TWI668259B - Resin composition and flux - Google Patents

Resin composition and flux Download PDF

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Publication number
TWI668259B
TWI668259B TW104134164A TW104134164A TWI668259B TW I668259 B TWI668259 B TW I668259B TW 104134164 A TW104134164 A TW 104134164A TW 104134164 A TW104134164 A TW 104134164A TW I668259 B TWI668259 B TW I668259B
Authority
TW
Taiwan
Prior art keywords
flux
mass
thermosetting resin
hydroxycarboxylic acid
acid
Prior art date
Application number
TW104134164A
Other languages
English (en)
Chinese (zh)
Other versions
TW201629135A (zh
Inventor
丸子大介
高橋淳美
吉田貴行
Original Assignee
日商千住金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商千住金屬工業股份有限公司 filed Critical 日商千住金屬工業股份有限公司
Publication of TW201629135A publication Critical patent/TW201629135A/zh
Application granted granted Critical
Publication of TWI668259B publication Critical patent/TWI668259B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3236—Heterocylic compounds
    • C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/06—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
TW104134164A 2014-10-31 2015-10-19 Resin composition and flux TWI668259B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014223126A JP6374298B2 (ja) 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法
JP2014-223126 2014-10-31

Publications (2)

Publication Number Publication Date
TW201629135A TW201629135A (zh) 2016-08-16
TWI668259B true TWI668259B (zh) 2019-08-11

Family

ID=55857260

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104134164A TWI668259B (zh) 2014-10-31 2015-10-19 Resin composition and flux

Country Status (7)

Country Link
US (1) US10160827B2 (enExample)
EP (1) EP3214138A4 (enExample)
JP (1) JP6374298B2 (enExample)
KR (1) KR20170077187A (enExample)
CN (1) CN107109071A (enExample)
TW (1) TWI668259B (enExample)
WO (1) WO2016067919A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3741498B1 (en) * 2018-01-16 2023-08-02 Senju Metal Industry Co., Ltd Flux and solder paste
JP7704136B2 (ja) * 2020-02-12 2025-07-08 株式会社レゾナック 導電性接着剤組成物、及び、接続構造体を製造する方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012072213A (ja) * 2010-09-27 2012-04-12 Panasonic Corp 熱硬化性樹脂組成物及び半導体部品実装基板
CN103517782A (zh) * 2011-05-25 2014-01-15 播磨化成株式会社 焊膏用焊剂和焊膏

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4988395A (en) 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
JP2646394B2 (ja) 1989-06-15 1997-08-27 千住金属工業株式会社 水溶性はんだ付け用フラックス
US5177134A (en) 1990-12-03 1993-01-05 Motorola, Inc. Tacking agent
CA2196024A1 (en) * 1996-02-28 1997-08-28 Craig N. Ernsberger Multilayer electronic assembly utilizing a sinterable composition and related method of forming
US20060194064A1 (en) 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US7037399B2 (en) * 2002-03-01 2006-05-02 National Starch And Chemical Investment Holding Corporation Underfill encapsulant for wafer packaging and method for its application
JP4211828B2 (ja) 2006-09-12 2009-01-21 株式会社日立製作所 実装構造体
CN101062536A (zh) * 2007-06-01 2007-10-31 中南大学 无铅焊锡用无卤素免清洗助焊剂
JP5842084B2 (ja) * 2010-09-27 2016-01-13 パナソニックＩｐマネジメント株式会社 半導体部品実装基板
JP5853146B2 (ja) * 2011-08-24 2016-02-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物及び回路基板
JP2013256584A (ja) * 2012-06-12 2013-12-26 Panasonic Corp 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012072213A (ja) * 2010-09-27 2012-04-12 Panasonic Corp 熱硬化性樹脂組成物及び半導体部品実装基板
CN103517782A (zh) * 2011-05-25 2014-01-15 播磨化成株式会社 焊膏用焊剂和焊膏

Also Published As

Publication number Publication date
US10160827B2 (en) 2018-12-25
US20170321000A1 (en) 2017-11-09
CN107109071A (zh) 2017-08-29
WO2016067919A1 (ja) 2016-05-06
EP3214138A4 (en) 2018-06-06
JP6374298B2 (ja) 2018-08-15
KR20170077187A (ko) 2017-07-05
EP3214138A1 (en) 2017-09-06
JP2016088993A (ja) 2016-05-23
TW201629135A (zh) 2016-08-16

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