KR20160022760A - 취성재료 기판의 분단방법, 취성재료 기판 분단용의 기판 지지 부재, 및 취성재료 기판의 분단시에 사용하는 점착필름 부착용 프레임체 - Google Patents

취성재료 기판의 분단방법, 취성재료 기판 분단용의 기판 지지 부재, 및 취성재료 기판의 분단시에 사용하는 점착필름 부착용 프레임체 Download PDF

Info

Publication number
KR20160022760A
KR20160022760A KR1020150079948A KR20150079948A KR20160022760A KR 20160022760 A KR20160022760 A KR 20160022760A KR 1020150079948 A KR1020150079948 A KR 1020150079948A KR 20150079948 A KR20150079948 A KR 20150079948A KR 20160022760 A KR20160022760 A KR 20160022760A
Authority
KR
South Korea
Prior art keywords
brittle material
material substrate
substrate
dividing
adhesive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020150079948A
Other languages
English (en)
Korean (ko)
Inventor
이치로 미야키
유이치 가네히라
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20160022760A publication Critical patent/KR20160022760A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

Landscapes

  • Engineering & Computer Science (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
KR1020150079948A 2014-08-20 2015-06-05 취성재료 기판의 분단방법, 취성재료 기판 분단용의 기판 지지 부재, 및 취성재료 기판의 분단시에 사용하는 점착필름 부착용 프레임체 Withdrawn KR20160022760A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014167298A JP2016043503A (ja) 2014-08-20 2014-08-20 脆性材料基板の分断方法、脆性材料基板分断用の基板保持部材、および、脆性材料基板の分断時に使用する粘着フィルム張設用の枠体
JPJP-P-2014-167298 2014-08-20

Publications (1)

Publication Number Publication Date
KR20160022760A true KR20160022760A (ko) 2016-03-02

Family

ID=55416045

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150079948A Withdrawn KR20160022760A (ko) 2014-08-20 2015-06-05 취성재료 기판의 분단방법, 취성재료 기판 분단용의 기판 지지 부재, 및 취성재료 기판의 분단시에 사용하는 점착필름 부착용 프레임체

Country Status (4)

Country Link
JP (1) JP2016043503A (enrdf_load_stackoverflow)
KR (1) KR20160022760A (enrdf_load_stackoverflow)
CN (1) CN105382945A (enrdf_load_stackoverflow)
TW (1) TWI644774B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017130630A1 (ja) 2016-01-29 2017-08-03 株式会社カネカ 植物における高温ストレス耐性向上剤、高温ストレス耐性を向上させる方法、白化抑制剤、及びｄｒｅｂ２ａ遺伝子発現促進剤
DE102017201154B4 (de) * 2017-01-25 2025-02-27 Disco Corporation Verfahren zum Bearbeiten eines Wafers und Waferbearbeitungssystem
JP2020151929A (ja) 2019-03-20 2020-09-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置およびブレイク方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014083821A (ja) 2012-10-26 2014-05-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法並びに分断装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4989475A (enrdf_load_stackoverflow) * 1972-12-27 1974-08-27
JP2000306864A (ja) * 1999-04-22 2000-11-02 Apic Yamada Corp 短冊ワークダイシング用フィルム取付フレーム
JP2004026539A (ja) * 2002-06-24 2004-01-29 Nakamura Tome Precision Ind Co Ltd ガラス基板の割断加工方法及びその装置
JP2006173269A (ja) * 2004-12-14 2006-06-29 Hamamatsu Photonics Kk 基板加工方法及びフィルム伸張装置
JP4589201B2 (ja) * 2005-08-23 2010-12-01 株式会社ディスコ 基板の切削装置
KR100748305B1 (ko) * 2006-03-02 2007-08-09 삼성에스디아이 주식회사 절단된 기판의 이송방법
JP5121746B2 (ja) * 2009-01-29 2013-01-16 昭和電工株式会社 基板切断方法および電子素子の製造方法
JP5182339B2 (ja) * 2010-08-31 2013-04-17 三星ダイヤモンド工業株式会社 基板ブレーク装置
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014083821A (ja) 2012-10-26 2014-05-12 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法並びに分断装置

Also Published As

Publication number Publication date
CN105382945A (zh) 2016-03-09
TW201607713A (zh) 2016-03-01
JP2016043503A (ja) 2016-04-04
TWI644774B (zh) 2018-12-21

Similar Documents

Publication Publication Date Title
TWI679094B (zh) 脆性材料基板之分斷方法及分斷裝置
TW201515801A (zh) 彈性支撐板、斷裂裝置及分斷方法
KR20160022760A (ko) 취성재료 기판의 분단방법, 취성재료 기판 분단용의 기판 지지 부재, 및 취성재료 기판의 분단시에 사용하는 점착필름 부착용 프레임체
TW201515802A (zh) 斷裂裝置及分斷方法
CN105304562A (zh) 贴合基板的分断方法及分断装置
JP6689023B2 (ja) ブレーク装置
TWI661999B (zh) 貼合基板之分斷方法及分斷刀
JP6233936B2 (ja) ウェハをダイに分割する方法
JP2016030413A (ja) 貼り合わせ基板の分断方法及び分断装置
JP6301658B2 (ja) ウェーハの加工方法
JP6175155B2 (ja) 脆性材料基板の分断装置
JP6140325B2 (ja) 脆性材料基板の分断装置
KR102351929B1 (ko) 브레이크 장치
JP6406532B2 (ja) 脆性材料基板の分断装置
JP6114422B2 (ja) 貼り合わせ基板の分断装置
TWI676539B (zh) 樹脂片材之分斷方法及分斷裝置
JP5913483B2 (ja) 脆性材料基板の分断方法並びに分断装置
JP6212580B2 (ja) 脆性材料基板の分断装置
JP2019081252A (ja) 樹脂シートの分断システム

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20150605

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination