JP2019110115A - Organic el display panel, organic el display device, and manufacturing method thereof - Google Patents

Abstract

To provide an organic EL display panel where the thickness of a luminous layer or a functional layer, formed by application method, is controlled suitably, and to provide a manufacturing method thereof.SOLUTION: An organic EL display panel includes a board 11, multiple pixel electrodes 13 arranged in matrix, multiple barrier membranes 141, 142, 143 elongating in the column direction on the crevice of the pixel electrodes 13 in the row direction, a first luminous layer placed above the pixel electrodes 13 in the first crevice selected from the multiple crevices between the barrier membranes adjoining in the row direction, a second luminous layer placed above the pixel electrodes in the second crevice adjoining the first crevice in the row direction, and counter electrodes 20 placed above the first and second luminous layers. The first luminous layer is thicker than the second luminous layer, and out of the barrier membranes existing between the first and second crevices, the first barrier membrane portion on the first crevice side is higher than the second barrier membrane portion on the second crevice side, and the position where the sidewall of the first barrier membrane portion is in contact with the first luminous layer is higher than the position where the sidewall of the second barrier membrane portion is in contact with the second luminous layer.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to an organic EL display panel using an organic EL (Electro Luminescence) element utilizing an electroluminescence phenomenon of an organic material, and an organic EL display device using the same.

In recent years, display devices using organic EL elements are becoming widespread.
The organic EL element has a structure in which at least a light emitting layer is sandwiched between an anode and a cathode. At present, as a method of efficiently forming a light emitting layer and a functional layer, an ink containing a functional material is applied and formed by a wet process such as an inkjet method. In the wet process, the manufacturing apparatus can be miniaturized as compared with a vacuum deposition apparatus, and it is not necessary to use a shadow mask used in depositing a functional material. Therefore, it is not necessary to align shadow masks, etc., and it becomes easy to manufacture large substrates such as mixed panel sizes considering generation of large panels and mass productivity, and it has features suitable for efficient panel generation. . Further, unlike the vapor deposition method, in the ink jet method, the panel manufacturing cost can be reduced by improving the use efficiency of functional materials such as expensive light emitting materials.

  On the other hand, in order to separately and print an ink in which a light emitting material and a functional material are dissolved for forming a light emitting layer and a functional layer, partition walls formed for each sub pixel called a bank are required. In the case of an ink containing a functional material mixed over the partition walls, in particular, in the case of an ink containing a light emitting material, color mixing caused by mixing of inks having different coloring causes a panel failure, so the top surface of the partition is repellent Liquidity is given.

JP, 2016-181498, A

  In general, the liquid repellency is imparted not only to the top of the partition wall but also to the upper portion of the side wall following it. However, when liquid repellency is imparted to the upper portion of the side wall portion, the lyophilic portion in the side wall portion gets wet with the ink, while the ink does not adhere to the liquid repellent portion. Then, when the ink is dried, the ink attached to the lyophilic portion does not move regardless of the height of the liquid surface, so the end of the functional layer is pinned at the interface between the lyophilic portion and the liquid repellent portion of the side wall portion Phenomenon occurs. If a step is present between the pinning position and the height of the central portion of the functional layer, the film thickness unevenness of the functional layer occurs. As a method of adjusting the pinning position, for example, as disclosed in Patent Document 1, there is a method of adding a liquid repellent portion to the side wall portion of the partition wall. However, in this method, it is necessary to retrofit the liquid repellent portion after the formation of the partition wall, and the height of the partition wall is constant regardless of the pinning position, so the height of the partition wall is necessarily the thickness of the functional layer or the ink It is not always appropriate for the amount of

  The present disclosure has been made in view of the above problems, and an organic EL display panel having a film thickness control suitable for an organic EL display panel in which at least one of a light emitting layer and a functional layer is formed by a coating method, And it aims at providing the manufacturing method.

  An organic EL display panel according to an aspect of the present disclosure includes: a substrate; a plurality of pixel electrodes disposed in a matrix above the substrate; and a gap between the pixel electrodes in the row direction disposed above the substrate A first light emitting layer disposed above the pixel electrode in a first gap selected from a plurality of partitions extending in the column direction and a plurality of gaps between the partitions adjacent in the row direction; A second light emitting layer disposed above the pixel electrode and a counter electrode disposed above the first light emitting layer and above the second light emitting layer in a second gap adjacent to the gap in the row direction; The thickness of the first light emitting layer is greater than the thickness of the second light emitting layer, and the partition wall present between the first gap and the second gap is located on the first gap side. The height of one partition portion is higher than the height of the second partition portion on the second gap side, and First pinning position where the side wall portion and the first light-emitting layer of the first partition wall portion is in contact is higher than the second pinning position where the side wall portion of the second partition wall portion and the second light-emitting layer is in contact.

  According to the organic EL display panel of the above aspect, since both the first light emitting layer and the second light emitting layer have a pinning position according to the film thickness, the organic EL display panel with suitable film thickness control Can be realized.

It is sectional drawing which shows typically the structure of the organic electroluminescent display panel 100 which concerns on embodiment. It is a top view which shows typically the structure of the organic electroluminescent display panel 100 which concerns on embodiment. It is a fragmentary sectional view which shows the state in which the light emitting layer was formed in each of embodiment and a comparative example. It is a fragmentary sectional view showing typically a part of manufacturing process of partition 141, 142, 143 concerning an embodiment. It is a fragmentary sectional view showing typically a part of manufacturing process of partition 141, 142, 143 concerning an embodiment. It is a fragmentary sectional view showing typically a part of manufacturing process of partition 141, 142, 143 concerning an embodiment. It is a fragmentary sectional view showing typically a part of manufacturing process of partition 141, 142, 143 concerning an embodiment. It is a flow chart which shows a manufacturing process of partition 141, 142, and 143 concerning an embodiment. It is a fragmentary sectional view which shows typically a part of manufacturing process of the organic electroluminescent display panel 100 which concerns on embodiment. (A) is a fragmentary sectional view which shows the state in which the TFT layer was formed on the base material. (B) is a fragmentary sectional view which shows the state in which the interlayer insulation layer was formed on the TFT layer. (C) is a fragmentary sectional view which shows the state in which the pixel electrode material layer was formed on the interlayer insulation layer. (D) is a fragmentary sectional view which shows the state in which the pixel electrode material layer was patterned and the pixel electrode was formed. (E) is a fragmentary sectional view which shows the state in which the partition was formed on the pixel electrode and the interlayer insulation layer. It is a fragmentary sectional view which shows typically a part of manufacturing process of the organic electroluminescent display panel 100 which concerns on embodiment. (A) is a fragmentary sectional view which shows the state in which the positive hole injection layer was formed in the opening part of the partition. (B) is a fragmentary sectional view which shows the state in which the positive hole transport layer was formed in the opening part of the partition. (C) is a fragmentary sectional view which shows the state in which the light emitting layer was formed in the opening part of the partition. It is a fragmentary sectional view which shows typically a part of manufacturing process of the organic electroluminescent display panel 100 which concerns on embodiment. (A) is a fragmentary sectional view which shows the state in which the electron carrying layer was formed on the partition and on a light emitting layer. (B) is a fragmentary sectional view which shows the state in which the electron injection layer was formed on the electron carrying layer. (C) is a fragmentary sectional view which shows the state in which the counter electrode was formed on the electron injection layer. (D) is a fragmentary sectional view which shows the state in which the sealing layer was formed on the counter electrode. It is a flowchart which shows the manufacturing process of the organic electroluminescent display panel 100 which concerns on embodiment. It is a fragmentary sectional view showing typically the structure of partition 141, 142, 143 concerning a modification. It is a schematic block diagram which shows schematic structure of the organic electroluminescence display which concerns on embodiment.

<Circumstances leading to one aspect of the present disclosure>
When forming a light emitting layer and a functional layer by a coating method, the ink which melt | dissolved material is apply | coated to a partition gap. As described above, the top of the partition wall and the upper portion of the side wall portion are provided with liquid repellence to prevent the ink from getting over, so the coated ink does not adhere to the liquid repellent portion of the side wall portion. On the other hand, since the ink attached to the lyophilic portion of the side wall remains without drying after drying, the contact between the light emitting layer or the functional layer and the side wall is fixed to the interface between the liquid repellent portion and the lyophilic portion It will be (pinned).

  In forming the partition, generally, the lyophilic portion and the lyophobic portion are simultaneously formed. Specifically, a fluorine-based or silicone-based liquid repellent surfactant is added to a lyophilic acrylic-based, methacrylic-based, polyimide-based, or phenol-based photoresist, which is coated and mask-exposed. , Develop, bake. Since the concentration of the liquid repellent surfactant is high at the top and low at the bottom of the formation step, the top of the partition including the top has liquid repellency and the bottom of the partition has lyophilic. Become. The interface between the liquid repellent portion and the lyophilic portion, that is, the pinning position, depends on the height of the partition wall and the amount of the liquid repellent surfactant added.

  On the other hand, the film thickness of the light emitting layer or the functional layer is to realize functions such as light emitting function of the light emitting layer, carrier injection function of the functional layer, transport function, block function, etc., light transparency, and optical resonator structure. Determined by various requirements such as thickness. Therefore, the optimum film thickness is often different for organic EL elements having different luminescent colors of the luminescent layer. On the other hand, as described above, when there is a step between the height of the pinning position and the height of the top surface of the light emitting layer or the functional layer, unevenness occurs in the film thickness of the light emitting layer or the functional layer. Therefore, it is necessary to change the pinning position for each luminescent color. For example, as shown in the schematic cross-sectional view of FIG. 3A, when the partition walls 814 having the same height are formed using the same material, the range of height in which the liquid repellent portions 842 are formed becomes the same. Then, the pinning positions become the same regardless of the film thickness of the light emitting layer, so that the film thickness of the light emitting layer is uneven. Specifically, since the pinning position is higher than the film thickness of the light emitting layer 917a, the upper surface of the light emitting layer 917a is concave, and the pinning position is lower than the film thickness of the light emitting layer 917b. A situation occurs in which the upper surface of the 917b is convex.

  As a method of solving this problem, for example, as described in Patent Document 1, it is conceivable to control the height of the liquid repellent portion. However, when controlling only the pinning position without changing the height of the partition wall, if the pinning position is too high relative to the partition wall, it is not possible to suppress the overcoming of the ink, as shown in the schematic cross sectional view of FIG. The heights of the partition walls 824 a, 824 b, and 824 c need to be set in accordance with the light emitting layer 927 b having the largest film thickness. Then, the two partitions 824a and 824b partitioning the light emitting layer 927a are too high for the film thickness of the light emitting layer 927a. In addition, since all of the liquid repellent portion 843a of the partition 824a, the liquid repellent portion 843b of the partition 824b, and the liquid repellent portion 843c of the partition 824c do not have the same structure with respect to two adjacent light emitting layers, It is difficult to integrally form the part and the liquid repellent part.

The inventor studied the organic EL display panel in which the pinning position and the height of the partition can be appropriately designed while integrally forming the lyophilic portion and the liquid repellent portion of the partition, and the present disclosure has been made.
<Aspect of disclosure>
An organic EL display panel according to an aspect of the present disclosure includes: a substrate; a plurality of pixel electrodes disposed in a matrix above the substrate; and a gap between the pixel electrodes in the row direction disposed above the substrate A first light emitting layer disposed above the pixel electrode in a first gap selected from a plurality of partitions extending in the column direction and a plurality of gaps between the partitions adjacent in the row direction; A second light emitting layer disposed above the pixel electrode and a counter electrode disposed above the first light emitting layer and above the second light emitting layer in a second gap adjacent to the gap in the row direction; The thickness of the first light emitting layer is greater than the thickness of the second light emitting layer, and the partition wall present between the first gap and the second gap is located on the first gap side. The height of one partition portion is higher than the height of the second partition portion on the second gap side, and First pinning position where the side wall portion and the first light-emitting layer of the first partition wall portion is in contact is higher than the second pinning position where the side wall portion of the second partition wall portion and the second light-emitting layer is in contact.

  Further, in the method of manufacturing an organic EL display panel according to one aspect of the present disclosure, a step of preparing a substrate, a step of forming a plurality of pixel electrodes in a matrix over the substrate, and a step of forming the plurality of pixel electrodes above the substrate A light emitting material is included in a step of forming a plurality of partitions along the column direction so as to partition the pixel electrodes in the row direction, and a first gap selected from a plurality of gaps between the partitions adjacent in the row direction Applying an ink to form a first light emitting layer, applying an ink containing a light emitting material to a second gap adjacent to the first gap in the row direction, and having a thickness smaller than the film thickness of the first light emitting layer Forming a second light emitting layer having a film thickness, and forming a counter electrode above the first light emitting layer and the second light emitting layer; The height of the first partition portion adjacent to the gap is A side wall portion of the second partition wall portion facing the first gap is formed higher than the height of the second partition wall portion adjacent to the second gap, and a side wall portion facing the second partition wall of the second partition wall portion Each forms a liquid repellent portion continuing from the top.

According to the organic EL display panel of the above aspect or the manufacturing method of the above aspect, any of the first light emitting layer and the second light emitting layer has a pinning position according to the film thickness, so a suitable film thickness A controlled organic EL display panel can be realized.
Further, in the organic EL display panel according to the above aspect or the manufacturing method of the above aspect, the following may be performed.

The first pinning position may have a height depending on the height of the first partition portion, and the second pinning position may have a height depending on the height of the second partition portion.
Thereby, the height of the partition wall portion and the pinning position can be interlocked in each gap to be optimized according to the light emitting layer or the functional layer formed in the gap, and the film thickness of the light emitting layer or the functional layer is uniform. Can be

The height of the first pinning position is a height obtained by multiplying the height of the first partition wall portion by a first coefficient, and the height of the second pinning position is a height of the second partition wall portion Or the height multiplied by the second coefficient.
Thereby, the position of pinning can be matched and controlled by controlling the height of the partition part of the both sides for every gap | interval.

Further, the first coefficient and the second coefficient may be different.
Thus, for each gap, the relationship between the heights of the partition wall portions on both sides thereof and the range of the height of the pinning position can be optimized in accordance with the light emitting layer and the functional layer formed in the gap.
Further, the height of the first pinning position is a height obtained by subtracting a predetermined thickness from the height of the first partition wall portion, and the height of the second pinning position is a height of the second partition wall portion It may be a height obtained by subtracting the predetermined thickness from.

Thereby, the difference in height between the pinning position and the top of the partition can be made uniform.
The first partition portion and the second partition portion may be made of an insulating resin material and may include a liquid repellent surfactant.
Further, the surfactant may be a fluorine-based compound or a silicone-based compound.

Further, in the step of forming a plurality of the partition walls, a resin material containing a liquid repellent surfactant may be used as a material of the partition walls.
Further, as the surfactant, a fluorine-based compound or a silicone-based compound may be used.
Thereby, a partition part can be integrally molded and the formation process of a partition can be simplified.

  In the side wall portion of the first partition portion facing the first light emitting layer, the content of the surfactant is higher in a portion higher than the first pinning position than in a portion lower than the first pinning position, In the side wall portion of the second partition portion facing the second light emitting layer, the content of the surfactant is higher in the portion higher than the second pinning position than in the portion lower than the second pinning position. Good.

In the step of forming a plurality of the partition walls, a resin material containing the surfactant is used as a material of the partition walls, and a portion of the partition walls in which the content ratio of the surfactant is a predetermined ratio or more is the liquid repellent portion It may be as well.
Thereby, the upper surface of the partition wall portion can be made to be a liquid repellent portion, and the process of forming the partition wall can be simplified.

Further, the height of the second partition wall portion is higher than the height of the first partition wall portion, and after the first partition wall portion is formed in the step of forming a plurality of the partition walls, the second partition wall formed portion The formation may be performed.
Thereby, when forming a partition part, the influence of the other partition part whose height is low can be made small.

Embodiment
1. Schematic Configuration of Organic EL Display Panel An organic EL display panel according to an aspect of the present invention will be described.
FIG. 1 is a partial cross-sectional view of the organic EL display panel 100 according to the embodiment. The organic EL display panel 100 includes a plurality of pixels formed of organic EL elements 1 (R), 1 (G) and 1 (B) that emit light of three colors (red, green and blue).

In the organic EL display panel 100, each organic EL element 1 is a so-called top emission type in which light is emitted forward (upward in the drawing of FIG. 1).
The organic EL element 1 (R), the organic EL element 1 (G), and the organic EL element 1 (B) have almost the same configuration, and therefore, they will be described as the organic EL element 1 when they are not distinguished.
As shown in FIG. 1, the organic EL element 1 includes a substrate 11, an interlayer insulating layer 12, a pixel electrode 13, partition walls 141, 142, 143, a hole injection layer 15, a hole transport layer 16, a light emitting layer 17, an electron transport. The layer 18, the electron injection layer 19, the counter electrode 20, and the sealing layer 21 are provided. The substrate 11, the interlayer insulating layer 12, the electron transport layer 18, the electron injection layer 19, the counter electrode 20, and the sealing layer 21 are not formed for each pixel, but are provided in the organic EL display panel 100. It is formed in common to the plurality of organic EL elements 1.

  FIG. 2 is a schematic plan view of the organic EL display panel 100. As shown in FIG. As shown in FIG. 2, the organic EL display panel 100 according to the embodiment adopts a so-called line bank structure. That is, the organic EL display panel 100 is long in the Y direction, and has a plurality of barrier ribs 141, 142 and 143 spaced apart from each other in the X direction, and each is long in the X direction, Y And a plurality of secondary walls 14b spaced apart from one another in the direction. FIG. 1 corresponds to a cross-sectional view taken along line A-A of FIG.

One of the organic EL elements 1 (R), 1 (G), and 1 (B) is formed in a region defined by the pair of adjacent partitions 141, 142, and 143 and the pair of adjacent sub walls 14b. , Each of which is a sub-pixel. The length in the Y direction of each sub-pixel is, for example, 300 μm.
Hereinafter, the configuration of each part of the organic EL display panel 100 will be described.

<Board>
The substrate 11 includes a base material 111 which is an insulating material, and a TFT (Thin Film Transistor) layer 112. In the TFT layer 112, a drive circuit is formed for each pixel. The substrate 111 is, for example, a glass substrate, a quartz substrate, a silicon substrate, a metal substrate such as molybdenum sulfide, copper, zinc, aluminum, stainless steel, magnesium, iron, nickel, gold or silver, a semiconductor substrate such as gallium arsenide, a plastic substrate Etc. can be adopted. As a plastic material, any resin of thermoplastic resin and thermosetting resin may be used. For example, polyimide (PI), polyetherimide (PEI), polysulfone (PSu), polycarbonate (PC), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate, styrene type, polyolefin type, polyurethane type, And various thermoplastic elastomers such as epoxy resins, unsaturated polyesters, silicone resins, polyurethanes, etc., or copolymers, blends, polymer alloys and the like mainly comprising these. From these, it is selected so as to have durability against the process temperature, and it is possible to use a laminate obtained by laminating one kind or two or more kinds.

<Interlayer insulating layer>
The interlayer insulating layer 12 is formed on the substrate 11. The interlayer insulating layer 12 is made of a resin material and is for planarizing a step on the top surface of the TFT layer 112. As a resin material, a positive photosensitive material is mentioned, for example. Moreover, acrylic resin, polyimide resin, siloxane resin, phenol resin etc. are mentioned as such a photosensitive material. Although not shown in the cross-sectional view of FIG. 1, contact holes are formed in the interlayer insulating layer 12 for each pixel.

<Pixel electrode>
The pixel electrode 13 includes a metal layer made of a light reflective metal material, and is formed on the interlayer insulating layer 12. The pixel electrode 13 is provided for each pixel, and is electrically connected to the TFT layer 112 through a contact hole provided in the interlayer insulating layer 12.
In the present embodiment, the pixel electrode 13 functions as an anode.

  Specific examples of the metal material having light reflectivity include Ag (silver), Al (aluminum), aluminum alloy, Mo (molybdenum), APC (silver, palladium, alloy of copper), ARA (silver, rubidium, gold) And MoCr (alloy of molybdenum and chromium), MoW (alloy of molybdenum and tungsten), NiCr (alloy of nickel and chromium), and the like.

The pixel electrode 13 may be formed of a metal layer alone, but a laminated structure in which a layer formed of a metal oxide such as ITO (indium tin oxide) or IZO (indium zinc oxide) is laminated on the metal layer It is also good.
<Partition wall>
The partition walls 141, 142, and 143 are formed on the pixel electrode 13 in a state in which a partial region of the upper surface of the pixel electrode 13 is exposed and the peripheral region is covered. Regions (hereinafter referred to as “openings”) which are not covered with the partitions 141, 142, and 143 on the upper surface of the pixel electrode 13 correspond to sub-pixels. That is, the partitions 141, 142, and 143 have openings 14a provided for each sub-pixel. Hereinafter, when it is necessary to distinguish, the opening of the organic EL element 1 (R) is the opening 14aR, the opening of the organic EL element 1 (G) is the opening 14aG, and the opening of the organic EL element 1 (B) Is denoted as an opening 14aB.

In the present embodiment, the partitions 141, 142, and 143 are formed on the interlayer insulating layer 12 in the portion where the pixel electrode 13 is not formed. That is, the bottom surfaces of the partition walls 141, 142, and 143 are in contact with the top surface of the interlayer insulating layer 12 in the portion where the pixel electrode 13 is not formed.
When forming the hole injection layer 15, the hole transport layer 16, and the light emitting layer 17 by the application method, the partition walls 141, 142, and 143 prevent the applied ink from contacting the ink of the adjacent subpixel. It functions as a structure. In the partition walls 141, 142, and 143, the top portions and the upper portions of the side wall portions subsequent thereto are the liquid repellent portions 146, 147, and 148, and a portion of the side wall portions excluding the liquid repellent portion is a lyophilic portion. The partition walls 141, 142, 143 are formed by adding a liquid repellent surfactant such as a fluorine compound or a silicone compound to a base material made of an insulating resin material. As a base material which is an insulating resin material, for example, a positive photosensitive material can be used, and specifically, acrylic resin, polyimide resin, siloxane resin, phenol resin and the like can be mentioned. . The base material is not limited to the positive photosensitive material. For example, a negative photosensitive material may be used, or a non-photosensitive material may be used.

  The partition 141 includes a partition facing the opening 14aR and a partition facing the opening 14aG. Similarly, the partition 142 includes a partition facing the opening 14aG and a partition facing the opening 14aB. It consists of parts. Similarly, the partition 143 includes a partition part facing the opening 14aB and a partition part facing the opening 14aR. Each of the partition portions is in the shape of a quadrangular frustum or a similar shape, and the cross-section is in the shape of a forward tapered trapezoidal or upwardly convex bowl in which the upper side is tapered. In addition, the two partition portions facing one opening have the same height and the same range of the height of the liquid repellent portion.

<Secondary wall>
The sub wall 14 b is formed on the pixel electrode 13 in a state in which a partial region of the upper surface of the pixel electrode 13 is exposed and the peripheral region is covered. The extending direction of the sub wall 14 b is orthogonal to the extending direction of the partition walls 141, 142, 143. Each of the sub walls 14 b is formed across the plurality of openings 14 a and divides the adjacent pixel electrode 13 in the openings 14 a.

In the present embodiment, the sub wall 14 b is formed on the interlayer insulating layer 12 in the portion where the pixel electrode 13 is not formed. That is, in the portion where the pixel electrode 13 is not formed, the bottom surface of the sub wall 14 b is in contact with the top surface of the interlayer insulating layer 12.
The sub wall 14 b is for regulating the flow of the applied ink in the column direction (Y direction) when the hole injection layer 15, the hole transport layer 16, and the light emitting layer 17 are formed by the application method. . The shape of the sub wall 14b is a quadrangular frustum shape or a similar shape, and the cross section is a trapezoidal shape of a forward taper whose upper side is tapered or a convex bowl shape. Further, the height of the sub wall 14 b from the interlayer insulating layer 12 is smaller than the height of the partition walls 141, 142, 143 from the interlayer insulating layer 12. The sub wall 14 b is made of a resin material, and for example, a positive photosensitive material can be used. Specific examples of such photosensitive materials include acrylic resins, polyimide resins, siloxane resins, and phenol resins. The resin material is not limited to the positive photosensitive material. For example, a negative photosensitive material may be used, or a non-photosensitive material may be used.

<Hole injection layer>
The hole injection layer 15 is provided on the pixel electrode 13 for the purpose of promoting the injection of holes from the pixel electrode 13 to the light emitting layer 17. Specific examples of the material of the hole injection layer 15 include, for example, conductive polymer materials such as PEDOT / PSS (a mixture of polythiophene and polystyrene sulfonic acid).

  The hole injection layer 15 may be formed of a transition metal oxide. Specific examples of the transition metal include Ag (silver), Mo (molybdenum), Cr (chromium), V (vanadium), W (tungsten), Ni (nickel), Ir (iridium) and the like. Since the transition metal takes a plurality of oxidation numbers, it can take a plurality of levels, as a result, hole injection becomes easy, which contributes to a reduction in drive voltage. In this case, the hole injection layer 15 preferably has a large work function.

<Hole transport layer>
The hole transport layer 16 has a function of transporting holes injected from the hole injection layer 15 to the light emitting layer 17, and in order to efficiently transport holes from the hole injection layer 15 to the light emitting layer 17, It is formed of an organic material with high hole mobility. The formation of the hole transport layer 16 is performed by applying and drying an organic material solution. As an organic material for forming the hole transport layer 16, a polymer compound such as polyfluorene or a derivative thereof, or a polyarylamine or a derivative thereof can be used.

  In addition, the hole transport layer 16 may be a triazole derivative, an oxadiazole derivative, an imidazole derivative, a polyarylalkane derivative, a pyrazoline derivative or a pyrazolone derivative, a phenylenediamine derivative, an arylamine derivative, an amino-substituted chalcone derivative, an oxazole derivative, a styrylanthracene derivative, It may be formed using a fluorenone derivative, hydrazone derivative, stilbene derivative, porphyrin compound, aromatic tertiary amine compound and styrylamine compound, butadiene compound, polystyrene derivative, hydrazone derivative, triphenylmethane derivative, tetraphenylbenzene derivative . In particular, porphyrin compounds, aromatic tertiary amine compounds and styrylamine compounds may be used. In this case, the hole transport layer 16 is formed by vacuum evaporation. In addition, the material and manufacturing method of the positive hole transport layer 16 are not restricted to the above-mentioned thing, Arbitrary materials which have a positive hole transport function may be used, and arbitrary manufacturing methods which can be used for manufacture of the positive hole transport layer 16 And may be formed of

<Light emitting layer>
The light emitting layer 17 is formed in the opening 14a. The light emitting layer 17 has a function of emitting light of each color of R, G and B by recombination of holes and electrons. A known material can be used as the material of the light emitting layer 17.
Examples of the organic light emitting material contained in the light emitting layer 17 include oxinoid compounds, perylene compounds, coumarin compounds, azacoumarin compounds, oxazole compounds, oxadiazole compounds, perinone compounds, pyrrolopyrrole compounds, naphthalene compounds, anthracene compounds, fluorene compounds, Fluoranthene compounds, tetracene compounds, pyrene compounds, coronene compounds, quinolone compounds and azaquinolone compounds, pyrazoline derivatives and pyrazolone derivatives, rhodamine compounds, chrysene compounds, phenanthrene compounds, cyclopentadiene compounds, stilbene compounds, diphenylquinone compounds, styryl compounds, butadiene compounds, Dicyanomethylene pyran compound, dicyanomethylene thiopyran compound, fluorescein compound, pyrilylated Compounds, thiapyrilium compounds, selenapyrilium compounds, telluropyrilium compounds, aromatic aldadiene compounds, oligophenylene compounds, thioxanthene compounds, cyanine compounds, acridine compounds, metal complexes of 8-hydroxyquinoline compounds, metal complexes of 2-bipyridine compounds, Schiff A fluorescent substance such as a complex of a salt and a Group III metal, an oxine metal complex, or a rare earth complex can be used. In addition, known phosphors such as metal complexes that emit phosphorescence such as tris (2-phenylpyridine) iridium can be used. The light emitting layer 17 is formed by using polyfluorene or a derivative thereof, polyphenylene or a derivative thereof, a high molecular compound such as polyarylamine or a derivative thereof, or a mixture of the low molecular compound and the high molecular compound. It is also good.

<Electron transport layer>
The electron transport layer 18 is formed on the light emitting layer 17 and the partitions 141, 142, and 143 in common to a plurality of pixels, and has a function of transporting electrons injected from the counter electrode 20 to the light emitting layer 17. The electron transport layer 18 is formed using, for example, an oxadiazole derivative (OXD), a triazole derivative (TAZ), a phenanthroline derivative (BCP, Bphen) or the like.

<Electron injection layer>
The electron injection layer 19 is provided commonly to a plurality of pixels on the electron transport layer 18 and has a function of promoting the injection of electrons from the counter electrode 20 to the light emitting layer 17.
The electron injection layer 19 is formed, for example, by doping an organic material having electron transportability with a metal material for improving electron injection. Here, doping refers to substantially uniformly dispersing metal atoms or metal ions of a metal material in an organic material, and specifically, forms a single phase containing an organic material and a trace amount of metal material. Point to In addition, it is preferable that the phase which does not have the phase other than that, especially, the phase which consists only of metal materials, such as a metal piece and a metal film, or the phase which has a metal material as a main component does not exist. In addition, in a single phase containing an organic material and a trace amount of metal material, the concentration of metal atoms or metal ions is preferably uniform, and it is preferable that metal atoms or metal ions are not aggregated. The metal material is preferably selected from alkali metals or alkaline earth metals, and more preferably Ba or Li. In the present embodiment, Ba is selected. Moreover, as for the dope amount of the metal material in the electron injection layer 19, 5-40 wt% is preferable. In the present embodiment, it is 20 wt%. Examples of the organic material having electron transportability include π electron low molecular weight organic materials such as oxadiazole derivative (OXD), triazole derivative (TAZ), phenanthroline derivative (BCP, Bphen) and the like.

The electron injection layer 19 may have a fluoride layer of a metal selected from an alkali metal or an alkaline earth metal on the light emitting layer 17 side.
<Counter electrode>
The counter electrode 20 is formed on the electron injection layer 19 in common to a plurality of pixels, and functions as a cathode.

  The counter electrode 20 has both light transmitting properties and conductivity, and includes at least one of a metal layer formed of a metal material and a metal oxide layer formed of a metal oxide. The film thickness of the metal layer is about 1 nm to 50 nm in order to ensure light transmittance. Examples of the material of the metal layer include Ag, a silver alloy containing Ag as a main component, Al, and an Al alloy containing Al as a main component. Examples of the Ag alloy include magnesium-silver alloy (MgAg) and indium-silver alloy. Ag basically has a low resistivity, and an Ag alloy is preferable in that it is excellent in heat resistance and corrosion resistance and can maintain good electrical conductivity over a long period of time. Examples of the Al alloy include magnesium-aluminum alloy (MgAl) and lithium-aluminum alloy (LiAl). Other alloys include lithium-magnesium alloys and lithium-indium alloys. Examples of the material of the metal oxide layer include ITO (indium tin oxide) and IZO (indium zinc oxide).

The cathode may be composed of a metal layer alone or a metal oxide layer alone, but a laminated structure in which the metal oxide layer is laminated on the metal layer, or a metal layer is laminated on the metal oxide layer It may be a laminated structure.
<Sealing layer>
A sealing layer 21 is provided on the counter electrode 20. The sealing layer 21 prevents impurities (water, oxygen) from invading the counter electrode 20, the electron injection layer 19, the electron transport layer 18, the light emitting layer 17 and the like from the opposite side of the substrate 11, and these layers Have the function of suppressing the deterioration of The sealing layer 21 is formed using a light transmitting material such as silicon nitride (SiN) or silicon oxynitride (SiON). In addition, a sealing resin layer made of a resin material such as an acrylic resin or an epoxy resin may be provided on a layer formed using a material such as silicon nitride (SiN) or silicon oxynitride (SiON).

In the present embodiment, since the organic EL display panel 100 is a top emission type, the sealing layer 21 needs to be formed of a light transmitting material.
<Others>
Although not shown in FIG. 1, a color filter or an upper substrate may be bonded onto the sealing layer 21 via a sealing resin. By bonding the upper substrate, the hole injection layer 15, the hole transport layer 16, the light emitting layer 17, the electron transport layer 18, the electron injection layer 19, and the counter electrode 20 can be protected from moisture, air, and the like.

<Effect of partition according to the embodiment>
Hereinafter, differences between the partition walls 141 and 142 according to the embodiment and a partition wall having another structure will be described using a schematic view. FIG. 3: is a schematic cross section which shows the application | coating process of the light emitting layer material in an Example and a comparative example. The horizontal direction in the drawing corresponds to the X direction, and the vertical direction corresponds to the Z direction.

  FIG. 3A is a schematic cross-sectional view in the case where the height is the same for all the partitions 814, and the range of the height in which the liquid repellent portion 842 is formed is the same. When the same material is used for all the partitions 814 and they are formed in the same step, such a configuration of the partitions is obtained. At this time, the pinning positions become the same regardless of the film thickness of the light emitting layer. Therefore, when the pinning position is higher than the film thickness of the light emitting layer 917a, the upper surface becomes concave like the light emitting layer 917a of FIG. 3A, and the film thickness becomes thicker as it approaches the partition wall. On the other hand, when the pinning position is lower than the film thickness of the light emitting layer 917a, the upper surface becomes convex as in the light emitting layer 917b of FIG. 3B, and the film thickness becomes thinner as it approaches the partition wall. Therefore, in order to make the film thickness of the light emitting layer uniform, the pinning position and the film thickness of the light emitting layer need to be the same, and the film thickness can not be adjusted in accordance with the light emission color.

  In FIG. 3B, while the heights of all the partitions 824a, 824b, and 843c are the same, the range of height in which the liquid repellent portions 843a, 843b, and 843c are formed is light emission formed in each opening. It is a schematic cross section at the time of controlling according to the film thickness of a layer. At this time, since the position of pinning can be controlled for each opening, the film thickness of the light emitting layer can be made uniform while designing the film thickness of the light emitting layer arbitrarily. On the other hand, when focusing on the partition wall 824b, for example, the range of the liquid repellent portion 843b in the side wall portion on the light emitting layer 927a side differs from the range of the liquid repellent portion 843b in the side wall portion on the light emitting layer 927b side. It is difficult to form such a structure by integrally forming the partition wall 824b and the liquid repellent portion 843b. In addition, in order to prevent the ink from overflowing in all the openings, it is necessary to design the height of the partition in accordance with the opening with the largest amount of ink, so in the opening with a small amount of ink, the partition is excessive. There are also challenges that will

  On the other hand, in the partition wall according to the embodiment, as shown in the schematic cross sectional view of FIG. 3C, in the partition walls 141 and 142, the partition wall portion 14p facing the opening where the light emitting layer 17a is formed; The height of the partition wall 14 q facing the opening where the layer 17 b is formed is different. Therefore, for the opening where the light emitting layer 17a is formed, the height of the two partition portions 14p facing the opening and the range of the height of the liquid repellent portions 146p and 147p are designed to match the light emitting layer 17a. can do. On the other hand, for the opening where the light emitting layer 17b is formed, the heights of the two partition portions 14q facing the opening and the range of the heights of the liquid repellent portions 146q and 147q are adjusted to the light emitting layer 17b. It can be designed. Therefore, for any opening, the side wall facing the opening of the partition can be designed according to the characteristics of the light emitting layer or the functional layer formed in the opening. Furthermore, since the two partition parts facing one opening have the same height of the partition part and the height range of the liquid repellent part, plural partition parts facing the same light emitting layer or functional layer are It can be molded at once including the liquid repellent portion. Further, since the two partition portions 14p and 14q can be formed by repeating the application, patterning, and development processes of the material only by the type of height of the partition portions, patterning of the liquid repellent portion is performed after formation of the lyophilic portion. The production process can be simplified rather than

As described above, the partition wall according to the embodiment is suitable as a structure that prevents the ink from overflowing when the light emitting layer and / or the functional layer is formed by the application method, and the film thickness is made uniform to make the organic EL element Is also suitable for improving the characteristics of
2. Method of Manufacturing Organic EL Display Panel 100 <Method of Manufacturing Partition Wall>
Next, a method of manufacturing the organic EL display panel 100 will be described using the drawings.

First, the method of manufacturing the partition walls 141, 142, and 143 will be described in detail. FIG. 4 to FIG. 7 are schematic cross-sectional views showing the state in each process of manufacturing the partition walls 141, 142, 143. As shown in FIG. FIG. 8 is a flowchart showing a method of manufacturing the partition walls 141, 142, 143.
In the present embodiment, the film thickness of the light emitting layer is assumed to increase in the order of the red light emitting layer, the green light emitting layer, and the blue light emitting layer.

(1) Formation of First Partition Material Layer 140R As shown in FIGS. 9A to 9D, the interlayer insulating layer 12 and the pixel electrode 13 are formed on the substrate 11 (details will be described later).
Next, as shown in FIG. 4A, the first barrier rib material layer 140R is formed to cover the interlayer insulating layer 12 and the pixel electrode 13 (step S210). In the first partition wall material layer 140R, for example, a fluorine compound which is a surfactant having liquid repellency is added to an acrylic resin, a polyimide resin, a siloxane resin, and a phenol resin which are negative photosensitive materials. Used. Specifically, for example, a solution in which a phenol resin as a partition resin and a fluorine compound are dissolved in a solvent (for example, a mixed solvent of PGMEA or ethyl lactate and GBL) is applied on the pixel electrode 13 and the interlayer insulating layer 12 It is formed by uniformly coating using a spin coating method or the like.

(2) Forming of First Partition Material Layer 140R Next, as shown in FIG. 4B, pattern exposure of the first partition material layer 140R is performed using a photomask 201 (Step S220). Subsequently, as shown in FIG. 4C, the uncured first partition wall material layer 140R is removed by development (Step S230), thereby forming the partition wall portion 143R facing the opening 14aR.

(3) Formation of Second Partition Material Layer 140G Next, as shown in FIG. 5A, the second partition material layer 140G is formed to cover the interlayer insulating layer 12 and the pixel electrode 13 (Step S240). ). As a material of the 2nd partition material layer 140G, the material similar to the material of the 1st partition material layer 140R can be used, for example.
(4) Forming of Second Partition Material Layer 140G Next, as shown in FIG. 5B, pattern exposure of the second partition material layer 140G is performed using a photomask 202 (Step S250). Subsequently, as shown in FIG. 5C, by removing the uncured second partition wall material layer 140G by development (Step S260), partition wall portions 143G facing the opening 14aG are formed.

(5) Formation of Third Partition Material Layer 140B Next, as shown in FIG. 6A, the third partition material layer 140B is formed so as to cover the interlayer insulating layer 12 and the pixel electrode 13 (step S270). ). As a material of the 3rd partition material layer 140B, the material similar to the material of the 1st partition material layer 140R can be used, for example.
(6) Forming of Third Partition Material Layer 140B Next, as shown in FIG. 6B, the third partition material layer 140B is pattern-exposed using a photomask 203 (step S280). Subsequently, as shown in FIG. 6C, the uncured third partition wall material layer 140B is removed by development (Step S290), thereby forming the partition wall portion 143B facing the opening 14aB.

(7) Firing of Partition Layers Finally, the partitions 141, 142, and 143 are completed by firing (Step S295). The firing is performed, for example, at a temperature of 150 ° C. or more and 250 ° C. or less for 60 minutes.
Here, although it is assumed that firing is collectively performed after the formation of all of the first partition wall material layer 140R, the second partition wall material layer 140G, and the third partition wall material layer 140B is completed, each time molding is performed, that is, After the end of (2), firing may be performed before the start of (3), after the end of (4) before the start of (5), and after the end of (6). By this, while the number of firing processes increases, it is possible to suppress the influence of the unbaked partition portion 143R from the development process when forming the second partition portion 143G, for example.

  Through the above steps, as shown in FIG. 7, the partition walls 141, 142, and 143 are completed. At this time, the liquid repellent portion 146 of the partition wall 141 includes the liquid repellent portion 146R facing the opening 14aR and the liquid repellent portion 146G facing the opening 14aG. Similarly, the liquid repellent portion 147 of the partition 142 includes a liquid repellent portion 147G facing the opening 14aG and a liquid repellent portion 147B facing the opening 14aB. Similarly, the liquid repellent portion 148 of the partition wall 143 includes a liquid repellent portion 148B facing the opening 14aB and a liquid repellent portion 148R facing the opening 14aR. Focusing on the liquid repellent portions on both sides facing the opening 14aR, since the liquid repellent portions 148R and the liquid repellent portions 146R are both formed as a part of the partition wall portion 143R, the range of the height is It becomes the same. Similarly, since both the liquid repellent portion 146G and the liquid repellent portion 147G facing the opening 14aG are formed as a part of the partition wall portion 143G, the range of the height is the same. Similarly, since both the liquid repellent portion 147B and the liquid repellent portion 148B facing the opening 14aB are formed as a part of the partition wall portion 143B, the range of the height is the same.

In addition, although it formed in order of the partition part 143R, 143G, 143B in the said description, the order at the time of formation of a partition part is not restricted to this.
As described above, in the organic EL display panel 100 according to the present embodiment, the height of the partition part facing the opening in the partition is different for each opening, and the side wall part of the partition is the liquid repellant continuing from the top It is characterized by having a part. With this feature, both the height of the partition wall portion and the pinning position defined by the range of the height of the liquid repellent portion are designed for each opening, so that a functional layer or a light emitting layer with a uniform film thickness can be formed. .

<Manufacturing method of organic EL display panel>
Next, a method of manufacturing the entire organic EL display panel 100 will be described using the drawings. FIG. 9 to FIG. 11 are schematic cross-sectional views showing the state in each process of manufacturing the organic EL display panel 100. FIG. FIG. 12 is a flowchart showing a method of manufacturing the organic EL display panel 100.

(1) Formation of Substrate 11 First, as shown in FIG. 9A, the TFT layer 112 is formed on the base material 111 to form the substrate 11 (step S1). The TFT layer 112 can be formed by a known TFT manufacturing method.
Next, as shown in FIG. 9B, the interlayer insulating layer 12 is formed on the substrate 11 (step S2). The interlayer insulating layer 12 can be stacked, for example, using a plasma CVD method, a sputtering method, or the like.

Next, dry etching is performed on the portion of the interlayer insulating layer 12 on the source electrode of the TFT layer to generate a contact hole. The contact hole is formed so that the surface of the source electrode is exposed at the bottom thereof.
Next, a connection electrode layer is formed along the inner wall of the contact hole. A part of the upper portion of the connection electrode layer is disposed on the interlayer insulating layer 12. For example, a sputtering method can be used to form the connection electrode layer, and after forming a metal film, patterning is performed using a photolithography method and a wet etching method.

(2) Preparation of Pixel Electrode 13 Next, as shown in FIG. 9C, the pixel electrode material layer 130 is formed on the interlayer insulating layer 12 (step S3). The pixel electrode material layer 130 can be formed using, for example, a vacuum evaporation method, a sputtering method, or the like.
Then, as shown in FIG. 9D, the pixel electrode material layer 130 is patterned by etching to form a plurality of pixel electrodes 13 partitioned for each sub-pixel (step S4).

(3) Preparation of Sub-Wall 14b Next, a sub-wall resin, which is a material of the sub-wall 14 b, is coated on the pixel electrode 13 and the interlayer insulating layer 12 to form a sub-wall material layer (step S5). For example, a phenol resin which is a positive photosensitive material is used as the sub-wall resin. The sub-wall material layer is formed by uniformly applying a solution in which a phenol resin is dissolved in a solvent on the pixel electrode 13 and the interlayer insulating layer 12 using a spin coating method or the like. Then, the sub-wall 14b is formed by performing pattern exposure and development on the sub-wall material layer.

(4) Preparation of Partitions 141, 142, 143 Next, as shown in FIG. 9 (e), the partitions 141, 142, 143 are formed on the pixel electrode 13 and the interlayer insulating layer 12 (step S6). The details have been described above as steps S210 to S295 in FIG. Thus, the opening 14 a to be the formation region of the light emitting layer 17 is defined.

  In addition, although it presupposed that baking of the subwall 14b is performed by the baking process (step 6, step S295 of FIG. 8 in detail) of the partition 141 here, after completion | finish of (3) start of (4) Only the side wall 14b may be fired before. If firing is performed each time, the number of processes increases, but the formed and unfired partition walls 141, 142 and 143 and the sub wall 14b can be less affected by the development process and the like.

(5) Film Formation of Hole Injection Layer Next, as shown in FIG. 10A, the material of the hole injection layer 15 with respect to the opening 14a defined by the partition walls 141, 142, 143 and the sub wall 14b. The ink containing the above is discharged from the nozzle 4030 of the ink jet head 401 and applied onto the pixel electrode 13 in the opening 14a, and baking (drying) is performed to form the hole injection layer 15 (step S7).

(6) Film Formation of Hole Transport Layer Next, as shown in FIG. 10B, the ink containing the constituent material of the hole transport layer 16 is discharged from the nozzle 4031 of the ink jet head 402 and the inside of the opening 14a The hole injection layer 15 is coated and baked (dried) to form the hole transport layer 16 (step S8).
(7) Film Formation of Light Emitting Layer Next, as shown in FIG. 10C, the ink containing the constituent material of the light emitting layer 17 is discharged from the nozzle 4032 of the ink jet head 403 to transport the holes in the opening 14a. The light-emitting layer 17 is formed by applying on the layer 16 and baking (drying) (step S9).

(8) Deposition of Electron Transport Layer Next, as shown in FIG. 11A, the material forming the electron transport layer 18 is vacuum deposited or sputtered on the light emitting layer 17 and the partitions 141, 142, and 143. A common film is formed on each sub-pixel by a method to form an electron transport layer 18 (step S10).
(9) Deposition of Electron Injection Layer Next, as shown in FIG. 11B, the material constituting the electron injection layer 19 is common to each sub-pixel on the electron transport layer 18 by vacuum evaporation or sputtering. To form an electron injection layer 19 (step S11).

(10) Deposition of counter electrode Next, as shown in FIG. 11C, the material forming the counter electrode 20 is commonly used for each sub-pixel on the electron injection layer 19 by vacuum evaporation or sputtering. A film is formed to form the counter electrode 20 (step S12).
(11) Film formation of sealing layer Finally, as shown in FIG. 11D, the material for forming the sealing layer is formed on the counter electrode 20 in common to each sub-pixel by the CVD method or the sputtering method. The film is formed to form the sealing layer 21 (step S13).

The organic EL display panel 100 is completed through the above steps.
Note that a color filter or an upper substrate may be placed on the sealing layer 21 and bonded.
3. Overall Configuration of Organic EL Display Device FIG. 14 is a schematic block diagram showing a configuration of an organic EL display device 1000 provided with the organic EL display panel 100. As shown in FIG. As shown in FIG. 14, the organic EL display device 1000 includes an organic EL display panel 100 and a drive control unit 200 connected to the organic EL display panel 100. The drive control unit 200 includes four drive circuits 210 to 240 and a control circuit 250.

In the actual organic EL display device 1000, the arrangement of the drive control unit 200 with respect to the organic EL display panel 100 is not limited to this.
4. Modifications (1) In the above embodiment, the case where all the partition walls are formed of the same material has been described. However, the following embodiment may be adopted. For example, with respect to the material of each partition portion, the amount of surfactant added to the material of the partition portion is changed so that the content of the surfactant decreases as the volume of the partition portion increases. By doing this, as shown in the schematic cross sectional view of FIG. 13A, while the height of each partition portion is changed to h _R , h _G and h _B , the liquid repellent portion is also formed in any of the partition portions. the height range of the can be made constant and h _a.

Further, for example, by changing the ratio of the material and the additive to be formed for each partition portion, the height of each of the liquid repellent portions can be designed arbitrarily. For example, as shown in the schematic cross-sectional view of FIG. 13B, the height h _{R of the} partition facing the opening 14aR and the range h _r of the height of the liquid repellent portion, and the partition facing the opening 14aG Even if the height h _G and the range h _g of the height of the liquid repellent portion, the height h _{B of the} partition facing the opening 14 a _B and the range h _b of the height of the liquid repellent portion are each independently designed Good.

  (2) In the above embodiment, the organic EL display panel in which three types of light emitting layers for emitting R, G, and B are provided has been described, but the number of types of light emitting layers may be two. And may be four or more. Here, the type of the light emitting layer refers to the variation of the film thickness of the light emitting layer or the functional layer, and even if the light emitting color is the same, when the film thickness of the light emitting layer or the functional layer is different, light emission of different types is emitted. You can think of it as a layer. The arrangement of the light emitting layers is not limited to the arrangement of RGBRGB... But may be the arrangement of RGBBGRRGB... Or an auxiliary electrode layer or another non-light emitting area may be provided between the pixels. At this time, the partition having the same type of light emitting layer on both sides is a partition having a conventional configuration in which the partition facing the one opening and the partition facing the other opening have the same structure. It is also good. Moreover, about the partition in which a light emitting layer is provided only in one side, it may be a partition of a conventional structure, or it has only the partition part facing the opening part in which a light emitting layer is provided, and a light emission part is not provided. It may be a partition which does not have a side structure.

(3) In the above embodiment, the hole injection layer 15, the hole transport layer 16, and the light emitting layer 17 in the organic EL element 1 are all formed by the coating method, but at least one is formed by the coating method. The other layers may be formed by other methods, for example, a vapor deposition method, a sputtering method, and the like.
In addition, the hole injection layer 15, the hole transport layer 16, the electron transport layer 18, and the electron injection layer 19 do not necessarily have the configuration of the above embodiment. One or more may not be provided, and another functional layer may be further provided. Also, for example, instead of the electron transport layer 18 and the electron injection layer 19, a single electron injection transport layer may be provided.

(4) In the above embodiment, the organic EL display panel is of the top emission type, and the case where the pixel electrode has light reflectivity and the counter electrode has light transparency has been described. However, the organic EL display panel according to the present disclosure may be a so-called bottom emission type.
(5) Although the organic EL display panel and the organic EL display device according to the present disclosure have been described above based on the embodiment and the modification, the present invention is limited to the above embodiment and the modification is not. By arbitrarily combining the components and functions in the embodiment and the modification within the scope not departing from the spirit of the present invention, the embodiment obtained by applying various modifications that the person skilled in the art thinks to the above embodiment and the modification The forms to be realized are also included in the present invention.

  The present invention is an organic EL display panel in which at least one of a light emitting layer and a functional layer is formed by a coating method, the organic EL display panel having excellent light emitting characteristics by making the film thickness of the light emitting layer and the functional layer uniform. Useful for manufacturing

DESCRIPTION OF SYMBOLS 1 organic EL element 11 board | substrate 111 base material 112 TFT layer 12 interlayer insulation layer 13 pixel electrode 141, 142, 143 partition 146, 147, 148 liquid repellent part 14a opening part 14b subwall 14p, 14q partition part 15 hole injection layer 16 Hole transport layer 17 Light emitting layer 18 Electron transport layer 19 Electron injection layer 20 Counter electrode 21 Sealing layer 100 Organic EL display panel 1000 Organic EL display device

Claims (13)

A substrate,
A plurality of pixel electrodes arranged in a matrix above the substrate;
A plurality of partition walls disposed above the substrate and extending in the column direction on the gaps of the pixel electrodes in the row direction;
A first light emitting layer disposed above the pixel electrode in a first gap selected from a plurality of gaps between the partitions adjacent in a row direction;
A second light emitting layer disposed above the pixel electrode in a second gap adjacent to the first gap in the row direction;
A counter electrode disposed above the first light emitting layer and above the second light emitting layer;
The film thickness of the first light emitting layer is thicker than the film thickness of the second light emitting layer,
Among the partitions present between the first gap and the second gap, the height of the first partition portion on the first gap side is higher than the height of the second partition portion on the second gap side. ,
The first pinning position at which the side wall portion of the first partition wall portion contacts the first light emitting layer is higher than the second pinning position at which the side wall portion of the second partition wall portion contacts the second light emitting layer. Organic EL display panel. The first pinning position has a height depending on the height of the first partition portion,
The organic EL display panel according to claim 1, wherein the second pinning position has a height depending on the height of the second partition wall portion. The height of the first pinning position is a height obtained by multiplying the height of the first partition portion by a first coefficient,
The organic EL display panel according to claim 2, wherein the height of the second pinning position is a height obtained by multiplying the height of the second partition wall portion by a second coefficient. The organic EL display panel according to claim 3, wherein the first coefficient and the second coefficient are different. The height of the first pinning position is a height obtained by subtracting a predetermined thickness from the height of the first partition wall portion,
The organic EL display panel according to claim 2, wherein the height of the second pinning position is a height obtained by subtracting the predetermined thickness from the height of the second partition wall portion. The said 1st partition part and the said 2nd partition part consist of an insulating resin material, respectively, and contain surfactant which has liquid repellency. Organic EL display panel. The organic EL display panel according to claim 6, wherein the surfactant is a fluorine-based compound or a silicone-based compound. In a side wall portion of the first partition portion facing the first light emitting layer, a portion higher than the first pinning position has a higher content of the surfactant than a portion lower than the first pinning position,
In the side wall portion of the second partition portion facing the second light emitting layer, the content of the surfactant is higher in a portion higher than the second pinning position than in the portion lower than the second pinning position. Or the organic electroluminescent display panel as described in 7.   An organic EL display device comprising the organic EL display panel according to any one of claims 1 to 8. Preparing the substrate;
Forming a plurality of pixel electrodes in a matrix form above the substrate;
Forming a plurality of partitions along the column direction so as to partition the pixel electrodes in the row direction above the substrate;
Applying an ink containing a light emitting material to a first gap selected from a plurality of gaps between the partitions adjacent in a row direction to form a first light emitting layer;
Applying an ink containing a light emitting material to a second gap adjacent to the first gap in the row direction to form a second light emitting layer having a thickness smaller than that of the first light emitting layer;
Forming a counter electrode above the first light emitting layer and the second light emitting layer,
In the step of forming a plurality of the partition walls,
The height of the first partition portion adjacent to the first gap is formed higher than the height of the second partition portion adjacent to the second gap,
A liquid repellent portion continuing from the top is formed on each of a side wall portion facing the first gap of the first partition wall portion and a side wall portion facing the second partition wall of the second partition wall portion. Of manufacturing organic EL display panel. In the step of forming a plurality of the partition walls, a resin material containing a liquid repellent surfactant is used as a material of the partition walls, and in the partition walls, a portion having a predetermined content of the surfactant is repellent A method of manufacturing an organic EL display panel according to claim 10, wherein the liquid portion is used. A method of manufacturing an organic EL display panel according to claim 11, wherein a fluorine-based compound or a silicone-based compound is used as the surfactant. The process according to any one of claims 10 to 12, wherein, in the step of forming a plurality of the barrier ribs, after the formation of the first barrier rib portion, the formation of the second barrier rib forming portion is performed. Manufacturing method of EL display panel.

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