TWI695527B - Display panel - Google Patents

Display panel Download PDF

Info

Publication number
TWI695527B
TWI695527B TW107146598A TW107146598A TWI695527B TW I695527 B TWI695527 B TW I695527B TW 107146598 A TW107146598 A TW 107146598A TW 107146598 A TW107146598 A TW 107146598A TW I695527 B TWI695527 B TW I695527B
Authority
TW
Taiwan
Prior art keywords
insulating pattern
display panel
electrode
thickness
organic light
Prior art date
Application number
TW107146598A
Other languages
Chinese (zh)
Other versions
TW202002353A (en
Inventor
陳文斌
李庚益
陳文泰
張國瑞
陳祖偉
陳國光
洪仕馨
Original Assignee
友達光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 友達光電股份有限公司 filed Critical 友達光電股份有限公司
Priority to CN201910419229.1A priority Critical patent/CN110112198B/en
Publication of TW202002353A publication Critical patent/TW202002353A/en
Application granted granted Critical
Publication of TWI695527B publication Critical patent/TWI695527B/en

Links

Images

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

A display panel includes a substrate, an active device layer disposed on the substrate, an insulating layer disposed on the active device layer, a first electrode disposed on the insulating layer, an organic light-emitting film, and a second electrode disposed on the organic light-emitting film. The insulating layer has a trench. A first electrode is electrically connected to the active device layer. An organic light-emitting film has a first thickness T1 and a second thickness T2. The thickness of the organic light-emitting film on the first electrode is the second thickness T2, and the thickness of the light-emitting film in the trench of the insulating layer is the first thickness T1. T1 is bigger than T2.

Description

顯示面板Display panel

本發明是有關於一種顯示面板,且特別是有關於一種在絕緣層具有溝槽的顯示面板。 The present invention relates to a display panel, and particularly to a display panel having grooves in an insulating layer.

發光二極體(light emitting diode;LED)具有諸如壽命長、體積小、高抗震性、低熱產生及低功率消耗等優點,因此已被廣泛應用於家用及各種設備中的指示器或光源。 Light emitting diode (LED) has advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption, so it has been widely used as an indicator or light source in homes and various devices.

噴墨塗佈技術(Ink Jet Printing,IJP)在LED的製程上能夠提升材料利用率以降低製程成本,但在進行噴墨塗佈之前需形成對應畫素設置的擋牆(bank),以定義每一畫素的區域。然而,在液滴噴塗於擋牆所構成的容置空間內時,液體的表面張力與擋牆附著力的不同導致後續經乾燥製程所形成之薄膜的厚度均勻度不佳,致使畫素周圍的亮度及色度與中心有明顯差異。 Ink Jet Printing (IJP) technology can improve the utilization rate of materials in the LED process to reduce the cost of the process, but before the inkjet coating needs to form a corresponding pixel setting bank (bank) to define Each pixel area. However, when the droplets are sprayed into the containing space formed by the retaining wall, the difference in the surface tension of the liquid and the adhesion of the retaining wall leads to the poor uniformity of the thickness of the film formed by the subsequent drying process, resulting in the surrounding pixels The brightness and chroma are significantly different from the center.

本發明提供一種顯示面板,可以改善膜厚均勻度,提供良好的顯示品質。 The invention provides a display panel, which can improve the uniformity of the film thickness and provide good display quality.

本發明的顯示面板,包括基板、主動元件層設置於基板上、絕緣層設置於主動元件層上、第一電極設置於絕緣層上、有機發光膜、以及第二電極設置於有機發光膜上。絕緣層具有溝槽。第一電極與主動元件層電性連接。有機發光膜具有第一厚度T1與第二厚度T2。有機發光膜於第一電極上的厚度為第二厚度T2。有機發光膜於絕緣層的溝槽中的厚度為第一厚度T1,且T1大於T2。 The display panel of the present invention includes a substrate, an active device layer disposed on the substrate, an insulating layer disposed on the active device layer, a first electrode disposed on the insulating layer, an organic light emitting film, and a second electrode disposed on the organic light emitting film. The insulating layer has trenches. The first electrode is electrically connected to the active device layer. The organic light-emitting film has a first thickness T1 and a second thickness T2. The thickness of the organic light-emitting film on the first electrode is the second thickness T2. The thickness of the organic light emitting film in the trench of the insulating layer is the first thickness T1, and T1 is greater than T2.

基於上述,本發明一實施例的顯示面板,由於顯示面板可以透過圖案化絕緣層以形成第一絕緣圖案、第二絕緣圖案以及溝槽,且溝槽可以部分地環繞第二絕緣圖案。在上述的設置下,有機發光膜可以設置在第二絕緣圖案上的第一電極,並具有第二厚度。有機發光膜具有第一厚度的部分,因靠近第一絕緣圖案導致膜厚不均勻,而設置於溝槽中。如此,可以改善有機發光膜在第一電極上的膜厚均勻度,以提供顯示面板均勻的亮度及良好的顯示品質。此外,溝槽還可以減少外溢的風險。另外,位於第一電極上的有機發光膜更可透過溝槽而遠離第一絕緣圖案,因而不容易受到水氣或氧氣的影響,而變質或縮膜,可以改善顯示面板的發光效率並提升壽命。 Based on the above, in the display panel according to an embodiment of the present invention, since the display panel can form the first insulating pattern, the second insulating pattern, and the trench through the patterned insulating layer, the trench can partially surround the second insulating pattern. Under the above-mentioned arrangement, the organic light-emitting film may be provided on the first electrode on the second insulating pattern and have a second thickness. The organic light-emitting film has a portion with a first thickness, which is disposed in the trench due to the non-uniform film thickness due to the proximity to the first insulating pattern. In this way, the uniformity of the film thickness of the organic light-emitting film on the first electrode can be improved to provide uniform brightness and good display quality of the display panel. In addition, grooves can reduce the risk of spillage. In addition, the organic light-emitting film located on the first electrode can be further away from the first insulating pattern through the trench, so it is not easily affected by moisture or oxygen, and the deterioration or shrinkage film can improve the luminous efficiency of the display panel and increase the life .

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

10、10A、10B、10C、10D、10E:顯示面板 10, 10A, 10B, 10C, 10D, 10E: display panel

100:基板 100: substrate

120:主動元件層 120: Active component layer

121:表面 121: Surface

122:介電層 122: dielectric layer

130、130A、130D、130E:絕緣層 130, 130A, 130D, 130E: insulating layer

131:第一頂面 131: first top surface

132:第一絕緣圖案 132: First insulation pattern

133、133D、133E:溝槽 133, 133D, 133E: groove

134、134A、134D、134E:第二絕緣圖案 134, 134A, 134D, 134E: second insulation pattern

135:第二頂面 135: Second top surface

136:長邊 136: Long side

137:短邊 137: Short side

139D:連接結構 139D: connection structure

140、140B:第一電極 140, 140B: the first electrode

150:第二電極 150: second electrode

160:保護層 160: protective layer

170:貫孔 170: through hole

180:第三絕緣圖案 180: third insulation pattern

200:有機發光膜 200: Organic light-emitting film

200’:有機發光材料 200’: Organic light-emitting materials

A-A’、B-B’、C-C’、D-D’:剖面線 A-A’, B-B’, C-C’, D-D’: hatching

CH:通道層 CH: channel layer

D:汲極 D: Jiji

G:閘極 G: gate

H1:第一高度 H1: first height

H2:第二高度 H2: second height

S:源極 S: source

T:主動元件 T: Active component

T1:第一厚度 T1: first thickness

T2:第二厚度 T2: second thickness

W1、W1A:第一寬度 W1, W1A: the first width

W2、W2A:第二寬度 W2, W2A: second width

圖1A至圖1E繪示為本發明一實施例中顯示面板的製作流程的剖面示意圖。 FIG. 1A to FIG. 1E are schematic cross-sectional views of a manufacturing process of a display panel according to an embodiment of the invention.

圖2繪示為本發明一實施例的顯示面板的局部上視示意圖。 2 is a schematic partial top view of a display panel according to an embodiment of the invention.

圖3繪示為本發明另一實施例的顯示面板的局部上視示意圖。 FIG. 3 is a schematic partial top view of a display panel according to another embodiment of the invention.

圖4A繪示為本發明再一實施例的顯示面板的局部上視示意圖。 4A is a schematic partial top view of a display panel according to still another embodiment of the invention.

圖4B繪示為圖4A的顯示面板沿剖面線B-B’的剖面示意圖。 4B is a schematic cross-sectional view of the display panel of FIG. 4A along the cross-sectional line B-B'.

圖5A繪示為本發明再一實施例的顯示面板的局部上視示意圖。 5A is a schematic partial top view of a display panel according to still another embodiment of the invention.

圖5B繪示為圖5A的顯示面板沿剖面線C-C’的剖面示意圖。 5B is a schematic cross-sectional view of the display panel of FIG. 5A along the cross-sectional line C-C'.

圖6A繪示為本發明再一實施例的顯示面板的局部上視示意圖。 6A is a schematic partial top view of a display panel according to still another embodiment of the invention.

圖6B繪示為圖6A的顯示面板沿剖面線D-D’的剖面示意圖。 6B is a schematic cross-sectional view of the display panel of FIG. 6A along the cross-sectional line D-D'.

圖7繪示為本發明再一實施例的顯示面板的局部上視示意圖。 7 is a schematic partial top view of a display panel according to still another embodiment of the invention.

在附圖中,為了清楚起見,放大了層、膜、面板、區域等的厚度。在整個說明書中,相同的附圖標記表示相同的元件。應當理解,當諸如層、膜、區域或基板的元件被稱為在另一元件”上”或”連接到”另一元件時,其可以直接在另一元件上或與另一元 件連接,或者中間元件可以也存在。相反,當元件被稱為”直接在另一元件上”或”直接連接到”另一元件時,不存在中間元件。如本文所使用的,”連接”可以指物理及/或電性連接。再者,”電性連接”或”耦合”係可為二元件間存在其它元件。 In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “connected to” another element, it can be directly on the other element or be connected to the other element Pieces, or intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connections. Furthermore, "electrical connection" or "coupling" may be that there are other elements between the two elements.

應當理解,儘管術語”第一”、”第二”、”第三”等在本文中可以用於描述各種元件、部件、區域、層及/或部分,但是這些元件、部件、區域、及/或部分不應受這些術語的限制。這些術語僅用於將一個元件、部件、區域、層或部分與另一個元件、部件、區域、層或部分區分開。因此,下面討論的”第一元件”、”部件”、”區域”、”層”或”部分”可以被稱為第二元件、部件、區域、層或部分而不脫離本文的教導。 It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, and/or Or part should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Accordingly, "first element", "component", "region", "layer" or "portion" discussed below may be referred to as a second element, component, region, layer or section without departing from the teachings herein.

除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。 Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and the present invention, and will not be interpreted as idealized or excessive Formal meaning unless explicitly defined as such in this article.

圖1A至圖1E繪示為本發明一實施例中顯示面板的製作流程的剖面示意圖。圖2繪示為本發明一實施例的顯示面板的局部上視示意圖,圖2為了方便說明及觀察,僅示意性地繪示部分構件。在本實施例中,顯示面板10(繪示於圖1E)包括基板100、主動元件層120設置於基板100上、絕緣層130設置於主動元件 層120上且具有溝槽133、第一電極140設置於絕緣層130上且與主動元件層120電性連接、有機發光膜200以及第二電極150設置於有機發光膜200上。在一些實施例中,第二電極150上還可以設置保護層160,但本發明不以此為限。以下將以一實施例簡單說明顯示面板10的製作方法。 FIG. 1A to FIG. 1E are schematic cross-sectional views of a manufacturing process of a display panel according to an embodiment of the invention. FIG. 2 is a schematic partial top view of a display panel according to an embodiment of the present invention. For convenience of description and observation, FIG. 2 only schematically shows some components. In this embodiment, the display panel 10 (shown in FIG. 1E) includes a substrate 100, an active device layer 120 disposed on the substrate 100, and an insulating layer 130 disposed on the active device The layer 120 has a trench 133, the first electrode 140 is disposed on the insulating layer 130 and is electrically connected to the active device layer 120, and the organic light emitting film 200 and the second electrode 150 are disposed on the organic light emitting film 200. In some embodiments, a protective layer 160 may also be provided on the second electrode 150, but the invention is not limited thereto. In the following, a manufacturing method of the display panel 10 will be briefly described with an embodiment.

請參考圖1A,在本實施例中,首先提供基板100。基板100的材料可以是玻璃、石英、有機聚合物、不透光/反射材料(例如:導電材料、金屬、晶圓、陶瓷或其它可適用的材料)或是其它可適用的材料。若使用導電材料或金屬時,則在基板100上覆蓋一層絕緣材料(未繪示),以避免短路問題。 Please refer to FIG. 1A. In this embodiment, the substrate 100 is first provided. The material of the substrate 100 may be glass, quartz, organic polymer, opaque/reflective material (for example: conductive material, metal, wafer, ceramic or other applicable materials) or other applicable materials. If conductive materials or metals are used, a layer of insulating material (not shown) is covered on the substrate 100 to avoid short circuit problems.

接著,設置主動元件層120於基板100上。主動元件層120可例如是主動元件陣列(未繪示),其中上述的主動元件陣列包括介電層122以及多個主動元件T(繪示於圖4B)。上述主動元件T包括薄膜電晶體(thin film transistor,TFT)。薄膜電晶體例如為低溫多晶矽薄膜電晶體(low temperature poly-Si,LTPS)或非晶矽薄膜電晶體(amorphous Si,a-Si),但本發明不以此為限。 Next, the active device layer 120 is provided on the substrate 100. The active device layer 120 may be, for example, an active device array (not shown), wherein the active device array described above includes a dielectric layer 122 and a plurality of active devices T (shown in FIG. 4B). The active device T includes a thin film transistor (TFT). The thin film transistor is, for example, low temperature poly-Si (LTPS) or amorphous silicon thin-film transistor (a-Si), but the invention is not limited thereto.

再來,設置絕緣層130於主動元件層120上。在本實施例中,絕緣層130的材料包括無機材料。無機材料包括氮化矽(SiNx)或其他合適材料,本發明不以此為限。絕緣層130包括第一絕緣圖案132以及第二絕緣圖案134。在本實施例中,第一絕緣圖案132、第二絕緣圖案134以及溝槽133的形成方法例如透過黃光微影蝕刻方式或半階調式光罩(halftone mask),對絕緣層130 進行蝕刻以形成第一絕緣圖案132環繞第二絕緣圖案134,且溝槽133設置於第一絕緣圖案132於第二絕緣圖案134之間。在本實施例中,可透過圖案化絕緣層130以形成定義畫素的擋牆的第一絕緣圖案132。如此,可以一層絕緣層130省去習知的分別形成絕緣層、平坦層及擋牆的步驟,以簡化製程並節省成本。 Next, an insulating layer 130 is provided on the active device layer 120. In this embodiment, the material of the insulating layer 130 includes an inorganic material. Inorganic materials include silicon nitride (SiN x ) or other suitable materials, and the invention is not limited thereto. The insulating layer 130 includes a first insulating pattern 132 and a second insulating pattern 134. In this embodiment, the first insulating pattern 132, the second insulating pattern 134, and the trench 133 are formed by etching the insulating layer 130 to form the first layer by, for example, yellow photolithography or a half-tone mask An insulating pattern 132 surrounds the second insulating pattern 134, and the trench 133 is disposed between the first insulating pattern 132 and the second insulating pattern 134. In this embodiment, the patterned insulating layer 130 can be formed to form a first insulating pattern 132 that defines a pixel wall. In this way, a layer of insulating layer 130 can omit the conventional steps of separately forming an insulating layer, a flat layer and a retaining wall, so as to simplify the manufacturing process and save costs.

請參考圖1B及圖2,然後,設置多個第一電極140於絕緣層130上。舉例而言,第一電極140設置於第二絕緣圖案134上。在本實施例中,第一電極140的材料為導體材料,例如鋁(Al)、銀(Ag)、鉻(Cr)、銅(Cu)、鎳(Ni)、鈦(Ti)、鉬(Mo)、鎂(Mg)、鉑(Pt)、金(Au)或其組合。第一電極140可以是單層、雙層或多層結構。舉例而言,第一電極140可以是由ITO/Ag/ITO所構成的三層結構,但本發明不以此為限。在其他實施例中,第一電極140也可以是Ti/Al/Ti或是由Mo/Al/Mo所構成的三層結構。在一些實施例中,第一電極140還包括反射電極,其材料可以是對可見光具有良好反射率的金屬,例如鋁、鉬、金或其組合。在一些實施例中,第一電極140的形成方法可以是化學氣相沉積(CVD)、物理氣相沉積(PVD)、原子層沉積(ALD)、蒸鍍(VTE)、濺鍍(SPT)或其組合。在一些實施例中,第一電極140可作為有機發光膜200的陽極(anode),但本發明不以此為限。 Please refer to FIGS. 1B and 2. Then, a plurality of first electrodes 140 are disposed on the insulating layer 130. For example, the first electrode 140 is disposed on the second insulating pattern 134. In this embodiment, the material of the first electrode 140 is a conductor material, such as aluminum (Al), silver (Ag), chromium (Cr), copper (Cu), nickel (Ni), titanium (Ti), molybdenum (Mo ), magnesium (Mg), platinum (Pt), gold (Au) or a combination thereof. The first electrode 140 may have a single-layer, double-layer, or multilayer structure. For example, the first electrode 140 may be a three-layer structure composed of ITO/Ag/ITO, but the invention is not limited thereto. In other embodiments, the first electrode 140 may also be Ti/Al/Ti or a three-layer structure composed of Mo/Al/Mo. In some embodiments, the first electrode 140 further includes a reflective electrode, the material of which may be a metal having good reflectivity for visible light, such as aluminum, molybdenum, gold, or a combination thereof. In some embodiments, the forming method of the first electrode 140 may be chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), vapor deposition (VTE), sputtering (SPT), or Its combination. In some embodiments, the first electrode 140 may serve as an anode of the organic light-emitting film 200, but the invention is not limited thereto.

請參考圖1C及圖1D,接著,設置有機發光膜200於第一電極140上及溝槽133中。請先參考圖1C,在本實施例中,為了提升材料的利用率以降低顯示面板10的製造成本,可藉由噴墨 塗佈(ink jet printing,IJP)製程來形成有機發光膜200。舉例而言,液態的有機發光材料200’可由噴墨塗佈製程設置於第一電極140上且位於溝槽133中。有機發光材料200’例如為作為畫素的有機發光膜200的液態材料。 Please refer to FIGS. 1C and 1D. Next, the organic light emitting film 200 is disposed on the first electrode 140 and in the trench 133. Please refer to FIG. 1C first. In this embodiment, in order to increase the utilization rate of materials to reduce the manufacturing cost of the display panel 10, inkjet An organic jet film 200 is formed by an ink jet printing (IJP) process. For example, the liquid organic light-emitting material 200' can be disposed on the first electrode 140 and located in the trench 133 by an inkjet coating process. The organic light emitting material 200' is, for example, a liquid material of the organic light emitting film 200 as a pixel.

然後,請參考圖1D,透過固化程序(未繪示),將液態的有機發光材料200’乾燥後形成固態的有機發光膜200。在一些實施例中,有機發光膜200可為多層結構,包括電洞注入層(hole injection layer,HIL)、電洞傳輸層(hole transfer layer,HTL)、發光層(emission layer,EL)和電子傳輸層(electron transfer layer,ETL)。圖1D為了方便說明及清楚表示,僅以一層結構表示。在本實施例中,可透過重覆進行噴墨塗佈製程以及固化程序以形成所需厚度的有機發光膜200,但本發明不以此為限。 Then, referring to FIG. 1D, through a curing process (not shown), the liquid organic light emitting material 200' is dried to form a solid organic light emitting film 200. In some embodiments, the organic light-emitting film 200 may have a multi-layer structure, including a hole injection layer (HIL), a hole transfer layer (HTL), an emission layer (EL), and electrons Transport layer (electron transfer layer, ETL). For convenience of description and clear representation, FIG. 1D is represented by only one layer structure. In this embodiment, the inkjet coating process and the curing process can be repeated to form the organic light-emitting film 200 with a desired thickness, but the invention is not limited thereto.

在一些實施例中,電洞注入層的材料例如是苯二甲藍銅、星狀芳胺類、聚苯胺、聚乙烯二氧噻吩或其他適合的材料。電洞傳輸層的材料例如是三芳香胺類、交叉結構二胺聯苯、二胺聯苯衍生物或其他適合的材料。發光層可以是紅色有機發光層、綠色有機發光層、藍色有機發光層或是混合各頻譜的光產生的不同顏色(例如白、橘、黃等)發光層。電子傳輸層的材料可以是噁唑衍生物及其樹狀物、金屬螯合物(例如Alq3)、唑類化合物、二氮蒽衍生物、含矽雜環化合物或其他適合的材料。 In some embodiments, the material of the hole injection layer is, for example, xylylene copper, star arylamines, polyaniline, polyethylene dioxythiophene, or other suitable materials. The material of the hole transport layer is, for example, triaromatic amines, cross-structured diamine biphenyl, diamine biphenyl derivatives or other suitable materials. The light-emitting layer may be a red organic light-emitting layer, a green organic light-emitting layer, a blue organic light-emitting layer, or a light-emitting layer of different colors (for example, white, orange, yellow, etc.) produced by mixing light of various spectra. The material of the electron transport layer may be an oxazole derivative and its dendrimer, a metal chelate compound (such as Alq3), an azole compound, a diazoanthracene derivative, a silicon-containing heterocyclic compound, or other suitable materials.

請參考圖1E及圖2,圖1E繪示為圖2的顯示面板10沿著剖面線A-A’的剖面示意圖。接著,將第二電極150設置於有機 發光膜200上。在本實施例中,第二電極150可以整面的方式設置在有機發光膜200及絕緣層130上並重疊第一電極140以及溝槽133,但本發明不以此為限。第二電極150的材料可為透明的導體材料,例如銦錫氧化物、銦鋅氧化物、鋁錫氧化物、鋁鋅氧化物或銦鍺鋅氧化物等金屬氧化物。在一些實施例中,第二電極150的形成方法可以是化學氣相沉積(CVD)、物理氣相沉積(PVD)、原子層沉積(ALD)、蒸鍍(VTE)、濺鍍(SPT)或其組合。在一些實施例中,第二電極150可作為有機發光膜200的陰極(cathode)。 Please refer to FIGS. 1E and 2. FIG. 1E is a schematic cross-sectional view of the display panel 10 of FIG. 2 along the cross-sectional line A-A'. Next, the second electrode 150 is provided on the organic On the light emitting film 200. In this embodiment, the second electrode 150 may be disposed on the organic light emitting film 200 and the insulating layer 130 over the entire surface and overlap the first electrode 140 and the trench 133, but the invention is not limited thereto. The material of the second electrode 150 may be a transparent conductive material, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, or indium germanium zinc oxide. In some embodiments, the formation method of the second electrode 150 may be chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), vapor deposition (VTE), sputtering (SPT), or Its combination. In some embodiments, the second electrode 150 may serve as a cathode of the organic light emitting film 200.

最後,設置保護層160於第二電極150上。在本實施例中,保護層160的材料包括無機材料。無機材料包括氮化矽(SiNx)或其他合適材料,本發明不以此為限。 Finally, a protective layer 160 is provided on the second electrode 150. In this embodiment, the material of the protective layer 160 includes an inorganic material. The inorganic material includes silicon nitride (SiNx) or other suitable materials, and the invention is not limited thereto.

請參考圖1E及圖2,在結構上,第一電極140於基板100上的正投影在有機發光膜200於基板100上的正投影內。此外,第二絕緣圖案134於基板100上的正投影重疊於或在第一電極140於基板100上的正投影內。本實施例是以第二絕緣圖案134於基板100上的正投影在第一電極140於基板100上的正投影內為例進行說明,但本發明不以此為限。在本實施例中,第一電極140覆蓋第二絕緣圖案134,且第一電極140的部分自第二絕緣圖案134的第二頂面135延伸至第二絕緣圖案134的側壁,並進入溝槽133中與主動元件層120接觸。 Please refer to FIGS. 1E and 2. In structure, the orthographic projection of the first electrode 140 on the substrate 100 is in the orthographic projection of the organic light-emitting film 200 on the substrate 100. In addition, the orthographic projection of the second insulating pattern 134 on the substrate 100 overlaps or is within the orthographic projection of the first electrode 140 on the substrate 100. This embodiment is described by taking the orthographic projection of the second insulating pattern 134 on the substrate 100 in the orthographic projection of the first electrode 140 on the substrate 100 as an example, but the invention is not limited thereto. In this embodiment, the first electrode 140 covers the second insulating pattern 134, and a portion of the first electrode 140 extends from the second top surface 135 of the second insulating pattern 134 to the sidewall of the second insulating pattern 134 and enters the trench 133 is in contact with the active device layer 120.

在本實施例中,顯示面板10更包括貫孔170,且貫孔170 於基板100上的正投影重疊溝槽133於基板100上的正投影。更具體而言,貫孔170於基板100上的正投影可以位於溝槽133於基板100上的正投影之內,但本發明不以此為限。在本實施例中,貫孔170例如重疊溝槽133且靠近第二絕緣圖案134的短邊137之處,但本發明不以此為限。第一電極140透過貫孔170電性連接至主動元件層120。在本實施例中,貫孔170的直徑例如是等於或大於3微米,但本發明不以此為限。 In this embodiment, the display panel 10 further includes a through hole 170, and the through hole 170 The orthographic projection on the substrate 100 overlaps the orthographic projection of the groove 133 on the substrate 100. More specifically, the orthographic projection of the through hole 170 on the substrate 100 may be within the orthographic projection of the trench 133 on the substrate 100, but the invention is not limited thereto. In this embodiment, the through hole 170 overlaps the trench 133 and is close to the short side 137 of the second insulating pattern 134, but the invention is not limited thereto. The first electrode 140 is electrically connected to the active device layer 120 through the through hole 170. In this embodiment, the diameter of the through hole 170 is, for example, equal to or greater than 3 microns, but the invention is not limited thereto.

值得注意的是,在本實施例中,第一絕緣圖案132的高度H1大於第二絕緣圖案134的高度H2。高度H1為第一絕緣圖案132的第一頂面131至主動元件層120的表面121的高度。高度H2為第二絕緣圖案134的第二頂面135至主動元件層120的表面121的高度。第一絕緣圖案132與第二絕緣圖案134之間具有高度差(例如:H1-H2)。上述的高度差為0.5微米至1.5微米。在上述的設置下,第一絕緣圖案132可作為定義出畫素的擋牆,以在噴墨塗佈製程中容置液態的有機發光材料200,(繪示於圖1C)。此外,在本實施例中,溝槽133設置於第一絕緣圖案132與第二絕緣圖案134之間並四面環繞第二絕緣圖案134。如此,多餘的有機發光材料200’可以流至溝槽133中而被容置,以減少外溢(overflow)的風險。 It is worth noting that in this embodiment, the height H1 of the first insulating pattern 132 is greater than the height H2 of the second insulating pattern 134. The height H1 is the height from the first top surface 131 of the first insulating pattern 132 to the surface 121 of the active device layer 120. The height H2 is the height from the second top surface 135 of the second insulating pattern 134 to the surface 121 of the active device layer 120. The first insulating pattern 132 and the second insulating pattern 134 have a height difference (for example: H1-H2). The above-mentioned height difference is 0.5 to 1.5 microns. Under the above arrangement, the first insulating pattern 132 can serve as a barrier wall defining pixels to accommodate the liquid organic light-emitting material 200 in the inkjet coating process (shown in FIG. 1C). In addition, in the present embodiment, the trench 133 is disposed between the first insulating pattern 132 and the second insulating pattern 134 and surrounds the second insulating pattern 134 on four sides. In this way, the excess organic light-emitting material 200' can flow into the trench 133 to be accommodated to reduce the risk of overflow.

此外,基於液體的表面張力與第一絕緣圖案132(作為擋牆結構)之吸附力的不同會導致液滴乾燥過程有膜厚不均的狀況,故有機發光膜200的厚度隨著靠近第一絕緣圖案132漸增, 而導致膜厚不均勻。由於本發明的顯示面板10在第一絕緣圖案132與第二絕緣圖案134之間設有溝槽133,因此於垂直基板100的方向上,有機發光膜200於溝槽133中接觸絕緣層130(例如:靠近第一絕緣圖案132)的厚度大於有機發光膜200於溝槽133的中心點(例如:溝槽133中最遠離第一絕緣圖案132及第二絕緣圖案134的點)的厚度。如此一來,有機發光膜200可以在發光區的第一電極140上形成均勻的膜厚,而將膜厚不均的部分設置於非發光區的溝槽133中,以提供均勻的亮度及良好的顯示品質。 In addition, the difference between the surface tension of the liquid and the adsorption force of the first insulating pattern 132 (as a retaining wall structure) may cause the film thickness to be uneven during the droplet drying process, so the thickness of the organic light emitting film 200 increases as it approaches the first The insulation pattern 132 gradually increases, This results in uneven film thickness. Since the display panel 10 of the present invention is provided with a trench 133 between the first insulating pattern 132 and the second insulating pattern 134, the organic light emitting film 200 contacts the insulating layer 130 in the trench 133 in the direction perpendicular to the substrate 100 ( For example, the thickness of the first insulating pattern 132 is greater than the thickness of the organic light emitting film 200 at the center point of the trench 133 (for example, the point of the trench 133 farthest from the first insulating pattern 132 and the second insulating pattern 134). In this way, the organic light-emitting film 200 can form a uniform film thickness on the first electrode 140 in the light-emitting region, and the uneven film thickness portion is disposed in the groove 133 in the non-light-emitting region to provide uniform brightness and good Display quality.

在本實施例中,有機發光膜200可以具有第一厚度T1與第二厚度T2。其中有機發光膜200於第一電極140上的厚度為第二厚度T2,有機發光膜200於絕緣層130的溝槽133中的厚度為第一厚度T1。如前文所述及圖1E所示,有機發光膜200的膜厚不均的部分設置於溝槽133中,第一厚度T1可被定義為由溝槽133的中心點往靠近第一絕緣圖案132而漸增的厚度。即第一厚度T1在有機發光膜200接觸第一絕緣圖案132之處可為第一厚度T1的最大厚度,而第一厚度T1在有機發光膜200位於溝槽133的中心點之處可為第一厚度T1的最小厚度,但本發明不以此為限。在本實施例中,第一厚度T1大於第二厚度T2。如此,除了可以改善第一電極140上的有機發光膜200的膜厚均勻度,有機發光膜200的厚度更可藉由溝槽133的設置而被控制,以提供均勻的亮度及良好的顯示品質。 In this embodiment, the organic light emitting film 200 may have a first thickness T1 and a second thickness T2. The thickness of the organic light-emitting film 200 on the first electrode 140 is the second thickness T2, and the thickness of the organic light-emitting film 200 in the trench 133 of the insulating layer 130 is the first thickness T1. As described above and shown in FIG. 1E, the uneven thickness of the organic light-emitting film 200 is provided in the trench 133, and the first thickness T1 can be defined as approaching the first insulating pattern 132 from the center point of the trench 133 And the increasing thickness. That is, the first thickness T1 may be the maximum thickness of the first thickness T1 where the organic light emitting film 200 contacts the first insulating pattern 132, and the first thickness T1 may be the first thickness where the organic light emitting film 200 is located at the center point of the trench 133 A minimum thickness of T1, but the invention is not limited thereto. In this embodiment, the first thickness T1 is greater than the second thickness T2. In this way, in addition to improving the thickness uniformity of the organic light-emitting film 200 on the first electrode 140, the thickness of the organic light-emitting film 200 can be controlled by the arrangement of the groove 133 to provide uniform brightness and good display quality .

在本實施例中,溝槽133的寬度為1.5微米至200微米。舉例而言,第二絕緣圖案134的短邊137與第一絕緣圖案132之間的距離定義出溝槽133的第一寬度W1。第二絕緣圖案134的長邊136與第一絕緣圖案132之間的距離定義出溝槽133的第二寬度W2。在本實施例中,第一寬度W1等於第二寬度W2,分別為1.5微米至200微米,但本發明不以此為限。在一些實施例中,第一寬度W1與第二寬度W2可依使用者的需求調整而不同。在上述的設置下,溝槽133除了可以容置有機發光膜200,位於第一電極140上的有機發光膜200還可透過溝槽133而遠離第一絕緣圖案132。如此,位於第一電極140上的有機發光膜200不容易受到來自第一絕緣圖案132的水氣或氧氣的影響,而變質或縮膜,以改善發光效率並提升壽命。 In the present embodiment, the width of the trench 133 is 1.5 microns to 200 microns. For example, the distance between the short side 137 of the second insulating pattern 134 and the first insulating pattern 132 defines the first width W1 of the trench 133. The distance between the long side 136 of the second insulating pattern 134 and the first insulating pattern 132 defines the second width W2 of the trench 133. In this embodiment, the first width W1 is equal to the second width W2, which is respectively 1.5 micrometers to 200 micrometers, but the invention is not limited thereto. In some embodiments, the first width W1 and the second width W2 can be adjusted differently according to user needs. Under the above arrangement, the trench 133 can accommodate the organic light-emitting film 200, and the organic light-emitting film 200 on the first electrode 140 can also pass through the trench 133 and away from the first insulating pattern 132. As such, the organic light-emitting film 200 located on the first electrode 140 is not easily affected by moisture or oxygen from the first insulating pattern 132, but is deteriorated or shrunk to improve the light-emitting efficiency and increase the lifespan.

簡言之,由於本發明一實施例的顯示面板10可以透過圖案化絕緣層130以形成第一絕緣圖案132、第二絕緣圖案134以及溝槽133,且溝槽133設置於第一絕緣圖案132與第二絕緣圖案134之間並部分環繞第二絕緣圖案134。在上述的設置下,有機發光膜200可以設置在第二絕緣圖案134上的第一電極140並具有第二厚度T2。有機發光膜200具有第一厚度T1的部分,因靠近第一絕緣圖案132導致膜厚不均勻,而設置於溝槽133中。如此,可以改善有機發光膜200在第一電極140上的膜厚均勻度,以提供顯示面板10均勻的亮度及良好的顯示品質。此外,在進行噴墨塗佈製程時,多餘的有機發光膜200可被容置於溝槽133中,以 減少外溢(overflow)的風險。另外,位於第一電極140上的有機發光膜200更可透過溝槽133的設置而遠離第一絕緣圖案132,因而不容易受到來自第一絕緣圖案132的水氣或氧氣的影響,而變質或縮膜,可以改善顯示面板10的發光效率並提升壽命。 In short, the display panel 10 according to an embodiment of the present invention can form the first insulating pattern 132, the second insulating pattern 134, and the trench 133 through the patterned insulating layer 130, and the trench 133 is disposed on the first insulating pattern 132 Between the second insulating pattern 134 and partially surrounding the second insulating pattern 134. Under the above-described arrangement, the organic light-emitting film 200 may be provided on the first electrode 140 on the second insulating pattern 134 and have the second thickness T2. The organic light-emitting film 200 has a portion with a first thickness T1, which is disposed in the trench 133 due to the non-uniform film thickness due to the proximity to the first insulating pattern 132. In this way, the uniformity of the film thickness of the organic light-emitting film 200 on the first electrode 140 can be improved to provide uniform brightness and good display quality of the display panel 10. In addition, during the inkjet coating process, the excess organic light-emitting film 200 can be accommodated in the trench 133 to Reduce the risk of overflow. In addition, the organic light-emitting film 200 located on the first electrode 140 can be further away from the first insulating pattern 132 through the arrangement of the trench 133, so it is not easily affected by moisture or oxygen from the first insulating pattern 132, and deteriorate or Shrinking the film can improve the luminous efficiency of the display panel 10 and increase the lifespan.

下述實施例沿用前述實施例的元件標號與部分內容,其中採用相同的標號來表示相同或近似的元件,關於省略了相同技術內容的部分說明可參考前述實施例,下述實施例中不再重複贅述。 The following embodiments continue to use the element numbers and partial contents of the previous embodiments, wherein the same reference numerals are used to denote the same or similar elements. For the description of the parts that omit the same technical content, please refer to the previous embodiments. Repeat the details.

圖3繪示為本發明另一實施例的顯示面板的局部上視示意圖。本實施例所示的顯示面板10A與圖2所示的顯示面板10類似,主要的差異在於:第二絕緣圖案134A與第一絕緣圖案132之間的溝槽133的第一寬度W1A不同於第二寬度W2A。在本實施例中,絕緣層130A包括第一絕緣圖案132以及第二絕緣圖案134A。相較於圖2的實施例,顯示面板10A的第一寬度W1A大於顯示面板10的第一寬度W1,且第二寬度W2A小於第二寬度W2。在上述的設置下,溝槽133的寬度可依使用者的需求調整,且不會犧牲顯示面板10A的開口率,可以提升顯示面板10A的顯示品質。 FIG. 3 is a schematic partial top view of a display panel according to another embodiment of the invention. The display panel 10A shown in this embodiment is similar to the display panel 10 shown in FIG. 2, the main difference is that the first width W1A of the trench 133 between the second insulating pattern 134A and the first insulating pattern 132 is different from the first Two width W2A. In this embodiment, the insulating layer 130A includes a first insulating pattern 132 and a second insulating pattern 134A. Compared to the embodiment of FIG. 2, the first width W1A of the display panel 10A is larger than the first width W1 of the display panel 10, and the second width W2A is smaller than the second width W2. Under the above configuration, the width of the groove 133 can be adjusted according to the needs of users without sacrificing the aperture ratio of the display panel 10A, which can improve the display quality of the display panel 10A.

在本實施例中,第一寬度W1A大於第二寬度W2A。貫孔170可以設置在溝槽133具有第一寬度W1A的部分中。如此,相較於寬度較小的第二寬度W2A,貫孔170可以設置於寬度較大的第一寬度W1A的溝槽133中,以降低設置貫孔170的製程難度。 藉此,更可以提升第一電極140與貫孔170接觸的面積,以降低斷線的機率。此外,顯示面板10A還可獲致與上述實施例類似的技術功效。 In this embodiment, the first width W1A is larger than the second width W2A. The through hole 170 may be provided in a portion of the trench 133 having the first width W1A. As such, compared to the second width W2A having a smaller width, the through hole 170 may be disposed in the trench 133 having the first width W1A having a larger width, so as to reduce the difficulty of the process of providing the through hole 170. In this way, the area where the first electrode 140 is in contact with the through hole 170 can be further increased to reduce the probability of disconnection. In addition, the display panel 10A can also obtain technical effects similar to those of the foregoing embodiments.

圖4A繪示為本發明再一實施例的顯示面板的局部上視示意圖。圖4B繪示為圖4A的顯示面板沿剖面線B-B’的剖面示意圖。圖4A及圖4B為了方便說明及觀察,僅示意性地繪示部分構件。本實施例所示的顯示面板10B與圖2所示的顯示面板10類似,主要的差異在於:第一電極140B於基板100上的正投影在第二絕緣圖案134於基板100上的正投影內。請參考圖4A及圖4B,在本實施例中,第一電極140B可不重疊第二絕緣圖案134的邊緣(例如長邊136或短邊137)而僅在重疊貫孔170處重疊第二絕緣圖案134的短邊137。如此,第一電極140B上的有機發光薄膜200可進一步遠離溝槽133,減少溝槽133中膜厚不平均的有機發光膜200的影響,進一步改善有機發光膜200的膜厚均勻度,提供顯示面板10B良好的顯示品質。 4A is a schematic partial top view of a display panel according to still another embodiment of the invention. 4B is a schematic cross-sectional view of the display panel of FIG. 4A along the cross-sectional line B-B'. 4A and 4B only schematically illustrate some components for convenience of explanation and observation. The display panel 10B shown in this embodiment is similar to the display panel 10 shown in FIG. 2, the main difference is that the orthographic projection of the first electrode 140B on the substrate 100 is in the orthographic projection of the second insulating pattern 134 on the substrate 100 . 4A and 4B, in this embodiment, the first electrode 140B may not overlap the edges of the second insulating pattern 134 (such as the long side 136 or the short side 137) but only overlap the second insulating pattern at the overlapping through-hole 170 The short side of 134 is 137. In this way, the organic light-emitting film 200 on the first electrode 140B can be further away from the trench 133, reducing the influence of the uneven thickness of the organic light-emitting film 200 in the trench 133, further improving the uniformity of the film thickness of the organic light-emitting film 200, and providing a display The panel 10B has good display quality.

在本實施例中,第一電極140B透過貫孔170電性連接至主動元件層120中的主動元件T。舉例而言,主動元件層120包括介電層122以及主動元件T。在本實施例中,主動元件T例如為薄膜電晶體,可包括通道層CH、閘極G、源極S和汲極D。源極S與汲極D分別與通道層CH電性連接。在一些實施例中,閘極G可與對應掃描線(未繪示)電性連接,源極S可與對應的資料線(未繪示)電性連接,汲極D可透過對應的貫孔170以電性 連接至第一電極140B。在本實施例中,主動元件T是頂閘型電晶體,但本發明不以此為限。在其他實施例中,主動元件T也可為底閘型電晶體、立體型電晶體、或其它合適的電晶體。通道層CH可為單層或多層結構,且其材料包含非晶矽、微晶矽、奈米晶矽、多晶矽、單晶矽、有機半導體材料、氧化物半導體材料、奈米碳管/桿、其它合適的材料、或前述之組合。藉此,第一電極140B可將主動元件T所提供的訊號導通至有機發光膜200及第二電極150以使有機發光膜200發光。 In this embodiment, the first electrode 140B is electrically connected to the active device T in the active device layer 120 through the through hole 170. For example, the active device layer 120 includes a dielectric layer 122 and an active device T. In this embodiment, the active element T is, for example, a thin film transistor, which may include a channel layer CH, a gate G, a source S, and a drain D. The source electrode S and the drain electrode D are electrically connected to the channel layer CH, respectively. In some embodiments, the gate G may be electrically connected to the corresponding scan line (not shown), the source S may be electrically connected to the corresponding data line (not shown), and the drain D may pass through the corresponding through hole 170 with electricity Connected to the first electrode 140B. In this embodiment, the active element T is a top-gate transistor, but the invention is not limited to this. In other embodiments, the active device T may also be a bottom gate transistor, a three-dimensional transistor, or other suitable transistors. The channel layer CH can be a single-layer or multi-layer structure, and its materials include amorphous silicon, microcrystalline silicon, nanocrystalline silicon, polycrystalline silicon, monocrystalline silicon, organic semiconductor materials, oxide semiconductor materials, carbon nanotubes/rods, Other suitable materials, or combinations of the foregoing. In this way, the first electrode 140B can conduct the signal provided by the active device T to the organic light-emitting film 200 and the second electrode 150 to make the organic light-emitting film 200 emit light.

圖5A繪示為本發明再一實施例的顯示面板的局部上視示意圖。圖5B繪示為圖5A的顯示面板沿剖面線C-C’的剖面示意圖。圖5A及圖5B為了方便說明及觀察,僅示意性地繪示部分構件。本實施例所示的顯示面板10C與圖2所示的顯示面板10類似,主要的差異在於:顯示面板10C更包括第三絕緣圖案180設置於主動元件層120與第一絕緣圖案132及第二絕緣圖案134之間。換句話說,第三絕緣圖案180係設置於絕緣層130與主動元件層120之間。第三絕緣圖案180的材料包括無機材料。無機材料包括氮化矽(SiNx)或其他合適材料,本發明不以此為限。在本實施例中,在設置主動元件層120後,可先設置第三絕緣圖案180作為平坦層,再設置絕緣層130。如此,第一絕緣圖案132及第二絕緣圖案134的表面(例如第一頂面131或第二頂面135)可以更加的平坦,以改善有機發光膜200的膜厚均勻度,提供顯示面板10C良好的顯示品質。 5A is a schematic partial top view of a display panel according to still another embodiment of the invention. FIG. 5B is a schematic cross-sectional view of the display panel of FIG. 5A along the section line CC′. 5A and 5B only schematically show some components for convenience of explanation and observation. The display panel 10C shown in this embodiment is similar to the display panel 10 shown in FIG. 2, the main difference is that the display panel 10C further includes a third insulating pattern 180 disposed on the active device layer 120 and the first insulating pattern 132 and the second Between the insulating patterns 134. In other words, the third insulating pattern 180 is disposed between the insulating layer 130 and the active device layer 120. The material of the third insulating pattern 180 includes an inorganic material. Inorganic materials include silicon nitride (SiN x ) or other suitable materials, and the invention is not limited thereto. In this embodiment, after the active device layer 120 is provided, the third insulating pattern 180 may be provided as a flat layer first, and then the insulating layer 130 may be provided. In this way, the surfaces of the first insulating pattern 132 and the second insulating pattern 134 (such as the first top surface 131 or the second top surface 135) can be more flat to improve the uniformity of the film thickness of the organic light-emitting film 200 and provide the display panel 10C Good display quality.

在本實施例中,第二絕緣圖案134於基板100上的正投影可以完全位於第一電極140於基板100上的正投影內,以使第一電極140完全的覆蓋第二絕緣圖案134。舉例而言,第一電極140可延伸進溝槽133中並接觸第三絕緣圖案180以及第三絕緣圖案180所暴露的部分貫孔170。如此,第一電極140的尺寸可進一步地提升,且可透過貫孔170電性連接至主動元件層120,並獲致與上述實施例類似的技術功效。。 In this embodiment, the orthographic projection of the second insulating pattern 134 on the substrate 100 can be completely located in the orthographic projection of the first electrode 140 on the substrate 100 so that the first electrode 140 completely covers the second insulating pattern 134. For example, the first electrode 140 may extend into the trench 133 and contact the third insulating pattern 180 and a portion of the through hole 170 exposed by the third insulating pattern 180. In this way, the size of the first electrode 140 can be further improved, and can be electrically connected to the active device layer 120 through the through hole 170, and a technical effect similar to that of the above-mentioned embodiment can be obtained. .

圖6A繪示為本發明再一實施例的顯示面板的局部上視示意圖。圖6B繪示為圖6A的顯示面板沿剖面線D-D’的剖面示意圖。圖6A及圖6B為了方便說明及觀察,僅示意性地繪示部分構件。本實施例所示的顯示面板10D與圖5A所示的顯示面板10C類似,主要的差異在於:溝槽133D環繞第二絕緣圖案134D的部分。請參考圖6A及圖6B,舉例而言,絕緣層130D包括第一絕緣圖案132以及第二絕緣圖案134D。第二絕緣圖案134D沿著長邊136方向延伸,且第二絕緣圖案134D的短邊137連接第一絕緣圖案132。具體而言,溝槽133D大致地環繞第二絕緣圖案134D,且在靠近短邊137的溝槽133D中,第二絕緣圖案134D的部分沿著長邊136的方向延伸,以在短邊137延伸出連接結構139D,使短邊137連接至第一絕緣圖案132。在本實施例中,連接結構139D與第二絕緣圖案134D屬於同一膜層。在上述的設置下,第二電極150可以自第二絕緣圖案134D上沿著連接結構139D延伸至第一絕緣圖案132上,以在垂直基板100的方向上,減少第二電極150 因溝槽133D與第二絕緣圖案134D之間的高度差所產生的斷線的機率,以提升顯示面板10D的良率及效能。 6A is a schematic partial top view of a display panel according to still another embodiment of the invention. 6B is a schematic cross-sectional view of the display panel of FIG. 6A along the cross-sectional line D-D'. For convenience of description and observation, FIGS. 6A and 6B only schematically show some components. The display panel 10D shown in this embodiment is similar to the display panel 10C shown in FIG. 5A, and the main difference is that the trench 133D surrounds a portion of the second insulating pattern 134D. 6A and 6B, for example, the insulating layer 130D includes a first insulating pattern 132 and a second insulating pattern 134D. The second insulating pattern 134D extends along the long side 136 direction, and the short side 137 of the second insulating pattern 134D is connected to the first insulating pattern 132. Specifically, the trench 133D substantially surrounds the second insulating pattern 134D, and in the trench 133D near the short side 137, a portion of the second insulating pattern 134D extends along the direction of the long side 136 to extend on the short side 137 The connection structure 139D is connected to connect the short side 137 to the first insulating pattern 132. In this embodiment, the connection structure 139D and the second insulating pattern 134D belong to the same film layer. Under the above arrangement, the second electrode 150 may extend from the second insulating pattern 134D along the connection structure 139D to the first insulating pattern 132 to reduce the second electrode 150 in a direction perpendicular to the substrate 100 The probability of disconnection due to the height difference between the trench 133D and the second insulating pattern 134D improves the yield and performance of the display panel 10D.

在本實施例中,是以在短邊137延伸出連接結構139D,使短邊137連接至第一絕緣圖案132為例進行說明。在一些實施例中,連接結構139D也可以自長邊136延伸出來,以使第二絕緣圖案134D的長邊136連接至第一絕緣圖案132,本發明不以此為限。此外,在一些實施例中,更可依需求同時在短邊137以及長邊136延伸出多個連接結構139D,以連接至第一絕緣圖案132。如此,顯示面板10D可獲致與上述實施例類似的技術功效。 In the present embodiment, the connection structure 139D is extended on the short side 137 and the short side 137 is connected to the first insulating pattern 132 as an example for description. In some embodiments, the connection structure 139D may also extend from the long side 136 to connect the long side 136 of the second insulating pattern 134D to the first insulating pattern 132, which is not limited in the present invention. In addition, in some embodiments, a plurality of connection structures 139D may be extended on the short side 137 and the long side 136 at the same time to connect to the first insulating pattern 132 as required. In this way, the display panel 10D can obtain technical effects similar to those of the foregoing embodiments.

圖7繪示為本發明再一實施例的顯示面板的局部上視示意圖。本實施例所示的顯示面板10E與圖6A所示的顯示面板10D類似,主要的差異在於:第二絕緣圖案134E的短邊137連接第一絕緣圖案132。在本實施例中,絕緣層130E包括第一絕緣圖案132以及第二絕緣圖案134E。溝槽133E環繞第二絕緣圖案134E的部分邊緣,例如第二絕緣圖案134E的部分長邊136或短邊137。相較於圖5A的顯示面板10C或圖6A的顯示面板10D,本實施例顯示面板10E的第二絕緣圖案134E的短邊137直接連接第一絕緣圖案132。舉例而言,顯示面板10E的溝槽133E僅環繞第二絕緣圖案134E的三邊。也就是說,第二絕緣圖案134E的其中一邊(例如短邊137)或多邊(例如第二絕緣圖案134E的任兩邊或任三邊)可以靠近並接觸第一絕緣圖案132。藉此,溝槽133E的寬度及位置可依使用者的需求調整而不會犧牲顯示面板10E的開口率。 7 is a schematic partial top view of a display panel according to still another embodiment of the invention. The display panel 10E shown in this embodiment is similar to the display panel 10D shown in FIG. 6A, and the main difference is that the short side 137 of the second insulating pattern 134E is connected to the first insulating pattern 132. In this embodiment, the insulating layer 130E includes a first insulating pattern 132 and a second insulating pattern 134E. The trench 133E surrounds a part of the edge of the second insulating pattern 134E, for example, a part of the long side 136 or the short side 137 of the second insulating pattern 134E. Compared with the display panel 10C of FIG. 5A or the display panel 10D of FIG. 6A, the short side 137 of the second insulating pattern 134E of the display panel 10E of this embodiment is directly connected to the first insulating pattern 132. For example, the trench 133E of the display panel 10E only surrounds three sides of the second insulating pattern 134E. That is, one side (for example, short side 137) or multiple sides (for example, any two sides or any three sides) of the second insulating pattern 134E may be close to and contact the first insulating pattern 132. Thereby, the width and position of the groove 133E can be adjusted according to the needs of users without sacrificing the aperture ratio of the display panel 10E.

在本實施例中,由於短邊137可整體地連接第一絕緣圖案132,因此可以提升第二電極150不重疊溝槽133E的比例,以進一步在垂直基板100的方向上,減少第二電極150因溝槽133E與第二絕緣圖案134E之間的高度差所產生的斷線的機率。如此,顯示面板10E可獲致與上述實施例類似的技術功效。 In this embodiment, since the short side 137 can integrally connect the first insulating pattern 132, the ratio of the second electrode 150 not overlapping the trench 133E can be increased to further reduce the second electrode 150 in the direction perpendicular to the substrate 100 The probability of disconnection due to the height difference between the trench 133E and the second insulating pattern 134E. In this way, the display panel 10E can obtain technical effects similar to those of the foregoing embodiments.

在本實施例中,貫孔170設置於溝槽133E中靠近長邊136的位置,但本發明不以此為限。在一些實施例中,貫孔170也可以設置於溝槽133E中靠近短邊137的位置。此外,在本實施例中,是以短邊137連接至第一絕緣圖案132為例進行說明。在一些實施例中,第二絕緣圖案134E也可以長邊136連接至第一絕緣圖案132,本發明不以此為限。此外,在一些實施例中,更可依需求同時以短邊137以及長邊136連接至第一絕緣圖案132。 In this embodiment, the through hole 170 is provided in the trench 133E near the long side 136, but the invention is not limited to this. In some embodiments, the through hole 170 may also be provided in the trench 133E near the short side 137. In addition, in this embodiment, the short side 137 is connected to the first insulating pattern 132 as an example for description. In some embodiments, the second insulating pattern 134E may also be connected to the first insulating pattern 132 by the long side 136, which is not limited in the present invention. In addition, in some embodiments, the short side 137 and the long side 136 can be connected to the first insulating pattern 132 at the same time as needed.

綜上所述,本發明一實施例的顯示面板,由於顯示面板可以透過圖案化絕緣層以形成第一絕緣圖案、第二絕緣圖案以及溝槽,且溝槽可以部分地環繞第二絕緣圖案。在上述的設置下,有機發光膜可以設置在第二絕緣圖案上的第一電極,並具有第二厚度。有機發光膜具有第一厚度的部分,因靠近第一絕緣圖案導致膜厚不均勻,而設置於溝槽中。如此,可以改善有機發光膜在第一電極上的膜厚均勻度,以提供顯示面板均勻的亮度及良好的顯示品質。此外,多餘的有機發光膜可被容置於溝槽中,以減少外溢的風險。另外,位於第一電極上的有機發光膜更可透過溝槽而遠離第一絕緣圖案,因而不容易受到來自第一絕緣圖案的水氣 或氧氣的影響,而變質或縮膜,可以改善顯示面板的發光效率並提升壽命。此外,溝槽的寬度還可依使用者的需求調整,且不會犧牲顯示面板的開口率,可以提升顯示面板的顯示品質。另外,第二絕緣圖案的短邊更可以連接至第一絕緣圖案,減少第二電極因溝槽與第二絕緣圖案之間的高度差所產生的斷線的機率,以提升顯示面板的良率及效能。 In summary, in the display panel according to an embodiment of the invention, the display panel can form the first insulating pattern, the second insulating pattern, and the trench through the patterned insulating layer, and the trench can partially surround the second insulating pattern. Under the above-mentioned arrangement, the organic light-emitting film may be provided on the first electrode on the second insulating pattern and have a second thickness. The organic light-emitting film has a portion with a first thickness, which is disposed in the trench due to the non-uniform film thickness due to the proximity to the first insulating pattern. In this way, the uniformity of the film thickness of the organic light-emitting film on the first electrode can be improved to provide uniform brightness and good display quality of the display panel. In addition, excess organic light-emitting film can be accommodated in the trench to reduce the risk of spillage. In addition, the organic light-emitting film located on the first electrode can pass through the trench and away from the first insulating pattern, so it is not susceptible to moisture from the first insulating pattern Or the influence of oxygen, and deterioration or shrinkage, can improve the luminous efficiency of the display panel and increase the life. In addition, the width of the groove can also be adjusted according to the needs of users without sacrificing the aperture ratio of the display panel, which can improve the display quality of the display panel. In addition, the short side of the second insulating pattern can be further connected to the first insulating pattern to reduce the probability of disconnection of the second electrode due to the height difference between the trench and the second insulating pattern, thereby improving the yield of the display panel And performance.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

10‧‧‧顯示面板 10‧‧‧Display panel

100‧‧‧基板 100‧‧‧ substrate

120‧‧‧主動元件層 120‧‧‧Active component layer

121‧‧‧表面 121‧‧‧Surface

130‧‧‧絕緣層 130‧‧‧Insulation

131‧‧‧第一頂面 131‧‧‧ First top

132‧‧‧第一絕緣圖案 132‧‧‧First insulation pattern

133‧‧‧溝槽 133‧‧‧Groove

134‧‧‧第二絕緣圖案 134‧‧‧Second insulation pattern

135‧‧‧第二頂面 135‧‧‧Second top surface

140‧‧‧第一電極 140‧‧‧First electrode

150‧‧‧第二電極 150‧‧‧Second electrode

160‧‧‧保護層 160‧‧‧Protective layer

200‧‧‧有機發光膜 200‧‧‧ organic light-emitting film

A-A’‧‧‧剖面線 A-A’‧‧‧hatching

H1‧‧‧第一高度 H1‧‧‧ First height

H2‧‧‧第二高度 H2‧‧‧second height

T1‧‧‧第一厚度 T1‧‧‧ First thickness

T2‧‧‧第二厚度 T2‧‧‧Second thickness

W1‧‧‧第一寬度 W1‧‧‧First width

Claims (11)

一種顯示面板,包括:一基板;一主動元件層,設置於該基板上;一絕緣層,設置於該主動元件層上,且該絕緣層包括一第一絕緣圖案、一第二絕緣圖案以及一溝槽,該第一絕緣圖案環繞該第二絕緣圖案,且該溝槽設置於該第一絕緣圖案與該第二絕緣圖案之間;一第一電極,設置於該第二絕緣圖案上,且與該主動元件層電性連接;一有機發光膜,具有一第一厚度T1與一第二厚度T2,其中該有機發光膜於該第一電極上的厚度為該第二厚度T2,該有機發光膜於該絕緣層的該溝槽中的厚度為該第一厚度T1,且T1大於T2;以及一第二電極,設置於該些有機發光膜及該第一絕緣圖案上。 A display panel includes: a substrate; an active element layer disposed on the substrate; an insulating layer disposed on the active element layer, and the insulating layer includes a first insulating pattern, a second insulating pattern and a A trench, the first insulating pattern surrounds the second insulating pattern, and the trench is disposed between the first insulating pattern and the second insulating pattern; a first electrode is disposed on the second insulating pattern, and Electrically connected to the active device layer; an organic light emitting film having a first thickness T1 and a second thickness T2, wherein the thickness of the organic light emitting film on the first electrode is the second thickness T2, the organic light emitting The thickness of the film in the trench of the insulating layer is the first thickness T1, and T1 is greater than T2; and a second electrode is disposed on the organic light-emitting films and the first insulating pattern. 如申請專利範圍第1項所述的顯示面板,其中該第一電極於該基板上的正投影在該有機發光膜於該基板上的正投影內。 The display panel as described in item 1 of the patent application range, wherein the orthographic projection of the first electrode on the substrate is in the orthographic projection of the organic light-emitting film on the substrate. 如申請專利範圍第1項所述的顯示面板,更包括一第三絕緣圖案設置於該主動元件層與該第一絕緣圖案及該第二絕緣圖案之間。 The display panel as described in item 1 of the patent application scope further includes a third insulating pattern disposed between the active device layer and the first insulating pattern and the second insulating pattern. 如申請專利範圍第3項所述的顯示面板,其中該第二絕緣圖案於該基板上的正投影重疊於或在該第一電極於該基板上的正投影內。 The display panel of claim 3, wherein the orthographic projection of the second insulating pattern on the substrate overlaps or is within the orthographic projection of the first electrode on the substrate. 如申請專利範圍第1項所述的顯示面板,其中該第一絕緣圖案的高度大於該第二絕緣圖案的高度,且該第一絕緣圖案與該第二絕緣圖案之間具有一高度差,該高度差為0.5微米至1.5微米。 The display panel according to item 1 of the patent application scope, wherein the height of the first insulation pattern is greater than the height of the second insulation pattern, and there is a height difference between the first insulation pattern and the second insulation pattern, the The difference in height is 0.5 to 1.5 microns. 如申請專利範圍第1項所述的顯示面板,其中該溝槽環繞該第二絕緣圖案的部分。 The display panel as described in item 1 of the patent application range, wherein the trench surrounds a portion of the second insulating pattern. 如申請專利範圍第6項所述的顯示面板,其中該第二絕緣圖案沿著長邊方向延伸,該第二絕緣圖案的短邊連接該第一絕緣圖案。 The display panel as described in Item 6 of the patent application range, wherein the second insulating pattern extends along a long side direction, and a short side of the second insulating pattern is connected to the first insulating pattern. 如申請專利範圍第1項所述的顯示面板,更包括一貫孔,該貫孔於該基板上的正投影重疊該溝槽於該基板上的正投影,該第一電極透過該貫孔電性連接至該主動元件層。 The display panel as described in item 1 of the patent application further includes a through hole, the orthographic projection of the through hole on the substrate overlaps the orthographic projection of the trench on the substrate, and the first electrode is electrically conductive through the through hole Connect to the active device layer. 如申請專利範圍第1項所述的顯示面板,更包括一貫孔,該貫孔於該基板上的正投影位於該溝槽於該基板上的正投影之內,該第一電極透過該貫孔電性連接至該主動元件層。 The display panel according to item 1 of the patent application scope further includes a through hole, the orthographic projection of the through hole on the substrate is within the orthographic projection of the groove on the substrate, and the first electrode passes through the through hole It is electrically connected to the active device layer. 如申請專利範圍第1項所述的顯示面板,其中該溝槽的寬度為1.5微米至200微米。 The display panel as described in item 1 of the patent application range, wherein the width of the groove is 1.5 μm to 200 μm. 如申請專利範圍第1項所述的顯示面板,其中於垂直該基板的方向上,該有機發光膜於該溝槽中接觸該絕緣層的厚度大於該有機發光膜於該溝槽的中心點的厚度。 The display panel as claimed in item 1 of the patent application range, wherein the thickness of the organic light emitting film contacting the insulating layer in the trench is greater than the thickness of the organic light emitting film at the center of the trench in a direction perpendicular to the substrate thickness.
TW107146598A 2018-06-22 2018-12-22 Display panel TWI695527B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910419229.1A CN110112198B (en) 2018-06-22 2019-05-20 Display panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862688635P 2018-06-22 2018-06-22
US62/688,635 2018-06-22

Publications (2)

Publication Number Publication Date
TW202002353A TW202002353A (en) 2020-01-01
TWI695527B true TWI695527B (en) 2020-06-01

Family

ID=69188922

Family Applications (18)

Application Number Title Priority Date Filing Date
TW107137602A TWI678009B (en) 2018-06-22 2018-10-24 Display panel and manufacturing method thereof
TW107138760A TWI684810B (en) 2018-06-22 2018-11-01 Display panel
TW107142834A TWI679789B (en) 2018-06-22 2018-11-30 Organic light emitting diode display apparatus
TW107142955A TWI684815B (en) 2018-06-22 2018-11-30 Display panel and method of fabricating the same
TW107143785A TWI685702B (en) 2018-06-22 2018-12-05 Display apparatus
TW107144587A TWI678802B (en) 2018-06-22 2018-12-11 Display panel and method for manufacturing the same
TW107144975A TWI679765B (en) 2018-06-22 2018-12-13 Display device and manufacturing method thereof
TW107146598A TWI695527B (en) 2018-06-22 2018-12-22 Display panel
TW107146906A TWI679792B (en) 2018-06-22 2018-12-25 Display panel and method of fabricating the same
TW108101440A TWI733078B (en) 2018-06-22 2019-01-15 Display device
TW108102163A TWI696870B (en) 2018-06-22 2019-01-19 Display device
TW108102272A TWI683375B (en) 2018-06-22 2019-01-21 Light emitting device
TW108103467A TWI690753B (en) 2018-06-22 2019-01-30 Display panel and method of fabricating the same
TW108104630A TWI694626B (en) 2018-06-22 2019-02-12 Pixel structure
TW108104827A TWI683168B (en) 2018-06-22 2019-02-13 Pixel structure and manufacturing method thereof
TW108106211A TWI680589B (en) 2018-06-22 2019-02-25 Light-emitting device and manufacturing method thereof
TW108109084A TWI710832B (en) 2018-06-22 2019-03-18 Quantum dot display panel
TW108119483A TWI714115B (en) 2018-06-22 2019-06-05 Display panel

Family Applications Before (7)

Application Number Title Priority Date Filing Date
TW107137602A TWI678009B (en) 2018-06-22 2018-10-24 Display panel and manufacturing method thereof
TW107138760A TWI684810B (en) 2018-06-22 2018-11-01 Display panel
TW107142834A TWI679789B (en) 2018-06-22 2018-11-30 Organic light emitting diode display apparatus
TW107142955A TWI684815B (en) 2018-06-22 2018-11-30 Display panel and method of fabricating the same
TW107143785A TWI685702B (en) 2018-06-22 2018-12-05 Display apparatus
TW107144587A TWI678802B (en) 2018-06-22 2018-12-11 Display panel and method for manufacturing the same
TW107144975A TWI679765B (en) 2018-06-22 2018-12-13 Display device and manufacturing method thereof

Family Applications After (10)

Application Number Title Priority Date Filing Date
TW107146906A TWI679792B (en) 2018-06-22 2018-12-25 Display panel and method of fabricating the same
TW108101440A TWI733078B (en) 2018-06-22 2019-01-15 Display device
TW108102163A TWI696870B (en) 2018-06-22 2019-01-19 Display device
TW108102272A TWI683375B (en) 2018-06-22 2019-01-21 Light emitting device
TW108103467A TWI690753B (en) 2018-06-22 2019-01-30 Display panel and method of fabricating the same
TW108104630A TWI694626B (en) 2018-06-22 2019-02-12 Pixel structure
TW108104827A TWI683168B (en) 2018-06-22 2019-02-13 Pixel structure and manufacturing method thereof
TW108106211A TWI680589B (en) 2018-06-22 2019-02-25 Light-emitting device and manufacturing method thereof
TW108109084A TWI710832B (en) 2018-06-22 2019-03-18 Quantum dot display panel
TW108119483A TWI714115B (en) 2018-06-22 2019-06-05 Display panel

Country Status (1)

Country Link
TW (18) TWI678009B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI738430B (en) * 2020-07-22 2021-09-01 友達光電股份有限公司 Organic light emitting diode display panel
TWI742977B (en) * 2020-08-21 2021-10-11 友達光電股份有限公司 Stretchable pixel array substrate
TWI762136B (en) * 2020-12-31 2022-04-21 財團法人工業技術研究院 Display apparatus
CN115362556A (en) * 2021-01-28 2022-11-18 京东方科技集团股份有限公司 Array substrate and display device
TWI769817B (en) * 2021-05-17 2022-07-01 友達光電股份有限公司 Display device and manufacturing method thereof
TWI779631B (en) * 2021-05-27 2022-10-01 友達光電股份有限公司 Light emitting device
CN113363302B (en) * 2021-06-02 2023-09-08 南京昀光科技有限公司 Display panel and manufacturing method thereof
TWI793921B (en) * 2021-12-13 2023-02-21 友達光電股份有限公司 Display panel

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201214690A (en) * 2010-09-13 2012-04-01 Epistar Corp Light-emitting structure
TW201306248A (en) * 2011-06-28 2013-02-01 Samsung Display Co Ltd Organic light emitting display devices and methods of manufacturing organic light emitting display devices
WO2017064593A1 (en) * 2015-10-12 2017-04-20 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
CN107731881A (en) * 2017-11-06 2018-02-23 武汉华星光电半导体显示技术有限公司 Flexible display panels and its manufacture method, flexible display apparatus

Family Cites Families (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02153353A (en) * 1988-07-25 1990-06-13 Matsushita Electric Ind Co Ltd Colored photopolymerization composition and color filter
JP3899566B2 (en) * 1996-11-25 2007-03-28 セイコーエプソン株式会社 Manufacturing method of organic EL display device
JP2848371B2 (en) * 1997-02-21 1999-01-20 日本電気株式会社 Organic EL display device and manufacturing method thereof
JP3628997B2 (en) * 2000-11-27 2005-03-16 セイコーエプソン株式会社 Method for manufacturing organic electroluminescence device
CN1557020A (en) * 2001-09-24 2004-12-22 �ʼҷ����ֵ��ӹɷ����޹�˾ Assembly for a thin-film optical device, organic electroluminescent display device and method of manufaturing same
US7378124B2 (en) * 2002-03-01 2008-05-27 John James Daniels Organic and inorganic light active devices and methods for making the same
JP4014901B2 (en) * 2002-03-14 2007-11-28 セイコーエプソン株式会社 Method of arranging material by droplet discharge and method of manufacturing display device
JP4252297B2 (en) * 2002-12-12 2009-04-08 株式会社日立製作所 LIGHT EMITTING ELEMENT AND DISPLAY DEVICE USING THE LIGHT EMITTING ELEMENT
SG142140A1 (en) * 2003-06-27 2008-05-28 Semiconductor Energy Lab Display device and method of manufacturing thereof
JP4479381B2 (en) * 2003-09-24 2010-06-09 セイコーエプソン株式会社 Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
JP3915806B2 (en) * 2003-11-11 2007-05-16 セイコーエプソン株式会社 Electro-optical device and electronic apparatus
US7019331B2 (en) * 2004-01-22 2006-03-28 Eastman Kodak Company Green light-emitting microcavity OLED device using a yellow color filter element
JP2006222071A (en) * 2005-01-17 2006-08-24 Seiko Epson Corp Light emitting device, manufacturing method thereof, and electronic equipment
DE112006002220B4 (en) * 2005-08-23 2018-05-24 Cambridge Display Technology Ltd. Organic electronic device structures and manufacturing processes
JP2007103349A (en) * 2005-09-08 2007-04-19 Seiko Epson Corp Method of forming film pattern, and manufacturing method for organic electroluminescent device, color filter substrate and liquid crystal display device
JP2007103032A (en) * 2005-09-30 2007-04-19 Seiko Epson Corp Light-emitting device and manufacturing method of light-emitting device
JP2007188653A (en) * 2006-01-11 2007-07-26 Seiko Epson Corp Light emitting unit and electronic apparatus
JP2007311235A (en) * 2006-05-19 2007-11-29 Seiko Epson Corp Device, film forming method, and manufacturing method of device
JP2009104969A (en) * 2007-10-25 2009-05-14 Seiko Epson Corp Light-emitting device and electronic apparatus
JP4953166B2 (en) * 2007-11-29 2012-06-13 カシオ計算機株式会社 Manufacturing method of display panel
JP5266823B2 (en) * 2008-03-21 2013-08-21 セイコーエプソン株式会社 Electro-optical display device, electrophoretic display device, and electronic apparatus
WO2011027712A1 (en) * 2009-09-07 2011-03-10 凸版印刷株式会社 Organic el display device, color filter substrate, and process for production of organic el display device
KR101084176B1 (en) * 2009-11-26 2011-11-17 삼성모바일디스플레이주식회사 Organic light emitting display
KR101074809B1 (en) * 2009-12-22 2011-10-19 삼성모바일디스플레이주식회사 Organic light emitting display apparatus
KR101084191B1 (en) * 2010-02-16 2011-11-17 삼성모바일디스플레이주식회사 Organic light emitting diode display apparatus and method of manufacturing the same
WO2012007996A1 (en) * 2010-07-15 2012-01-19 パナソニック株式会社 Organic electroluminescence display panel, organic electroluminescence display device, and method of manufacturing same
CN102577612B (en) * 2010-10-15 2015-11-25 株式会社日本有机雷特显示器 Organic luminous panel and manufacture method thereof and organic display device
JP5935238B2 (en) * 2011-04-20 2016-06-15 Nltテクノロジー株式会社 Image display device and terminal device including the same
CN103620805B (en) * 2011-07-15 2016-03-30 株式会社日本有机雷特显示器 Organic illuminating element
JP5927476B2 (en) * 2011-10-03 2016-06-01 株式会社Joled Display device and electronic device
JPWO2013069233A1 (en) * 2011-11-07 2015-04-02 パナソニック株式会社 Organic EL display panel and organic EL display device
US8648337B2 (en) * 2012-04-03 2014-02-11 Au Optronics Corporation Active matrix organic light-emitting diode
TWI469194B (en) * 2012-05-16 2015-01-11 Au Optronics Corp Pixel structure of organic electroluminescence device
JP6013067B2 (en) * 2012-07-26 2016-10-25 株式会社ジャパンディスプレイ Display device and manufacturing method thereof
TWI610112B (en) * 2012-09-17 2018-01-01 友達光電股份有限公司 Display panel and method of making the same
JP2014119705A (en) * 2012-12-19 2014-06-30 Sony Corp Moisture-proof structure and display device
JP6314451B2 (en) * 2012-12-27 2018-04-25 大日本印刷株式会社 Color filter forming substrate and organic EL display device
JP2014137489A (en) * 2013-01-17 2014-07-28 Dainippon Printing Co Ltd Display panel
KR102021027B1 (en) * 2013-02-28 2019-09-16 삼성디스플레이 주식회사 Organic luminescence emitting display device
WO2014159267A1 (en) * 2013-03-14 2014-10-02 Applied Materials, Inc. Thin film encapsulation - thin ultra high barrier layer for oled application
KR102028680B1 (en) * 2013-03-20 2019-11-05 삼성디스플레이 주식회사 Organic light emitting diode display
KR102055683B1 (en) * 2013-03-29 2019-12-16 삼성디스플레이 주식회사 Organic light emitting display apparatus
KR20140133053A (en) * 2013-05-09 2014-11-19 삼성디스플레이 주식회사 Organic light emitting diode display
TWI515890B (en) * 2013-06-03 2016-01-01 友達光電股份有限公司 Organic light emitting diode display panel and manufacture method thereof
KR102122380B1 (en) * 2013-07-10 2020-06-15 삼성디스플레이 주식회사 Organic light emitting display device
KR102148935B1 (en) * 2013-11-21 2020-08-31 삼성디스플레이 주식회사 Organic light emitting diode display device and method of manufacturing the same
US9431463B2 (en) * 2014-04-30 2016-08-30 Lg Display Co., Ltd. Display apparatus
CN104021735B (en) * 2014-05-23 2016-08-17 京东方科技集团股份有限公司 A kind of quantum dot light emitting display screen and preparation method thereof
JP2016004053A (en) * 2014-06-13 2016-01-12 株式会社ジャパンディスプレイ Display device
KR20150145525A (en) * 2014-06-20 2015-12-30 엘지디스플레이 주식회사 Organic light emitting display device
CN104157671B (en) * 2014-06-25 2018-02-23 京东方科技集团股份有限公司 A kind of electroluminescence display panel, its preparation method and display device
KR102205700B1 (en) * 2014-07-16 2021-01-21 삼성전자주식회사 Organic electro-luminescent display and method of fabricating the same
KR102246294B1 (en) * 2014-08-04 2021-04-30 삼성디스플레이 주식회사 organic light emitting display apparatus and manufacturing method thereof
KR102151475B1 (en) * 2014-09-04 2020-09-04 엘지디스플레이 주식회사 Organic light emitting display panel and method for fabricating the same
KR102201827B1 (en) * 2014-09-16 2021-01-13 엘지디스플레이 주식회사 Organic light emitting display device, organic light emitting display panel and method for fabricating the same
KR101640803B1 (en) * 2014-09-26 2016-07-20 엘지디스플레이 주식회사 Organic Light Emitting Diode Display Device and Method of Fabricating the Same
TWI572025B (en) * 2015-01-15 2017-02-21 財團法人工業技術研究院 Semiconductor light-emitting device and fabricating method thereof
CN104882468B (en) * 2015-06-09 2017-12-15 京东方科技集团股份有限公司 Organic electroluminescent display substrate and preparation method thereof, display device
KR102418009B1 (en) * 2015-06-25 2022-07-05 엘지디스플레이 주식회사 Organic light emitting display device
KR102489836B1 (en) * 2015-06-30 2023-01-18 엘지디스플레이 주식회사 Organic light emitting display device
TW201703248A (en) * 2015-07-06 2017-01-16 友達光電股份有限公司 Pixel structure and manufacturing method thereof
CN105118928B (en) * 2015-07-29 2018-02-09 京东方科技集团股份有限公司 Color membrane substrates, its preparation method, OLED display panel and display device
KR101808715B1 (en) * 2015-09-23 2017-12-14 엘지디스플레이 주식회사 Organic light emitting display device
KR102528294B1 (en) * 2015-11-12 2023-05-04 삼성디스플레이 주식회사 Organic light emitting display and manufacturing method thereof
KR101739771B1 (en) * 2015-11-30 2017-05-26 엘지디스플레이 주식회사 Organic light emitting display device and method for manufacturing the same
CN105449111B (en) * 2016-01-08 2018-03-20 京东方科技集团股份有限公司 Light emitting diode with quantum dots substrate with binder course and preparation method thereof
KR102466191B1 (en) * 2016-01-15 2022-11-11 삼성디스플레이 주식회사 Method of manufacturing light emitting display device
KR102628849B1 (en) * 2016-03-24 2024-01-25 삼성디스플레이 주식회사 Organic light-emitting display apparatus
CN105870346B (en) * 2016-04-15 2018-07-03 深圳市华星光电技术有限公司 The manufacturing method and LED display of LED display
JP2018006212A (en) * 2016-07-05 2018-01-11 株式会社ジャパンディスプレイ Display device
KR102603593B1 (en) * 2016-07-29 2023-11-20 엘지디스플레이 주식회사 Display device having a white light emitting layer
KR102518130B1 (en) * 2016-08-04 2023-04-06 삼성디스플레이 주식회사 Organic light emitting diode display
KR20180020091A (en) * 2016-08-17 2018-02-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Display device
CN106206970A (en) * 2016-08-31 2016-12-07 深圳市华星光电技术有限公司 A kind of luminescent panel and preparation method thereof
CN106338857B (en) * 2016-11-08 2019-06-14 深圳市华星光电技术有限公司 A kind of quantum dot liquid crystal display device
KR20180066556A (en) * 2016-12-09 2018-06-19 엘지디스플레이 주식회사 Organic light emitting display device and method of manufacturing the same
CN106601922B (en) * 2016-12-15 2020-05-26 Tcl科技集团股份有限公司 Quantum dot display panel and manufacturing method thereof
CN106601774B (en) * 2016-12-16 2020-05-12 深圳市Tcl高新技术开发有限公司 Printing type pixel bank structure and preparation method thereof
CN107329314A (en) * 2017-08-24 2017-11-07 深圳市华星光电半导体显示技术有限公司 Color membrane substrates and preparation method thereof, display panel and display
CN107402416B (en) * 2017-08-31 2020-10-30 深圳市华星光电技术有限公司 Quantum diffusion membrane and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201214690A (en) * 2010-09-13 2012-04-01 Epistar Corp Light-emitting structure
TW201306248A (en) * 2011-06-28 2013-02-01 Samsung Display Co Ltd Organic light emitting display devices and methods of manufacturing organic light emitting display devices
WO2017064593A1 (en) * 2015-10-12 2017-04-20 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
CN107731881A (en) * 2017-11-06 2018-02-23 武汉华星光电半导体显示技术有限公司 Flexible display panels and its manufacture method, flexible display apparatus

Also Published As

Publication number Publication date
TWI679792B (en) 2019-12-11
TW202001853A (en) 2020-01-01
TWI684810B (en) 2020-02-11
TWI710832B (en) 2020-11-21
TW202001374A (en) 2020-01-01
TWI683168B (en) 2020-01-21
TW202001385A (en) 2020-01-01
TWI733078B (en) 2021-07-11
TW202001373A (en) 2020-01-01
TW202002352A (en) 2020-01-01
TWI685702B (en) 2020-02-21
TWI690753B (en) 2020-04-11
TW202002354A (en) 2020-01-01
TW202002096A (en) 2020-01-01
TW202002276A (en) 2020-01-01
TWI680589B (en) 2019-12-21
TWI678009B (en) 2019-11-21
TW202002329A (en) 2020-01-01
TW202002351A (en) 2020-01-01
TWI714115B (en) 2020-12-21
TW202001386A (en) 2020-01-01
TW202001389A (en) 2020-01-01
TWI684815B (en) 2020-02-11
TW202002275A (en) 2020-01-01
TWI679765B (en) 2019-12-11
TW202002353A (en) 2020-01-01
TW202002277A (en) 2020-01-01
TW202002356A (en) 2020-01-01
TW202018386A (en) 2020-05-16
TWI683375B (en) 2020-01-21
TWI696870B (en) 2020-06-21
TWI694626B (en) 2020-05-21
TW202001363A (en) 2020-01-01
TWI679789B (en) 2019-12-11
TWI678802B (en) 2019-12-01

Similar Documents

Publication Publication Date Title
TWI695527B (en) Display panel
US11011552B2 (en) Method for manufacturing a display substrate comprising interconnected first and second wirings
JP5642142B2 (en) Thin film transistor, thin film transistor array substrate, and manufacturing method thereof
US9425426B2 (en) Organic light emitting diode display having auxiliary electrode
US8164252B2 (en) Organic light emitting diode display apparatus and method of manufacturing the same
US7985609B2 (en) Light-emitting apparatus and production method thereof
WO2016107291A1 (en) Array substrate and manufacturing method therefor, display panel and display device
WO2016176886A1 (en) Flexible oled and manufacturing method therefor
WO2020155801A1 (en) Array substrate and manufacturing method therefor, and display panel
KR20120042029A (en) Display device and method for manufacturing the same
CN110071162B (en) Display panel
WO2019028955A1 (en) Organic electroluminescent display panel and method for manufacturing same
WO2020259273A1 (en) Thin film transistor, manufacturing method therefor, display substrate, and display device
KR101520489B1 (en) Organic light emitting diodde desplay device and fabricating method therof
TWI559380B (en) Method of fabricating pixel structure for organic light-emitting display
WO2022017050A1 (en) Display substrate and preparation method therefor, and display apparatus
US20180012968A1 (en) Thin film transistor substrates, methods of manufacturing the same and display devices including the same
CN109994648B (en) Display panel and manufacturing method thereof
KR102555788B1 (en) Thin film transistor substrate, method of manufacturing the same, and display device including the same
CN110112198B (en) Display panel
KR101450905B1 (en) Organic light emitting diodde desplay device and fabricating method therof
KR101753773B1 (en) Organic light emitting display apparatus and method of manufacturing thereof
US9082731B2 (en) Manufacturing method of metal wire and thin transistor array panel, and organic light emitting diode display
KR20160047450A (en) Organic light emitting display apparatus and method of manufacturing thereof
KR20150058131A (en) Organic light emitting display apparatus and method of manufacturing thereof