TWI651017B - 表面粗化方法 - Google Patents
表面粗化方法 Download PDFInfo
- Publication number
- TWI651017B TWI651017B TW104110079A TW104110079A TWI651017B TW I651017 B TWI651017 B TW I651017B TW 104110079 A TW104110079 A TW 104110079A TW 104110079 A TW104110079 A TW 104110079A TW I651017 B TWI651017 B TW I651017B
- Authority
- TW
- Taiwan
- Prior art keywords
- organic resin
- substrate
- layer
- surface roughening
- etching
- Prior art date
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- 238000007788 roughening Methods 0.000 title claims abstract description 73
- 238000000034 method Methods 0.000 title claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 164
- 239000011347 resin Substances 0.000 claims abstract description 164
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 239000000203 mixture Substances 0.000 claims abstract description 75
- 238000005530 etching Methods 0.000 claims abstract description 63
- 239000007789 gas Substances 0.000 claims abstract description 55
- 239000000243 solution Substances 0.000 claims abstract description 43
- 239000010954 inorganic particle Substances 0.000 claims abstract description 32
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000001301 oxygen Substances 0.000 claims abstract description 28
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 28
- 229910000420 cerium oxide Inorganic materials 0.000 claims abstract description 25
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims abstract description 25
- 230000002378 acidificating effect Effects 0.000 claims abstract description 17
- 239000007864 aqueous solution Substances 0.000 claims abstract description 17
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- 238000001039 wet etching Methods 0.000 claims abstract description 12
- 238000000605 extraction Methods 0.000 claims abstract description 10
- 239000003960 organic solvent Substances 0.000 claims abstract description 10
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 125000003277 amino group Chemical group 0.000 claims description 10
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/854—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/877—Arrangements for extracting light from the devices comprising scattering means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014068009 | 2014-03-28 | ||
| JP2014-068009 | 2014-03-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201611659A TW201611659A (zh) | 2016-03-16 |
| TWI651017B true TWI651017B (zh) | 2019-02-11 |
Family
ID=54195798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104110079A TWI651017B (zh) | 2014-03-28 | 2015-03-27 | 表面粗化方法 |
Country Status (5)
| Country | Link |
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| JP (1) | JP6551691B2 (ja) |
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| US10804111B2 (en) * | 2015-09-15 | 2020-10-13 | Nissan Chemical Industries, Ltd. | Method for roughening surface using wet treatment |
| KR20180118104A (ko) * | 2015-12-08 | 2018-10-30 | 네덜란제 오르가니자티에 포오르 토에게파스트-나투우르베텐샤펠리즈크 온데르조에크 테엔오 | Ｏｌｅｄ에서의 발광 향상 |
| TWI803390B (zh) * | 2022-07-15 | 2023-05-21 | 三福化工股份有限公司 | 蝕刻液組成物及其蝕刻方法 |
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| US20110267698A1 (en) * | 2010-04-30 | 2011-11-03 | Diane Kimberlie Guilfoyle | Anti-glare surface treatment method and articles thereof |
| TW201411177A (zh) * | 2012-08-01 | 2014-03-16 | 3M Innovative Properties Co | 抗反射硬性塗層及抗反射物件 |
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| JP3313741B2 (ja) * | 1991-08-02 | 2002-08-12 | 大日本印刷株式会社 | 部分蒸着化粧シートの製造方法 |
| JP2006107744A (ja) | 2004-09-30 | 2006-04-20 | Toshiba Corp | 有機エレクトロルミネッセンス表示装置 |
| JP4887612B2 (ja) * | 2004-10-20 | 2012-02-29 | 日油株式会社 | 減反射材及びそれを用いた電子画像表示装置 |
| CN1921156A (zh) * | 2005-08-26 | 2007-02-28 | 鸿富锦精密工业（深圳）有限公司 | 发光二极体光源模组及其制造方法 |
| JP5214284B2 (ja) | 2008-03-10 | 2013-06-19 | 株式会社東芝 | 発光装置用光取り出し層、およびそれを用いた有機エレクトロルミネッセンス素子 |
| WO2010078071A1 (en) * | 2008-12-30 | 2010-07-08 | 3M Innovative Properties Company | Antireflective articles and methods of making the same |
| US8933526B2 (en) * | 2009-07-15 | 2015-01-13 | First Solar, Inc. | Nanostructured functional coatings and devices |
| WO2011118109A1 (ja) * | 2010-03-23 | 2011-09-29 | 株式会社朝日ラバー | 可撓性反射基材、その製造方法及びその反射基材に用いる原材料組成物 |
| JP2012175052A (ja) * | 2011-02-24 | 2012-09-10 | Stanley Electric Co Ltd | 半導体発光装置の製造方法 |
| US8692446B2 (en) * | 2011-03-17 | 2014-04-08 | 3M Innovative Properties Company | OLED light extraction films having nanoparticles and periodic structures |
| JP2013072929A (ja) * | 2011-09-27 | 2013-04-22 | Toshiba Corp | 表示装置 |
| CN102540562A (zh) * | 2012-01-06 | 2012-07-04 | 中国电子科技集团公司第五十五研究所 | 液晶显示屏高透过低反射电磁屏蔽结构及制作方法 |
| SG11201405941QA (en) * | 2012-03-26 | 2014-10-30 | 3M Innovative Properties Co | Article and method of making the same |
| US10804111B2 (en) * | 2015-09-15 | 2020-10-13 | Nissan Chemical Industries, Ltd. | Method for roughening surface using wet treatment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20110267698A1 (en) * | 2010-04-30 | 2011-11-03 | Diane Kimberlie Guilfoyle | Anti-glare surface treatment method and articles thereof |
| TW201411177A (zh) * | 2012-08-01 | 2014-03-16 | 3M Innovative Properties Co | 抗反射硬性塗層及抗反射物件 |
Also Published As
| Publication number | Publication date |
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| JP6551691B2 (ja) | 2019-07-31 |
| JPWO2015147294A1 (ja) | 2017-04-13 |
| WO2015147294A1 (ja) | 2015-10-01 |
| CN106061627A (zh) | 2016-10-26 |
| KR20160137958A (ko) | 2016-12-02 |
| TW201611659A (zh) | 2016-03-16 |
| KR102358180B1 (ko) | 2022-02-04 |
| CN106061627B (zh) | 2020-08-04 |
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