JP2016088993A5 - - Google Patents

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Publication number
JP2016088993A5
JP2016088993A5 JP2014223126A JP2014223126A JP2016088993A5 JP 2016088993 A5 JP2016088993 A5 JP 2016088993A5 JP 2014223126 A JP2014223126 A JP 2014223126A JP 2014223126 A JP2014223126 A JP 2014223126A JP 2016088993 A5 JP2016088993 A5 JP 2016088993A5
Authority
JP
Japan
Prior art keywords
acid
epoxy resin
flux
hydroxycarboxylic
hydroxycarboxylic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014223126A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016088993A (ja
JP6374298B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014223126A external-priority patent/JP6374298B2/ja
Priority to JP2014223126A priority Critical patent/JP6374298B2/ja
Priority to PCT/JP2015/079026 priority patent/WO2016067919A1/ja
Priority to EP15855383.4A priority patent/EP3214138A4/en
Priority to US15/522,883 priority patent/US10160827B2/en
Priority to CN201580059362.0A priority patent/CN107109071A/zh
Priority to KR1020177014328A priority patent/KR20170077187A/ko
Priority to TW104134164A priority patent/TWI668259B/zh
Publication of JP2016088993A publication Critical patent/JP2016088993A/ja
Publication of JP2016088993A5 publication Critical patent/JP2016088993A5/ja
Publication of JP6374298B2 publication Critical patent/JP6374298B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014223126A 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法 Active JP6374298B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014223126A JP6374298B2 (ja) 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法
CN201580059362.0A CN107109071A (zh) 2014-10-31 2015-10-14 树脂组合物及助焊剂
EP15855383.4A EP3214138A4 (en) 2014-10-31 2015-10-14 Resin composition and flux
US15/522,883 US10160827B2 (en) 2014-10-31 2015-10-14 Resin composition and flux
PCT/JP2015/079026 WO2016067919A1 (ja) 2014-10-31 2015-10-14 樹脂組成物及びフラックス
KR1020177014328A KR20170077187A (ko) 2014-10-31 2015-10-14 수지 조성물 및 플럭스
TW104134164A TWI668259B (zh) 2014-10-31 2015-10-19 Resin composition and flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014223126A JP6374298B2 (ja) 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法

Publications (3)

Publication Number Publication Date
JP2016088993A JP2016088993A (ja) 2016-05-23
JP2016088993A5 true JP2016088993A5 (enExample) 2017-06-01
JP6374298B2 JP6374298B2 (ja) 2018-08-15

Family

ID=55857260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014223126A Active JP6374298B2 (ja) 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法

Country Status (7)

Country Link
US (1) US10160827B2 (enExample)
EP (1) EP3214138A4 (enExample)
JP (1) JP6374298B2 (enExample)
KR (1) KR20170077187A (enExample)
CN (1) CN107109071A (enExample)
TW (1) TWI668259B (enExample)
WO (1) WO2016067919A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY197946A (en) 2018-01-16 2023-07-25 Senju Metal Industry Co Flux and solder paste
WO2021161963A1 (ja) * 2020-02-12 2021-08-19 昭和電工マテリアルズ株式会社 導電性接着剤組成物、及び、接続構造体を製造する方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4988395A (en) * 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
JP2646394B2 (ja) 1989-06-15 1997-08-27 千住金属工業株式会社 水溶性はんだ付け用フラックス
US5177134A (en) 1990-12-03 1993-01-05 Motorola, Inc. Tacking agent
CA2196024A1 (en) * 1996-02-28 1997-08-28 Craig N. Ernsberger Multilayer electronic assembly utilizing a sinterable composition and related method of forming
US20060194064A1 (en) 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US7037399B2 (en) 2002-03-01 2006-05-02 National Starch And Chemical Investment Holding Corporation Underfill encapsulant for wafer packaging and method for its application
JP4211828B2 (ja) 2006-09-12 2009-01-21 株式会社日立製作所 実装構造体
CN101062536A (zh) * 2007-06-01 2007-10-31 中南大学 无铅焊锡用无卤素免清洗助焊剂
JP5588287B2 (ja) * 2010-09-27 2014-09-10 パナソニック株式会社 熱硬化性樹脂組成物及び半導体部品実装基板
JP5842084B2 (ja) * 2010-09-27 2016-01-13 パナソニックＩｐマネジメント株式会社 半導体部品実装基板
JP4897932B1 (ja) * 2011-05-25 2012-03-14 ハリマ化成株式会社 はんだペースト用フラックスおよびはんだペースト
JP5853146B2 (ja) * 2011-08-24 2016-02-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物及び回路基板
JP2013256584A (ja) 2012-06-12 2013-12-26 Panasonic Corp 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置

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