TWI644774B - a method for separating a brittle material substrate, a substrate holding member for breaking a brittle material substrate, and a frame for adhering the adhesive film used for breaking the brittle material substrate - Google Patents
a method for separating a brittle material substrate, a substrate holding member for breaking a brittle material substrate, and a frame for adhering the adhesive film used for breaking the brittle material substrate Download PDFInfo
- Publication number
- TWI644774B TWI644774B TW104108443A TW104108443A TWI644774B TW I644774 B TWI644774 B TW I644774B TW 104108443 A TW104108443 A TW 104108443A TW 104108443 A TW104108443 A TW 104108443A TW I644774 B TWI644774 B TW I644774B
- Authority
- TW
- Taiwan
- Prior art keywords
- brittle material
- material substrate
- substrate
- frame
- breaking
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 194
- 239000000463 material Substances 0.000 title claims abstract description 145
- 239000002313 adhesive film Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000013001 point bending Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 210000000746 body region Anatomy 0.000 claims 1
- 238000005520 cutting process Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Engineering & Computer Science (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014167298A JP2016043503A (ja) | 2014-08-20 | 2014-08-20 | 脆性材料基板の分断方法、脆性材料基板分断用の基板保持部材、および、脆性材料基板の分断時に使用する粘着フィルム張設用の枠体 |
| JPJP2014-167298 | 2014-08-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201607713A TW201607713A (zh) | 2016-03-01 |
| TWI644774B true TWI644774B (zh) | 2018-12-21 |
Family
ID=55416045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104108443A TWI644774B (zh) | 2014-08-20 | 2015-03-17 | a method for separating a brittle material substrate, a substrate holding member for breaking a brittle material substrate, and a frame for adhering the adhesive film used for breaking the brittle material substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016043503A (enrdf_load_stackoverflow) |
| KR (1) | KR20160022760A (enrdf_load_stackoverflow) |
| CN (1) | CN105382945A (enrdf_load_stackoverflow) |
| TW (1) | TWI644774B (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2955007T3 (es) | 2016-01-29 | 2023-11-28 | Kaneka Corp | Uso de alantoína para potenciar la resistencia a altas temperaturas en plantas |
| DE102017201154B4 (de) * | 2017-01-25 | 2025-02-27 | Disco Corporation | Verfahren zum Bearbeiten eines Wafers und Waferbearbeitungssystem |
| JP2020151929A (ja) | 2019-03-20 | 2020-09-24 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク装置およびブレイク方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000306864A (ja) * | 1999-04-22 | 2000-11-02 | Apic Yamada Corp | 短冊ワークダイシング用フィルム取付フレーム |
| TW200629473A (en) * | 2004-12-14 | 2006-08-16 | Hamamatsu Photonics Kk | Processing method for substrate and film expansion device |
| CN102265386A (zh) * | 2009-01-29 | 2011-11-30 | 昭和电工株式会社 | 基板切断方法及电子元件的制造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4989475A (enrdf_load_stackoverflow) * | 1972-12-27 | 1974-08-27 | ||
| JP2004026539A (ja) * | 2002-06-24 | 2004-01-29 | Nakamura Tome Precision Ind Co Ltd | ガラス基板の割断加工方法及びその装置 |
| JP4589201B2 (ja) * | 2005-08-23 | 2010-12-01 | 株式会社ディスコ | 基板の切削装置 |
| KR100748305B1 (ko) * | 2006-03-02 | 2007-08-09 | 삼성에스디아이 주식회사 | 절단된 기판의 이송방법 |
| JP5182339B2 (ja) * | 2010-08-31 | 2013-04-17 | 三星ダイヤモンド工業株式会社 | 基板ブレーク装置 |
| JP2013071335A (ja) * | 2011-09-28 | 2013-04-22 | Mitsuboshi Diamond Industrial Co Ltd | マザー基板の分断方法 |
| JP6039363B2 (ja) | 2012-10-26 | 2016-12-07 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の分断方法並びに分断装置 |
-
2014
- 2014-08-20 JP JP2014167298A patent/JP2016043503A/ja active Pending
-
2015
- 2015-03-17 TW TW104108443A patent/TWI644774B/zh not_active IP Right Cessation
- 2015-06-05 KR KR1020150079948A patent/KR20160022760A/ko not_active Withdrawn
- 2015-07-15 CN CN201510417153.0A patent/CN105382945A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000306864A (ja) * | 1999-04-22 | 2000-11-02 | Apic Yamada Corp | 短冊ワークダイシング用フィルム取付フレーム |
| TW200629473A (en) * | 2004-12-14 | 2006-08-16 | Hamamatsu Photonics Kk | Processing method for substrate and film expansion device |
| CN102265386A (zh) * | 2009-01-29 | 2011-11-30 | 昭和电工株式会社 | 基板切断方法及电子元件的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160022760A (ko) | 2016-03-02 |
| JP2016043503A (ja) | 2016-04-04 |
| TW201607713A (zh) | 2016-03-01 |
| CN105382945A (zh) | 2016-03-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |