TWI687444B - 硬化體、電子零件及顯示元件 - Google Patents

硬化體、電子零件及顯示元件 Download PDF

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Publication number
TWI687444B
TWI687444B TW104137497A TW104137497A TWI687444B TW I687444 B TWI687444 B TW I687444B TW 104137497 A TW104137497 A TW 104137497A TW 104137497 A TW104137497 A TW 104137497A TW I687444 B TWI687444 B TW I687444B
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TW
Taiwan
Prior art keywords
moisture
meth
acrylate
curable resin
resin composition
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Application number
TW104137497A
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English (en)
Chinese (zh)
Other versions
TW201629107A (zh
Inventor
高橋徹
結城彰
木田拓身
Original Assignee
日商積水化學工業股份有限公司
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Publication of TW201629107A publication Critical patent/TW201629107A/zh
Application granted granted Critical
Publication of TWI687444B publication Critical patent/TWI687444B/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • C08G18/10Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/62Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225Polymers of esters of acrylic or methacrylic acid
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Nonlinear Science (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Polymerisation Methods In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
TW104137497A 2014-11-13 2015-11-13 硬化體、電子零件及顯示元件 TWI687444B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2014-230851 2014-11-13
JP2014230851 2014-11-13

Publications (2)

Publication Number Publication Date
TW201629107A TW201629107A (zh) 2016-08-16
TWI687444B true TWI687444B (zh) 2020-03-11

Family

ID=55954482

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104137497A TWI687444B (zh) 2014-11-13 2015-11-13 硬化體、電子零件及顯示元件

Country Status (5)

Country Link
JP (3) JP6023359B2 (ja)
KR (2) KR20210127820A (ja)
CN (1) CN106232634B (ja)
TW (1) TWI687444B (ja)
WO (1) WO2016076407A1 (ja)

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* Cited by examiner, † Cited by third party
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JP7012458B2 (ja) * 2016-05-26 2022-02-14 日本精化株式会社 樹脂基材のハードコート形成用組成物、ハードコートの形成方法およびそれを用いた物品
JP6789014B2 (ja) * 2016-07-05 2020-11-25 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
JP6834609B2 (ja) * 2017-03-07 2021-02-24 デクセリアルズ株式会社 画像表示装置の製造方法
JP7205149B2 (ja) * 2018-10-09 2023-01-17 Dic株式会社 樹脂組成物及び該樹脂組成物から形成される物品
JP7228088B2 (ja) * 2018-10-09 2023-02-24 Dic株式会社 樹脂組成物及び該樹脂組成物から形成される物品
KR20210114953A (ko) * 2019-01-18 2021-09-24 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 및 경화체
JP2020158197A (ja) * 2019-03-28 2020-10-01 オート化学工業株式会社 硬化性組成物の充填方法
WO2021201013A1 (ja) * 2020-04-01 2021-10-07 デンカ株式会社 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法
KR20230113551A (ko) 2020-11-30 2023-07-31 세키스이가가쿠 고교가부시키가이샤 습기 경화성 수지 조성물, 및 전자기기용 접착제

Citations (4)

* Cited by examiner, † Cited by third party
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CN1341133A (zh) * 1999-01-20 2002-03-20 H.B.富勒许可和金融公司 耐水解性极好的透湿气性高的热熔湿固化聚氨酯粘合剂
CN103703087A (zh) * 2011-07-22 2014-04-02 H.B.富勒公司 用在电子器件上的单组分双固化粘合剂
WO2015056717A1 (ja) * 2013-10-18 2015-04-23 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
WO2015190499A1 (ja) * 2014-06-11 2015-12-17 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤

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JP2000178342A (ja) 1998-12-17 2000-06-27 Sumitomo Bakelite Co Ltd 絶縁ペースト
JP2001064543A (ja) * 1999-08-27 2001-03-13 Nippon Shokubai Co Ltd 硬化型被覆材用樹脂組成物
JP4342684B2 (ja) * 2000-03-21 2009-10-14 昭和高分子株式会社 水反応性光硬化性ウレタン樹脂組成物,frpライニング用樹脂組成物,プライマー樹脂組成物及びそれらの硬化方法
JP2004018621A (ja) * 2002-06-14 2004-01-22 Nippon Shokubai Co Ltd ラジカル硬化性ウレタン樹脂組成物
JP2004292622A (ja) 2003-03-26 2004-10-21 Sekisui Chem Co Ltd 硬化性組成物、シーリング材及び接着剤
JP2005290273A (ja) 2004-04-01 2005-10-20 Sekisui Chem Co Ltd 硬化性組成物、シーリング材及び接着剤
JP2005339593A (ja) * 2004-05-24 2005-12-08 Fuji Photo Film Co Ltd 磁気テープおよびその製造方法
US7988987B2 (en) * 2005-01-25 2011-08-02 Boston Scientific Scimed, Inc. Medical devices containing crazed polymeric release regions for drug delivery
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JP5228370B2 (ja) 2007-04-27 2013-07-03 東亞合成株式会社 一液湿気硬化型ウレタン系ホットメルト接着剤組成物及びその使用方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1341133A (zh) * 1999-01-20 2002-03-20 H.B.富勒许可和金融公司 耐水解性极好的透湿气性高的热熔湿固化聚氨酯粘合剂
CN103703087A (zh) * 2011-07-22 2014-04-02 H.B.富勒公司 用在电子器件上的单组分双固化粘合剂
WO2015056717A1 (ja) * 2013-10-18 2015-04-23 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
WO2015190499A1 (ja) * 2014-06-11 2015-12-17 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤

Also Published As

Publication number Publication date
KR20210127820A (ko) 2021-10-22
JP6023359B2 (ja) 2016-11-09
CN106232634B (zh) 2019-08-16
CN106232634A (zh) 2016-12-14
WO2016076407A1 (ja) 2016-05-19
KR20170083964A (ko) 2017-07-19
TW201629107A (zh) 2016-08-16
JPWO2016076407A1 (ja) 2017-04-27
JP6243969B2 (ja) 2017-12-06
JP2018021209A (ja) 2018-02-08
KR102323646B1 (ko) 2021-11-08
JP2016172878A (ja) 2016-09-29

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