KR101998338B1 - 광염기 발생제를 함유하는 광이미지화 가능한 폴리올레핀 조성물 - Google Patents
광염기 발생제를 함유하는 광이미지화 가능한 폴리올레핀 조성물 Download PDFInfo
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- KR101998338B1 KR101998338B1 KR1020177025264A KR20177025264A KR101998338B1 KR 101998338 B1 KR101998338 B1 KR 101998338B1 KR 1020177025264 A KR1020177025264 A KR 1020177025264A KR 20177025264 A KR20177025264 A KR 20177025264A KR 101998338 B1 KR101998338 B1 KR 101998338B1
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- South Korea
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562117774P | 2015-02-18 | 2015-02-18 | |
| US62/117,774 | 2015-02-18 | ||
| PCT/US2016/017656 WO2016133795A1 (en) | 2015-02-18 | 2016-02-12 | Photoimageable polyolefin compositions containing photobase generators |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20170117468A KR20170117468A (ko) | 2017-10-23 |
| KR101998338B1 true KR101998338B1 (ko) | 2019-10-01 |
Family
ID=55487111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177025264A Active KR101998338B1 (ko) | 2015-02-18 | 2016-02-12 | 광염기 발생제를 함유하는 광이미지화 가능한 폴리올레핀 조성물 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US9952507B2 (https=) |
| JP (1) | JP6513208B2 (https=) |
| KR (1) | KR101998338B1 (https=) |
| CN (1) | CN107407872B (https=) |
| TW (1) | TWI652281B (https=) |
| WO (1) | WO2016133795A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180088652A (ko) * | 2015-11-30 | 2018-08-06 | 프로메러스, 엘엘씨 | 광산발생제 및 염기 함유 영구유전체조성물 |
| TWI732111B (zh) * | 2017-03-28 | 2021-07-01 | 日商住友電木股份有限公司 | 感光性組成物、彩色濾光片及由其衍生之微透鏡 |
| TWI758525B (zh) | 2017-08-10 | 2022-03-21 | 日商住友電木股份有限公司 | 作為光學材料之聚環烯烴聚合物組成物 |
| WO2021076131A1 (en) * | 2019-10-17 | 2021-04-22 | Promerus, Llc | Photosensitive compositions and applications thereof |
| TWI834019B (zh) * | 2020-01-09 | 2024-03-01 | 日商住友電木股份有限公司 | 作為3d列印材料之穩定本體聚合型多環烯烴組成物及其製備方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015007770A (ja) * | 2013-05-29 | 2015-01-15 | 住友ベークライト株式会社 | 感光性樹脂組成物および電子装置 |
| JP2015018049A (ja) | 2013-07-09 | 2015-01-29 | 太陽インキ製造株式会社 | 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5563011A (en) * | 1993-04-21 | 1996-10-08 | Shipley Company Inc. | Color filter assembly |
| JP4054477B2 (ja) * | 1998-04-08 | 2008-02-27 | キヤノン株式会社 | 同一相手に対して複数の通信チャネルを用いた通信を行なうことが可能な通信装置、及びその制御方法 |
| US6849377B2 (en) * | 1998-09-23 | 2005-02-01 | E. I. Du Pont De Nemours And Company | Photoresists, polymers and processes for microlithography |
| KR100481601B1 (ko) * | 1999-09-21 | 2005-04-08 | 주식회사 하이닉스반도체 | 광산 발생제와 함께 광염기 발생제를 포함하는 포토레지스트 조성물 |
| AU1603101A (en) * | 1999-11-17 | 2001-05-30 | E.I. Du Pont De Nemours And Company | Nitrile/fluoroalcohol-containing photoresists and associated processes for microlithography |
| EP1246013A3 (en) * | 2001-03-30 | 2003-11-19 | E.I. Du Pont De Nemours And Company | Photoresists, polymers and processes for microlithography |
| US6737215B2 (en) * | 2001-05-11 | 2004-05-18 | Clariant Finance (Bvi) Ltd | Photoresist composition for deep ultraviolet lithography |
| US8030425B2 (en) * | 2002-07-03 | 2011-10-04 | Promerus Llc | Photosensitive compositions based on polycyclic polymers for low stress, high temperature films |
| CN101031595A (zh) * | 2003-10-31 | 2007-09-05 | 普罗米鲁斯有限责任公司 | 用于环烯烃潜聚合的单组分阳离子钯前引发剂 |
| KR101252321B1 (ko) * | 2005-06-30 | 2013-04-08 | 도레이 카부시키가이샤 | 감광성 수지 조성물 및 접착 개량제 |
| WO2010113813A1 (ja) * | 2009-03-31 | 2010-10-07 | 大日本印刷株式会社 | 塩基発生剤、感光性樹脂組成物、当該感光性樹脂組成物からなるパターン形成用材料、当該感光性樹脂組成物を用いたパターン形成方法並びに物品 |
| US20150007950A1 (en) * | 2011-12-27 | 2015-01-08 | Allure Home Creations Co., Inc. | Curtain hanging assembly |
| KR101572049B1 (ko) * | 2012-09-25 | 2015-11-26 | 프로메러스, 엘엘씨 | 사이클로올레핀성 중합체를 함유하는 말레이미드 및 그의 용도 |
| JP5803957B2 (ja) * | 2013-03-05 | 2015-11-04 | 信越化学工業株式会社 | パターン形成方法及びレジスト組成物 |
| WO2014176490A1 (en) * | 2013-04-26 | 2014-10-30 | Promerus, Llc | Photosensitive compositions and applications thereof |
| JP6369132B2 (ja) * | 2013-06-28 | 2018-08-08 | 住友ベークライト株式会社 | ネガ型感光性樹脂組成物、硬化膜、電子装置およびポリマー |
| WO2015038412A2 (en) * | 2013-09-16 | 2015-03-19 | Promerus, Llc | Amine treated maleic anhydride polymers with pendent silyl group, compositions and applications thereof |
| JP2015184325A (ja) * | 2014-03-20 | 2015-10-22 | 住友ベークライト株式会社 | 感光性樹脂組成物および電子装置 |
| KR20180088652A (ko) * | 2015-11-30 | 2018-08-06 | 프로메러스, 엘엘씨 | 광산발생제 및 염기 함유 영구유전체조성물 |
-
2016
- 2016-02-02 TW TW105103252A patent/TWI652281B/zh active
- 2016-02-12 CN CN201680018462.3A patent/CN107407872B/zh active Active
- 2016-02-12 WO PCT/US2016/017656 patent/WO2016133795A1/en not_active Ceased
- 2016-02-12 KR KR1020177025264A patent/KR101998338B1/ko active Active
- 2016-02-12 US US15/042,240 patent/US9952507B2/en active Active
- 2016-02-12 JP JP2017542905A patent/JP6513208B2/ja active Active
-
2018
- 2018-03-12 US US15/918,604 patent/US10409160B2/en active Active
-
2019
- 2019-07-22 US US16/517,927 patent/US10634998B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015007770A (ja) * | 2013-05-29 | 2015-01-15 | 住友ベークライト株式会社 | 感光性樹脂組成物および電子装置 |
| JP2015018049A (ja) | 2013-07-09 | 2015-01-29 | 太陽インキ製造株式会社 | 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6513208B2 (ja) | 2019-05-15 |
| WO2016133795A1 (en) | 2016-08-25 |
| TW201634502A (zh) | 2016-10-01 |
| US20160238932A1 (en) | 2016-08-18 |
| US10634998B2 (en) | 2020-04-28 |
| CN107407872A (zh) | 2017-11-28 |
| US20180203349A1 (en) | 2018-07-19 |
| JP2018508824A (ja) | 2018-03-29 |
| CN107407872B (zh) | 2020-08-07 |
| US10409160B2 (en) | 2019-09-10 |
| KR20170117468A (ko) | 2017-10-23 |
| US9952507B2 (en) | 2018-04-24 |
| TWI652281B (zh) | 2019-03-01 |
| US20190369492A1 (en) | 2019-12-05 |
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Patent event date: 20170907 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PE0701 | Decision of registration |
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| N231 | Notification of change of applicant | ||
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