TWI674230B - 電子零件搬送裝置及電子零件檢查裝置 - Google Patents
電子零件搬送裝置及電子零件檢查裝置 Download PDFInfo
- Publication number
- TWI674230B TWI674230B TW106117561A TW106117561A TWI674230B TW I674230 B TWI674230 B TW I674230B TW 106117561 A TW106117561 A TW 106117561A TW 106117561 A TW106117561 A TW 106117561A TW I674230 B TWI674230 B TW I674230B
- Authority
- TW
- Taiwan
- Prior art keywords
- holding
- holding portion
- electronic component
- light
- suction nozzle
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 121
- 238000001514 detection method Methods 0.000 claims abstract description 77
- 238000003780 insertion Methods 0.000 claims description 43
- 230000037431 insertion Effects 0.000 claims description 43
- 238000011084 recovery Methods 0.000 claims description 37
- 238000012546 transfer Methods 0.000 abstract description 147
- 230000008859 change Effects 0.000 abstract description 8
- 230000007246 mechanism Effects 0.000 description 33
- 238000005192 partition Methods 0.000 description 10
- 230000032258 transport Effects 0.000 description 10
- 238000004064 recycling Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002791 soaking Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP??2016-109812 | 2016-06-01 | ||
| JP2016109812A JP6903267B2 (ja) | 2016-06-01 | 2016-06-01 | 電子部品搬送装置および電子部品検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201742809A TW201742809A (zh) | 2017-12-16 |
| TWI674230B true TWI674230B (zh) | 2019-10-11 |
Family
ID=60486935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106117561A TWI674230B (zh) | 2016-06-01 | 2017-05-26 | 電子零件搬送裝置及電子零件檢查裝置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6903267B2 (enExample) |
| CN (1) | CN107450011B (enExample) |
| TW (1) | TWI674230B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019164099A (ja) * | 2018-03-20 | 2019-09-26 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
| JP2020193902A (ja) * | 2019-05-29 | 2020-12-03 | セイコーエプソン株式会社 | 電子部品搬送装置、判断方法、および電子部品検査装置 |
| TWI767736B (zh) * | 2021-06-03 | 2022-06-11 | 鴻勁精密股份有限公司 | 校正裝置、校正方法及其應用之作業機 |
| TWI791270B (zh) * | 2021-08-23 | 2023-02-01 | 鴻勁精密股份有限公司 | 校正裝置、校正方法及其應用之作業機 |
| TWI777740B (zh) * | 2021-08-23 | 2022-09-11 | 鴻勁精密股份有限公司 | 校正裝置、校正方法及其應用之作業機 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011159964A (ja) * | 2010-01-06 | 2011-08-18 | Juki Corp | 電子部品実装装置 |
| TW201144837A (en) * | 2010-05-14 | 2011-12-16 | Seiko Epson Corp | Electronic component testing device and electronic component transport method |
| TW201612536A (en) * | 2014-09-30 | 2016-04-01 | Seiko Epson Corp | Electronic component conveying device and electronic component testing device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4634204B2 (ja) * | 2005-04-05 | 2011-02-16 | Ｊｕｋｉ株式会社 | 電子部品実装装置 |
| DE112006001825T5 (de) * | 2005-07-08 | 2008-05-21 | Matsushita Electric Industrial Co., Ltd., Kadoma | Elektronikbauteilmontagevorrichtung, Höhenerfassungsverfahren für elektronische Bauteile, und Optikachsenanpassungsverfahren für eine Bauteilhöhenerfassungseinheit |
| CN102118961B (zh) * | 2010-01-06 | 2015-09-16 | Juki株式会社 | 电子部件安装装置 |
| JP2014010018A (ja) * | 2012-06-28 | 2014-01-20 | Seiko Epson Corp | ハンドラーおよび検査装置 |
| JP6220566B2 (ja) * | 2013-06-07 | 2017-10-25 | 株式会社 Ｓｙｎａｘ | 電子部品の搬送装置 |
| JP6435099B2 (ja) * | 2014-02-26 | 2018-12-05 | Juki株式会社 | 電子部品実装装置及び電子部品実装方法 |
-
2016
- 2016-06-01 JP JP2016109812A patent/JP6903267B2/ja active Active
-
2017
- 2017-05-23 CN CN201710371150.7A patent/CN107450011B/zh active Active
- 2017-05-26 TW TW106117561A patent/TWI674230B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011159964A (ja) * | 2010-01-06 | 2011-08-18 | Juki Corp | 電子部品実装装置 |
| TW201144837A (en) * | 2010-05-14 | 2011-12-16 | Seiko Epson Corp | Electronic component testing device and electronic component transport method |
| TW201612536A (en) * | 2014-09-30 | 2016-04-01 | Seiko Epson Corp | Electronic component conveying device and electronic component testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6903267B2 (ja) | 2021-07-14 |
| CN107450011A (zh) | 2017-12-08 |
| JP2017215228A (ja) | 2017-12-07 |
| CN107450011B (zh) | 2020-04-24 |
| TW201742809A (zh) | 2017-12-16 |
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