TW202002276A - Display device and manufacturing method thereof - Google Patents
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本發明是有關於一種顯示裝置及其製造方法。The invention relates to a display device and a manufacturing method thereof.
隨著科技的進步,於有機發光二極體(ORGANIC LIGHT EMITTING DIODE;OLED)顯示裝置的製程中,可使用噴墨印刷製程(Ink Jet Printing;IJP)形成發光層。噴墨印刷製程是將液化的有機發光材料噴射或注入到由堤岸(bank)定義出的開口中,以形成發光層。然而,有機發光材料在開口中形成的發光層的膜厚不均,進而影響顯示面板的顯示品質。舉例來說,發光層在開口邊緣處的膜厚遠大於發光層在開口中心處的膜厚,亦即,發光層在開口邊緣處的膜厚與在開口中心處的膜厚差異極大。With the advancement of technology, in the process of organic light emitting diode (ORGANIC LIGHT EMITTING DIODE; OLED) display devices, an inkjet printing process (Ink Jet Printing; IJP) can be used to form a light emitting layer. The inkjet printing process is to spray or inject the liquefied organic light-emitting material into the opening defined by the bank to form a light-emitting layer. However, the thickness of the light-emitting layer formed in the opening of the organic light-emitting material is not uniform, which further affects the display quality of the display panel. For example, the film thickness of the light emitting layer at the edge of the opening is much larger than the film thickness of the light emitting layer at the center of the opening, that is, the film thickness of the light emitting layer at the edge of the opening is very different from the film thickness at the center of the opening.
本發明提供一種顯示裝置,性能佳。The invention provides a display device with good performance.
本發明提供一種顯示裝置的製造方法,能製造出性能佳的顯示裝置。The invention provides a method for manufacturing a display device, which can manufacture a display device with good performance.
本發明的一種顯示裝置,包括多個子畫素。多個子畫素設置於基板上。每一子畫素包括主動元件、第一電極、第一堤岸層、第二堤岸層、發光層以及第二電極。第一電極與主動元件電性連接。第一堤岸層設置於第一電極上,且具有與部分之第一電極重疊的第一開口。第二堤岸層設置於第一堤岸層上,且具有與第一開口重疊的第二開口。發光層設置於部分的第一電極上,且位於第一堤岸層的第一開口與第二堤岸層的第二開口。第二電極設置於發光層上。第一堤岸層具材料區域,材料區域於基板上的垂直投影位於第一開口於基板上的垂直投影與第二開口於基板上的垂直投影之間。材料區域在第一方向上具有第一寬度,材料區域在與第一方向交錯的第二方向上具有第二寬度。子畫素包括第一子畫素。第一子畫素之材料區域的第一寬度不等於第一子畫素之材料區域的第二寬度。A display device of the present invention includes multiple sub-pixels. A plurality of sub-pixels are arranged on the substrate. Each sub-pixel includes an active element, a first electrode, a first bank layer, a second bank layer, a light-emitting layer, and a second electrode. The first electrode is electrically connected to the active element. The first bank layer is disposed on the first electrode and has a first opening overlapping with a part of the first electrode. The second bank layer is disposed on the first bank layer and has a second opening overlapping with the first opening. The light emitting layer is disposed on part of the first electrode, and is located in the first opening of the first bank layer and the second opening of the second bank layer. The second electrode is disposed on the light emitting layer. The first bank layer has a material area, and the vertical projection of the material area on the substrate is between the vertical projection of the first opening on the substrate and the vertical projection of the second opening on the substrate. The material region has a first width in a first direction, and the material region has a second width in a second direction that intersects the first direction. The sub-pixel includes the first sub-pixel. The first width of the material area of the first sub-pixel is not equal to the second width of the material area of the first sub-pixel.
本發明的一種顯示裝置的製造方法,包括:提供基板;於基板上形成多個主動元件;形成分別與主動元件電性連接的多個第一電極,第一電極在第一方向上排成多個第一電極行,且在第二方向上排成多個第一電極列,第一方向與第二方向交錯;提供遮罩結構,具有彼此隔開的多個條狀實體部以及多個條狀開口部,其中每一條狀開口部隔開相鄰的條狀實體部;在令遮罩結構的條狀實體部分別遮蔽第一電極列的情況下,令源材料通過遮罩結構的條狀開口部,以於第一電極上形成第一堤岸層,其中第一堤岸層具有多個堤岸條以及多個第一條狀開口,堤岸條在第一方向上彼此隔開,每一第一條狀開口隔開相鄰的堤岸條,且相鄰兩堤岸條分別配置於多個第一電極列之同一第一電極列的每一第一電極的相對兩側;於第一堤岸層上形成第二堤岸層,第二堤岸層具有分別與第一電極重疊的多個開口;注入多個液滴於第一堤岸層的第一條狀開口以及第二堤岸層的開口,以於第一電極、第一堤岸層的第一條狀開口以及第二堤岸層的開口形成多個發光層;形成第二電極,以覆蓋發光層。A manufacturing method of a display device of the present invention includes: providing a substrate; forming a plurality of active elements on the substrate; forming a plurality of first electrodes electrically connected to the active elements, the first electrodes being arranged in a plurality in the first direction A row of first electrodes, and arranged in a plurality of first electrode columns in a second direction, the first direction and the second direction are interleaved; a mask structure is provided, having a plurality of strip-shaped solid portions and a plurality of strips separated from each other Each of the strip-shaped openings separates adjacent strip-shaped solid portions; when the strip-shaped solid portions of the mask structure respectively shield the first electrode row, the source material passes through the strip-shaped structure of the mask structure An opening to form a first bank layer on the first electrode, wherein the first bank layer has a plurality of bank strips and a plurality of first strip-shaped openings, the bank strips are separated from each other in the first direction, each first strip The shape of the opening separates the adjacent bank strips, and the two adjacent bank strips are respectively disposed on opposite sides of each first electrode of the same first electrode row of the plurality of first electrode rows; A second bank layer, the second bank layer has a plurality of openings respectively overlapping with the first electrode; a plurality of droplets are injected into the first stripe opening of the first bank layer and the opening of the second bank layer, so that the first electrode, The first stripe opening of the first bank layer and the opening of the second bank layer form a plurality of light emitting layers; a second electrode is formed to cover the light emitting layer.
基於上述,本發明一實施例的顯示裝置及其製造方法中,至少一子畫素的第一堤岸層於基板上的垂直投影具有未與第二堤岸層於基板上的垂直投影重疊的材料區域,材料區域在第一方向上具有第一寬度,材料區域在第二方向上具有第二寬度,而第一寬度不等於第二寬度。藉此,能改善顯示裝置之發光層的膜厚不均勻的問題。Based on the above, in the display device and the manufacturing method thereof according to an embodiment of the present invention, the vertical projection of the first bank layer on the substrate of at least one sub-pixel has a material area that does not overlap with the vertical projection of the second bank layer on the substrate The material area has a first width in the first direction, the material area has a second width in the second direction, and the first width is not equal to the second width. With this, the problem of uneven film thickness of the light-emitting layer of the display device can be improved.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.
在下文中將參照附圖更全面地描述本發明,在附圖中示出了本發明的示例性實施例。如本領域技術人員將認識到的,可以以各種不同的方式修改所描述的實施例,而不脫離本發明的精神或範圍。Hereinafter, the present invention will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the present invention are shown. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.
在附圖中,為了清楚起見,放大了層、膜、面板、區域等的厚度。在整個說明書中,相同的附圖標記表示相同的元件。應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件「上」或「連接到」另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時,不存在中間元件。如本文所使用的,「連接」可以指物理及/或電性連接。再者,「電性連接」或「耦合」係可為二元件間存在其它元件。In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrical connection" or "coupling" can mean that there are other components between the two components.
此外,諸如「下」或「底部」和「上」或「頂部」的相對術語可在本文中用於描述一個元件與另一元件的關係,如圖所示。應當理解,相對術語旨在包括除了圖中所示的方位之外的裝置的不同方位。例如,如果一個附圖中的裝置翻轉,則被描述為在其它元件的「下」側的元件將被定向在其它元件的「上」側。因此,示例性術語「下」可以包括「下」和「上」的取向,取決於附圖的特定取向。類似地,如果一個附圖中的裝置翻轉,則被描述為在其它元件「下方」或「下方」的元件將被定向為在其它元件「上方」。因此,示例性術語「上面」或「下面」可以包括上方和下方的取向。In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship between one element and another element, as shown. It should be understood that relative terms are intended to include different orientations of the device than those shown in the figures. For example, if the device in one drawing is turned over, the element described as being on the "lower" side of the other element will be oriented on the "upper" side of the other element. Thus, the exemplary term "lower" may include "lower" and "upper" orientations, depending on the particular orientation of the drawings. Similarly, if the device in one drawing is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "above" or "below" can include an orientation of above and below.
本文使用的「約」、「近似」、或「實質上」包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,「約」可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。再者,本文使用的「約」、「近似」或「實質上」可依光學性質、蝕刻性質或其它性質,來選擇較可接受的偏差範圍或標準偏差,而可不用一個標準偏差適用全部性質。As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by those of ordinary skill in the art, taking into account the measurements and A certain amount of measurement-related errors (ie, measurement system limitations). For example, "about" may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. In addition, "about", "approximately" or "substantially" used in this article can select a more acceptable range of deviation or standard deviation according to optical properties, etching properties or other properties, instead of applying one standard deviation to all properties .
本文參考作為理想化實施例的示意圖的截面圖來描述示例性實施例。因此,可以預期到作為例如製造技術及/或(and/or)公差的結果的圖示的形狀變化。因此,本文所述的實施例不應被解釋為限於如本文所示的區域的特定形狀,而是包括例如由製造導致的形狀偏差。例如,示出或描述為平坦的區域通常可以具有粗糙及/或非線性特徵。此外,所示的銳角可以是圓的。因此,圖中所示的區域本質上是示意性的,並且它們的形狀不是旨在示出區域的精確形狀,並且不是旨在限制權利要求的範圍。Exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Therefore, a change in the shape of the graph as a result of, for example, manufacturing techniques and/or tolerances can be expected. Therefore, the embodiments described herein should not be construed as being limited to the specific shapes of the regions as shown herein, but include deviations in shapes caused by manufacturing, for example. For example, an area shown or described as flat may generally have rough and/or non-linear characteristics. In addition, the acute angle shown may be round. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the precise shapes of the regions, and are not intended to limit the scope of the claims.
除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and the present invention, and will not be interpreted as idealized or excessive Formal meaning unless explicitly defined as such in this article.
圖1A是依照本發明一實施例的顯示裝置的部分元件的上視示意圖。圖1B是根據圖1A的剖線A-A’繪示的顯示裝置的子畫素的剖面示意圖。圖1A省略圖1B之基板100、主動元件110、平坦層120、電洞注入層160、電洞傳輸層170、發光層180、電子傳輸層190、電子注入層200及第二電極210的繪示。FIG. 1A is a schematic top view of some components of a display device according to an embodiment of the invention. FIG. 1B is a schematic cross-sectional view of the sub-pixels of the display device according to section line A-A' of FIG. 1A. FIG. 1A omits the drawing of the
請參考圖1A及圖1B,本實施例的顯示裝置10包括多個子畫素10A。子畫素10A設置於基板100上。在本實施例中,基板100例如為硬質基板(rigid substrate)。然而,本發明不限於此,在其它實施例中,基板100也可以是可撓式基板(flexible substrate)。舉例而言,上述之硬質基板的材質可為玻璃、石英或其它適當材料;上述之可撓式基板的材質可以是塑膠或其它適當材料。Please refer to FIGS. 1A and 1B. The
本實施例的每一子畫素10A包括主動元件110、第一電極130、第一堤岸層140、第二堤岸層150、發光層180以及第二電極210。在本實施例中,每一子畫素10A還可包括平坦層120、電洞注入層160、電洞傳輸層170、電子傳輸層190以及電子注入層200,但本發明不以此為限。Each
主動元件110設置於基板100上。舉例而言,在本實施例中,主動元件110包括至少一薄膜電晶體,具有閘極、半導體圖案、汲極與源極,其中汲極與第一電極130(或稱,畫素電極)電性連接,但本發明不以此為限。The
在本實施例中,平坦層120設置於基板100上,且覆蓋主動元件110。平坦層120為一層未圖案化的膜層,但不以此為限。平坦層120的材料包含無機材料(例如:氧化矽、氮化矽、氮氧化矽、其它合適的材料或上述至少二種材料的堆疊層)、有機材料(例如:聚酯類(PET)、聚烯類、聚丙醯類、聚碳酸酯類、聚環氧烷類、聚苯烯類、聚醚類、聚酮類、聚醇類、聚醛類、其它合適的材料或上述之組合)、其它合適的材料或上述之組合。In this embodiment, the
在本實施例中,第一電極130設置於平坦層120上。第一電極130與主動元件110電性連接。舉例而言,本實施例的第一電極130例如為畫素電極,電性連接於主動元件110之至少一薄膜電晶體的汲極。In this embodiment, the
第一堤岸層140設置於第一電極130上。第一堤岸層140具有與部分之第一電極130重疊的第一開口140a。第一堤岸層140的材料包含氧化矽、氮化矽或其它合適的材料。The
第二堤岸層150設置於第一堤岸層140上。第二堤岸層150具有與第一開口140a重疊的第二開口150a。在本實施例中,第二堤岸層150的材質與第一堤岸層140的材質可以不相同;舉例來說,對同一有機發光材料而言(例如簡稱為墨),第一堤岸層140例如為親墨性,而第二堤岸層150例如為疏墨性,但本發明不限於此。在本實施例中,第二堤岸層150的材料例如是光阻,但本發明不限於此。第一堤岸層140具材料區域145,材料區域145於基板100上的垂直投影位於第一開口140a於基板100上的垂直投影與第二開口150a於基板100上的垂直投影之間。材料區域145在第一方向y上具有第一寬度W1,材料區域145在第二方向x上具有第二寬度W2。部分之第一電極130與第一堤岸層140的第一開口140a及第二堤岸層150的第二開口150a重疊,第一方向y係指由所述部分之第一電極130的正上方指向定義第二開口150a之第二堤岸層150的側壁150s,而第一方向y與第二方向x交錯。The
顯示裝置10的多個子畫素10A包括第一子畫素10a。第一子畫素10a之材料區域145的第一寬度W1不等於第一子畫素10a之材料區域145的第二寬度W2。舉例而言,在本實施例中,第一子畫素10a之第一開口140a在第一方向y上的寬度140y大於第一子畫素10a之第一開口140a在第二方向x上的寬度140x,而第一子畫素10a之第一寬度W1可選擇性地大於第一子畫素10a之第二寬度W2。The plurality of sub-pixels 10A of the
發光層180設置於部分的第一電極130上,且位於第一堤岸層140的第一開口140a與第二堤岸層150的第二開口150a。舉例而言,在本實施例中,電洞注入層160、電洞傳輸層170與發光層180依序設置於所述部分的第一電極130上。電洞注入層160、電洞傳輸層170與發光層180位於第一堤岸層140的第一開口140a與第二堤岸層150的第二開口150a中。舉例而言,在本實施例中,電洞注入層160、電洞傳輸層170與發光層180依序設置於部分的第一電極130上的方法例如是利用噴墨印刷製程(Ink Jet Printing;IJP),但本發明不限於此。在本實施例中,發光層180的材料例如是有機電致發光材料,但本發明不限於此。在本實施例中,藉由第一寬度W1不等於第二寬度W2的設計,能改善發光層180的膜厚不均的問題。The
於垂直基板100的第三方向z上,發光層180的頂面182具有與第二開口150a之中心重疊的一點182a。發光層180的頂面182上的一點182a至第一電極130的頂面130t的距離為第一距離T1。發光層180的頂面182與第二堤岸層150的交界邊180a至第一堤岸層140的頂面140t的距離為第二距離T2。在本實施例中,第一距離T1小於或等於第二距離T2。舉例而言,第二距離T2小於或等於20倍的第一距離T1,即T1 ≤ T2 ≤ 20´T1,但本發明不以此為限。In the third direction z perpendicular to the
在本實施例中,電子傳輸層190與電子注入層200依序設置於發光層180與第二堤岸層150上。舉例而言,在本實施例中,電子傳輸層190與電子注入層200的形成方式例如是利用蒸鍍製程,但本發明不限於此。In this embodiment, the
第二電極210設置於發光層180上。舉例而言,在本實施例中,第二電極210設置於電子注入層200上。在本實施例中,於垂直基板100的第三方向z上,第二電極210可具有大致上相同的膜厚。也就是說,於垂直基板100的第三方向z上,發光層180的頂面182具有與第二開口150a之中心重疊的一點182a,第二電極210的頂面212具有與第二開口150a之中心重疊的一點212a。發光層180的頂面182上的一點182a位於與第一開口140a及第二開口150a重疊之部分的第一電極130的上方,第二電極210的頂面212上的一點212a位於一點182a的正上方,一點182a至一點212a在第三方向z上的距離為第一距離H1。第二堤岸層150的頂面150t與第二電極210的頂面212在第三方向z上的距離為第二距離H2,第一距離H1約等於第二距離H2。也就是說,在本實施例中,由電子傳輸層190、電子注入層200及第二電極210構成的複合層具有大致上相同的膜厚,但本發明不以此為限。The
基於上述,在本發明一實施例的顯示裝置10中,第一堤岸層140的第一開口140a在第一方向y上的寬度140y大於第一開口140a在第二方向x上的寬度140x,而第一寬度W1大於第二寬度W2。藉此,可以改善發光層180的厚度不均勻的問題,進而改善顯示裝置10的顯示品質。Based on the above, in the
圖2是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。在此必須說明的是,圖2的實施例沿用圖1A的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。2 is a schematic top view of some components of a display device according to another embodiment of the invention. It must be noted here that the embodiment of FIG. 2 uses the element numbers and partial contents of the embodiment of FIG. 1A, wherein the same or similar reference numerals are used to indicate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
圖2的實施例與圖1A的實施例的主要差異在於:第一寬度W1與第二寬度W2的大小關係不同。The main difference between the embodiment of FIG. 2 and the embodiment of FIG. 1A is that the size relationship between the first width W1 and the second width W2 is different.
請參考圖2,在本實施例的顯示裝置20中,子畫素20A的第一子畫素20a的第一堤岸層140的第一開口140a在第一方向y上的寬度140y大於第一開口140a在第二方向x上的寬度140x,而第一寬度W1小於第二寬度W2。2, in the
類似地,在本發明一實施例的顯示裝置20中,第一寬度W1小於第二寬度W2。藉此,可以改善發光層180的厚度不均勻的問題,進而改善顯示裝置20的顯示品質。Similarly, in the
圖3是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。在此必須說明的是,圖3的實施例沿用圖1A的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。3 is a schematic top view of some components of a display device according to another embodiment of the invention. It must be noted here that the embodiment of FIG. 3 uses the element numbers and partial contents of the embodiment of FIG. 1A, wherein the same or similar reference numerals are used to indicate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
圖3的實施例與圖1A的實施例的主要差異在於:第一堤岸層140的第一開口140a具有多個彎曲段140b。The main difference between the embodiment of FIG. 3 and the embodiment of FIG. 1A is that the
請參考圖3,在本實施例的顯示裝置30中,子畫素30A的第一子畫素30a的第一堤岸層140的第一開口140a具有多個彎曲段140b。在本實施例中,多個彎曲段140b在第一方向y上排列。多個彎曲段140b連接成波浪線段140b’。藉此,可以增加顯示裝置30的開口率。Referring to FIG. 3, in the
在本實施例中,第一堤岸層140具有材料區域145,材料區域145在第一方向y上具有第一寬度W1,材料區域145在第二方向x上的最小寬度為第二寬度W2,材料區域145在第二方向x上的最大寬度為寬度W2’。在本實施例中,第一開口140a在第二方向x上具有最大寬度140x,第一開口140a在第一方向y上的寬度140y大於寬度140x,而第一寬度W1大於第二寬度W2。在本實施例中,寬度W2’可以等於第一寬度W1,但本發明不限於此。舉例而言,在本實施例中,寬度W2’與第二寬度W2的大小關係可以是0.2´W2’ ≤ W2 ≤ 0.8´W2’,但本發明不限於此。In this embodiment, the
圖4是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。在此必須說明的是,圖4的實施例沿用圖3的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。4 is a schematic top view of some components of a display device according to another embodiment of the invention. It must be noted here that the embodiment of FIG. 4 uses the element numbers and partial contents of the embodiment of FIG. 3, wherein the same or similar reference numerals are used to indicate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
圖4的實施例與圖3的實施例的主要差異在於:波浪線段140b’的形成位置不同。The main difference between the embodiment of FIG. 4 and the embodiment of FIG. 3 is that the formation position of the
請參考圖4,在本實施例的顯示裝置40中,子畫素40A的第一子畫素40a的第一堤岸層140的第一開口140a的多個彎曲段140b在第二方向x上排列。多個彎曲段140b連接為波浪線段140b’。藉此,可以增加顯示裝置40的開口率。Referring to FIG. 4, in the
第一堤岸層140具有材料區域145。在本實施例中,材料區域145在第一方向y上的最小寬度為第一寬度W1,材料區域145在第二方向x上具有第二寬度W2。在本實施例中,第一開口140a在第一方向y上具有最大寬度140y,寬度140y大於第一開口140a在第二方向x上的寬度140x,而第一寬度W1小於第二寬度W2。在本實施例中,寬度W1’可以等於第二寬度W2,但本發明不限於此。舉例而言,在本實施例中,寬度W1’與第一寬度W1的大小關係可以是0.2´W1’ ≤ W1 ≤ 0.8´W1’,但本發明不限於此。The
圖5A是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。圖5B是根據圖5A的剖線B-B’繪示的顯示裝置的子畫素的剖面示意圖。圖6A至圖6D是圖5A之顯示裝置的部分元件的製造流程剖面示意圖。圖5A省略圖5B之基板100、主動元件110、平坦層120、電洞注入層160、電洞傳輸層170、發光層180、電子傳輸層190、電子注入層200及第二電極210的繪示。在此必須說明的是,圖5A~5B的實施例沿用圖1A~1B的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。5A is a schematic top view of some components of a display device according to another embodiment of the invention. 5B is a schematic cross-sectional view of the sub-pixels of the display device according to the cross-sectional line B-B' of FIG. 5A. 6A to 6D are schematic cross-sectional views of manufacturing processes of some components of the display device of FIG. 5A. FIG. 5A omits the drawing of the
圖5A~圖5B的實施例與圖1A~圖1B的實施例的主要差異在於:第一寬度W1與第二寬度W2的大小關係不同。The main difference between the embodiment of FIGS. 5A-5B and the embodiment of FIGS. 1A-1B is that the relationship between the size of the first width W1 and the second width W2 is different.
請參考圖5A及圖5B,在本實施例的顯示裝置50中,子畫素50A的第一子畫素50a的第一堤岸層140的第一開口140a在第一方向y上的寬度140y大於第一開口140a在第二方向x上的寬度140x,第一寬度W1不為零,而第二寬度W2為零。藉此,可以增加顯示裝置50的開口率。5A and 5B, in the display device 50 of this embodiment, the
在本實施例中,由於第二寬度W2為零,顯示裝置50的製造方法可以與前述之顯示裝置的實施例10~40的製造方法不相同。以下配合圖6A至圖6D及圖7A至圖7B,舉例說明本發明另一實施例之顯示裝置50的製造流程。圖7A及圖7B分別是圖6B及圖6D的顯示裝置的製造步驟的上視示意圖。特別是,圖6B對應圖7A的剖線C-C’,圖6D對應圖7B的剖線D-D’。In this embodiment, since the second width W2 is zero, the manufacturing method of the display device 50 may be different from the manufacturing methods of the foregoing
請參考圖6A,首先,提供基板100。接著,於基板100上形成多個主動元件110。然後,形成分別與多個主動元件110電性連接的多個第一電極130。在本實施例中,形成第一電極130之前,還可選擇性地於主動元件110上形成平坦層120,平坦層120覆蓋主動元件110以及基板110,但本發明不限於此。多個第一電極130在第一方向y上排成多個第一電極行130y(如圖7A所示),且在第二方向x上排成多個第一電極列130x(如圖7A所示)。第一方向y與第二方向x交錯。Please refer to FIG. 6A. First, the
請參考圖6B及圖7A,接著,提供遮罩結構300。遮罩結構300具有彼此隔開的多個條狀實體部310以及多個條狀開口部320。每一條狀開口部320隔開相鄰的條狀實體部310。多個條狀實體部310分別遮蔽多個第一電極列130x,舉例來說,每一條狀實體部310遮蔽對應之一個第一電極列130x的各第一電極130的中間部分,相鄰條狀開口部320露出對應之一個第一電極列130x的各第一電極130在第一方向y上的相對兩側。Please refer to FIGS. 6B and 7A, and then, a
請參考圖6C,然後,在令遮罩結構300的條狀實體部310分別遮蔽第一電極列130x的情況下,令源材料410通過遮罩結構300的條狀開口部320,以於第一電極130上形成第一堤岸層140(如圖6D所示)。舉例而言,在本實施例中,利用部件400提供源材料410,使源材料410通過遮罩結構300的條狀開口部320並沉積在條狀開口部320中,以於第一電極130上形成第一堤岸層140。然而,本發明不限於此。在其他實施例中,也可以利用蒸鍍等物理氣相沉積工序來形成第一堤岸層140。Please refer to FIG. 6C, and then, when the strip-shaped
值得一提的是,由於第一寬度W1與第二寬度W2的一者為零,因此能使用遮罩結構300進行物理氣相沉積工序,以形成第一堤岸層140。相較於利用微影、蝕刻等製程,利用前述物理氣相沉積工序來形成第一堤岸層140較為簡單且省時,有助於降低顯示裝置50的製造成本。It is worth mentioning that, since one of the first width W1 and the second width W2 is zero, the
請參考圖6D及圖7B,本實施例的第一堤岸層140具有多個堤岸條140’以及多個第一條狀開口140a’。在本實施例中,堤岸條140’在第一方向y上彼此隔開。每一第一條狀開口140a’隔開相鄰的堤岸條140’。相鄰兩堤岸條140’分別配置於同一第一電極列130x之每一第一電極130的相對兩側。6D and FIG. 7B, the
請參照圖5B,接著,於第一堤岸層140上形成第二堤岸層150。第二堤岸層150具有分別與第一電極130重疊的多個第二開口150a。Please refer to FIG. 5B. Next, a
然後,注入多個液滴於第一堤岸層140的第一條狀開口140a’以及第二堤岸層150的多個第二開口150a中,以於多個第一電極130、第一堤岸層140的多個第一條狀開口140a’以及第二堤岸層150的多個第二開口150a中形成多個發光層180。舉例而言,在本實施例中,可以在第一條狀開口140a’以及多個第二開口150a中形成電洞注入層160、電洞傳輸層170與發光層180(如圖5B所示)。Then, a plurality of droplets are injected into the
之後,形成第二電極210,以覆蓋發光層180。舉例而言,在本實施例中,電子傳輸層190、電子注入層200以及第二電極210依序設置於發光層180與第二堤岸層150上。於此,便完成顯示裝置50。After that, the
圖8是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。在此必須說明的是,圖8的實施例沿用圖5A的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。8 is a schematic top view of some components of a display device according to another embodiment of the invention. It must be noted here that the embodiment of FIG. 8 uses the element numbers and partial contents of the embodiment of FIG. 5A, wherein the same or similar reference numerals are used to indicate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
圖8的實施例與圖5A的實施例的主要差異在於:第一寬度W1與第二寬度W2的大小關係不同。The main difference between the embodiment of FIG. 8 and the embodiment of FIG. 5A is that the size relationship between the first width W1 and the second width W2 is different.
請參考圖8,在本實施例的顯示裝置60中,子畫素60A的第一子畫素60a的第一堤岸層140的第一開口140a在第一方向y上的寬度140y大於第一開口140a在第二方向x上的寬度140x,第一寬度W1為零,而第二寬度W2不為零。藉此,可以增加顯示裝置60的開口率。8, in the
在本實施例中,由於第一寬度W1為零,顯示裝置60的製造方法可以與前述之顯示裝置50的實施例的製造方法相同,以下便不再重複贅述。In this embodiment, since the first width W1 is zero, the manufacturing method of the
圖9A是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。圖9B是根據圖9A的剖線E-E’繪示的顯示裝置的子畫素的剖面示意圖。圖9C是根據圖9A的剖線F-F’繪示的顯示裝置的子畫素的剖面示意圖。圖9A省略圖9B之基板100、主動元件110及平坦層120的繪示。在此必須說明的是,圖9A~圖9C的實施例沿用圖1A~圖1B的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。9A is a schematic top view of some components of a display device according to another embodiment of the invention. 9B is a schematic cross-sectional view of the sub-pixels of the display device according to the cross-sectional line E-E' of FIG. 9A. 9C is a schematic cross-sectional view of the sub-pixels of the display device according to the section line F-F' of FIG. 9A. FIG. 9A omits the drawing of the
圖9A~圖9C的實施例與圖1A~圖1B的實施例的主要差異在於:在圖9A~圖9C的實施例中,相鄰的兩子畫素72a、74a的第二開口1502、1504相通。The main difference between the embodiment of FIGS. 9A-9C and the embodiment of FIGS. 1A-1B is that: in the embodiment of FIGS. 9A-9C, the
請參考圖9A至圖9C,在本實施例的顯示裝置70中,子畫素70A包括相鄰的第四子畫素72a與第五子畫素74a。第四子畫素72a與第五子畫素74a用以顯示相同的顏色。在本實施例中,第四子畫素72a的第一開口1402與第五子畫素74a的第一開口1404相分離,而第四子畫素72a的第二開口1502與第五子畫素74a的第二開口1504相通。由於第四子畫素72a的第二開口1502與第五子畫素74a的第二開口1504相通,因此第四子畫素72a與第五子畫素74a的發光層180可利用分佈於第四子畫素72a之第一開口1402與第五子畫素74a之第一開口1404的同一液滴形成。Please refer to FIGS. 9A to 9C. In the
第一堤岸層140具有材料區域145。在本實施例中,材料區域145具有位於第四子畫素72a的第一開口1402與第五子畫素74a的第一開口1404之間的部分的材料區域1451。在本實施例中,材料區域145在第一方向y上具有第一寬度W1,材料區域145相鄰於第二堤岸層150的部分在第二方向x上具有第二寬度W2,部分材料區域1451在第二方向x上具有寬度W3。在本實施例中,第一開口1402、1404在第一方向y上的寬度140y大於第一開口1402、1404在第二方向x上的寬度140x,而第一寬度W1小於第二寬度W2。The
發光層180設置於第四子畫素72a的部分第一電極130上與第五子畫素74a的部分第一電極130上,且位於第四子畫素72a的第一開口1402、第五子畫素74a的第一開口1404、第四子畫素72a的第二開口1502以及第五子畫素74a的第二開口1504中。舉例而言,在本實施例中,由於第四子畫素72a的第二開口1502與第五子畫素74a的第二開口1504相通,因此第四子畫素72a與第五子畫素74a的電洞注入層160、電洞傳輸層170與發光層180可分別利用分佈於第四子畫素72a之第一開口1402與第五子畫素74a之第一開口1404的液滴,形成電洞注入層160、電洞傳輸層170與發光層180,形成於第四子畫素72a與第五子畫素74a的多個第一電極130上。電洞注入層160、電洞傳輸層170與發光層180位於第四子畫素72a的第一開口1402、第五子畫素74a的第一開口1404、第四子畫素72a的第二開口1502以及第五子畫素74a的第二開口1504中。The
在本實施例中,電洞注入層160、電洞傳輸層170與發光層180還可形成於位於部分材料區域1451的第一堤岸層142上。於垂直基板100的第三方向z上,發光層180的頂面182具有與第二開口之中心重疊的一點182a以及與第一堤岸層142之中心重疊的一點182b。發光層180的頂面182上的一點182a至第一電極130的頂面130t的距離為第一距離T1。發光層180的頂面182上的一點182b至第一堤岸層142的頂面142t具有距離T1’。在本實施例中,第一距離T1約等於距離T1’。In this embodiment, the
電子傳輸層190、電子注入層200與第二電極210依序設置於發光層180與第二堤岸層150上。舉例而言,在本實施例中,電子傳輸層190、電子注入層200與第二電極210的每一者可以具有大致上相同的膜厚,但本發明不限於此。The
類似地,在本發明一實施例的顯示裝置70中,第一寬度W1小於第二寬度W2。藉此,可以改善發光層180的膜厚不勻的問題,進而改善顯示裝置70的顯示品質。Similarly, in the
圖10A是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。圖10B是根據圖10A的剖線G-G’繪示的顯示裝置的子畫素的剖面示意圖。圖10C是根據圖10A的剖線H-H’繪示的顯示裝置的子畫素的剖面示意圖。圖10A省略圖10B之基板100、主動元件110及平坦層120的繪示。在此必須說明的是,圖10A~圖10C的實施例沿用圖9A~圖9C的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。10A is a schematic top view of some components of a display device according to another embodiment of the invention. 10B is a schematic cross-sectional view of the sub-pixels of the display device according to the cross-sectional line G-G' of FIG. 10A. FIG. 10C is a schematic cross-sectional view of the sub-pixels of the display device according to line H-H' of FIG. 10A. FIG. 10A omits the drawing of the
圖10A~圖10C的實施例與圖9A~圖9C的實施例的主要差異在於:第一寬度W1與第二寬度W2的大小關係不同。The main difference between the embodiments of FIGS. 10A to 10C and the embodiments of FIGS. 9A to 9C is that the size relationship between the first width W1 and the second width W2 is different.
請參考圖10A至圖10C,在本實施例的顯示裝置80中,子畫素80A包括相鄰的第四子畫素82a與第五子畫素84a。第四子畫素82a與第五子畫素84a用以顯示相同的顏色。在本實施例中,第四子畫素82a的第一開口1402與第五子畫素84a的第一開口1404相分離,而第四子畫素82a的第二開口1502與第五子畫素84a的第二開口1504相通。Please refer to FIGS. 10A to 10C. In the
第一堤岸層140具有材料區域145。在本實施例中,材料區域145具有位於第四子畫素82a的第一開口1402與第五子畫素84a的第一開口1404之間的部分材料區域1451。在本實施例中,材料區域145在第一方向y上具有第一寬度W1,材料區域145相鄰於第二堤岸層150的部分在第二方向x上具有第二寬度W2,部分材料區域1451在第二方向x上具有寬度W3。在本實施例中,第一開口1402、1404在第一方向y上的寬度140y大於第一開口1402、1404在第二方向x上的寬度140x,而第一寬度W1大於第二寬度W2。The
類似地,在本發明一實施例的顯示裝置80中,第一寬度W1大於第二寬度W2。藉此,可以改善發光層180的膜厚不勻的問題,進而改善顯示裝置80的顯示品質。Similarly, in the
圖11是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。在此必須說明的是,圖11的實施例沿用圖1A的實施例的元件標號與部分內容,其中採用相同或近似的標號來表示相同或近似的元件,並且省略了相同技術內容的說明。關於省略部分的說明可參考前述實施例,下述實施例不再重複贅述。11 is a schematic top view of some components of a display device according to another embodiment of the invention. It must be noted here that the embodiment of FIG. 11 follows the element numbers and part of the contents of the embodiment of FIG. 1A, wherein the same or similar reference numerals are used to indicate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.
圖11的實施例與圖1A的實施例的主要差異在於:顯示裝置90的多個子畫素92a、94b、96a可不相同。The main difference between the embodiment of FIG. 11 and the embodiment of FIG. 1A is that the plurality of sub-pixels 92a, 94b, and 96a of the
請參考圖11,在本實施例的顯示裝置90中,子畫素90A包括第一子畫素92a與第二子畫素94a。在本實施例中,子畫素90A還可包括第三子畫素96a,但本發明不限於此。在本實施例中,第一子畫素92a的第一開口1402在第一方向y上的寬度140y大於第一開口1402在第二方向x上的寬度140x,而第一子畫素92a的材料區域1452的第一寬度W1大於第二寬度W2。第二子畫素94a的第一開口1404在第一方向y上的寬度140y大於第一開口1404在第二方向x上的寬度140x,而第二子畫素94a的材料區域1454的第一寬度W1小於第二寬度W2。也就是說,本實施例的第一子畫素92a的材料區域1452的第一寬度W1和第二寬度W2的大小關係與第二子畫素94a的材料區域1454的第一寬度W1和第二寬度W2的大小關係不相同。Referring to FIG. 11, in the
在本實施例中,第三子畫素96a相鄰於第二子畫素94a,第二子畫素94a設置於第一子畫素92a與第三子畫素96a之間。第三子畫素96a的第一開口1406在第一方向y上的寬度140y大於第一開口1406在第二方向x上的寬度140x,而第三子畫素96a的材料區域1456的第一寬度W1等於第二寬度W2。也就是說,本實施例的第一子畫素92a的材料區域1452、第二子畫素94a的材料區域1454與第三子畫素96a的材料區域1456各自具有第一寬度W1和第二寬度W2,且不同子畫素中的第一寬度W1和第二寬度W2的大小關係都不相同。然而,本發明不限於此。在其他實施例中,也可以選擇性地將其中兩個子畫素設置為具有相同的第一寬度W1和第二寬度W2的大小關係。In this embodiment, the
在本實施例中,第一子畫素92a、第二子畫素94a及第三子畫素96a可分別顯示互不相同的顏色,但本發明不限於此。在本實施例中,第一子畫素92a、第二子畫素94a及第三子畫素96a可分別顯示紅色、綠色和藍色,但本發明不限於此。In this embodiment, the
綜上所述,本發明一實施例的顯示裝置,包括多個子畫素。多個子畫素設置於基板上。每一子畫素包括主動元件、第一電極、第一堤岸層、第二堤岸層、發光層以及第二電極。第一電極與主動元件電性連接。第一堤岸層設置於第一電極上,且具有與部分之第一電極重疊的第一開口。第二堤岸層設置於第一堤岸層上,且具有與第一開口重疊的第二開口。發光層設置於部分的第一電極上,且位於第一堤岸層的第一開口與第二堤岸層的第二開口。第二電極設置於發光層上。第一堤岸層具材料區域。材料區域於基板上的垂直投影位於第一開口於基板上的垂直投影與第二開口於基板上的垂直投影之間。材料區域在第一方向上具有第一寬度,材料區域在第二方向上具有第二寬度。多個子畫素包括第一子畫素。特別是,第一子畫素之材料區域的第一寬度不等於第一子畫素之材料區域的第二寬度。藉此,能改善本發明一實施例的顯示裝置之發光層的膜厚度不均勻的問題。In summary, the display device according to an embodiment of the present invention includes multiple sub-pixels. A plurality of sub-pixels are arranged on the substrate. Each sub-pixel includes an active element, a first electrode, a first bank layer, a second bank layer, a light-emitting layer, and a second electrode. The first electrode is electrically connected to the active element. The first bank layer is disposed on the first electrode and has a first opening overlapping with a part of the first electrode. The second bank layer is disposed on the first bank layer and has a second opening overlapping with the first opening. The light emitting layer is disposed on part of the first electrode, and is located in the first opening of the first bank layer and the second opening of the second bank layer. The second electrode is disposed on the light emitting layer. The first bank layer has a material area. The vertical projection of the material region on the substrate is between the vertical projection of the first opening on the substrate and the vertical projection of the second opening on the substrate. The material region has a first width in the first direction, and the material region has a second width in the second direction. The plurality of sub-pixels includes the first sub-pixel. In particular, the first width of the material area of the first sub-pixel is not equal to the second width of the material area of the first sub-pixel. Thereby, the problem of uneven film thickness of the light-emitting layer of the display device according to an embodiment of the invention can be improved.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.
10、20、30、40、50、60、70、80、90‧‧‧顯示裝置10A、20A、30A、40A、50A、60A、70A、80A、90A‧‧‧子畫素10a、20a、30a、40a、50a、60a、92a‧‧‧第一子畫素94a‧‧‧第二子畫素96a‧‧‧第三子畫素72a、82a‧‧‧第四子畫素74a、84a‧‧‧第五子畫素100‧‧‧基板110‧‧‧主動元件120‧‧‧平坦層130‧‧‧第一電極130t‧‧‧頂面130x‧‧‧第一電極列130y‧‧‧第一電極行140、142‧‧‧第一堤岸層140’‧‧‧堤岸條140t、142t‧‧‧頂面140x、140y‧‧‧寬度140a、1402、1404、1406‧‧‧第一開口140a’‧‧‧第一條狀開口140b‧‧‧彎曲段140b’‧‧‧波浪線段145、1451、1452、1454、1456‧‧‧材料區域150‧‧‧第二堤岸層150a、1502、1504‧‧‧第二開口150s‧‧‧側壁150t‧‧‧頂面160‧‧‧電洞注入層170‧‧‧電洞傳輸層180‧‧‧發光層180a‧‧‧交界邊182‧‧‧頂面182a、182b‧‧‧點190‧‧‧電子傳輸層200‧‧‧電子注入層210‧‧‧第二電極212‧‧‧頂面212a‧‧‧點300‧‧‧遮罩結構310‧‧‧實體部320‧‧‧開口部400‧‧‧部件410‧‧‧源材料A-A’、B-B’、C-C’、D-D’、E-E’、F-F’、G-G’、H-H’‧‧‧剖線H1、T1‧‧‧第一距離H2、T2‧‧‧第二距離T1’‧‧‧距離W1‧‧‧第一寬度W2‧‧‧第二寬度W1’、W2’、W3‧‧‧寬度x‧‧‧第二方向y‧‧‧第一方向z‧‧‧第三方向10, 20, 30, 40, 50, 60, 70, 80, 90‧‧‧ Display device 10A, 20A, 30A, 40A, 50A, 60A, 70A, 80A, 90A , 40a, 50a, 60a, 92a ‧‧‧ first sub-pixel 94a‧‧‧ second sub-pixel 96a‧‧‧ third sub-pixel 72a, 82a‧‧‧ fourth sub-pixel 74a, 84a‧‧ ‧Fifth sub-pixel 100‧‧‧Substrate 110‧‧‧Active element 120‧‧‧Flat layer 130‧‧‧First electrode 130t‧‧‧Top surface 130x‧‧‧First electrode column 130y‧‧‧First Electrode row 140, 142‧‧‧ first bank layer 140′‧‧‧ bank strip 140t, 142t‧‧‧ top surface 140x, 140y‧‧‧ width 140a, 1402, 1404, 1406‧‧‧ first opening 140a'‧ ‧‧The first strip-shaped opening 140b‧‧‧Bent section 140b′‧‧‧Wave line section 145,1451,1452,1454,1456‧‧‧Material area 150‧‧‧Second bank layer 150a,1502,1504‧‧‧ Second opening 150s ‧‧‧ Side wall 150t ‧‧‧ Top surface 160 ‧ ‧ ‧ hole injection layer 170 ‧ ‧ ‧ hole transmission layer 180 ‧ ‧ ‧ light emitting layer 180a ‧ ‧ ‧ junction boundary 182 ‧ ‧ ‧ top surface 182a, 182b‧‧‧ point 190‧‧‧ electron transport layer 200‧‧‧ electron injection layer 210‧‧‧second electrode 212‧‧‧ top surface 212a‧‧‧ point 300‧‧‧ mask structure 310‧‧‧ physical part 320‧‧‧Opening 400‧‧‧Part 410‧‧‧ Source materials A-A', B-B', C-C', D-D', E-E', F-F', G-G ', H-H' ‧‧‧ section line H1, T1‧‧‧ first distance H2, T2‧‧‧ second distance T1'‧‧‧ distance W1‧‧‧ first width W2‧‧‧ second width W1 ', W2', W3‧‧‧ width x‧‧‧ second direction y‧‧‧ first direction z‧‧‧ third direction
圖1A是依照本發明一實施例的顯示裝置的部分元件的上視示意圖。 圖1B是根據圖1A的剖線A-A’繪示的顯示裝置的子畫素的剖面示意圖。 圖2是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。 圖3是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。 圖4是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。 圖5A是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。 圖5B是根據圖5A的剖線B-B’繪示的顯示裝置的子畫素的剖面示意圖。 圖6A至圖6D是圖5A之顯示裝置的部分元件的製造流程剖面示意圖。 圖7A及圖7B分別是圖6B及圖6D的顯示裝置的製造步驟的上視示意圖。 圖8是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。 圖9A是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。 圖9B是根據圖9A的剖線E-E’繪示的顯示裝置的子畫素的剖面示意圖。 圖9C是根據圖9A的剖線F-F’繪示的顯示裝置的子畫素的剖面示意圖。 圖10A是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。 圖10B是根據圖10A的剖線G-G’繪示的顯示裝置的子畫素的剖面示意圖。 圖10C是根據圖10A的剖線H-H’繪示的顯示裝置的子畫素的剖面示意圖。 圖11是依照本發明另一實施例的顯示裝置的部分元件的上視示意圖。FIG. 1A is a schematic top view of some components of a display device according to an embodiment of the invention. FIG. 1B is a schematic cross-sectional view of the sub-pixels of the display device according to section line A-A' of FIG. 1A. 2 is a schematic top view of some components of a display device according to another embodiment of the invention. 3 is a schematic top view of some components of a display device according to another embodiment of the invention. 4 is a schematic top view of some components of a display device according to another embodiment of the invention. 5A is a schematic top view of some components of a display device according to another embodiment of the invention. 5B is a schematic cross-sectional view of the sub-pixels of the display device according to the cross-sectional line B-B' of FIG. 5A. 6A to 6D are schematic cross-sectional views of manufacturing processes of some components of the display device of FIG. 5A. 7A and 7B are schematic top views of manufacturing steps of the display device of FIGS. 6B and 6D, respectively. 8 is a schematic top view of some components of a display device according to another embodiment of the invention. 9A is a schematic top view of some components of a display device according to another embodiment of the invention. 9B is a schematic cross-sectional view of the sub-pixels of the display device according to the cross-sectional line E-E' of FIG. 9A. 9C is a schematic cross-sectional view of the sub-pixels of the display device according to the section line F-F' of FIG. 9A. 10A is a schematic top view of some components of a display device according to another embodiment of the invention. 10B is a schematic cross-sectional view of the sub-pixels of the display device according to the cross-sectional line G-G' of FIG. 10A. FIG. 10C is a schematic cross-sectional view of the sub-pixels of the display device according to line H-H' of FIG. 10A. 11 is a schematic top view of some components of a display device according to another embodiment of the invention.
10‧‧‧顯示裝置 10‧‧‧Display device
10A‧‧‧子畫素 10A‧‧‧subpixel
10a‧‧‧第一子畫素 10a‧‧‧The first pixel
130‧‧‧第一電極 130‧‧‧First electrode
140‧‧‧第一堤岸層 140‧‧‧The first embankment
140x、140y‧‧‧寬度 140x、140y‧‧‧Width
140a‧‧‧第一開口 140a‧‧‧First opening
145‧‧‧材料區域 145‧‧‧Material area
150‧‧‧第二堤岸層 150‧‧‧Second embankment
150a‧‧‧第二開口 150a‧‧‧Second opening
150s‧‧‧側壁 150s‧‧‧Side wall
A-A’‧‧‧剖線 A-A’‧‧‧Cut line
W1‧‧‧第一寬度 W1‧‧‧First width
W2‧‧‧第二寬度 W2‧‧‧second width
x‧‧‧第二方向 x‧‧‧Second direction
y‧‧‧第一方向 y‧‧‧first direction
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862688635P | 2018-06-22 | 2018-06-22 | |
US62/688,635 | 2018-06-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI679765B TWI679765B (en) | 2019-12-11 |
TW202002276A true TW202002276A (en) | 2020-01-01 |
Family
ID=69188922
Family Applications (18)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107137602A TWI678009B (en) | 2018-06-22 | 2018-10-24 | Display panel and manufacturing method thereof |
TW107138760A TWI684810B (en) | 2018-06-22 | 2018-11-01 | Display panel |
TW107142955A TWI684815B (en) | 2018-06-22 | 2018-11-30 | Display panel and method of fabricating the same |
TW107142834A TWI679789B (en) | 2018-06-22 | 2018-11-30 | Organic light emitting diode display apparatus |
TW107143785A TWI685702B (en) | 2018-06-22 | 2018-12-05 | Display apparatus |
TW107144587A TWI678802B (en) | 2018-06-22 | 2018-12-11 | Display panel and method for manufacturing the same |
TW107144975A TWI679765B (en) | 2018-06-22 | 2018-12-13 | Display device and manufacturing method thereof |
TW107146598A TWI695527B (en) | 2018-06-22 | 2018-12-22 | Display panel |
TW107146906A TWI679792B (en) | 2018-06-22 | 2018-12-25 | Display panel and method of fabricating the same |
TW108101440A TWI733078B (en) | 2018-06-22 | 2019-01-15 | Display device |
TW108102163A TWI696870B (en) | 2018-06-22 | 2019-01-19 | Display device |
TW108102272A TWI683375B (en) | 2018-06-22 | 2019-01-21 | Light emitting device |
TW108103467A TWI690753B (en) | 2018-06-22 | 2019-01-30 | Display panel and method of fabricating the same |
TW108104630A TWI694626B (en) | 2018-06-22 | 2019-02-12 | Pixel structure |
TW108104827A TWI683168B (en) | 2018-06-22 | 2019-02-13 | Pixel structure and manufacturing method thereof |
TW108106211A TWI680589B (en) | 2018-06-22 | 2019-02-25 | Light-emitting device and manufacturing method thereof |
TW108109084A TWI710832B (en) | 2018-06-22 | 2019-03-18 | Quantum dot display panel |
TW108119483A TWI714115B (en) | 2018-06-22 | 2019-06-05 | Display panel |
Family Applications Before (6)
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TW107137602A TWI678009B (en) | 2018-06-22 | 2018-10-24 | Display panel and manufacturing method thereof |
TW107138760A TWI684810B (en) | 2018-06-22 | 2018-11-01 | Display panel |
TW107142955A TWI684815B (en) | 2018-06-22 | 2018-11-30 | Display panel and method of fabricating the same |
TW107142834A TWI679789B (en) | 2018-06-22 | 2018-11-30 | Organic light emitting diode display apparatus |
TW107143785A TWI685702B (en) | 2018-06-22 | 2018-12-05 | Display apparatus |
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Family Applications After (11)
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TW108101440A TWI733078B (en) | 2018-06-22 | 2019-01-15 | Display device |
TW108102163A TWI696870B (en) | 2018-06-22 | 2019-01-19 | Display device |
TW108102272A TWI683375B (en) | 2018-06-22 | 2019-01-21 | Light emitting device |
TW108103467A TWI690753B (en) | 2018-06-22 | 2019-01-30 | Display panel and method of fabricating the same |
TW108104630A TWI694626B (en) | 2018-06-22 | 2019-02-12 | Pixel structure |
TW108104827A TWI683168B (en) | 2018-06-22 | 2019-02-13 | Pixel structure and manufacturing method thereof |
TW108106211A TWI680589B (en) | 2018-06-22 | 2019-02-25 | Light-emitting device and manufacturing method thereof |
TW108109084A TWI710832B (en) | 2018-06-22 | 2019-03-18 | Quantum dot display panel |
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2018
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- 2019-01-30 TW TW108103467A patent/TWI690753B/en active
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