection layer or the p-type hole transporting layer to other undesired sub-pixels can be prevented. That is, an additional organic layer having a common structure between the pixel electrodes 152 and 154 and the organic light emitting layers 182 and 184 is formed on the undercut 163 of the first bank layer 162 and the undercut 163 of the second bank layer 164 The first common layer 172 and the second common layer 174 are separately disposed in the respective sub-pixels SP1 and SP2 by the first common layer 172 and the second common layer 174. Accordingly, problems such as light emission in undesired sub-pixels due to the current leakage phenomenon and problems in that a pure white color with a low gray scale can not be realized, such as a redish phenomenon, can be effectively solved .

In the OLED display 100 according to the first embodiment of the present invention, the undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164 form separate The first common layer 172 and the second common layer 174 can be easily and separately arranged in the first sub-pixel SP1 and the second sub-pixel SP2 using a common mask without a patterning process. Therefore, the process time for disposing the first common layer 172 and the second common layer 174 can be shortened, and the process cost can be reduced.

The minimum gap W1 within the undercut 163 of the first bank layer 162 and the minimum gap W2 within the undercut 165 of the second bank layer 164 are each equal to the width W2 of the first common layer 172, May be greater than the thickness of the first common layer (172) or the second common layer (174) so that the second common layer (174) can be smoothly separated. For example, the minimum spacing W1 within the undercut 163 of the first bank layer 162 and the minimum spacing W2 within the undercut 165 of the second bank layer 164 may be between 200 A and 2500 A have. The minimum spaces W1 and W2 inside the undercuts 163 and 165 of the bank layers 162 and 164 are set so as to extend from the upper surface of the conductive layer 156 to the inside of the undercuts 163 and 165 Is the distance to the upper surface of the frame. The minimum spacing W1 in the undercut 163 of the first bank layer 162 and the minimum spacing W2 in the undercut 165 of the second bank layer 164 are set to be equal to each other 190 may not be separated from each other. The minimum gap W1 inside the undercut 163 of the first bank layer 162 and the minimum gap W2 inside the undercut 165 of the second bank layer 164 are out of step coverage of the common electrode 190 A part of the common electrode 190 is cut off, so that a problem that a normal driving voltage is not applied to a specific sub-pixel may occur.

The organic light emitting devices ED1 and ED2 may further include a hole transporting layer between the common layers 172 and 174 and the organic light emitting layers 182 and 184. [ The hole transporting layer may be arranged in a common structure so as to share a plurality of sub-pixels SP1 and SP2 like the common layers 172 and 174. In order to optimize the micro-cavity distance of the organic light emitting elements ED1 and ED2 according to the characteristics of the organic light emitting layers 182 and 184 arranged for the sub-pixels SP1 and SP2, SP1, and SP2) may be arranged in a patterned structure having different thicknesses. At least a part of the hole transporting layer in the structure in which the hole transporting layers are arranged in a common structure is formed by the undercuts 163 and 165 of the bank layers 162 and 164 in the same manner as the common layers 172 and 174, May be arranged separately for each of the pixels SP1 and SP2. In this case, a dummy hole transporting layer, which is the remaining hole separation layer separated by the bank layers 162 and 164, is formed between the adjacent sub-pixels SP1 and SP2 in common with the conductive layer 156 Electrodes 190 may be further disposed.

The organic light emitting devices ED1 and ED2 may further include an electron transporting layer or an electron injecting layer between the organic light emitting layers 182 and 184 and the common electrode 190. [

Although the first embodiment of the present invention has been described with reference to the organic light emitting display 100 having the pattern light emitting layer structure, the application of the structure according to the first embodiment of the present invention to the organic light emitting display having the common emission layer structure It is possible. This will be described in detail as follows.

The organic light emitting display having a common light emitting layer structure may have a structure in which a plurality of organic light emitting layers for emitting white light, for example, a blue organic light emitting layer and a yellow organic light emitting layer, are laminated between the pixel electrode and the common electrode. In addition, organic layers such as an injecting layer, a transporting layer, and the like may be further disposed between the two electrodes to enhance the characteristics of the organic light emitting device. A plurality of organic layers included in the organic light emitting display of the common light emitting layer structure are stacked in the same structure in all pixels without a pattern for each pixel by using a common mask and the organic light emitting elements arranged in each sub pixel emit white light do. When an organic light emitting display having a common light emitting layer structure is driven, current is leaked through at least some of a plurality of organic layers, and a problem that not only a sub-pixel to which a driving voltage is applied but also other sub- Lt; / RTI > For example, the organic light emitting display of the common light emitting layer structure may further include a carrier generation layer disposed between the organic light emitting layers and for supplying electric charges to the respective organic light emitting layers. In this case, a problem may occur that a current is leaked to an undesired sub-pixel through the charge generating layer arranged to share a plurality of sub-pixels.

In this structure, by arranging the bank layers 162 and 164 including the undercuts 163 and 165 described in the first embodiment of the present invention between the adjacent sub-pixels SP1 and SP2, The sub pixels SP1 and SP2 may be separately arranged so as not to share the plurality of sub pixels SP1 and SP2, that is, the sub pixels SP1 and SP2. At this time, since the minimum spaces W1 and W2 inside the undercuts 163 and 165 of the bank layers 162 and 164 have a larger value than the distance from the pixel electrode to the charge generation layer, Can be separated smoothly.

That is, the minimum distances W1 and W2 inside the undercuts 163 and 165 of the bank layers 162 and 164 are designed to have a larger value than the distance from the pixel electrode to the organic layer to be separated per sub- The organic layers capable of causing current leakage without a separate patterning process can be separately arranged for each sub-pixel. Accordingly, the problem that the display quality of the organic light emitting display device is degraded due to the color mixture problem between neighboring sub-pixels can be improved.

The minimum distances W1 and W2 within the undercuts 163 and 165 of the bank layers 162 and 164 are designed to be larger than the distance from the pixel electrode to the organic layer to be separated per sub pixel, May not be separated by the undercuts 163 and 165 of the bank layers 162 and 164.

2 is a schematic cross-sectional view of an OLED display 200 according to a second embodiment of the present invention.

The OLED display 200 of FIG. 2 includes a common bank layer 260 in place of the first and second bank layers 162 and 164 as compared to the OLED display 100 of FIG. 1 And the first common layer 272, the second common layer 274, the dummy common layer 276, and the first organic light emitting layer (second common layer) 276 are arranged on the common bank layer 260, 282, the second organic light emitting layer 284, and the common electrode 290 are the same, and the remaining components are the same. That is, for the sake of convenience of description, a detailed description of the same or corresponding components to those of the previous embodiment will be omitted.

Referring to FIG. 2, the OLED display 200 includes a common bank layer 260 and barrier ribs 266.

The common bank layer 260 divides the sub pixels SP1 and SP2 and exposes a part of the upper surface of each of the first pixel electrode 152 and the second pixel electrode 154. [ 2, the common bank layer 260 may be disposed so as to cover an edge of the first pixel electrode 152 and an edge of the second pixel electrode 154. As shown in FIG. The common bank layer 260 is disposed between the first sub-pixel SP1 and the second sub-pixel SP2. The common bank layer 260 may be made of a transparent organic insulating material or a material that exhibits black.

A partition wall 266 is disposed on the common bank layer 260. The barrier ribs 266 serve to disconnect the first common layer 272 and the second common layer 274. In other words, the first common layer 272 and the second common layer 274 may be separately arranged for the sub-pixels SP1 and SP2 by the barrier ribs 266. [ The barrier ribs 266 may be arranged in a mesh structure over the entire surface of the substrate 110. 2, the barrier rib 266 may include a first barrier rib 267 and a second barrier rib 269 disposed on the first barrier rib 267.

The first bank 267 may have a reverse tapered shape. 2, the lower surface of the first bank 267 is in contact with a part of the common bank layer 260, and the cross-sectional area of the first bank 267 is increased as it is away from the common bank layer 260 The area of the upper surface of the first barrier rib 267 may be larger than the area of the lower surface of the first barrier rib 267 or the lower surface of the barrier rib 266. As the first bank 267 has an inverted taper shape, the first common layer 272 and the second common layer 274 can be separately arranged using a common mask. The first bank 267 may be composed of a soft metallic material, for example, molybdenum (Mo). The first barrier rib 267 may have a thickness of 200 Å to 5000 Å, but is not limited thereto.

A second partition 269 is disposed on the first partition 267. The second barrier rib 269 may serve as a mask disposed on the first barrier rib 267 when the first barrier rib 267 is processed in the reverse tapered shape. The second bank 269 may be composed of a heat or UV (ultraviolet) curable material. For example, the second bank 269 may be formed of polyimide, which is a thermosetting material. The second bank 269 may have a thickness of 1 탆 to 2.5 탆, but is not limited thereto. The structure consisting of the common bank layer 260 and the partition 266 may be referred to as a bank member

The first common layer 272 and the second common layer 274 extend to the top of the common bank layer 260. [ As shown in FIG. 2, the first common layer 272 and the second common layer 274 are separately arranged for the sub-pixels SP1 and SP2 by the barrier ribs 266. As shown in FIG.

A dummy common layer 276 made of the same material as the first common layer 272 and the second common layer 274 is disposed on the partition wall 266. [ Specifically, the dummy common layer 276 separated by the reverse tapered shape of the first partition 267 is disposed on the second partition 269. The dummy common layer 276 is disposed between the first sub-pixel SP1 and the second sub-pixel SP2 and is disposed separately from the first common layer 272 and the second common layer 274. [

The common electrode 290 is disposed on the first organic light emitting layer 282 and the second organic light emitting layer 284. The common electrode 290 is formed so as to be common to the first sub-pixel SP1 and the second sub-pixel SP2, that is, along the side surface of the first partition 267, Electrode 290 may comprise a layer of material with good step coverage. For example, the common electrode 290 may be formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO) Layer.

The first common layer 272 and the second common layer 274 are formed by the partition walls 266 disposed on the common bank layer 260 in the organic light emitting diode display 200 according to the second embodiment of the present invention. Pixels SP1 and SP2 can be easily arranged even in a process using a common mask. More specifically, the first common layer 272 and the second common layer 274 are formed on the first pixel electrode 152, the second pixel electrode 154, the common bank layer 260, Organic materials having low step coverage can not be connected to each other due to the reverse tapered shape of the first barrier ribs 267 in the process of depositing the organic material for forming the layer 274 on the entire surface. That is, the organic material having a low step coverage can not be deposited to the side of the reverse tapered shape of the partition wall 266 but is cut off, so that a part of the organic material can be separated between the sub pixels SP1 and SP2. The organic material disposed on the first pixel electrode 152 and the common bank layer 260 becomes the first common layer 272 and is disposed on the second pixel electrode 154 and the common bank layer 260 The organic material disposed on the barrier ribs 266 is a dummy common layer 276 separated from the first common layer 272 and the second common layer 274 do.

Accordingly, since the first common layer 272 and the second common layer 274 are separately arranged for each of the sub-pixels SP1 and SP2 without a separate patterning process, current is leaked to neighboring sub-pixels, The problem of light emission from the pixel can be improved.

The second embodiment of the present invention is also applicable to an OLED display device having a common light emitting layer structure. Specifically, by disposing the common bank layer 260 and the barrier ribs 266 described in the second embodiment of the present invention between the neighboring sub-pixels SP1 and SP2, an organic layer Pixels SP1 and SP2 can be separately arranged without a separate patterning process. Accordingly, the color mixing problem between neighboring sub-pixels is improved, and the display quality of the organic light emitting display device can be improved.

3 is a flowchart illustrating a method of manufacturing the OLED display 100 according to the first embodiment of the present invention. 4A to 4F are cross-sectional views illustrating a method of manufacturing the OLED display 100 according to the first embodiment of the present invention. In the following description of the present embodiment, for the sake of convenience of description, detailed description of the same or corresponding components to those of the previously described embodiment will be omitted.

Referring to FIG. 3, a method of manufacturing an OLED display 100 according to a first embodiment of the present invention includes forming a first pixel electrode and a second pixel electrode on a substrate, (S310) forming a conductive layer between the pixel electrodes, forming a sacrifice layer (S320) in which at least a part of the sacrifice layer overlaps the conductive layer on the conductive layer (S320), forming a first pixel electrode (S330) forming a second bank layer covering the bank layer, the second pixel electrode and the other end of the sacrificial layer, forming an undercut on a side surface of the first bank layer and a side surface of the second bank layer overlapping the conductive layer , Removing the sacrifice layer (S340), forming a first common layer on the first pixel electrode, a second common layer on the second pixel electrode, and a second common layer on the first bank layer and the second bank layer Forming a dummy common layer at the same time (S350); and forming a common layer on the first common layer, the second common layer, and the dummy common layer And forming an electrode (S360).

4A, a buffer layer 120, a thin film transistor 130, a gate insulating layer 140, an interlayer insulating layer 142, and an overcoat layer 144 are formed on a substrate 100.

A first pixel electrode 152 and a second pixel electrode 154 are formed on the substrate 110 and a conductive layer 156 is formed between the first pixel electrode 152 and the second pixel electrode 154. [ (S310). More specifically, a first pixel electrode 152 is formed on the first sub-pixel SP1 of the substrate 110, a second pixel electrode 154 is formed on the second sub-pixel SP2, A conductive layer 156 is formed between the pixel electrode 152 and the second pixel electrode 154. [ The first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 are simultaneously formed in the same process. A mask patterned so that the first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 are disposed separately from each other can be used. The first pixel electrode 152, the second pixel electrode 154, and the conductive layer 156 may be formed of the same material.

Next, referring to FIG. 4B, a sacrifice layer 461 is formed on the conductive layer 156 so as to overlap at least a part of the conductive layer 156 (S320). The sacrificial layer 461 may be made of a soft metallic material, for example, molybdenum (Mo), but is not limited thereto. The thickness of the sacrificial layer 461 may be greater than the thickness of the first common layer 172 or the second common layer 174 to be formed later, and may be, for example, 200 Å to 2500 Å have. That is, the thickness of the sacrifice layer 461 is set to be the minimum gap W1 inside the undercut 163 of the first bank layer 162 and the minimum gap W2 inside the undercut 165 of the second bank layer 164, (W2) can be determined.

The sacrificial layer 461 may be disposed between the first sub-pixel SP1 and the second sub-pixel SP2 using a patterned mask. That is, a material forming the sacrifice layer 461 is deposited on the first pixel electrode 152, the conductive layer 156, and the second pixel electrode 154, and then a patterned mask is formed on the metal layer 156 The remaining portion except the portion overlapping the metal layer 461 may be removed through the etching process. At this time, the sacrifice layer 461 and the conductive layer 156 may be made of materials having different etch selectivities.

4C, a first bank layer 162 and a second pixel electrode 154 that cover one edge of the first pixel electrode 152 and the sacrifice layer 461, and a sacrifice layer 461 The second bank layer 164 is formed to cover the other end of the first bank layer 164 (S330). The first bank layer 162 and the second bank layer 164 are made of the same material and can be simultaneously formed through the same process.

4D, the undercuts 163 and 165 are formed on the side surfaces of the first bank layer 162 and the side surfaces of the second bank layer 164 overlapping the conductive layer 156, 461 are removed (S340). The etchant having a specific etch selectivity suitable for the sacrificial layer 461 may be used to affect other components such as the conductive layer 156 because the etch selectivities of the sacrificial layer 461 and the conductive layer 156 are different from each other. Can be etched away and removed. At this time, the etchant may be composed of, for example, an aqueous solution of sulfuric acid (H ₂ SO ₄ ), an aqueous solution of nitric acid (HNO ₃ ), an aqueous solution of phosphoric acid (H ₃ PO ₄ ), or a combination thereof.

Next, as shown in FIG. 4E, a first common layer 172 located on the first pixel electrode 152, a second common layer 174 located on the second pixel electrode 154, The dummy common layer 176 located between the first bank layer 162 and the second bank layer 164 is formed simultaneously (S350). The first common layer 172, the second common layer 174, and the dummy common layer 176 can be formed simultaneously in the same process. Specifically, the first common layer 172, the second common layer 174, and the dummy common layer 176 can be simultaneously disposed using a thermal evaporation method as one common mask. The organic material constituting the first common layer 172, the second common layer 174 and the dummy common layer 176 may be the first pixel electrode 152, a part of the first bank layer 162, The undercut 163 of the first bank layer 162 and the second bank layer 164 are deposited only on the two pixel electrodes 154, a part of the second bank layer 164 and a part of the conductive layer 156, Do not reach the conductive layer 156 along the undercut 165 of the conductive layer 156. That is, the organic material having a low step coverage is formed on the side surface of the second bank layer 164 and the undercut 163 formed on the side surface of the first bank layer 162, which overlaps with the conductive layer 156 The undercut (165) is broken and is not deposited and is cut off. As a result, the first common layer 172 and the second common layer 174 are patterned by the undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164, Can be separately arranged for each of the sub-pixels SP1 and SP2 without any process.

Next, referring to FIG. 4F, a common electrode 190 is formed on the first common layer 172, the second common layer 174, and the dummy common layer 176 (S360). More specifically, a first organic emission layer 182 is formed on the first common layer 172 of the first sub-pixel SP1 and a second organic emission layer 182 is formed on the second common layer 174 of the second sub- 2 organic light emitting layer 184 are formed. The first organic light emitting layer 182 and the second organic light emitting layer 184 emit light of different colors and pattern deposition is performed using a mask opened for each of the sub-pixels SP1 and SP2, for example, a fine metal mask (FMM) . Thereafter, the common electrode 190 is disposed on the first organic light emitting layer 182, the second organic light emitting layer 184, and the dummy common layer 176. The common electrode 190 can be formed using a sputtering method as a common mask, and can be connected or extended without being disconnected from one sub-pixel SP1 to a neighboring sub-pixel SP2.

In the method of manufacturing the organic light emitting diode display 100 according to the first embodiment of the present invention, after the sacrifice layer 461, the first bank layer 162, and the second bank layer 164 are sequentially arranged, The undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164 can be easily formed by a simple process of etching the layer 461. [ The undercut 163 of the first bank layer 162 and the undercut 165 of the second bank layer 164 are used to form the first common layer 172 and the second common layer 174 using a common mask without a separate patterning step. 2 common layer 174 can be stably arranged for each of the sub-pixels SP1 and SP2. As a result, the problem that the display quality of the organic light emitting diode display due to the current leakage phenomenon is lowered or the problem that the power consumption is increased can be improved.

5 is a flowchart illustrating a method of manufacturing the organic light emitting diode display 200 according to the second embodiment of the present invention. 6A to 6F are cross-sectional views illustrating a method of manufacturing the organic light emitting diode display 200 according to the second embodiment of the present invention. In the following description of the present embodiment, for the sake of convenience of description, detailed description of the same or corresponding components to those of the previously described embodiment will be omitted.

Referring to FIG. 5, a method of manufacturing an OLED display 200 according to a second embodiment of the present invention includes forming a first pixel electrode and a second pixel electrode on a substrate (S510) (S520) forming a common bank layer covering one end of the electrode and one end of the second pixel electrode, forming a common bank layer on the first pixel electrode, the second pixel electrode, and the common bank layer, (S530), forming a second barrier rib on the common bank layer by etching the second barrier rib material layer (S540), etching the first barrier rib material layer using the second barrier rib as a mask Forming a first bank on the bank layer (S550); forming a first common layer on the first pixel electrode, a second common layer on the second pixel electrode, and a dummy common layer on the second bank (S560), and forming a common electrode on the first common layer, the second common layer, and the dummy common layer And a step (S570) to.

First, referring to FIG. 6A, a first pixel electrode 152 and a second pixel electrode 154 are formed on a substrate 110 (S510). Specifically, a first pixel electrode 152 is formed on the first sub-pixel SP1 of the substrate 110, and a second pixel electrode 154 is formed on the second sub-pixel SP2. The first pixel electrode 152 and the second pixel electrode 154 are formed simultaneously in the same process and may be formed of the same material.

6B, a common bank layer 260 covering one end of the first pixel electrode 152 and one end of the second pixel electrode 154 is formed (S520), and the first pixel electrode 152 A first barrier material layer 668 and a second barrier material layer 670 are sequentially formed on the first pixel electrode 152, the second pixel electrode 154 and the common bank layer 260 in operation S530. The first barrier material layer 668 and the second barrier material layer 670 are formed to share the first sub-pixel SP1 and the second sub-pixel SP2. The first barrier material layer 668 may be comprised of, for example, molybdenum (Mo), and the second barrier material layer 670 may be comprised of, for example, polyimide.

Next, referring to FIG. 6C, the second bank material layer 670 is etched to form a second bank 269 on the common bank layer 260 (S540). Before the second barrier material layer 670 is etched, an exposure process may be performed to apply heat or UV only to the portion of the second barrier material layer 670 to be left as the second barrier rib 269 using a mask . After the exposure process, etchant etches the second barrier material layer 670, the remaining portion of the second barrier material layer 670, except for the hardened portion, is removed and the second A barrier rib 269 may be formed.

Referring to FIG. 6D, the first barrier rib material layer 668 is etched using the second barrier ribs 269 as a mask to form the first barrier ribs 267 on the common bank layer 260 (S550). Specifically, the etchant is used to etch the first barrier material layer 668 until only the portion overlapping the second barrier ribs 269 remains, and further etch the first barrier material layer 668 for an additional time The first bank 267 having a reverse tapered shape can be disposed on the common bank layer 260. [ That is, when the first barrier material layer 668 is overetched using the second barrier rib 269 as a mask, a first barrier rib 267 having an inverted taper shape is formed as shown in FIG. 6D . The etchant for etching the first barrier material layer 668 may be, for example, 40 to 70 wt% phosphoric acid (H ₃ PO ₄ ) and 3 to 15 wt % Of nitric acid (HNO ₃ ), 5 to 35 wt% of acetic acid (CH ₃ COOH), 0.05 to 5 wt% of a chlorine compound, 0.01 to 5 wt% of a chlorine stabilizer, 0.01 to 5 wt% of a pH stabilizer, Water.

6E, a first common layer 272 located on the first pixel electrode 152, a second common layer 274 located on the second pixel electrode 154, A dummy common layer 276 located on the dummy common layer 269 is simultaneously formed (S560). The first common layer 272, the second common layer 274, and the dummy common layer 276 can be simultaneously formed in the same process. More specifically, the organic material constituting the first common layer 272, the second common layer 274 and the dummy common layer 276 is electrically connected to the first pixel electrode 152, the second pixel electrode 154, 266 and the common bank layer 260, but not along the sides of the barrier ribs 266. That is, the organic material having a low step coverage can not be deposited on the side surface of the barrier rib 266, for example, the side surface of the first barrier rib 267 having an inverted taper shape, and is cut off. As a result, the first common layer 272 and the second common layer 274 can be separately arranged for each of the sub-pixels SP1 and SP2 by a partition 266 without a separate patterning process.

Next, referring to FIG. 6F, a common electrode 290 is formed on the first common layer 272, the second common layer 274, and the dummy common layer 276 (S670). More specifically, a first organic emission layer 282 is formed on the first common layer 272 of the first sub-pixel SP1 and a second organic emission layer 282 is formed on the second common layer 274 of the second sub- 2 organic light emitting layer 284 are formed. Thereafter, the common electrode 290 is disposed on the first organic light emitting layer 282, the second organic light emitting layer 284, and the dummy common layer 276. The common electrode 290 can be formed using a sputtering method as a common mask, and can be connected or extended without being disconnected from one sub-pixel SP1 to the neighboring sub-pixel SP2.

In the method of manufacturing the OLED display 200 according to the second embodiment of the present invention, the first barrier rib 267 having an inverted taper shape can be easily formed using the second barrier rib 269 as a mask. The first common layer 272 and the second common layer 274 are formed by using a common mask without a separate patterning process using the first barrier rib 267 and the second barrier rib 269 having a reverse tapered shape. It can be stably arranged separately for each of the sub-pixels SP1 and SP2. Accordingly, a problem that the display quality of an organic light emitting display device such as a redish phenomenon due to a current leakage phenomenon is lowered can be solved.

7 is a schematic cross-sectional view of an OLED display 700 according to a third embodiment of the present invention.

The organic light emitting display 700 of FIG. 7 is different from the organic light emitting display 100 of FIG. 1 and the organic light emitting display 200 of FIG. 2 in that the structure of the common bank layer 760 and the first common Only the arrangement of the layer 772, the second common layer 774, the dummy common layer 776, the first organic luminescent layer 782, the second organic luminescent layer 784 and the common electrode 790 are different, Are the same, so duplicate descriptions will be omitted. That is, for the sake of convenience of description, detailed description of the same or corresponding components to those of the previous embodiments will be omitted.

Referring to FIG. 7, an OLED display 700 according to a third embodiment of the present invention includes a common bank layer 760 including undercuts 763 and 765.

The common bank layer 760 divides the sub pixels SP1 and SP2 and exposes the top surfaces of the first pixel electrode 152 and the second pixel electrode 154, respectively. Specifically, the upper surfaces of the first pixel electrode 152 and the second pixel electrode 154 are completely exposed by the undercuts 763 and 765 of the common bank layer 760. The common bank layer 760 is disposed between the first sub-pixel SP1 and the second sub-pixel SP2, and may be made of a transparent organic insulating material or a material showing black.

" 형상을 가질 수 있다. 공통 뱅크층(760)은 뱅크 부재로 지칭될 수 있다The common bank layer 760 includes an undercut 763 formed on the upper portion of the edge of the first pixel electrode 152 and an undercut 765 formed on the upper portion of the end of the second pixel electrode 154. 7, the upper region of the side surface of the common bank layer 760 overlapping the first pixel electrode 152 has a shape protruding toward the center of the first pixel electrode 152, An upper region of the side surface of the common bank layer 760 overlapping the second pixel electrode 154 has a shape protruding from the center of the second pixel electrode 54. Alternatively, one side of the common bank layer 760 overlapping the first pixel electrode 152 and the other side of the common bank layer 760 overlapping the second pixel electrode 154 may have an eave Shape. Alternatively, one side of the common bank layer 760 located close to the first pixel electrode 152 and the other side of the common bank layer 760 located close to the second pixel electrode 154 are respectively undercuts 763 and 765 ). The undercuts 763 and 765 of the common bank layer 760 may have a symmetrical structure about the center of the common bank layer 760. [ 7, the cross section of the undercut 763 on one side of the common bank layer 760 has an "a" shape and the undercut 765 on the other side of the common bank layer 760 has a " Sectional shape is a symmetric shape "a"

"Shape. The common bank layer 760 can be referred to as a bank member

The upper surfaces of the first pixel electrode 152 and the second pixel electrode 154 are completely exposed by the undercuts 763 and 765 of the common bank layer 760 as described above. That is, the edge of the first pixel electrode 152 and the edge of the second pixel electrode 154 are not covered by the common bank layer 760. When forming the undercuts 763 and 765 of the common bank layer 760 and forming the undercuts 765 using the same mask for forming the pixel electrodes 152 and 154 without the additional mask, 760 do not cover the ends of the pixel electrodes 152, 154. That is, since a separate mask for forming the undercuts 763 and 765 is not required, the process cost of the OLED display 700 can be reduced. A manufacturing method of forming the undercuts 763 and 765 of the common bank layer 760 without a separate mask will be described later in more detail with reference to FIGS. 9 and 10. FIG.

A first common layer 772 is disposed on the first pixel electrode 152 and a second common layer 774 is disposed on the second pixel electrode 154. A dummy common layer 774 is formed on the common bank layer 760, A layer 776 is disposed. The first common layer 772, the second common layer 774, and the dummy common layer 776 are disposed separately from each other.

The first common layer 772 and the second common layer 774 are formed by the undercuts 763 and 765 of the common bank layer 760 in the organic light emitting diode display 700 according to the third embodiment of the present invention, Can be disposed separately from each other in a process using a common mask. More specifically, the first common layer 772 and the second common layer 774 are formed on the first pixel electrode 152, the second pixel electrode 154, and the common bank layer 760 using a common mask. Organic materials for constitution are deposited on the entire surface, and the lower regions of both sides of the common bank layer 760 are depressed, so that organic materials having low step coverage can not be connected to each other and are broken. That is, the organic material having a low step coverage can not be deposited to the undercuts 763 and 765 of the common bank layer 760, so that the organic material can be cut off for each of the sub-pixels SP1 and SP2 without a separate patterning process . The organic material disposed on the first pixel electrode 152 becomes the first common layer 772 and the organic material disposed on the second pixel electrode 154 becomes the second common layer 774, The organic material disposed on layer 776 becomes a dummy common layer 776 separated from the first common layer 772 and the second common layer 774. [ That is, the dummy common layer 776 separated by the undercuts 763 and 765 formed on both sides of the common bank layer 776 is disposed on the common bank layer 776.

The minimum gap W3 in the undercuts 763 and 765 of the common bank layer 760 is set to be the same as the thickness of the first common layer 772 or the second common layer 774 so that the first common layer 772 and the second common layer 774 are smoothly separated May have a value larger than the thickness of the second common layer 774. The minimum interval W3 in the undercuts 763 and 765 of the common bank layer 760 is smaller than the sum of the thicknesses of all the organic layers disposed between the pixel electrodes 152 and 154 and the common electrode 790 A short circuit between the pixel electrodes 152 and 154 and the common electrode 790 can be prevented. In other words, the minimum gap W3 in the undercuts 763 and 765 of the common bank layer 760 is set to a value between the first pixel electrode 152 and the common electrode 790 or between the second pixel electrode 154 and the common electrode 790, Lt; RTI ID = 0.0 > 790 < / RTI > Here, the undercuts 762 and 765 of the common bank layer 760 refer to the distance from the upper surface of the pixel electrodes 152 and 154 to the upper surface of the undercuts 763 and 765, respectively.

7, the minimum interval W3 inside the undercuts 763 and 765 of the common bank layer 760 is set between the pixel electrodes 152 and 154 and the common electrode 790 The organic light emitting layers 782 and 784 made of an organic material as well as the common layers 772 and 774 have a larger value than the sum of the thicknesses of all the organic layers, specifically, the common layers 772 and 774 and the organic light emitting layers 782 and 784. [ 784 are also broken by the undercuts 763, 765 of the common bank layer 760. Since the common electrode 790 is made of a material having a high step coverage, the organic light emitting layers 782 and 784 are deposited along the side of the common bank layer 760, specifically, the undercut 763, And may be in contact with the electrodes 152 and 154. As a result, a short circuit phenomenon occurs between the pixel electrodes 152 and 154 and the common electrode 790, so that the driving failure of the OLED display 700 can be increased. The minimum gap W3 inside the undercuts 763 and 765 of the common bank layer 760 is smaller than the sum of the thicknesses of all the organic layers disposed between the pixel electrodes 152 and 154 and the common electrode 790 It is possible to prevent a problem of poor driving of the OLED display 700 due to a short circuit between the pixel electrodes 152 and 154 and the common electrode 790. [

The first organic light emitting layer 782 and the second organic light emitting layer 784 are separately arranged for the sub-pixels SP1 and SP2. 7, the first organic light emitting layer 782 is disposed on the first common layer 772 and a part of the common bank layer 760, and the second organic light emitting layer 782 is disposed on the second common organic light emitting layer 782. [ The common layer 774 and the common bank layer 760. The first organic light emitting layer 782 and the second organic light emitting layer 784 emit light of different colors.

A common electrode 790 is disposed on the first organic light emitting layer 782, the second organic light emitting layer 784, and the dummy common layer 776. The common electrode 790 is disposed in common to the first sub-pixel SP1 and the second sub-pixel SP2.

The first common layer 772 and the second common layer 772 are formed by the undercuts 764 and 765 formed on both sides of the common bank layer 760 in the organic light emitting diode display 700 according to the third embodiment of the present invention. The layers 774 may be separately arranged for the sub-pixels SP1 and SP2 without a separate patterning process. Accordingly, there is a problem that the display quality of the organic light emitting diode display 700 is lowered due to the color mixture problem between the neighboring sub-pixels SP1 and SP2, the power consumption is increased, the problem that pure white of low gray scale is not realized, For example, problems such as the redish phenomenon can be improved.

The third embodiment of the present invention is also applicable to an OLED display device having a common light emitting layer structure. Specifically, by disposing the common bank layer 760 including the undercuts 763 and 765 described in the third embodiment of the present invention between the adjacent sub-pixels SP1 and SP2, it is possible to prevent current leakage The resulting organic layer can be separated without a separate patterning step. Thus, since the neighboring color mixing problem is reduced, the display quality of the organic light emitting display can be improved.

8 is a schematic cross-sectional view of an OLED display 800 according to a fourth embodiment of the present invention.

The OLED display 800 of FIG. 8 is different from the OLED display 700 of FIG. 7 in that the common bank layer 860 including the first bank layer 861 and the second bank layer 862 The arrangement and arrangement of the first common layer 872, the second common layer 874, the dummy common layer 876, the first organic luminescent layer 882, the second organic luminescent layer 884, and the common electrode 890 And the remaining components are the same, so duplicate descriptions are omitted. That is, for the sake of convenience of description, detailed description of the same or corresponding components to those of the previous embodiments will be omitted.

8, the common bank layer 860 of the OLED display 800 according to the fourth exemplary embodiment of the present invention includes a first bank layer 861 and a first bank layer 861 And a second bank layer 862 disposed thereon.

The common bank layer 860 including the first bank layer 861 and the second bank layer 862 divides the sub pixels SP1 and SP2 and the first pixel electrode 152 and the second pixel electrode 154 As shown in FIG. Concretely, the upper surfaces of the first pixel electrode 152 and the second pixel electrode 154 are completely formed by the undercuts 863 and 865 due to the difference in width between the first bank layer 861 and the second bank layer 862 Exposed. The first bank layer 861 and the second bank layer 862 are disposed between the first sub-pixel SP1 and the second sub-pixel SP2 and may be made of a transparent organic insulating material or a material showing black. Specifically, the first bank layer 861 and the second bank layer 862 may be made of a photoresist (PR) material which causes chemical change by light. In order to form the undercuts 863 and 865 due to the difference in width between the first bank layer 861 and the second bank layer 862, a positive photoresist having a characteristic that the resist on the light- positive PR) material. A manufacturing method of forming the common bank layer 860 using the positive type photoresist will be described in more detail later with reference to FIGS. 11 and 12. FIG.

8, the width of the second bank layer 862 is larger than the width of the first bank layer 861 when viewed in cross section. Specifically, the width of the lower surface of the second bank layer 862 is greater than the width of the upper surface of the first bank layer 861, so that a gap is formed between the first bank layer 861 and the second bank layer 862 And undercuts 863 and 865 are formed. In other words, since both side surfaces of the second bank layer 862 protrude from both sides of the first bank layer 861, the first bank layer 861 and the second bank layer 862 are formed so as to have a cross- , It can have an eave shape.

The upper surfaces of the first pixel electrode 152 and the second pixel electrode 154 are completely exposed by the undercuts 863 and 865 between the first bank layer 861 and the second bank layer 862 . The edge edgw of the first pixel electrode 152 and the edge of the second pixel electrode 862 are not covered by the first bank layer 861 and the second bank layer 862. [ When the first bank layer 861 and the second bank layer 862 are formed using the same mask for forming the pixel electrodes 152 and 154 without the additional mask The ends of the pixel electrodes 152 and 154 are not covered. That is, even if the common bank layer 860 is composed of the plurality of bank layers 861 and 862, since the plurality of bank layers 861 and 862 can be formed without a separate additional mask, The process cost can be reduced. A manufacturing method of forming the first bank layer 861 without an additional mask will be described later in more detail with reference to FIGS. 11 and 12. The common bank layer 860 including the first bank layer 861 and the second bank layer 862 may be referred to as a bank member

A first common layer 872 is disposed on the first pixel electrode 152 and a second common layer 874 is disposed on the second pixel electrode 154. On the second bank layer 862, A common layer 876 is disposed. The first common layer 872, the second common layer 874, and the dummy common layer 876 are disposed separately from each other.

By the undercuts 863 and 865 formed by the first bank layer 861 and the second bank layer 862 in the organic light emitting diode display 800 according to the fourth embodiment of the present invention, The layer 872 and the second common layer 874 can be disposed separately from each other in a process using a common mask. More specifically, a first common layer 872 and a second common layer 874 are formed on the first pixel electrode 152, the second pixel electrode 154, and the second bank layer 862 using a common mask, Since the side surfaces of the first bank layer 861 are more depressed than the side surfaces of the second bank layer 862 while organic materials for forming the organic layer are deposited on the entire surface, organic materials having low step coverage can not be connected to each other It will be cut off. That is, the organic material having a low step coverage can not be deposited to the undercuts 863 and 865 of the common bank layer 860, so that the organic material can be broken by the sub-pixels SP1 and SP2 without a separate patterning process . The organic material disposed on the first pixel electrode 152 becomes the first common layer 872 and the organic material disposed on the second pixel electrode 154 becomes the second common layer 874, The organic material disposed on the bank layer 862 becomes the dummy common layer 876 separated from the first common layer 872 and the second common layer 874. [ That is, the dummy common layer 876 separated by the protruding side surfaces of the second bank layer 862 is disposed on the second bank layer 862. [

The minimum interval W4 in the undercuts 863 and 865 of the common bank layer 860 composed of the plurality of bank layers 861 and 862 is set such that the first common layer 872 and the second common layer 874 are smooth The thickness of the first common layer 872 or the second common layer 874 may be greater than the thickness of the first common layer 872 or the second common layer 874. The minimum interval W4 in the undercuts 863 and 865 of the common bank layer 860 is smaller than the sum of the thicknesses of all the organic layers disposed between the pixel electrodes 152 and 154 and the common electrode 890 A short circuit between the pixel electrodes 152 and 154 and the common electrode 890 can be prevented. In other words, the minimum interval W4 in the undercuts 863 and 865 of the common bank layer 860 is set to a value between the first pixel electrode 152 and the common electrode 890 or between the second pixel electrode 154 and the common electrode 890. [ Lt; RTI ID = 0.0 > 890 < / RTI > The minimum interval W4 in the undercuts 863 and 865 of the common bank layer 860 is a distance from the upper surface of the pixel electrodes 152 and 154 to the upper surface of the first bank layer 861, Refers to the distance from the upper surface of the second bank layer 862 to the upper surface of the first bank layer 152, 154.

The first organic light emitting layer 882 and the second organic light emitting layer 884 are separately arranged for the sub-pixels SP1 and SP2. 8, the first organic light-emitting layer 882 is disposed on a portion of the first common layer 872 and the second bank layer 862, and the second organic light- 2 common layer 874 and a portion of the second bank layer 862. The first organic light emitting layer 882 and the second organic light emitting layer 884 emit light of different colors.

A common electrode 890 is disposed on the first organic light emitting layer 882, the second organic light emitting layer 884, and the dummy common layer 876. The common electrode 890 is disposed in common to the first sub-pixel SP1 and the second sub-pixel SP2.

By the undercuts 863 and 865 formed due to the difference in width between the first bank layer 861 and the second bank layer 862 in the OLED display 800 according to the fourth embodiment of the present invention, 1 common layer 872 and the second common layer 874 may be separately arranged for each of the sub-pixels SP1 and SP2 without a separate patterning process. Accordingly, a problem that display quality of the organic light emitting diode display 800 is deteriorated due to a mixed color problem between neighboring sub pixels SP1 and SP2, and a problem that power consumption is increased can be solved. Further, the problem that a pure white color having a low gray scale as in a redish phenomenon can not be realized can be solved.

The fourth embodiment of the present invention is also applicable to an organic light emitting display device having a common light emitting layer structure. Specifically, the common bank layer 760 (including the undercuts 863 and 865) formed by the plurality of bank layers 861 and 862 described in the fourth embodiment of the present invention between the adjacent sub-pixels SP1 and SP2 ), It is possible to separate the organic layer causing current leakage like the charge generation layer without a separate patterning process. Thus, since the neighboring color mixing problem is reduced, the display quality of the organic light emitting display can be improved.

9 is a flowchart illustrating a method of manufacturing an OLED display 700 according to a third embodiment of the present invention. 10A to 10F are cross-sectional views illustrating a method of manufacturing an OLED display 700 according to a third embodiment of the present invention. In the following description of the present embodiment, for the sake of convenience of description, detailed description of the same or corresponding components to those of the previously described embodiment will be omitted.

9, a method of manufacturing an OLED display 700 according to a third exemplary embodiment of the present invention includes forming a first pixel electrode and a second pixel electrode on a substrate (S910) (S920) forming a first sacrificial layer and a second sacrificial layer to overlap with the first electrode and the second pixel electrode, forming a common bank layer covering one end of the first sacrificial layer and one end of the second sacrificial layer (S930), removing the first sacrificial layer and the second sacrificial layer (S940) so that undercuts are formed on both sides of the common bank layer, forming a first common layer, a second pixel (S950) simultaneously forming a second common layer positioned on the electrode and a dummy common layer located on the common bank layer, and forming a common electrode on the first common layer, the second common layer, and the dummy common layer (S960).

First, referring to FIG. 10A, a first pixel electrode 152 and a second pixel electrode 154 are formed on a substrate 110 (S910). The first pixel electrode 152 and the second pixel electrode 154 may be simultaneously patterned by the same process using the first mask M1.

Next, referring to FIG. 10B, a first sacrificial layer 1061 and a second sacrificial layer 1062 are formed to overlap the first pixel electrode 152 and the second pixel electrode 154, respectively (S920). The first sacrificial layer 1061 and the second sacrificial layer 1062 may be made of a soft metallic material, for example, molybdenum (Mo), but are not limited thereto. The thickness of the first sacrificial layer 1061 and the thickness of the second sacrificial layer 1062 are greater than the thicknesses of the first common layer 772 or the second common layer 774 to be formed later, The sum of the thicknesses of all the organic layers disposed between the pixel electrodes 152 and 154 and the common electrode 790 to be formed. That is, the thickness of the first sacrificial layer 1061 and the thickness of the second sacrificial layer 1062 can determine the minimum gap W3 inside the undercuts 763 and 765 of the common bank layer 760 described in FIG. 7 .

The first sacrificial layer 1061 and the second sacrificial layer 1062 may be formed using the same first mask M1 used for forming the first pixel electrode 152 and the second pixel electrode 154, The first sacrificial layer 1061 and the second sacrificial layer 1062 are formed on the first pixel electrode 152 and the second pixel electrode 154, respectively, so that a separate mask for forming the first sacrificial layer 1061 and the second sacrificial layer 1062 is not required. That is, a material constituting the sacrifice layers 1061 and 1062 is deposited on the first pixel electrode 152 and the second pixel electrode 154, and then the first pixel electrode 152 and the second pixel electrode 154 are patterned using a patterned first mask M1. The remaining portions except the portions overlapping the second pixel electrode 152 and the second pixel electrode 154 can be removed through the etching process. At this time, the sacrifice layers 1061 and 1062 and the pixel electrodes 152 and 154 may be made of materials having different etch selectivities.

The sacrifice layers 1061 and 1062 and the pixel electrodes 152 and 154 are formed using the same first mask M1 and therefore have the same width. Specifically, the width of the first pixel electrode 152 is equal to the width of the first sacrificial layer 1061, and the width of the second pixel electrode 154 is equal to the width of the second sacrificial layer 1062.

Next, referring to FIG. 10C, a common bank layer 760 covering one edge of the first sacrificial layer 1061 and one end of the second sacrificial layer 1062 is formed (S930).

10D, the first sacrificial layer 1061 and the second sacrificial layer 1062 are removed so that undercuts 763 and 765 are formed on both sides of the common bank layer 760 (S940) . Since the etch selectivities of the sacrifice layers 1061 and 1062 and the pixel electrodes 152 and 154 are different from each other, the pixel electrodes 152 and 154 are formed using an etchant having a specific etch selectivity suitable for the sacrifice layers 1061 and 1062, And can be etched away without affecting other components such as,

Next, referring to FIG. 10E, a first common layer 772 located on the first pixel electrode 152, a second common layer 774 located on the second pixel electrode 154, A dummy common layer 776 located on the dummy common layer 760 is simultaneously formed (S950). The first common layer 772, the second common layer 774, and the dummy common layer 776 can be simultaneously arranged using thermal evaporation as one common mask. The organic material constituting the first common layer 772, the second common layer 774 and the dummy common layer 776 is electrically connected to the first pixel electrode 152, the second pixel electrode 154, But is not deposited along the undercuts 763 and 765 of the common bank layer 760. [ That is, the organic material having a low step coverage is broken up to the undercuts 763 and 765 formed on both sides of the common bank layer 760 without being deposited. As a result, by the undercuts 763 and 765 of the common bank layer 760, the first common layer 772 and the second common layer 774 are separated by the sub-pixels SP1 and SP2 without a separate patterning process .

Next, referring to FIG. 10F, a common electrode 790 is formed on the first common layer 772, the second common layer 774, and the dummy common layer 776 (S960). More specifically, a first organic emission layer 782 is formed on the first common layer 772 of the first sub-pixel SP1 and a second organic emission layer 782 is formed on the second common layer 774 of the second sub- 2 organic light emitting layer 784 is formed. The first organic light emitting layer 782 and the second organic light emitting layer 784 emit light of different colors and are patterned using a mask opened for each of the sub-pixels SP1 and SP2, for example, a fine metal mask (FMM) . Thereafter, the common electrode 790 is disposed on the first organic light emitting layer 782, the second organic light emitting layer 784, and the dummy common layer 776. The common electrode 790 can be formed using a sputtering method as a common mask, and the common electrode 790 can be connected to or extended from one sub-pixel SP1 to the neighboring sub-pixel SP2 without a break.

The sacrificial layers 1061 and 1062 and the common bank layer 760 overlapping with the pixel electrodes 152 and 154 and the common bank layer 760 are sequentially formed in the same manner as the pixel electrodes 152 and 154. In the method of manufacturing the OLED display 700 according to the third embodiment of the present invention, The undercuts 763 and 765 of the common bank layer 760 can be easily formed through a simple process of etching the sacrificial layers 1061 and 1062 after the sacrificial layers 1061 and 1062 are disposed. The first common layer 772 and the second common layer 774 are stably formed by the undercuts 763 and 765 of the common bank layer 760 using a common mask without a separate patterning step to form the sub- , SP2). Accordingly, the phenomenon of leakage of current to the neighboring sub-pixels is reduced, and the display quality of the OLED display 700 can be improved. When the sacrifice layers 1061 and 1062 for forming the undercuts 763 and 765 of the common bank layer 760 are formed, the first mask M1 forming the pixel electrodes 152 and 154 is the same Thus, there is an effect that the process cost of the organic light emitting diode display 700 is reduced because a separate additional mask is not required.

11 is a flowchart illustrating a method of manufacturing an OLED display 800 according to a fourth embodiment of the present invention. 12A to 12F are cross-sectional views illustrating a method of manufacturing the OLED display 800 according to the fourth embodiment of the present invention. In the following description of the present embodiment, for the sake of convenience of description, detailed description of the same or corresponding components to those of the previously described embodiment will be omitted.

Referring to FIG. 11, a method of manufacturing an OLED display 800 according to a fourth exemplary embodiment of the present invention includes forming a first pixel electrode and a second pixel electrode on a substrate (S1110) Forming a first bank material layer on the first pixel electrode and the second pixel electrode in step S1120; exposing the A area overlapping the first pixel electrode and the second pixel electrode in step S1130; Forming a second bank material layer on the first bank material layer (S1140); exposing the B region overlapping with the A region of the first bank water layer in the second bank material layer and having a width smaller than the A region; (Step S1150), removing the A region of the first bank material layer and the B region of the second bank material layer to form a second bank layer having a larger width than the first bank layer and the first bank layer S1160), a first common layer on the first pixel electrode, a second common layer on the second pixel electrode, and a second common layer on the second bank layer PL comprises a step (S1170) and the first common layer, the second common dummy layer and the step (S1180) of forming a common electrode on a common layer forming the common dummy layer at the same time.

First, referring to FIG. 12A, a first pixel electrode 152 and a second pixel electrode 154 are formed on a substrate 110 (S1110). The first pixel electrode 152 and the second pixel electrode 154 may be simultaneously patterned by the same process using the first mask M1.

Next, referring to FIG. 12B, a first bank material layer 1261 is formed on the first pixel electrode 152 and the second pixel electrode 154 (S1120). Then, in the first bank material layer 1261, the A region overlapping the first pixel electrode 152 and the second pixel electrode 154 is exposed (S1130). The first bank material layer 1261 is made of a positive photoresist material having the property that the resist on the light-receiving portion is removed. Since the first mask M1 used for forming the pixel electrodes 152 and 154 is used in the same manner to expose the A region of the first bank material layer 1261 as shown in FIG. 12B, The width of the A region of the bank material layer 1261 has the same value as the width of the pixel electrodes 152 and 154. [ The thickness of the first bank material layer 1261 is greater than the thickness of the first common layer 872 or the second common layer 874 to be formed later and the thickness of the pixel electrodes 152 and 154, And the thickness of all the organic layers disposed between the common electrode 890 and the common electrode 890. That is, the minimum gap W4 inside the undercuts 873 and 875 of the common bank layer 860 described in FIG. 8 can be adjusted depending on the thickness of the first bank material layer 1261. FIG.

Next, referring to FIG. 12C, a second bank material layer 1262 is formed on the first bank material layer 1261 (S1140). Then, in the second bank material layer 1262, the B region overlapping with the A region of the first bank water layer 1261 and having a width smaller than that of the A region is exposed (S1150). The second bank material layer 1262 is also made of a positive PR material, as is the first bank material layer 1261. The first bank material layer 1261 and the second bank material layer 1262 may be made of the same material. As shown in FIG. 12C, the second mask M2 is used to expose the B region overlapping with the A region of the first bank material layer 1261 and having a smaller width than the A region.

12D, the A region of the first bank material layer 1261 and the B region of the second bank material layer 1262 are removed to form the first bank layer 861 and the first bank layer 861 The second bank layer 862 having a larger width than the first bank layer 862 is formed (S1160). The A region of the first bank material layer 1261 and the B region of the second bank material layer 1262 may be simultaneously removed through a strip process. The A region is removed from the first bank material layer 1261 and the remaining portion becomes the first bank layer 861 and the B region is removed from the second bank material layer 1262 and the remaining portion becomes the second bank layer 862 ). The width of the first bank layer 861 formed while the A region of the first bank material layer 1261 is removed is formed while the B region of the second bank material layer 1262 having a width smaller than the A region is removed And has a smaller value than the width of the second bank layer 862. That is, since the side surface of the second bank layer 862 is formed so as to protrude from the side surface of the first bank layer 861, the undercuts 863 and 865 are formed by the first bank layer 861 and the second bank layer 862, . In other words, eccentric undercuts 863 and 865 are formed on both sides of the common bank layer 860 composed of the first bank layer 861 and the second bank layer 862. The width of the upper surface of the first bank layer 861 is formed to be smaller than the width of the lower surface of the second bank layer 862. [

In the process of removing the A region of the first bank material layer 1261 and the B region of the second bank material layer 1262, the sides of the second bank layer 862 may be formed in an inclined shape by the strip solution have. Although not shown in the drawing, the side surface of the first bank layer 861 may also be formed in an inclined shape.

As mentioned above, the first bank material layer 1261 and the second bank material layer 1262 are preferably made of a positive PR material. When the first bank material layer 1261 and the second bank material layer 1262 are made of a negative PR material, it is difficult to form the undercuts 863 and 865 of the common bank layer 860 . This will be described in detail as follows. The four negative type photoresist (negative PR) materials have the characteristic that the resist of the portion where the light comes in remains. A process of forming the undercuts 863 and 865 using the four large-type photoresist materials will be described. First, after the first bank material layer 1261 is formed, light is irradiated to the region for forming the first bank layer 861 Investigate. Thereafter, a second bank material layer 1262 is formed on the first bank material layer 1261, and light is irradiated to a region for forming the second bank layer 862. [ At this time, the region for forming the first bank layer 861 and the region for forming the second bank layer 862 overlap with each other. In order to form the shape of the undercuts 863 and 865, specifically, the side surface of the second bank layer 862 protruding from the side surface of the first bank layer 861, The width of the region must be larger than the width of the region for forming the first bank layer 861. [ In this case, when light is irradiated to the region for forming the second bank layer 862 of the second bank material layer 1262, the space in which the undercuts 863 and 865 are to be formed, that is, It may overlap the region for making the first bank layer 862 but may penetrate the region for making the first bank layer 861. As a result, the shapes and sizes of the desired undercuts 863 and 865 may not be normally realized.

12E, a first common layer 872 located on the first pixel electrode 152, a second common layer 874 located on the second pixel electrode 154, A dummy common layer 876 located on the layer 862 is simultaneously formed (S1170). The first common layer 872, the second common layer 874, and the dummy common layer 876 can be simultaneously disposed using a thermal evaporation method as one common mask. The organic material constituting the first common layer 872, the second common layer 874 and the dummy common layer 876 is electrically connected to the first pixel electrode 152, the second pixel electrode 154, Is deposited only on layer 862 and is not deposited along the undercuts 863 and 865 of the first bank layer 861 and the second bank layer 862. [ That is, the organic material having a low step coverage is broken into the undercuts 863 and 865 formed on both sides of the common bank layer 860 without being deposited. As a result, the first common layer 872 and the second common layer 874 can be subjected to a sub-process without any additional patterning process by the undercuts 863 and 865 of the first bank layer 861 and the second bank layer 862. [ May be arranged separately for each of the pixels SP1 and SP2.

Next, referring to FIG. 12F, a common electrode 890 is formed on the first common layer 872, the second common layer 874, and the dummy common layer 876 (S1180). Specifically, a first organic emission layer 882 is formed on the first common layer 872 of the first sub-pixel SP1 and a second organic emission layer 882 is formed on the second common layer 872 of the second sub- An organic light emitting layer 884 is formed. The first organic light emitting layer 882 and the second organic light emitting layer 884 emit light of different colors and are patterned using a mask opened for each of the sub-pixels SP1 and SP2, for example, a fine metal mask (FMM) . Thereafter, a common electrode 890 is disposed on the first organic light emitting layer 882, the second organic light emitting layer 884, and the dummy common layer 876. The common electrode 890 can be formed using a sputtering method as a common mask, and can be connected or extended without a broken portion from one sub-pixel SP1 to a neighboring sub-pixel SP2.

In the method of manufacturing the organic light emitting diode display 800 according to the fourth embodiment of the present invention, by the undercuts 863 and 865 of the common bank layer 860 composed of the plurality of bank layers 861 and 862, The first common layer 872 and the second common layer 874 can be arranged separately for the sub-pixels SP1 and SP2 using a common mask without a patterning process. Accordingly, the problem of color mixing between neighboring pixels due to the current leakage phenomenon is reduced, and the display quality of the OLED display 800 can be improved. The common bank layer 860 is formed by forming the first bank layer 861 of the common bank layer 860 using the same first mask M1 forming the pixel electrodes 152 and 154 The manufacturing cost of the organic light emitting diode display 800 can be reduced.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100, 200, 700, 800: organic light emitting display
110: substrate
130: thin film transistor
152: first pixel electrode
154: second pixel electrode
156: conductive layer
162, 861: first bank layer
164, 862: a second bank layer
172, 272, 772, 872: a first common layer
174, 274, 774, 874: a second common layer
176, 276, 776, 876: a dummy common layer
182, 282, 782, 882: first organic light emitting layer
184, 284, 784, 884: a second organic light emitting layer
190, 290, 790, 890:
260, 760, 860:

Claims (22)

A first pixel electrode disposed in a first sub-pixel of the substrate;
A second pixel electrode disposed in a second sub-pixel of the substrate;
A first common layer disposed on the first pixel electrode;
A second common layer disposed on the second pixel electrode; And
And a dummy common layer disposed between the first sub-pixel and the second sub-pixel,
Wherein the first common layer, the second common layer, and the dummy common layer are made of the same material and are separated from each other. The method according to claim 1,
Further comprising a first bank layer and a second bank layer disposed between the first pixel electrode and the second pixel electrode,
Wherein each of the first bank layer and the second bank layer includes an undercut,
Wherein the dummy common layer is disposed between the undercut of the first bank layer and the undercut of the second bank layer. 3. The method of claim 2,
Wherein a minimum interval between the inside of the undercut of the first bank layer and a minimum interval within the undercut of the second bank layer has a larger value than the thickness of the first common layer or the second common layer. 3. The method of claim 2,
Further comprising a conductive layer separately disposed between the first pixel electrode and the second pixel electrode and made of the same material as the first pixel electrode or the second pixel electrode,
Wherein an undercut of the first bank layer and an undercut of the second bank layer are respectively located above the edges of the conductive layer,
And the dummy common layer is disposed at the center upper portion of the conductive layer. The method according to claim 1,
A common bank layer disposed between the first pixel electrode and the second pixel electrode; And
Further comprising barrier ribs disposed on the common bank layer,
Wherein the barrier rib is composed of a first barrier rib having an inverted tapered shape and a second barrier rib disposed on the first barrier rib,
And the dummy common layer is disposed on the second bank. 6. The method of claim 5,
Wherein the first bank is made of a metallic material,
And the second bank is made of heat or a UV-curable material. The method according to claim 1,
Further comprising a common bank layer disposed between the first pixel electrode and the second pixel electrode,
One side of the common bank layer positioned close to the first pixel electrode and the other side of the common bank layer positioned close to the second pixel electrode each include an undercut,
And the dummy common layer is disposed on the common bank layer. 8. The method of claim 7,
And a common electrode disposed in common to the first sub-pixel and the second sub-pixel,
Wherein a minimum interval in the undercut of the common bank layer is greater than a thickness of the first common layer or the second common layer, and the common electrode, the first pixel electrode, Of the organic light emitting display device. 8. The method of claim 7,
And the end of the first pixel electrode and the end of the second pixel electrode are not covered by the common bank layer. The method according to claim 1,
A first bank layer disposed between the first pixel electrode and the second pixel electrode; And
Further comprising a second bank layer disposed over the first bank layer and having a greater width than the first bank layer,
And the dummy common layer is disposed on the second bank layer. 11. The method of claim 10,
And a common electrode disposed in common to the first sub-pixel and the second sub-pixel,
The distance from the top surface of the first pixel electrode to the top surface of the first bank layer or the distance from the top surface of the second pixel electrode to the top surface of the first bank layer may be a thickness of the first common layer or the second common layer And has a value smaller than a distance between the common electrode and the first pixel electrode or between the common electrode and the second pixel electrode. 11. The method of claim 10,
Wherein ends of the first pixel electrode and the second pixel electrode are not covered by the first bank layer. A plurality of pattern electrodes;
A common electrode disposed on the plurality of pattern electrodes;
A plurality of organic layers disposed between the plurality of pattern electrodes and the common electrode, the plurality of organic layers including at least one common layer having a structure separated for each of the neighboring sub-pixels so that current leakage to neighboring sub-pixels is minimized; And
And a bank member disposed between the neighboring sub-pixels and having a structure for separating the common layer. 14. The method of claim 13,
Wherein the bank member includes a first bank layer and a second bank layer which are spaced apart from each other when viewed in cross section between two adjacent pattern electrodes of the plurality of pattern electrodes,
One side of the first bank layer and one side of the second bank layer facing one side of the first bank layer each have an eave shape for separating the common layer,
And a part of the common layer separated by the eave shape is disposed between the first bank layer and the second bank layer. 14. The method of claim 13,
The bank member
A common bank layer disposed between two neighboring patterns of the plurality of pattern electrodes;
A first bank disposed on the common bank layer and having a reverse taper shape for separating the common layer; And
And a second barrier rib disposed on the first barrier rib,
And a part of the common layer separated by the reverse tapered shape is disposed on the second bank. 14. The method of claim 13,
Wherein the bank member includes a common bank layer disposed between two adjacent patterns of the plurality of pattern electrodes and having undercuts for separating the common layers from each other on both sides,
And a part of the common layer separated by the undercut is disposed on the common bank layer. 14. The method of claim 13,
The bank member
A first bank layer disposed between two neighboring patterns of the plurality of pattern electrodes; And
And a second bank layer stacked on the first bank layer and having a side projected from the first bank layer,
And a part of the common layer separated by the protruding side surface of the second bank layer is disposed on the second bank layer. Forming a first pixel electrode and a second pixel electrode in each of a first sub-pixel and a second sub-pixel of the substrate;
Forming a bank member between the first pixel electrode and the second pixel electrode; And
Forming a first common layer on the first pixel electrode, a second common layer on the second pixel electrode, and a dummy common layer located on the bank member, ≪ / RTI > 19. The method of claim 18,
Wherein forming the bank member comprises:
Forming a sacrificial layer between the first pixel electrode and the second pixel electrode;
Forming a first bank layer covering the first pixel electrode and one end of the sacrificial layer and a second bank layer covering the second pixel electrode and the other end of the sacrificial layer; And
Further comprising the step of removing the sacrificial layer such that an undercut is formed on the side surfaces of the first bank layer and the second bank layer. 19. The method of claim 18,
Wherein forming the bank member comprises:
Forming a common bank layer covering one end of the first pixel electrode and one end of the second pixel electrode;
Forming a first bank material layer and a second bank material layer on the first pixel electrode, the second pixel electrode, and the common bank layer;
Etching the second leveled material layer to form a second bank on the common bank layer; And
Etching the first barrier rib material layer using the second barrier rib as a mask to form a first barrier rib having an inverted taper shape. 19. The method of claim 18,
Wherein forming the bank member comprises:
Forming a first sacrificial layer and a second sacrificial layer overlapping the first pixel electrode and the second pixel electrode, respectively;
Forming a common bank layer covering one end of the first sacrificial layer and one end of the second sacrificial layer; And
And removing the first sacrificial layer and the second sacrificial layer such that an undercut is formed on both sides of the common bank layer. 19. The method of claim 18,
Wherein forming the bank member comprises:
Forming a first bank material layer on the first pixel electrode and the second pixel electrode;
Exposing an A region overlapping the first pixel electrode and the second pixel electrode in the first bank material layer;
Forming a second bank material layer on the first bank material layer;
Exposing a B region overlapping the A region of the first bank material layer and having a width smaller than the A region in the second bank material layer; And
Removing the A region of the first bank material layer and the B region of the second bank material layer to form a first bank layer and a second bank layer having a greater width than the first bank layer , A method of manufacturing an organic light emitting display device.

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