TWI674654B - 用以接合裸晶片晶粒之方法 - Google Patents

用以接合裸晶片晶粒之方法 Download PDF

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Publication number
TWI674654B
TWI674654B TW102140687A TW102140687A TWI674654B TW I674654 B TWI674654 B TW I674654B TW 102140687 A TW102140687 A TW 102140687A TW 102140687 A TW102140687 A TW 102140687A TW I674654 B TWI674654 B TW I674654B
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Taiwan
Prior art keywords
connection pad
substrate
pad structure
bonding
connection
Prior art date
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TW102140687A
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English (en)
Chinese (zh)
Other versions
TW201426920A (zh
Inventor
艾德斯格Ｃ Ｐ 史密茲
Edsger Constant Pieter Smits
桑迪普Ｍ 珀英曲瑞
Sandeep Menon Perinchery
傑若恩 凡德布蘭德
Jeroen Van Den Brand
拉節許 曼丹帕朗皮
Rajesh Mandamparambil
哈瑪納斯Ｆ Ｍ 西后
Harmannus Franciscus Maria Schoo
Original Assignee
荷蘭商荷蘭Ｔｎｏ自然科學組織公司
Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno
校際微電子研究中心
Imec Vzw
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Application filed by 荷蘭商荷蘭Ｔｎｏ自然科學組織公司, Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno, 校際微電子研究中心, Imec Vzw filed Critical 荷蘭商荷蘭Ｔｎｏ自然科學組織公司
Publication of TW201426920A publication Critical patent/TW201426920A/zh
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Publication of TWI674654B publication Critical patent/TWI674654B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
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    • H10H20/80—Constructional details
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    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
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    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
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    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
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    • H10W72/011—Apparatus therefor
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    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/01212—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps at a different location than on the final device, e.g. forming as prepeg
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    • H10W72/01225—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using local deposition in solid form, e.g. by using a powder or by stud bumping
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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TW102140687A 2012-11-09 2013-11-08 用以接合裸晶片晶粒之方法 TWI674654B (zh)

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JP6283679B2 (ja) 2018-02-21
KR20150106875A (ko) 2015-09-22
TW201426920A (zh) 2014-07-01
US9859247B2 (en) 2018-01-02
CN104854686B (zh) 2018-11-27
EP2917931B1 (en) 2023-08-02
CN104854686A (zh) 2015-08-19
WO2014073963A1 (en) 2014-05-15
EP2917931A1 (en) 2015-09-16
JP2015534285A (ja) 2015-11-26
KR102160321B1 (ko) 2020-09-28
US20150294951A1 (en) 2015-10-15
EP2731126A1 (en) 2014-05-14

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