JP6495079B2 - チャックテーブル - Google Patents
チャックテーブル Download PDFInfo
- Publication number
- JP6495079B2 JP6495079B2 JP2015082376A JP2015082376A JP6495079B2 JP 6495079 B2 JP6495079 B2 JP 6495079B2 JP 2015082376 A JP2015082376 A JP 2015082376A JP 2015082376 A JP2015082376 A JP 2015082376A JP 6495079 B2 JP6495079 B2 JP 6495079B2
- Authority
- JP
- Japan
- Prior art keywords
- magnet
- suction
- mounting surface
- chuck table
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002390 adhesive tape Substances 0.000 claims description 14
- 238000003780 insertion Methods 0.000 claims description 13
- 230000037431 insertion Effects 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 8
- 239000002699 waste material Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/018—Holding the work by suction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
- B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Description
また、磁着力発生部は、載置面130に磁石を露出させないで磁石を配設する構成としたが、載置面130を磁性体で構成しても良い。すなわち、載置面130自体を磁着力発生部としてもよい。
6:分割予定ライン
10,10a:チャックテーブル 11,11a:枠体 12:吸引保持部
120:吸引面 120a:側面 121:吸引源 122:吸引孔
13:フレーム保持手段 130:載置面 131:磁石 132:磁着力発生部
133:底面 134:磁石挿入孔 135:スナップリング 14:接続面
15:切削手段 150:スピンドル 151:切削ブレード 152:ノズル
16:接続面
Claims (1)
- 中央に開口部を有するリングフレームに粘着テープを貼着し該開口部から露出した該粘着テープに板状ワークを貼着して構成されるワークセットを保持するチャックテーブルであって、
板状ワークを吸引する吸引面と、該吸引面を吸引源に連通させる吸引孔と、該吸引面の外周側において該リングフレームを磁着によって保持する載置面を有するフレーム保持手段と、該載置面と面一に形成され該吸引面の外周から垂下する側面の下端に接続されるか、又は、該吸引面の外周と該載置面の内周とに接続され内周側に向かって上昇する傾斜を有する接続面と、を備え、
該フレーム保持手段は、該載置面と、該載置面に該リングフレームを磁着させる磁石と、該載置面において該磁石を露出させずに該載置面に磁着力を作用させる磁着力発生部とを備え、
該磁着力発生部は、該磁石が挿入される磁石挿入孔と、該載置面に該磁着力を作用させるように該磁石挿入部に挿入された該磁石を固定するスナップリングと、
を備えるチャックテーブル。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015082376A JP6495079B2 (ja) | 2015-04-14 | 2015-04-14 | チャックテーブル |
TW105107372A TWI689376B (zh) | 2015-04-14 | 2016-03-10 | 切割盤 |
KR1020160040881A KR102334121B1 (ko) | 2015-04-14 | 2016-04-04 | 척 테이블 |
CN201610230634.5A CN106057725B (zh) | 2015-04-14 | 2016-04-14 | 卡盘台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015082376A JP6495079B2 (ja) | 2015-04-14 | 2015-04-14 | チャックテーブル |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016198870A JP2016198870A (ja) | 2016-12-01 |
JP6495079B2 true JP6495079B2 (ja) | 2019-04-03 |
Family
ID=57256906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015082376A Active JP6495079B2 (ja) | 2015-04-14 | 2015-04-14 | チャックテーブル |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6495079B2 (ja) |
KR (1) | KR102334121B1 (ja) |
CN (1) | CN106057725B (ja) |
TW (1) | TWI689376B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110491808B (zh) * | 2019-08-20 | 2021-08-03 | 湖南艾凯瑞斯智能科技有限公司 | 一种晶圆划片机 |
KR20220162058A (ko) * | 2021-05-31 | 2022-12-07 | 이나리 테크놀로지 에스디엔 비에이치디 | 패키지 레벨의 전자기기 또는 그 일부에 컨포멀 emi 쉴드를 형성하기 위한 시스템, 프로세스, 및 지그 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59123340U (ja) * | 1983-02-09 | 1984-08-20 | 凸版印刷株式会社 | 断裁用チヤツクステ−ジ |
JP4532895B2 (ja) | 2003-12-18 | 2010-08-25 | 株式会社ディスコ | 板状物の切削装置 |
US7776746B2 (en) * | 2007-02-28 | 2010-08-17 | Alpha And Omega Semiconductor Incorporated | Method and apparatus for ultra thin wafer backside processing |
JP2009206166A (ja) * | 2008-02-26 | 2009-09-10 | Renesas Technology Corp | 半導体装置の製造方法 |
JP5888935B2 (ja) * | 2011-10-28 | 2016-03-22 | 株式会社ディスコ | 保持テーブル |
WO2013174744A1 (en) | 2012-05-21 | 2013-11-28 | Bayer Pharma Aktiengesellschaft | Thienopyrimidines |
JP2015109416A (ja) * | 2013-10-21 | 2015-06-11 | 東芝機械株式会社 | チャック装置 |
-
2015
- 2015-04-14 JP JP2015082376A patent/JP6495079B2/ja active Active
-
2016
- 2016-03-10 TW TW105107372A patent/TWI689376B/zh active
- 2016-04-04 KR KR1020160040881A patent/KR102334121B1/ko active IP Right Grant
- 2016-04-14 CN CN201610230634.5A patent/CN106057725B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2016198870A (ja) | 2016-12-01 |
CN106057725A (zh) | 2016-10-26 |
KR102334121B1 (ko) | 2021-12-01 |
CN106057725B (zh) | 2021-11-30 |
TW201707860A (zh) | 2017-03-01 |
KR20160122638A (ko) | 2016-10-24 |
TWI689376B (zh) | 2020-04-01 |
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