TWI679425B - 用於測試頭之接觸式探針 - Google Patents
用於測試頭之接觸式探針 Download PDFInfo
- Publication number
- TWI679425B TWI679425B TW104144231A TW104144231A TWI679425B TW I679425 B TWI679425 B TW I679425B TW 104144231 A TW104144231 A TW 104144231A TW 104144231 A TW104144231 A TW 104144231A TW I679425 B TWI679425 B TW I679425B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact
- contact probe
- layer
- core
- probe
- Prior art date
Links
- 239000000523 sample Substances 0.000 title claims abstract description 166
- 238000012360 testing method Methods 0.000 title claims abstract description 77
- 238000005253 cladding Methods 0.000 claims abstract description 75
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 139
- 239000004020 conductor Substances 0.000 claims description 31
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 24
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 19
- 239000002313 adhesive film Substances 0.000 claims description 18
- 239000010931 gold Substances 0.000 claims description 17
- 229910052703 rhodium Inorganic materials 0.000 claims description 14
- 239000010948 rhodium Substances 0.000 claims description 14
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 14
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 239000011241 protective layer Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910000531 Co alloy Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000012811 non-conductive material Substances 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 229910052741 iridium Inorganic materials 0.000 claims description 3
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 3
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 8
- 229910001080 W alloy Inorganic materials 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000003698 laser cutting Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 230000002500 effect on skin Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229910000914 Mn alloy Inorganic materials 0.000 description 2
- 229910021118 PdCo Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- ZAUUZASCMSWKGX-UHFFFAOYSA-N manganese nickel Chemical compound [Mn].[Ni] ZAUUZASCMSWKGX-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- -1 specifically Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- AZXKALLRCOCGBV-UHFFFAOYSA-N 1-phenyl-2-(propan-2-ylamino)hexan-1-one Chemical compound CCCCC(NC(C)C)C(=O)C1=CC=CC=C1 AZXKALLRCOCGBV-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910003266 NiCo Inorganic materials 0.000 description 1
- 229910003289 NiMn Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910002669 PdNi Inorganic materials 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITMI2014A002286 | 2014-12-30 | ||
| ITMI20142286 | 2014-12-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201629493A TW201629493A (zh) | 2016-08-16 |
| TWI679425B true TWI679425B (zh) | 2019-12-11 |
Family
ID=52633392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104144231A TWI679425B (zh) | 2014-12-30 | 2015-12-29 | 用於測試頭之接觸式探針 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11131690B2 (OSRAM) |
| EP (1) | EP3241028B1 (OSRAM) |
| JP (1) | JP6759213B2 (OSRAM) |
| KR (2) | KR102542154B1 (OSRAM) |
| CN (1) | CN107257928B (OSRAM) |
| PH (1) | PH12017501220B1 (OSRAM) |
| SG (1) | SG11201704433TA (OSRAM) |
| TW (1) | TWI679425B (OSRAM) |
| WO (1) | WO2016107729A1 (OSRAM) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6221031B1 (ja) | 2016-12-16 | 2017-11-01 | 日本電産リード株式会社 | コンタクトプローブ及び電気接続治具 |
| IT201700021397A1 (it) * | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura con migliorate proprietà in frequenza |
| JP7005939B2 (ja) * | 2017-05-25 | 2022-01-24 | 日本電産リード株式会社 | コンタクトプローブ |
| CN109425762B (zh) * | 2017-09-01 | 2021-05-07 | 中华精测科技股份有限公司 | 探针组件及其探针结构 |
| CN109425814B (zh) * | 2017-09-01 | 2021-09-10 | 中华精测科技股份有限公司 | 探针组件及其探针结构 |
| US20190103693A1 (en) * | 2017-09-29 | 2019-04-04 | Apple Inc. | Electrical contacts having sacrificial layer for corrosion protection |
| US11973301B2 (en) | 2018-09-26 | 2024-04-30 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
| US11262383B1 (en) | 2018-09-26 | 2022-03-01 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
| US12181493B2 (en) | 2018-10-26 | 2024-12-31 | Microfabrica Inc. | Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using |
| US12078657B2 (en) | 2019-12-31 | 2024-09-03 | Microfabrica Inc. | Compliant pin probes with extension springs, methods for making, and methods for using |
| WO2020158575A1 (ja) * | 2019-01-29 | 2020-08-06 | 株式会社ヨコオ | プランジャーおよびコンタクトプローブ |
| US12000865B2 (en) | 2019-02-14 | 2024-06-04 | Microfabrica Inc. | Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes |
| TWI714151B (zh) * | 2019-07-01 | 2020-12-21 | 技鼎股份有限公司 | 探針頭及其導電探針 |
| TWI822833B (zh) * | 2019-08-15 | 2023-11-21 | 優顯科技股份有限公司 | 電子探測板、光電探測模組、與電子探測方法 |
| IT201900024889A1 (it) * | 2019-12-19 | 2021-06-19 | Technoprobe Spa | Sonda di contatto per applicazioni ad alta frequenza con migliorata portata di corrente |
| US12196781B2 (en) | 2019-12-31 | 2025-01-14 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes |
| US12196782B2 (en) | 2019-12-31 | 2025-01-14 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes |
| US11867721B1 (en) | 2019-12-31 | 2024-01-09 | Microfabrica Inc. | Probes with multiple springs, methods for making, and methods for using |
| US11761982B1 (en) | 2019-12-31 | 2023-09-19 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact and methods for making such probes |
| CN113109603A (zh) * | 2020-01-13 | 2021-07-13 | 科磊股份有限公司 | 具有多个金属涂层的悬臂式探针 |
| EP3862759B1 (de) * | 2020-02-04 | 2022-05-11 | Heraeus Deutschland GmbH & Co. KG | Manteldraht und verfahren zur herstellung von manteldrähten |
| US12055562B2 (en) * | 2020-03-19 | 2024-08-06 | Nidec Read Corporation | Contact terminal, inspection jig, and inspection apparatus |
| CN111403937A (zh) * | 2020-03-24 | 2020-07-10 | 东莞立德精密工业有限公司 | 金属端子及其制作方法 |
| US11774467B1 (en) | 2020-09-01 | 2023-10-03 | Microfabrica Inc. | Method of in situ modulation of structural material properties and/or template shape |
| CN121831221A (zh) * | 2020-09-15 | 2026-04-10 | 日本电子材料株式会社 | 探针卡 |
| US12146898B2 (en) | 2020-10-02 | 2024-11-19 | Microfabrica Inc. | Multi-beam probes with decoupled structural and current carrying beams and methods of making |
| KR102517778B1 (ko) * | 2021-02-26 | 2023-04-04 | (주)포인트엔지니어링 | 전기 전도성 접촉핀 어셈블리 및 그 제조방법 |
| TW202244282A (zh) * | 2021-03-26 | 2022-11-16 | 日商石福金屬興業股份有限公司 | 探測針用合金材料 |
| KR102549551B1 (ko) * | 2021-04-06 | 2023-06-29 | (주)포인트엔지니어링 | 전기 전도성 접촉핀, 이를 구비하는 검사장치 및 전기 전도성 접촉핀의 제조방법 |
| KR102577539B1 (ko) * | 2021-04-09 | 2023-09-12 | (주)포인트엔지니어링 | 전기 전도성 접촉핀 및 이의 제조방법 |
| KR102321083B1 (ko) * | 2021-07-21 | 2021-11-03 | (주)새한마이크로텍 | 접촉 프로브 |
| CN113507005A (zh) * | 2021-08-10 | 2021-10-15 | 烟台艾睿光电科技有限公司 | 一种巡检机器人充电房及巡检机器人 |
| CN114791517B (zh) * | 2022-04-18 | 2025-06-03 | 苏州伊欧陆系统集成有限公司 | 一种低漏电耐高温陶瓷刀片测试探针 |
| KR102763456B1 (ko) * | 2022-05-11 | 2025-02-07 | (주)티에스이 | 프로브 팁의 제조 방법 및 이에 의해 제조된 프로브 팁 |
| TW202424495A (zh) * | 2022-08-15 | 2024-06-16 | 美商微製造股份有限公司 | 具有解耦結構及電流乘載梁的多梁探針 |
| EP4325227B1 (de) | 2022-08-16 | 2025-10-01 | Heraeus Precious Metals GmbH & Co. KG | Bandförmiger verbundwerkstoff für prüfnadeln |
| JP2024070404A (ja) * | 2022-11-11 | 2024-05-23 | 株式会社日本マイクロニクス | プローブおよび電気的接続装置 |
| JP2024081055A (ja) * | 2022-12-05 | 2024-06-17 | 株式会社日本マイクロニクス | プローブおよび電気的接続装置 |
| JP2024082419A (ja) * | 2022-12-08 | 2024-06-20 | 株式会社日本マイクロニクス | プローブ |
| DE102023110670B4 (de) * | 2023-04-26 | 2025-08-21 | Pac Tech - Packaging Technologies Gmbh | Prüfkontakt, Vorrichtung und Verfahren zur vereinfachten Aufnahme eines Prüfkontakts durch aktive Vorausrichtung mittels elektromagnetischer Manipulation |
| JP2025117043A (ja) * | 2024-01-30 | 2025-08-12 | 株式会社日本マイクロニクス | プローブおよび電気的接続装置 |
| CN120405195B (zh) * | 2025-05-09 | 2026-01-02 | 芯卓科技(浙江)有限公司 | 测试探针、探针卡和测试探针制造方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04351968A (ja) * | 1991-05-29 | 1992-12-07 | Vacuum Metallurgical Co Ltd | プローブ |
| JPH11160355A (ja) * | 1997-11-28 | 1999-06-18 | Mitsubishi Materials Corp | コンタクトプローブ |
| WO2000079293A1 (en) * | 1999-06-22 | 2000-12-28 | International Test Solutions, Inc. | Probe device using superelastic probe elements |
| JP2003057266A (ja) * | 2001-08-20 | 2003-02-26 | Mitsubishi Materials Corp | コンタクトプローブ及びその製造方法 |
| EP2060921A1 (en) * | 2007-11-16 | 2009-05-20 | Technoprobe S.p.A | Contact probe for testing head having vertical probes and related testing head for testing microstructure electric performance |
| CN100520414C (zh) * | 2004-12-14 | 2009-07-29 | 株式会社爱德万测试 | 触针以及探针板 |
| US20120176122A1 (en) * | 2010-03-30 | 2012-07-12 | Yoshihiro Hirata | Contact probe, linked body of contact probes, and manufacturing methods thereof |
| CN103063883A (zh) * | 2011-10-21 | 2013-04-24 | 东京毅力科创株式会社 | 探针卡用接触端子和探针卡 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3215452B2 (ja) * | 1991-05-30 | 2001-10-09 | 真空冶金株式会社 | 電 極 |
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- 2015-12-14 WO PCT/EP2015/079544 patent/WO2016107729A1/en not_active Ceased
- 2015-12-14 EP EP15823139.9A patent/EP3241028B1/en active Active
- 2015-12-14 CN CN201580070711.9A patent/CN107257928B/zh active Active
- 2015-12-14 KR KR1020227037896A patent/KR102542154B1/ko active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2016107729A1 (en) | 2016-07-07 |
| PH12017501220A1 (en) | 2018-01-08 |
| KR20220153661A (ko) | 2022-11-18 |
| CN107257928B (zh) | 2020-12-01 |
| PH12017501220B1 (en) | 2020-11-18 |
| CN107257928A (zh) | 2017-10-17 |
| US20170307657A1 (en) | 2017-10-26 |
| TW201629493A (zh) | 2016-08-16 |
| EP3241028A1 (en) | 2017-11-08 |
| KR102542154B1 (ko) | 2023-06-13 |
| KR20170107465A (ko) | 2017-09-25 |
| EP3241028B1 (en) | 2020-02-05 |
| KR102502965B1 (ko) | 2023-02-23 |
| SG11201704433TA (en) | 2017-07-28 |
| JP2018501490A (ja) | 2018-01-18 |
| US11131690B2 (en) | 2021-09-28 |
| JP6759213B2 (ja) | 2020-09-23 |
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