TWI652281B - 含有光產鹼劑的光可成像聚烯烴組成物 - Google Patents

含有光產鹼劑的光可成像聚烯烴組成物 Download PDF

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Publication number
TWI652281B
TWI652281B TW105103252A TW105103252A TWI652281B TW I652281 B TWI652281 B TW I652281B TW 105103252 A TW105103252 A TW 105103252A TW 105103252 A TW105103252 A TW 105103252A TW I652281 B TWI652281 B TW I652281B
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TW
Taiwan
Prior art keywords
formula
composition
alkyl
group
film
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TW105103252A
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English (en)
Chinese (zh)
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TW201634502A (zh
Inventor
帕拉蒙 崁達那拉曲奇
Pramod Kandanarachchi
拉里 羅得思
Larry Rhodes
漢德拉 恩
Hendra Ng
偉 鄭
Wei Zhang
布萊恩 納普
Brian Knapp
Original Assignee
日商住友電木股份有限公司
Sumitomo Bakelite Co., Ltd.
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Application filed by 日商住友電木股份有限公司, Sumitomo Bakelite Co., Ltd. filed Critical 日商住友電木股份有限公司
Publication of TW201634502A publication Critical patent/TW201634502A/zh
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Publication of TWI652281B publication Critical patent/TWI652281B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW105103252A 2015-02-18 2016-02-02 含有光產鹼劑的光可成像聚烯烴組成物 TWI652281B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562117774P 2015-02-18 2015-02-18
US62/117,774 2015-02-18

Publications (2)

Publication Number Publication Date
TW201634502A TW201634502A (zh) 2016-10-01
TWI652281B true TWI652281B (zh) 2019-03-01

Family

ID=55487111

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105103252A TWI652281B (zh) 2015-02-18 2016-02-02 含有光產鹼劑的光可成像聚烯烴組成物

Country Status (6)

Country Link
US (3) US9952507B2 (https=)
JP (1) JP6513208B2 (https=)
KR (1) KR101998338B1 (https=)
CN (1) CN107407872B (https=)
TW (1) TWI652281B (https=)
WO (1) WO2016133795A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180088652A (ko) * 2015-11-30 2018-08-06 프로메러스, 엘엘씨 광산발생제 및 염기 함유 영구유전체조성물
TWI732111B (zh) * 2017-03-28 2021-07-01 日商住友電木股份有限公司 感光性組成物、彩色濾光片及由其衍生之微透鏡
TWI758525B (zh) 2017-08-10 2022-03-21 日商住友電木股份有限公司 作為光學材料之聚環烯烴聚合物組成物
WO2021076131A1 (en) * 2019-10-17 2021-04-22 Promerus, Llc Photosensitive compositions and applications thereof
TWI834019B (zh) * 2020-01-09 2024-03-01 日商住友電木股份有限公司 作為3d列印材料之穩定本體聚合型多環烯烴組成物及其製備方法

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US5563011A (en) * 1993-04-21 1996-10-08 Shipley Company Inc. Color filter assembly
JP4054477B2 (ja) * 1998-04-08 2008-02-27 キヤノン株式会社 同一相手に対して複数の通信チャネルを用いた通信を行なうことが可能な通信装置、及びその制御方法
US6849377B2 (en) * 1998-09-23 2005-02-01 E. I. Du Pont De Nemours And Company Photoresists, polymers and processes for microlithography
KR100481601B1 (ko) * 1999-09-21 2005-04-08 주식회사 하이닉스반도체 광산 발생제와 함께 광염기 발생제를 포함하는 포토레지스트 조성물
AU1603101A (en) * 1999-11-17 2001-05-30 E.I. Du Pont De Nemours And Company Nitrile/fluoroalcohol-containing photoresists and associated processes for microlithography
EP1246013A3 (en) * 2001-03-30 2003-11-19 E.I. Du Pont De Nemours And Company Photoresists, polymers and processes for microlithography
US6737215B2 (en) * 2001-05-11 2004-05-18 Clariant Finance (Bvi) Ltd Photoresist composition for deep ultraviolet lithography
US8030425B2 (en) * 2002-07-03 2011-10-04 Promerus Llc Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
CN101031595A (zh) * 2003-10-31 2007-09-05 普罗米鲁斯有限责任公司 用于环烯烃潜聚合的单组分阳离子钯前引发剂
KR101252321B1 (ko) * 2005-06-30 2013-04-08 도레이 카부시키가이샤 감광성 수지 조성물 및 접착 개량제
WO2010113813A1 (ja) * 2009-03-31 2010-10-07 大日本印刷株式会社 塩基発生剤、感光性樹脂組成物、当該感光性樹脂組成物からなるパターン形成用材料、当該感光性樹脂組成物を用いたパターン形成方法並びに物品
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JP5803957B2 (ja) * 2013-03-05 2015-11-04 信越化学工業株式会社 パターン形成方法及びレジスト組成物
WO2014176490A1 (en) * 2013-04-26 2014-10-30 Promerus, Llc Photosensitive compositions and applications thereof
JP2015007770A (ja) * 2013-05-29 2015-01-15 住友ベークライト株式会社 感光性樹脂組成物および電子装置
JP6369132B2 (ja) * 2013-06-28 2018-08-08 住友ベークライト株式会社 ネガ型感光性樹脂組成物、硬化膜、電子装置およびポリマー
JP6306296B2 (ja) 2013-07-09 2018-04-04 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板
WO2015038412A2 (en) * 2013-09-16 2015-03-19 Promerus, Llc Amine treated maleic anhydride polymers with pendent silyl group, compositions and applications thereof
JP2015184325A (ja) * 2014-03-20 2015-10-22 住友ベークライト株式会社 感光性樹脂組成物および電子装置
KR20180088652A (ko) * 2015-11-30 2018-08-06 프로메러스, 엘엘씨 광산발생제 및 염기 함유 영구유전체조성물

Also Published As

Publication number Publication date
JP6513208B2 (ja) 2019-05-15
WO2016133795A1 (en) 2016-08-25
TW201634502A (zh) 2016-10-01
US20160238932A1 (en) 2016-08-18
US10634998B2 (en) 2020-04-28
CN107407872A (zh) 2017-11-28
US20180203349A1 (en) 2018-07-19
KR101998338B1 (ko) 2019-10-01
JP2018508824A (ja) 2018-03-29
CN107407872B (zh) 2020-08-07
US10409160B2 (en) 2019-09-10
KR20170117468A (ko) 2017-10-23
US9952507B2 (en) 2018-04-24
US20190369492A1 (en) 2019-12-05

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