JP6374298B2 - フラックス及びフラックスを用いた接合方法 - Google Patents

フラックス及びフラックスを用いた接合方法 Download PDF

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Publication number
JP6374298B2
JP6374298B2 JP2014223126A JP2014223126A JP6374298B2 JP 6374298 B2 JP6374298 B2 JP 6374298B2 JP 2014223126 A JP2014223126 A JP 2014223126A JP 2014223126 A JP2014223126 A JP 2014223126A JP 6374298 B2 JP6374298 B2 JP 6374298B2
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JP
Japan
Prior art keywords
flux
acid
hydroxycarboxylic acid
mass
thermosetting resin
Prior art date
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Application number
JP2014223126A
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English (en)
Japanese (ja)
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JP2016088993A5 (enExample
JP2016088993A (ja
Inventor
大介 丸子
大介 丸子
淳美 高橋
淳美 高橋
吉田　貴行
貴行 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2014223126A priority Critical patent/JP6374298B2/ja
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to US15/522,883 priority patent/US10160827B2/en
Priority to PCT/JP2015/079026 priority patent/WO2016067919A1/ja
Priority to EP15855383.4A priority patent/EP3214138A4/en
Priority to KR1020177014328A priority patent/KR20170077187A/ko
Priority to CN201580059362.0A priority patent/CN107109071A/zh
Priority to TW104134164A priority patent/TWI668259B/zh
Publication of JP2016088993A publication Critical patent/JP2016088993A/ja
Publication of JP2016088993A5 publication Critical patent/JP2016088993A5/ja
Application granted granted Critical
Publication of JP6374298B2 publication Critical patent/JP6374298B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3236—Heterocylic compounds
    • C08G59/3245—Heterocylic compounds containing only nitrogen as a heteroatom
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/423—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/06—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
JP2014223126A 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法 Active JP6374298B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014223126A JP6374298B2 (ja) 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法
PCT/JP2015/079026 WO2016067919A1 (ja) 2014-10-31 2015-10-14 樹脂組成物及びフラックス
EP15855383.4A EP3214138A4 (en) 2014-10-31 2015-10-14 Resin composition and flux
KR1020177014328A KR20170077187A (ko) 2014-10-31 2015-10-14 수지 조성물 및 플럭스
US15/522,883 US10160827B2 (en) 2014-10-31 2015-10-14 Resin composition and flux
CN201580059362.0A CN107109071A (zh) 2014-10-31 2015-10-14 树脂组合物及助焊剂
TW104134164A TWI668259B (zh) 2014-10-31 2015-10-19 Resin composition and flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014223126A JP6374298B2 (ja) 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法

Publications (3)

Publication Number Publication Date
JP2016088993A JP2016088993A (ja) 2016-05-23
JP2016088993A5 JP2016088993A5 (enExample) 2017-06-01
JP6374298B2 true JP6374298B2 (ja) 2018-08-15

Family

ID=55857260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014223126A Active JP6374298B2 (ja) 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法

Country Status (7)

Country Link
US (1) US10160827B2 (enExample)
EP (1) EP3214138A4 (enExample)
JP (1) JP6374298B2 (enExample)
KR (1) KR20170077187A (enExample)
CN (1) CN107109071A (enExample)
TW (1) TWI668259B (enExample)
WO (1) WO2016067919A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3741498B1 (en) * 2018-01-16 2023-08-02 Senju Metal Industry Co., Ltd Flux and solder paste
JP7704136B2 (ja) * 2020-02-12 2025-07-08 株式会社レゾナック 導電性接着剤組成物、及び、接続構造体を製造する方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4988395A (en) 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
JP2646394B2 (ja) 1989-06-15 1997-08-27 千住金属工業株式会社 水溶性はんだ付け用フラックス
US5177134A (en) 1990-12-03 1993-01-05 Motorola, Inc. Tacking agent
CA2196024A1 (en) * 1996-02-28 1997-08-28 Craig N. Ernsberger Multilayer electronic assembly utilizing a sinterable composition and related method of forming
US20060194064A1 (en) 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US7037399B2 (en) * 2002-03-01 2006-05-02 National Starch And Chemical Investment Holding Corporation Underfill encapsulant for wafer packaging and method for its application
JP4211828B2 (ja) 2006-09-12 2009-01-21 株式会社日立製作所 実装構造体
CN101062536A (zh) * 2007-06-01 2007-10-31 中南大学 无铅焊锡用无卤素免清洗助焊剂
JP5588287B2 (ja) * 2010-09-27 2014-09-10 パナソニック株式会社 熱硬化性樹脂組成物及び半導体部品実装基板
JP5842084B2 (ja) * 2010-09-27 2016-01-13 パナソニックＩｐマネジメント株式会社 半導体部品実装基板
JP4897932B1 (ja) * 2011-05-25 2012-03-14 ハリマ化成株式会社 はんだペースト用フラックスおよびはんだペースト
JP5853146B2 (ja) * 2011-08-24 2016-02-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物及び回路基板
JP2013256584A (ja) * 2012-06-12 2013-12-26 Panasonic Corp 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置

Also Published As

Publication number Publication date
US10160827B2 (en) 2018-12-25
US20170321000A1 (en) 2017-11-09
CN107109071A (zh) 2017-08-29
TWI668259B (zh) 2019-08-11
WO2016067919A1 (ja) 2016-05-06
EP3214138A4 (en) 2018-06-06
KR20170077187A (ko) 2017-07-05
EP3214138A1 (en) 2017-09-06
JP2016088993A (ja) 2016-05-23
TW201629135A (zh) 2016-08-16

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