TWI689376B - 切割盤 - Google Patents

切割盤 Download PDF

Info

Publication number
TWI689376B
TWI689376B TW105107372A TW105107372A TWI689376B TW I689376 B TWI689376 B TW I689376B TW 105107372 A TW105107372 A TW 105107372A TW 105107372 A TW105107372 A TW 105107372A TW I689376 B TWI689376 B TW I689376B
Authority
TW
Taiwan
Prior art keywords
suction
mounting surface
magnet
cutting
frame
Prior art date
Application number
TW105107372A
Other languages
English (en)
Chinese (zh)
Other versions
TW201707860A (zh
Inventor
福岡武臣
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201707860A publication Critical patent/TW201707860A/zh
Application granted granted Critical
Publication of TWI689376B publication Critical patent/TWI689376B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01—Means for holding or positioning work
    • B26D7/018—Holding the work by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
TW105107372A 2015-04-14 2016-03-10 切割盤 TWI689376B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-082376 2015-04-14
JP2015082376A JP6495079B2 (ja) 2015-04-14 2015-04-14 チャックテーブル

Publications (2)

Publication Number Publication Date
TW201707860A TW201707860A (zh) 2017-03-01
TWI689376B true TWI689376B (zh) 2020-04-01

Family

ID=57256906

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105107372A TWI689376B (zh) 2015-04-14 2016-03-10 切割盤

Country Status (4)

Country Link
JP (1) JP6495079B2 (ja)
KR (1) KR102334121B1 (ja)
CN (1) CN106057725B (ja)
TW (1) TWI689376B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110491808B (zh) * 2019-08-20 2021-08-03 湖南艾凯瑞斯智能科技有限公司 一种晶圆划片机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234444Y2 (ja) * 1983-02-09 1987-09-02
JP6234444B2 (ja) 2012-05-21 2017-11-22 バイエル ファーマ アクチエンゲゼルシャフト チエノピリミジン類

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4532895B2 (ja) 2003-12-18 2010-08-25 株式会社ディスコ 板状物の切削装置
US7776746B2 (en) * 2007-02-28 2010-08-17 Alpha And Omega Semiconductor Incorporated Method and apparatus for ultra thin wafer backside processing
JP2009206166A (ja) * 2008-02-26 2009-09-10 Renesas Technology Corp 半導体装置の製造方法
JP5888935B2 (ja) * 2011-10-28 2016-03-22 株式会社ディスコ 保持テーブル
JP2015109416A (ja) * 2013-10-21 2015-06-11 東芝機械株式会社 チャック装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6234444Y2 (ja) * 1983-02-09 1987-09-02
JP6234444B2 (ja) 2012-05-21 2017-11-22 バイエル ファーマ アクチエンゲゼルシャフト チエノピリミジン類

Also Published As

Publication number Publication date
CN106057725A (zh) 2016-10-26
KR20160122638A (ko) 2016-10-24
TW201707860A (zh) 2017-03-01
CN106057725B (zh) 2021-11-30
JP2016198870A (ja) 2016-12-01
JP6495079B2 (ja) 2019-04-03
KR102334121B1 (ko) 2021-12-01

Similar Documents

Publication Publication Date Title
KR102094048B1 (ko) 절삭 장치
US20090036034A1 (en) Semiconductor wafer and processing method for same
JP4502260B2 (ja) スピンナー洗浄装置及びダイシング装置
KR102223587B1 (ko) 플랜지 기구
TWI742239B (zh) 凸緣機構
JP6050626B2 (ja) 切削装置のチャックテーブル機構
TWI660823B (zh) Cutting device
JP6491017B2 (ja) 被加工物の搬送トレー
TWI689376B (zh) 切割盤
JP5976312B2 (ja) ウェーハ保持装置
TWI760488B (zh) 被加工物的切削方法
JP2016042556A (ja) エッジクランプ搬送機構
JP2010050295A (ja) 被加工物の切削方法
JP2010017786A (ja) 保持治具
JP6315455B2 (ja) 環状フレーム
JP5943581B2 (ja) 搬送装置
CN106997864B (zh) 卡盘工作台
JP2015109381A (ja) 洗浄装置および切削装置
TWI815953B (zh) 卡盤台以及晶圓加工方法
JP2014212190A (ja) チャックテーブル
JP7455463B2 (ja) 切削装置
JP2010123805A (ja) 支持装置、支持方法、ダイシング装置、およびダイシング方法
TW202224891A (zh) 切割刀片
JP6291334B2 (ja) 被加工物の加工方法
JP6736217B2 (ja) 切削装置